Abstract: This invention relates to a method of selection of an electrocatalyst array for a desired product outcome. The method comprises exposing an electrocatalyst system to an active agent dissolved or suspended in a conductive solution; and applying a voltage to the electrocatalyst system. The voltage sufficient to cause a multi-electron oxidation or multi-electron reduction of the active species; the electrocatalyst system comprises a counter electrode; and an electrocatalyst array. The array comprising a support substrate; uniformly sized surface structures protruding from a surface of the support substrate; the uniformly sized surface structures have edges and/or apices comprising a catalyst.

Abstract: A method of decomposing a cured aromatic epoxy resin uses a molten salt bath at less than about 350° C. The molten salt bath includes a plurality of alkali metal hydroxides. The cured aromatic epoxy resin can be in intimate physical contact with a metal or alloy. The cured aromatic epoxy resin can be patterned by a lithographic method. The lithographic method can be multibeam interference lithography to form a three-dimensional photonic crystal template on a conductive substrate for electrodeposition of metal. Contacting the three-dimensional photonic crystal template with the electrodeposited metal with the molten salt bath can form a metal matrix device displaying a periodic pattern that is the inverse of the periodic pattern of the decomposed three-dimensional photonic crystal template.

Abstract: An exemplary hybrid battery separator is provided with a porous sheet with a folded bottom edge and joined lateral edges that form a pocket. The folded bottom edge may have one or more openings or slits. The hybrid separators of the present disclosure are particularly useful for flat-plate cycling batteries. The separators of the present disclosure may effectively enhance the battery re-chargeability and the backup time. In addition, the separators of the present disclosure may contribute to the reduction of water loss in the battery, lowering the maintenance needs in service. It is expected that batteries having the separators of the present disclosure may be useful in various applications, such as in inverters, golf carts, as well as solar and traction applications.

Abstract: A method for repairing a display device, the display device including a plurality of inorganic light emitting elements arranged in a matrix and an insulator arranged around the plurality of inorganic light emitting elements, the method comprising steps of: detecting a defective inorganic light emitting element as the inorganic light emitting element having a defect; removing the insulator around the defective inorganic light emitting element while the defective inorganic light emitting element remains without being removed by irradiating the insulator around the defective inorganic light emitting element with irradiation light; and removing the defective inorganic light emitting element after the insulator therearound has been removed.

Abstract: A method for producing a module includes a first step of preparing a conductive layer disposed at one side in a thickness direction of a first peeling layer, a second step of forming a conductive pattern from the conductive layer, a third step of pushing the conductive pattern into a first adhesive layer containing a first magnetic particle and a first resin component, and a fourth step of peeling the first peeling layer.

Abstract: Disclosed herein is a device having a shaped seal ring comprising a workpiece, the workpiece comprising at least one dielectric layer disposed on a first side of a substrate, a seal ring disposed in the at least one dielectric layer, and at least one groove in the seal ring. A lid is disposed over the workpiece, the workpiece extending into a recess in the lid and a first thermal interface material (TIM) contacts the seal ring and the lid, with the first TIM extending into the at least one groove. The workpiece is mounted to the package carrier. A die is mounted over a first side of workpiece and disposed in the recess. A first underfill a disposed under the die and a second underfill is disposed between the workpiece and the package carrier. The first TIM is disposed between the first underfill and the second underfill.

Abstract: The present disclosure relates to solar cells for a shingled solar cell module, a shingled solar cell module, and a method of making solar cells for the shingled solar cell module. Said solar cell has a front side and a back side, a plurality of front side busbars being arranged on the front side, a plurality of back side busbars being arranged on the back side, the solar cell comprising a plurality of sections, each section comprising a front side busbar and a back side busbar located at edges thereof, the front side busbar of at least one section of the solar cell having an extension at one end or both ends, the extension extending along another edge of said at least one section intersecting with the above-mentioned edges. The shingled solar cell module is fabricated from solar cell strips split from the solar cell.

Abstract: An exemplary hybrid battery separator is provided with a porous sheet with a folded bottom edge and joined lateral edges that form a pocket. The folded bottom edge may have one or more openings or slits. The hybrid separators of the present disclosure are particularly useful for flat-plate cycling batteries. The separators of the present disclosure may effectively enhance the battery re-chargeability and the backup time. In addition, the separators of the present disclosure may contribute to the reduction of water loss in the battery, lowering the maintenance needs in service. It is expected that batteries having the separators of the present disclosure may be useful in various applications, such as in inverters, golf carts, as well as solar and traction applications.

Abstract: A method of manufacturing electrical connector contacts includes the steps of: forming a row of contacts each having a front contacting portion, a rear soldering portion, and a securing portion between the front contacting portion and the rear soldering portion; forming an electrophoretic deposition (ED) coating on the contacting portions of the row of contacts; removing a respective front region of ED coating on the contacting portion; and forming a precious-metal-alloy coating on the front regions removed of ED coating.

Abstract: A display device is provided, including a first substrate, a plurality of first contact pads, a second substrate, a plurality of second contact pads, and a plurality of first traces. The first substrate includes a display area and a non-display area. The first contact pads disposed on the non-display area. The second substrate includes a first side and a second side, wherein the first side is opposite to the second side. The second contact pads are disposed on the first side, wherein the second contact pads are electrically connected to the first contact pads. The first traces are disposed on the second side, wherein the first traces are electrically connected to the second contact pads through a plurality of through holes respectively, and one of the through holes overlaps corresponding one of the second contact pads in a normal direction of the second substrate.

Abstract: Disclosed herein is a structure having: a support, a plurality of nanowires perpendicular to the support, and an electrode in contact with a first end of each nanowire. Each nanowire has a second end in contact with the support. The electrode contains a plurality of perforations. The electrode contains a plurality of perforations. Also disclosed herein is a method of: providing the above support and nanowires; depositing a layer of a filler material that covers a portion of each nanowire and leaves a first end of each nanowire exposed; depositing a plurality of nanoparticles onto the filler material; depositing an electrode material on the nanoparticles, the ends of the nanowires, and any exposed filler material; and removing the nanoparticles and filler material to form an electrode in contact with the first end of each nanowire; wherein the electrode contains a plurality of perforations.

Abstract: A metal structure manufacture method for a multi-layer substrate comprises coating a photoresist layer on a first dielectric layer; proceeding a photolithography process to the photoresist layer to define a specific position for a first metal layer; removing the photoresist layer at the specific position; and forming the first metal layer at the specific position, wherein a base area of the first metal layer is larger than a top area thereof, and wherein the embedded base and the main body are formed in a same process and are monolithic formed. Said manufacturing method can be employed to manufacture a pad or a metal line of the flexible multi-layer substrate, and the manufactured metal structure cannot easily be delaminated or separated from the contacted dielectric layer.

Abstract: A mold is fabricated with a cavity formed in an insulating layer formed so as to be placed on an upper surface of a conductive base material. This mold is disposed in an electrolyte bath to be applied with a voltage, and a metal is electrodeposited on the bottom surface of the cavity to electroform a metal-formed product in the cavity. In this electrodepositing process, when the width of the cavity is taken as W and a vertical height of a head space between an upper opening of the cavity and an upper surface of a metal layer is taken as H, the growth of the metal layer is stopped so that the height H of the head space left above the metal layer satisfies: where 300 ?m?W; H?W/3.75 where 200 ?m?W<300 ?m; H?W/4 where 100 ?m?W<200 ?m; and H?W/10 where W<100 ?m.

Abstract: In a method for the production of semi-finished copper products, first copper is melted and cast to produce copper anodes, in one casting procedure, within multiple ingot molds, subsequently copper cathodes are formed by electrolysis, using at least one of the copper anodes, and then these copper cathodes are processed further to produce semi-finished copper products. A long-term coating is applied to at least one of the ingot molds as a wash, a sulfur-free wash is applied to the ingot mold and/or part of the work pieces cast in the ingot molds is directly processed further to produce semi-finished copper products. A method and an apparatus applies a wash to an ingot mold and a system produces semi-finished copper products.

Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The metallic article has a plurality of electroformed elements that are configured to serve as an electrical conduit for a photovoltaic cell. A first electroformed element has at least one of: a) a non-uniform width along a first length of the first element, b) a change in conduit direction along the first length of the first element, c) an expansion segment along the first length of the first element, d) a first width that is different from a second width of a second element in the plurality of electroformed elements, e) a first height that is different from a second height of the second element in the plurality of electroformed elements, and f) a top surface that is textured.

Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The mandrel has an outer surface with a preformed pattern, wherein at least a portion of the metallic article is formed in the preformed pattern. The metallic article is separated from the electrically conductive mandrel, which forms a free-standing metallic article that may be coupled with the surface of a semiconductor material for a photovoltaic cell.

Abstract: The invention relates to a microarray structure including a substrate material layer, a continuous three-dimensional (3D) surface layer on the substrate material layer that is capable of functionalisation for use as an array, and an inert material wherein the structure includes accurately defined and functionalisable isolated areas which are millimeter to nanometer in size. The functionalised areas are part of the continuous 3D surface layer and are isolated by the inert material and are interconnected within the structure by the continuous 3D surface layer.

Abstract: A contact has a flat surface and a side surface that is parallel to the flat surface. At least a part of the side surface is curved so as to swell. At least a part of the contact is able to be elastically deformed in parallel to the flat surface.

Abstract: A composition for making a contact includes a nickel-cobalt alloy containing 1% by weight or more to less than 20% by weight of cobalt, and 0.002 part by weight or more to 0.1 part by weight or less of sulfur with respect to 100 parts by weight of the nickel-cobalt alloy. The composition has an average particle size of 0.07 ?m or larger to 0.35 ?m or smaller.

Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The metallic article has a plurality of electroformed elements that are configured to serve as an electrical conduit for a photovoltaic cell. A first electroformed element has at least one of: a) a non-uniform width along a first length of the first element, b) a change in conduit direction along the first length of the first element, c) an expansion segment along the first length of the first element, d) a first width that is different from a second width of a second element in the plurality of electroformed elements, e) a first height that is different from a second height of the second element in the plurality of electroformed elements, and f) a top surface that is textured.

Abstract: A free-standing metallic article, and method of making, is disclosed in which the metallic article is electroformed on an electrically conductive mandrel. The mandrel has an outer surface with a preformed pattern, wherein at least a portion of the metallic article is formed in the preformed pattern. The metallic article is separated from the electrically conductive mandrel, which forms a free-standing metallic article that may be coupled with the surface of a semiconductor material for a photovoltaic cell.

Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.

Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Abstract: There is provided a method of manufacturing a wiring substrate. The method includes: (a) forming a first resist layer having first openings therein on a first surface of a support plate, forming first plated films in the first openings by an electrolytic plating method, and removing the first resist layer; (b) forming a second resist layer having second openings therein on the first surface of the support plate, forming second plated films in the second openings by an electrolytic plating method, and removing the second resist layer; (c) forming a wiring layer and an insulating layer such that the wiring layer is electrically connected to the first and second plated films; and (d) removing the support plate to expose the first and second plated films.

Abstract: Electroformed housings for electronic devices and methods for making the same are provided. An electronic device is provided having circuitry with interface circuitry for processing a user input event, and an electroformed housing that is an enclosure for the circuitry, the electroformed housing having a user interface region positioned adjacent to the interface circuitry such that when a user initiates a user input event on the user interface region, the interface circuitry processes the user input event.

Abstract: The present invention provides a method for directed assembly of a conducting polymer. A method of the invention comprises providing a template such as an insulated template and electrophorectically assembling a conducting polymer thereon. Preferably, the template comprises a patterned electrode on which the conducting polymer is assembled. Moreover, the invention provides a method for transferring an assembled conducting polymer. For example, a method of the invention comprises providing a substrate such as a polymeric substrate and contacting a surface thereof with an assembled conducting polymer. The assembled conducting polymer can be disposed on a patterned electrode of a template, hi one embodiment, a method comprises removing the substrate. By removing the substrate, the assembled conducting polymer is transferred from the patterned electrode of the template to the substrate. The invention also provides a device with a template or substrate comprising an assembled conducting polymer.

Abstract: A method of fabricating a multilayer electronic support structure comprising electroplating copper substructures, laying a dielectric pre-preg comprising a polymer resin over the copper substructures, and pressing to pressures of 200 to 600 PSI against a release film having a higher hardness than the resin of the prepreg but a lower hardness than the cured resin, and heating through a curing cycle whilst maintaining pressure.

Abstract: Techniques for manufacturing an enhanced carbon nanotube (CNT) assembly are provided. In one embodiment, a method of manufacturing an enhanced CNT assembly comprises preparing a metal tip, preparing a CNT plus transition-metal colloidal solution, forming a CNT plus transition-metal composite assembly by using the prepared metal tip and CNT plus transition-metal colloidal solution, and growing the CNT plus transition-metal composite assembly.

Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier provided with an insulating layer which is patterned at a front side. Conducting material in an electrode layer is applied in the cavities of the patterned insulating layer and in contact with the carrier. A connection layer is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.

Abstract: Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.

Abstract: A porous metallic body has a three-dimensional network structure composed of an alloy containing at least Ni and Cr, the porous metallic body having a skeleton formed of a hollow core and a shell, in which when a cross section of the shell is evenly divided in the thickness direction into three portions, i.e., an outer portion, a central portion, and an inner portion, and when concentrations in percent by weight of Cr in the outer portion, the central portion, and the inner portions are defined as a, b, and c, a, b, and c satisfy the relation given by expression (1): |(a+c)/2?b|/(a+b+c)/3<0.

Abstract: A method for filling through hole interconnects in a substrate used in the manufacture of electronic devices uses a film filler material. The film comprises a resin matrix filled with conductive and/or dielectric particles, and can be a single or multi-layer film. The method comprises providing a substrate for an electronic device having one or more through hole interconnects; providing a film comprising at least one film filler material for the through hole interconnects; deposing the film filler material over the substrate; and pressing the film filler material into the through hole interconnects.

Abstract: A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Abstract: A calibration unit for a measurement device for connecting to a connector embodied in a coaxial manner. The calibration unit provides a housing and an inner conductor, whereas the inner conductor (15) is embodied centered within an aperture of the housing. The calibration unit provides a connecting element, that the connecting element is inserted into the aperture of the housing and hosts the inner conductor and that the connecting element is embodied in an elastic manner and supports the inner conductor in an elastic manner relative to the housing.

Abstract: A method of manufacturing a flexible electronic device includes forming a flexible substrate on a roll-type mother substrate, separating the flexible substrate from the roll-type mother substrate, and forming an electronic device on a separation surface of the flexible substrate, which has contacted the roll-type mother substrate, thus solving the problems of low performance and low yield of flexible electronic devices due to a low processing temperature, high surface roughness, high thermal expansion coefficient, and poor handling characteristics.

Abstract: In order to produce industrially advantageously an electroformed copper/niobium composite piping material wherein an electroformed copper layer and a niobium thin piping material are strongly bonded to each other, the electroformed copper/niobium composite piping material can be produced by coating any one or each of the outer peripheral surface and the inner peripheral surface of a niobium thin piping material with a nickel thin film, coating the surface of the nickel thin film with copper by electroforming, and subsequently annealing the resultant.

Abstract: A fuel cell, having a first electrode, a second electrode, and a membrane element, in which the membrane element is disposed between the first electrode and the second electrode. At least one of the electrodes has a flow field plate and at least one flow conduit, through which a reactant can be conducted, extends in at least one outer surface of the flow field plate. The flow field plate has at least one microreaction chamber, and the microreaction chamber is disposed in the outer surface and on the flow conduit. A catalyst is disposed on at least a part of the microreaction chamber in such a way that the catalyst has contact simultaneously with the membrane element and the inflowing reactant.

Abstract: A composite material includes a metal matrix of a metal and a reducing agent. The reducing agent is dispersed in the metal matrix and is capable of reducing an oxide of the metal at room temperature.

Abstract: Systems and methods are provided for electroforming a dome for use in a dome switch. A mandrel having several dome shapes incorporated in a planar surface is provided. The mandrel can serve as a cathode in an electroforming process to construct a sheet of domes, for example by enabling the deposition of a sheet of nickel on the mandrel. The domes can be singulated from the sheet for use as part of dome switches. The electroforming process may ensure that the domes have a uniform thickness and no internal stresses that may affect the performance of the domes.

Abstract: Disclosed is a manufacturing method which enables manufacturing of an ultra-fine, thin contact for current inspection jigs. After a gold or gold alloy plating layer is formed, an Ni electroformed layer is formed by electroformation on the outer periphery of the formed plating layer. After a resistant layer is formed on the outer periphery of the Ni electroformed layer, a spiral groove is formed in the resistant layer by laser exposure, and etching is carried out using the resistant layer as a masking material. The Ni electroformed layer is removed from the part of the resistant layer where the spiral groove was formed, and then the resistant layer is removed and the plating layer is removed from the part of the spiral groove section where the Ni electroformed layer was removed. The core material is then removed, leaving the plating layer inside the periphery of the Ni electroformed layer.

Abstract: A method for manufacturing a metal component includes the steps of forming a resist film on a surface of an electrode plate, making the resist film exposed to light by use of a photomask having a mask pattern, in at least part of a rim of which a fine concavity and convexity are drawn, developing the resist film, to form an opening for molding in the resist film, and epositing an electroforming material by electroforming inside the opening for molding, to mold the material.

Abstract: A lead carrier provides support for a semiconductor device during manufacture. The lead carrier includes a temporary support member with multiple package sites. Each site includes a die attach pad surrounded by terminal pads. The pads are formed of multiple materials including a lower layer and a body portion. An upper layer can also be provided over the body portion. A chip is mounted upon the die pad and wire bonds extend from the chip to the terminal pads. These parts are all encapsulated within a mold compound. The body portion is preferably formed by providing a matrix of metal powder and a suspension medium at locations where the pads are to be located. Heat is applied to disperse the suspension medium and sinter the metal powder to form the body portion. After encapsulation the temporary support member can be peeled away and the package sites isolated from each other.

Abstract: A contact structure has a probe and a housing disposed on an outer circumference thereof. The housing has a housing main body in which a hollow section vertically penetrating the same is formed, and a conductive coat film with which an inner wall surface of the hollow section is coated. The probe has a base end portion fixed in place on one end side of the housing, a conductive leading end portion that is movable in the hollow section while being in contact with the coat film and has, on a leading end thereof, a contact that comes into contact with a subject to be inspected, and an elastic portion that connects together the base end portion and the leading end portion, is disposed in the hollow section, and has elasticity.

Abstract: Techniques for manufacturing an enhanced carbon nanotube (CNT) wire are provided. In one embodiment, an enhanced CNT wire may be manufactured by immersing a metal tip into a CNT colloidal solution, withdrawing the metal tip from the CNT colloidal solution, and then coating the CNT wire with a polymer.

Abstract: According to one embodiment, an electroforming master comprises a patterns of protrusions and recesses formed on one major surface of an Si substrate having two major surfaces, corresponding to information for positioning of a read/write head (a preamble, address, and burst), recording tracks or recording bits. Impurity ions are doped in the surface of this patterns of protrusions and recesses. The impurity ion concentration distribution in the film thickness direction of the Si substrate has a peak in a portion from the patterns of protrusions and recesses surface to a depth of 40 nm in the film thickness direction. The impurity concentration of this peak is 1×1020 to 2×1021 ions/cm3.

Abstract: A porous metal body containing continuous pores and having a low oxygen content is provided by decomposing a porous resin body that contains continuous pores and has a layer of a metal thereon by heating the porous resin body at a temperature equal to or less than the melting point of the metal while the porous resin body is immersed in a first molten salt and a negative potential is applied to the metal layer; and a method for producing the porous metal body is provided.

Abstract: A porous metal body containing continuous pores and having a low oxygen content is provided by decomposing a porous resin body that contains continuous pores and has a layer of a metal thereon by heating the porous resin body at a temperature equal to or less than the melting point of the metal while the porous resin body is immersed in a first molten salt and a negative potential is applied to the metal layer; and a method for producing the porous metal body is provided.

Abstract: A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.

Abstract: Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.

Abstract: A connecting terminal for a connector has a fixed portion configured to be connected to an electrode portion provided in a member for mounting the connector, and a contact configured to electrically come in contact with a contact portion of a connected portion to be connected to the connector. At least one concave portion is provided along a whole outer peripheral surface of the connector terminal.