Abstract: A method for plating a high impact resistant plastic, particularly a polycarbonate substrate which has been modified with up to about 50 percent by weight of acrylonitrile-butadiene-styrene. The surface of the plastic is first conditioned with a halogenated organic solvent conditioner, preferably 1-3-dichloro-2-propanol, prior to electroless plating and the electrochemical deposition of the desired metal layer.

Abstract: Improved methods for electroplating non-conducting substrates are disclosed utilizing aqueous alkali metal containing adhesion promoter solutions to enhance the surface deposition of colloidal metal activating catalysts to form conducting layers capable of direct electroplating. The adhesion promoter solutions contain sufficient alkali metal ions to deposit trace amounts of metal ions onto the substrate surface to be plated. Copper ions may be incorporated into the adhesion promoters to enhance this effect. These adhesion promoter solutions eliminate the swelling and related problems associated with the direct electroplating of acrylic and epoxy containing substrates. Following adhesion promoter treatment, the substrates are conditioned with a cleaner/conditioner solution and catalytically activated with a colloidal catalyst of palladium and tin forming a highly conductive catalytically treated surface which will support subsequent direct electroplating in conventional plating baths.

Abstract: Method of modifying a polycarbonate surface to improve adhesion of a metal layer thereon and to the articles produced therefrom. The surface is first rendered hydrophilic by an exposure to actinic light such as ultraviolet light. The surface is then impregnated with a diffuser such as hydrochloric acid. The surface after impregnation is etched with a base such as potassium hydroxide and cleaned by oxidizing it with a solution of an oxidizing agent such as potassium permanganate. The cleaned surface is then neutralized by contacting it with a mild reducing agent. The chemically and physically modified surface is electrolessly plated with a primary metal layer. A secondary metal layer is then electrolessly or electrolytically applied on top of the primary metal layer until a metal layer of a desired thickness is attained.

Abstract: A flexible metal-film laminate can comprise a layered film structure having a metal layer securely bonded to a film layer. The laminate contains a unique metal-oxide attachment structure between the film and metal layer comprising randomly distributed regions of metal-oxide. The peel strength of such a laminate is significantly improved over prior laminates and is resistant to peel strength reduction due to environmental stress. The preferred metal-film laminates made with polyester or polyimide can be used in the manufacture of high-quality, low cost, flexible printed circuit boards.