Abstract: Disclosed is a plating structure including a substrate having a plurality of pins to be plated and a metallic plating screen having a plurality of apertures, wherein each of the apertures has at least two tabs spaced apart from each other, wherein the metallic plating screen is placed over the pins so that at least two pins penetrate each aperture, each of the pins contacting a tab of the aperture. Also disclosed is a method of electrolytically plating a plurality of pins utilizing the above metallic plating screen.

Abstract: The invention relates to a process for the production of an electro-chemical deposit (8-1, . . . , 8-4) with the aid of a substrate (2) having connection pieces (4-1, . . . , 4-5), said pieces being used as electrodes, the deposit taking place on the surface of a removable support (6) and which can be subsequently separated from the substrate on areas of said surface in electrical contact with the pieces of the substrate.

Abstract: Electrical conductors (2) embedding filaments (4) of a fabric (3), and substantially filling interstices (5) that coextend with the imbedded filaments (4), are fabricated by plating conductive material onto a surface (14) of a passivated cathode against which the fabric (3) is held. Resist material (19) conforms the conductive material to form an array of electrical conductors (2).

Abstract: A method of producing a circuit board includes the steps of: electroplating a mold surface of a mold so that a circuit body made of a metal plating layer is formed on the mold surface of the mold; pressing the mold against a board made of a thermoplastic resin; heating and retaining the mold so that the circuit body is bonded to the board under heat and pressure; and releasing the mold from the board after cooling the board to thereby transfer the circuit body to the board. The circuit board may be in the shape of box with the circuit body on the inner surfaces thereof.

Abstract: An electroforming process and apparatus for creating a nickel or like substrate encapsulated by another material to prevent wear to the nickel substrate. The encapsulation of the nickel substrate requires encapsulation of the inner and outer diameter of the nickel substrate. The encapsulating material must adhere to the nickel substrate. Encapsulation of the nickel substrate prevents exposure of the nickel and thus avoids the hazardous nickel dust particles that can occur when the nickel is exposed.

Abstract: Disclosed is a method of producing an electrically conductive polymer composite comprising a general-purpose resin layer and an electrically conductive layer, wherein the conductive layer is formed on at least one surface of the general-purpose resin layer, the method comprising the steps of forming the conductive layer on at least one internal surface of a mold, introducing into the mold a raw solution of the general-purpose resin comprising a monomer polymerizable without condensation reaction, and subjecting said monomer to polymerization in said mold to provide the general-purpose resin layer.

Abstract: An anode bonding method for bonding a first substrate and a second substrate, both of which have a recessed portion, includes the steps of heating the first and second substrates in a stacked state; and bonding the substrates by applying a voltage between the substrates.

Abstract: A method for producing a conductive pattern includes the steps of forming a mask layer on a conductive base plate, the mask layer having a pattern defining an exposed area of the conductive base plate; forming a conductive pattern on the exposed area of the conductive base plate by electroforming using a plating liquid which substantially maintains the pattern of the mask layer; and transferring the conductive pattern onto a support layer without removing the mask layer.

Abstract: A method for manufacturing a lead frame employing a resist pattern formed on a matrix and having a cavity therein, in which an electro-deposition pattern is formed. A connecting cavity portion interconnects tip ends of inner lead cavity portions such that a connecting portion interconnects the tip ends of inner leads of the electro-deposition pattern formed in the cavity. The connecting piece is maintained while the electro-deposition pattern is separated from the matrix and the resist.

Abstract: Uniform zinc pellets are formed for use in batteries having a stationary or moving slurry zinc particle electrode. The process involves the cathodic deposition of zinc in a finely divided morphology from battery reaction product onto a non-adhering electrode substrate. The mossy zinc is removed from the electrode substrate by the action of gravity, entrainment in a flowing electrolyte, or by mechanical action. The finely divided zinc particles are collected and pressed into pellets by a mechanical device such as an extruder, a roller and chopper, or a punch and die. The pure zinc pellets are returned to the zinc battery in a pumped slurry and have uniform size, density and reactivity. Applications include zinc-air fuel batteries, zinc-ferricyanide storage batteries, and zinc-nickel-oxide secondary batteries.

Abstract: An electro-optic device featuring an semiconductor device formed by providing an insulator over a gate electrode, and anodic oxidizing only the sides of the gate electrode.

Abstract: An apparatus and a method for electroplating pin grid array (PGA) packaging modules by utilizing a compressible member and an electrically conductive foil for providing electrical connections to the pins such that all the critical areas of the pins, the wire bond pads, the seal band and the die cavity are electroplated simultaneously through the connection to the pins.

Abstract: A microstructured mold with at least one open cavity is produced from a solid body (metal, ceramic, glass, stone or monocrystalline material) by precision mechanical machining, additive or subtractive structuring. The cavity is filled and the mold covered by a flowable material and the solidified flowable material is separated from the mold giving a microstructure element. Alternatively, the top portion of the solidified flowable material is removed to expose the surface of the mold and the solidified material filling the cavity. A layer of conductive material is applied to the exposed surface and remaining solidified material. Then the conductive layer and the remaining solidified material are separated from the mold to provide a structure with a shape complementary to the mold. A layer of metal is electrodeposited on the complementary structure and, finally, the metal layer is separated to produce a metallic microstructure element.

Abstract: To prepare a screen printing stencil, a pattern of resist, having a complementary design to the final screen printing stencil, is applied to a conductive mandrel. A patterned layer is electroformed onto the exposed surface of the mandrel such that the layer corresponds to the exposed orifices of the pattern of resist. The resulting screen printing stencil can have an overgrowth geometry or a straight-wall geometry depending on the type of photoresist employed, and can be used in the electronic substrate fabrication and electronic assembly industries.

Abstract: Shaped contacts (40,42) for interconnecting circuits or for use in an integrated circuit test probe are electroplated as integral parts of circuit traces (34) upon a stainless steel mandrel (10). A shaped, hardened steel indentation tool (16,18,26,28) makes indentations (24a,24b) of predetermined shape in the surface of the mandrel (10), which is provided with a pattern of dielectric, such as Teflon (12), or photoresist. Areas of the steel mandrel, including the indentations (24a,24b), are electroplated with a pattern of conductive material (34,36,38), and a dielectric substrate (32) is laminated to the conductive material. The circuit features formed by the indentations define raised contacts of a conical (18) or pyramidal (28) shape, having free ends with a small area that allows higher pressures to be applied to a surface against which the contacts are pressed.

Abstract: In the manufacture of a silicon-containing iron sheet for electrical applications consisting of 0.1-8% by weight Si, optionally up to 1% by weight Al, remainder iron and unavoidable impurities, iron sheet is made by electrodeposition, and silicon or a silicon-containing material is incorporated in the electro-deposited iron sheet. The silicon-containing material may be included in the electrolyte, becoming embedded during the electro-deposition in the iron sheet. The method can be performed without a step of thickness reduction of the iron sheet made by electro-deposition. The sheet is annealed to homogenize the silicon content.

Abstract: A layered photosensitive imaging member is modified to reduce the effects of interference within the member caused by reflections from coherent light incident on a base ground plane. The modification described is to form the ground plane surface by an electroforming process which leaves the surface with a black finish. Light incident on the ground plane is absorbed, eliminating the reflections which contribute to the interference effect at the imaging member surface.

Abstract: A circuit is produced by using a formed mandrel (10,12) and semi-additive techniques for creating circuit traces. A stainless steel mandrel (10) flash plated with copper (14) includes a depression (12) which will form a raised interconnection feature (24). Using a photolithographically formed pattern of photoresistive material (16) on the mandrel the selected pattern of circuit traces (18,20) and raised features (24) are electroplated onto the flash plated mandrel. After stripping the photoresist (16), a dielectric substrate (26) is laminated to the circuit traces, effectively encapsulating the traces on three sides. After removing the laminated circuit traces and dielectric from the mandrel the flash plated copper (14) is removed and the circuit covered with an insulation coverlay.