Abstract: Medical devices, particularly stents, suitable for drug delivery and including a porous structure and/or colors are disclosed.

Abstract: A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode and a reference electrode and can reduce the molar ratio [Fe+3]/[Fe+2] to 1 ppm without depositing Fe or other metals on the working electrode or causing hydrogen evolution. The process is applicable to electroplating soft magnetic films such as NiFe, FeCo, and CoNiFe and can be performed during plating or during cell idling. The process is cost effective by reducing the amount of hazardous waste and tool down time due to routine solution swap. Other benefits are improved uniformity in composition and thickness of plated films because issues associated with decomposed reducing agents are avoided.

Abstract: The anode is separated from the alkaline electrode to avoid undesirable secondary reactions in an alkali zinc nickel electroplating bath.

Abstract: There is provided a composite plated product wherein a coating of a composite material containing carbon particles in a silver layer is formed on a substrate, the composite plated product having a large content of carbon and a large quantity of carbon particles on the surface thereof and having a low coefficient of friction and an excellent wear resistance. Carbon particles treated by an oxidation treatment and a silver matrix orientation adjusting agent are added to a silver plating solution for electroplating a substrate to adjust the orientation of a silver matrix to form a coating of a composite material, which contains the carbon particles in a silver layer, on the substrate.

Abstract: Provided is a cup-shaped plating apparatus which can plate the whole area of a plating target surface with a uniform film thickness. In a cup-shaped plating apparatus including a placement portion of an object to be plated which is provided at an opening end of a plating tank, means for supplying a plating solution into the plating tank, a plating solution outlet port which is formed in the plating tank, a cavity portion into which the plating solution which has flown out of the outlet port flows, a plating solution discharge port within the cavity portion, and a collection tank for the plating solution discharged from the discharge port, which subjects the object to be plated to plating treatment while supplying the plating solution into the plating tank, the shape and/or opening area of the discharge port formed on the downstream side of the cavity portion can be changed.

Abstract: A system and method for reducing ferric ion content in a plating solution by exposing hydrogen to an electrode in a plating solution for reducing a ferric ion content in the plating solution.

Abstract: A method of photochemically reducing iron(III) species in an iron or iron alloy plating solution by adding an additive to the electroplating solution; contacting the additive with iron(III) species to form an iron(III)-additive species; and irradiating the electroplating solution, wherein the radiation is of sufficient energy to reduce the iron(III) in the iron(III)-additive species to iron(II). The additive comprises hydroxycarboxylic acids and their lactones.

Abstract: A method of electroplating iron or an iron alloy with a solution containing an iron-chelating agent to catalytically cycle the undesirable Fe(III) species back to Fe(II) for electroplating. The iron-chelating agents may be siderophores, specifically, for example, desferrioxamine E, desferrioxamine B, alcaligin, bisucaberin, putrebactin, rhodotorulic acid, enterobactin, vibriobactin, azotochelin, myxochelin, fluvibactin, and serratiochelin.

Abstract: The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.

Abstract: A method and system for preventing gas bubble formation on a selected region of a wafer surface as the surface is brought in contact with a process solution for an electrochemical process is provided. The present invention employs the process solution to prevent or remove gas bubbles from the wafer surface during or before the electrochemical processing of the wafer surface. Accordingly, during the process, the wafer surface is initially brought in proximity of the surface of the process solution. Next, a process solution flow is directed towards the selected region of the wafer surface for a predetermined time. In the following step, the selected region of the wafer surface is contacted with the process solution flow for the predetermined time to prevent bubble formation, and the wafer surface is immersed into the process solution for electrochemical processing.

Abstract: The present invention relates to an anodic oxidation method and a treatment apparatus thereof which is suitable, for example, for generation of an oxide film and electropolishing of aluminum, capable of generating an oxide film at a low cost and rapidly by eliminating the use of electrolytic solution having a strong acid property and using a carbonated water as the electrolytic solution, capable of improving the oxide film generating operation and rationalizing the water discharging treatment, capable of preventing increase in temperature of the electrolytic solution without a need of a special equipment, capable of generating an oxide film in a stable manner and obtaining a good oxide film by eliminating the generation of oxide in the vicinity of an object to be treated, and capable of rationalization of the oxide film generating treatment and enhancing the productivity by using supercritical carbon dioxide. An object (3) to be treated is electrolyzed as an anode in an electrolytic solution.

Abstract: A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and X and Y may be the same only when they are a carbon atom, and by contacting the electrolytic copper plating solution with ozone is disclosed.

Abstract: The present invention provides a system and method for selectively removing one or more organic and inorganic and also preferably one or more inorganic contaminants from plating baths. More particularly, the invented method relates to the use of a source of energy in combination with chemical oxidants, alone or in conjunction with a catalyst to oxidize organic contaminants in the plating bath to a level such that the electroplating bath can be recovered and reused after appropriate chemical adjustment. The oxidative treatment method may be a continuous process or a batch process that is performed in a single pass. Residual organics, if desired and chloride ions in the bath are removed from the solution by a chemisorption or physisorption treatment. Inorganic contaminants are removed from the electroplating bath by selective ion exchange resins or electrodialysis, while particulate and suspended colloidal particles are removed by filtration before the treated plating bath is recycled.

Abstract: A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plating solution is supplied by causing an impregnated member containing the plating solution to face the conductive layer. Since the plating solution stays in the depression, a larger amount of plating solution is supplied than on the upper surface of the substrate, and the plating rate of the plating film in the depression increases. Consequently, the plating film can be preferentially formed in the depression such as a groove or hole.

Abstract: In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and the present invention can recycle a foemer plating solution to prepare a new plating solution, for example, in the following order: a process for preparing a Sn—Bi alloy plating solution (S1); a process for an active carbon treatment to remove the completing agent (S2); a process for removing Bi (S3); a process for a sedimenting treatment (S4); and a process for analyzing and correcting Sn plating solution. The recycling of plating solutions eliminates their effluent treatment and reduces environmental loads, effluent costs, and costs for purchasing new solutions. In the administration of the plating solution compositions, the conventional data can be utilized to facilitate the administrating operation.

Abstract: The invention relates to a method for combinatorially producing a library of materials by means of an electrochemical deposition in an array. The inventive library is made from an array of containers that consist of an electroconductive material, are open to the top and are electroconductively connected to a shared current supply device and is made from a corresponding array of auxiliary electrodes that are electroconductively connected to a shared current supply device and are arranged in such a way that an auxiliary electrode plunges into a container respectively or can be introduced therein without touching said container. The inventive method comprises the following steps: filling the containers with electrolytes having different compositions and containing electrolytically separable elements and applying an electric voltage between the current supply devices of the containers and auxiliary electrodes for obtaining an electrolytic deposition on the surfaces of the containers.

Abstract: An apparatus and method is provided for analyzing or conditioning an electrochemical bath. One aspect of the invention provides a method for analyzing an electrochemical bath in an electrochemical deposition process including providing a first electrochemical bath having a first bath composition, utilizing the first electrochemical bath in an electrochemical deposition process to form a second electrochemical bath having a second bath composition and analyzing the first and second compositions to identify one or more constituents generated in the electrochemical deposition process. Additive material having a composition that is substantially the same as all or at least some of the one or more constituents generated in the electrochemical deposition process may be added to another electrochemical bath to produce a desired chemical composition.

Abstract: A system for use with a plating cell configured to plate objects in a plating process. At least one byproduct is created in a plating substance used in the plating cell. The system includes a purification system configured to remove at least a portion of the at least one byproduct from the plating substance. The purification system comprises at least a first processing vessel, a second processing vessel, and a flow path providing flow from the first processing vessel to the second processing vessel. The flow path may be configured such that the flow from the first vessel to the second vessel is caused by gravity. A method is also provided for removing at least a portion of at least one byproduct from a plating substance used in a plating cell.

Abstract: A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient to promote dissolution of the hydrogen peroxide and generation of hydroxyl radicals; and adding an amount of an iron-containing compound so as to increase the rate of dissolution of the hydrogen peroxide to hydroxyl radicals so as to oxidize the organic compounds; whereby the total amount of organic carbon compounds in the solution is reduced. The apparatus comprises a treatment vessel, a pump for transferring a portion of the solution from the vessel to a mixing tank and for transferring a second portion of the solution to a heat exchanger for heating or cooling the second portion of the solution and a pump for transferring hydrogen peroxide to the vessel.

Abstract: Electrolytic copper plating methods are provided, wherein copper is electrolytically deposited on a substrate, and the electrolytic copper plating solution supplied to the electrolytic copper plating is subjected to dummy electrolysis using an insoluble anode. The method described above can maintain and restore the electrolytic copper plating solution so as to maintain satisfactory appearance of plated copper, fineness of deposited copper film, and via-filling.

Abstract: A method to determine and monitor concentrations of inert metal plating components in metal plating baths. An inert indictor is included in the bath composition and the concentration of the inert indictor is monitored during plating. The change in the concentration of the inert indicator is used to determine the change in the concentration of inert bath components.

Abstract: In the conventional plating process, plating solutions are newly prepared and the plating solutions used previously are dumped as industrial wastes, which is accompanied by environmental loads, effluent costs, costs for purchasing new solutions, and the like, and the present invention can recycle a foemer plating solution to prepare a new plating solution, for example, in the following order: a process for preparing a Sn—Bi alloy plating solution (S1); a process for an active carbon treatment to remove the completing agent (S2); a process for removing Bi (S3); a process for a sedimenting treatment (S4); and a process for analyzing and correcting Sn plating solution. The recycling of plating solutions eliminates their effluent treatment and reduces environmental loads, effluent costs, and costs for purchasing new solutions. In the administration of the plating solution compositions, the conventional data can be utilized to facilitate the administrating operation.

Abstract: The present invention relates to a method of modifying a surface. The method may include introducing a liquid to a first cluster generation site. The liquid includes an oxidizing agent, such as hydroxylamine. The liquid is subjected to electrical forces higher than a surface tension of said liquid to prepare a first plurality of clusters. Clusters of the first plurality of clusters are impacted upon the surface.

Abstract: Embodiments of the invention provide a method and formulations for preventing foam formation inside a plating apparatus prior to or during plating a material on a substrate. In one embodiment, a method for preventing foam formation inside a plating apparatus designed for plating a material on a substrate includes providing an electrolyte solution containing at least one antifoaming agent, at least one metal ion source, and a supporting electrolyte. The method further includes placing the substrate onto a substrate holder of the plating apparatus, immersing the substrate in the electrolyte solution, and depositing the material onto the substrate.

Abstract: The invention deals with the technical problem to devise a process for the extended use of electrolytes which economically ensures a high electrolyte quality without having to accept production interruptions for regeneration. Especially, it is envisaged to conduct the process for the precipitation of non-glaring metal coatings in such a manner that work can proceed in three shifts for five days per week, without encountering production interruptions due to coagulation of the fine dispersal phase, respectively, and without the additional operating cost of a heating/cooling circuit. The invention solves the problem in that during the extended use of an electrolyte a partial flow is split off which is filtered and, if applicable, regenerated by the addition of active substances and reintegrated in the operating cycle.

Abstract: A method and system for preventing gas bubble formation on a selected region of a wafer surface as the surface is brought in contact with a process solution for an electrochemical process is provided. The present invention employs the process solution to prevent or remove gas bubbles from the wafer surface during or before the electrochemical processing of the wafer surface. Accordingly, during the process, the wafer surface is initially brought in proximity of the surface of the process solution. Next, a process solution flow is directed towards the selected region of the wafer surface for a predetermined time. In the following step, the selected region of the wafer surface is contacted with the process solution flow for the predetermined time to prevent bubble formation, and the wafer surface is immersed into the process solution for electrochemical processing.

Abstract: An anode assembly by which a solution can be supplied to a surface of a semiconductor substrate includes a housing defining an internal housing volume into which the solution can flow. A closure is provided for the internal housing volume, and the solution can be discharged from the internal housing volume through the closure towards the surface of the semiconductor substrate. A filter divides the internal housing volume into a first chamber and a second chamber located between the first chamber and the closure. During supply of the solution to the surface, a flow of the solution into the second chamber occurs at a higher rate than a flow of the solution into the first chamber, and the flows are blended in the second chamber.

Abstract: The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.

Abstract: The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with use of a plating liquid having high throwing power and leveling properties, and which can make film thickness of a plated film substantially equal between an interconnection region and a non-interconnection region. A plating method comprises filling a plating liquid containing metal ions and an additive into a plating space formed between a substrate and an anode disposed closely to the substrate so as to face the substrate, and changing concentration of the additive in the plating liquid filled into the plating space during a plating process.

Abstract: One embodiment of the present invention is a method for electrofilling a metal or alloy inside at least one opening located in a front surface of a substrate, said front surface of the substrate includes the at least one opening and a top field surrounding the at least one opening, said at least one opening includes a bottom and sidewalls surfaces wherein at least the bottom surface comprises an exposed metallic surface, said method includes steps of: (a) immersing the substrate in an activation (or wetting) solution; (b) applying ultrasonic or megasonic vibrations to the substrate and to the activation (or wetting) solution; (c) applying high pressure electrolyte jets to the substrate, said electrolyte includes metallic ions of said metal or alloy; and (d) applying an electroplating current to the substrate to electroplate said metal or alloy inside the at least one opening.

Abstract: The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.

Abstract: By means of a pump for supplying a processing fluid such as a plating fluid to a closed processing cup such as a closed plating cup, at least either the pressure or flow rate of the processing fluid or plating fluid circulating within the closed processing cup or the closed plating cup is cyclically changed. Further, the direction of circulation of the processing fluid circulating within the closed processing cup is also changed cyclically. Under a method of manufacturing a semiconductor device and a method of manufacturing a printed board, a semiconductor wafer and a printed board are disposed in the closed plating cup such that blind holes formed by closing openings on one end of via holes or openings on one end of through holes are brought into contact with a circulating plating fluid, thereby eliminating air bubbles that remain. As a result, a manufacturing yield or performance of a product is improved.

Abstract: An apparatus is provided for manipulating droplets. The apparatus is a single-sided electrode design in which all conductive elements are contained on one surface on which droplets are manipulated. An additional surface can be provided parallel with the first surface for the purpose of containing the droplets to be manipulated. Droplets are manipulated by performing electrowetting-based techniques in which electrodes contained on or embedded in the first surface are sequentially energized and de-energized in a controlled manner. The apparatus enables a number of droplet manipulation processes, including merging and mixing two droplets together, splitting a droplet into two or more droplets, sampling a continuous liquid flow by forming from the flow individually controllable droplets, and iterative binary or digital mixing of droplets to obtain a desired mixing ratio.

Abstract: An electro-chemical deposition apparatus and method are generally provided. In one embodiment of the invention, an electro-chemical deposition apparatus includes a housing having a substrate support disposed therein and adapted to rotate a substrate. One or more electrical contact elements are disposed on the substrate support. A drive system is disposed proximate the housing. The drive system is magnetically coupled to and adapted to rotate the substrate support. In another embodiment, a method of plating a substrate includes the steps of covering a substrate supported within a housing with electrolyte, and displacing a portion of the electrolyte from the housing prior to electrically biasing the substrate, and electrically biasing the substrate.

Abstract: A method and system are disclosed for plating objects. At least one aspect associated with the object plating is monitored to determine the amount of at least one byproduct created during the plating and/or the reduction in the amount of at least one plating component. Based on this monitored aspect, an adjustment is made to the flow rate of substances added to a plating cell and/or the flow rate of used plating substances drained from the plating cell. The used plating substances are purified to remove at least some of the byproduct and then the purified plating substances are combined with at least one component before passing back into the plating cell to reuse at least some of the plating substances. The method and system could be used during the plating of semiconductor wafers with copper.

Abstract: A recovery system for platinum electrolytic baths operating at low current densities is disclosed. An oxidizing system is provided in a closed-loop recirculation system for platinum plating at low current densities. The oxidizing system reoxidizes Pt+2 ions, which are typically formed at low current densities, to Pt+4 ions by using oxidizers, for example peroxide. A sensor may be also provided to detect the relative concentration of [Pt+2] ions to [Pt+4] ions and to tailor the relative concentrations to a predetermined level.

Abstract: Embodiments of the invention generally provide an apparatus and method for replenishing organic molecules in an electroplating bath. The replenishment process of the present invention may occur on a real-time basis, and therefore, the concentration of organics minimally varies from desired concentration levels. The replenishment method generally includes conducting pre-processing depletion measurements in order to determine organic depletion rates per current density applied in the electroplating system. Once the organic depletion rates per current density are determined, these depletion rates may be applied to an electroplating processing recipe to calculate the volume of organic depletion per recipe step. The calculated volume of organic depletion per recipe step may then be used to determine the volume of organic molecule replenishment per unit of time that is required per recipe step in order to maintain a desired concentration of organics in the plating solution.

Abstract: A method and associated apparatus of electroplating an object and filling small features. The method comprises immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features. In one embodiment, the mechanical enhancement comprises mechanically vibrating the plating surface. In another embodiment, the mechanical enhancement comprises mechanically vibrating the electrolyte solution. In a further embodiment, the mechanical enhancement comprises increasing the pressure applied to the electrolyte solution.

Abstract: An electrolyte line extends from the outlet of an electrolysis device to a collecting tank and from the same back to the inlet of the electrolysis device. The electrolyte is passed from the outlet of the electrolysis device to a first container which is disposed at a higher level than a second container. Electrolyte collected in the first container is periodically discharged through a first syphon line into the second container, and electrolyte collected in the second container is periodically discharged through a second syphon line into the collecting tank which is disposed at a lower level than the second container. The outlet end of each syphon line is disposed at a distance above the liquid level of the container disposed thereunder, so that electrolyte always flows only in one of the two syphon lines or in none of the syphon lines. When electrolyte flows in none of the two syphon lines, electrolyte is preferably supplied from the collecting tank into the second container.

Abstract: A method and apparatus for removing degraded organics from an electroplating solution by passing at least a portion of electroplating solution through a filter. The apparatus generally includes a deposition cell including a fluid inlet, a fluid reservoir, and at least one filter disposed between the reservoir and the fluid inlet. The apparatus may further include a control valve disposed between the fluid reservoir and the fluid inlet for passing at least a portion of an electroplating solution to a recovery stream including the at least one filter.

Abstract: A method and apparatus for treating an aqueous electroplating bath solution. The method comprises continuously agitating the solution; adjusting the pH of the solution, adjusting the temperature of the solution while adding an amount of hydrogen peroxide sufficient to promote dissolution of the hydrogen peroxide and generation of hydroxyl radicals; and adding an amount of an iron-containing compound so as to increase the rate of dissolution of the hydrogen peroxide to hydroxyl radicals so as to oxidize the organic compounds; whereby the total amount of organic carbon compounds in the solution is reduced. The apparatus comprises a treatment vessel, a pump for transferring a portion of the solution from the vessel to a mixing tank and for transferring a second portion of the solution to a heat exchanger for heating or cooling the second portion of the solution and a pump for transferring hydrogen peroxide to the vessel.

Abstract: A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge (electro-plasma) is established at the surface of the workpiece by suitable adjustment of the operating parameters, characterized in that the working gap between the anode and the cathode is filled with an electrically conductive medium consisting of a foam (9) comprising a gas/vapor phase and a liquid phase. The process can be adapted for simultaneously coating the metal surface by including ions of the species required to form the coating in the electrically conductive medium.

Abstract: A process for galvanic depositing of a dispersion layer on a surface of a work piece, in particular a contact layer on a plain bearing half liner, is described, where an electrolyte with the dispersed phase finely distributed therein is moved opposite the work piece surface to be coated with formation of a flow component parallel to the surface. In order to create advantageous processing conditions, the surface of the work piece to be coated is profiled prior to coating with an average minimum profile depth of 5 &mgr;m and is then coated transversely to a salient profile direction in a flow component of the electrolyte opposite the work piece surface.

Abstract: A process for recovering vanadium contained in inorganic acid solutions by precipitating the vanadium as a solid compound of vanadium and alkali metal or monovalent cation ferricyanide. Separation is carried out electrochemically by depositing the compound on to a metal immersed in the acid solution that contains vanadium, to which a ferricyanide salt of an alkali metal or a monovalent cation has been added. If the inorganic acid present in solution is different from nitric acid, the vanadium can be also separated by direct addition of a ferricyanide salt of an alkali metal or a monovalent cation to the acid solution containing vanadium. The method described allows recovery of vanadium without modifying the initial composition of the solution, except for the concentration of the vanadium dissolved.

Abstract: A method and associated apparatus of electroplating an object and filling small features. The method comprises immersing the plating surface into an electrolyte solution and mechanically enhancing the concentration of metal ions in the electrolyte solution in the features. In one embodiment, the mechanical enhancement comprises mechanically vibrating the plating surface. In another embodiment, the mechanical enhancement comprises mechanically vibrating the electrolyte solution. In a further embodiment, the mechanical enhancement comprises increasing the pressure applied to the electrolyte solution.

Abstract: To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

Abstract: The present invention provides a plating apparatus comprising: a plating bath filled with a plating solution; at least an anode in the plating solution; at least a plating object which serves as a cathode in the plating solution, so that the at least plating object is distanced from the at least anode; and at least a dummy cathode in the plating solution, so that the at least dummy cathode is applied with voltage to suppress a substitute-deposition of metal ions in the plating solution.

Abstract: The present invention relates to a plating method and a plating apparatus which can attain embedding of copper into fine interconnection patterns with the use of a plating liquid having high throwing power and leveling properties, and which can make the film thickness of the plated film substantially equal between the interconnection region and the non-interconnection region, thereby facilitating a later CMP processing. A plating method comprising filling a plating liquid containing metal ions and an additive into a plating space formed between a substrate and an anode disposed closely to the substrate so as to face the substrate, and changing the concentration of the additive in the plating liquid filled into the plating space during a plating process.

Abstract: The present invention provides a method of producing a zinc oxide film, which comprises applying current between a conductive base member immersed in an electrodepositing bath and a counter electrode immersed in the electrodepositing bath to form a zinc oxide film on the conductive base member, wherein the electrodepositing bath is maintained at a temperature of 50° C. or more and has a temperature profile such that the temperature of the electrodepositing bath is lower in the final stage of electrodeposition than in the initial of electrodeposition. By the present method, a zinc oxide film with the excellent effect of light containment is stably produced in a short time, thereby producing a solar cell with a high efficiency at low a cost.

Abstract: An electrochemical cell for use in electrochemical processes, such as plating processes, has a first electrode which extends circumferentially about at least a portion of an electrode chamber. The article being treated is the second electrode and is disposed within the chamber. Electrolyte is flowed between the two electrodes. Various construction details of the electrochemical cell are developed which facilitate a plating process. In one embodiment, a supply conduit to the electrode chamber has a swirler.