For A Circuit Board Patents (Class 206/706)
  • Patent number: 6683250
    Abstract: A protected electronic assembly is provided that includes an electronic device, an outer shell, and an inner layer. The outer shell is preferably made from a rigid polymeric material, located over the electronic device, and adapted to protect the electronic device from an environment. The inner layer is preferably made from a resilient polymeric material, located between the electronic device and the outer shell, and adapted to cushion the electronic device from mechanical shock. A method of making the protected electronic assembly is also provided that includes providing an electronic device, disposing a resilient polymeric material as an inner layer around the electronic device to cushion the electronic device, and injection molding a rigid polymeric material as an outer shell around the resilient polymeric material to protect the electronic device.
    Type: Grant
    Filed: July 25, 2001
    Date of Patent: January 27, 2004
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Michael John Luettgen, Susan Marie Degrood
  • Patent number: 6587352
    Abstract: A female screw device is constructed to include a female screw rod adapted for mounting in a mounting hole of a motherboard to support an object above the motherboard, the female screw rod having an axially extended screw hole for the installation of a screw, and a quick-release cap adapted for fastening to the female screw rod to close the screw hole for enabling the female screw rod to be installed in a mounting hole of a motherboard by a SMT automatic machine, the quick-release cap having a cap body and a plurality of springy retaining arms adapted for fastening to the screw hole of the female screw rod to secure the cap body to the female screw rod to block up the screw hole.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: July 1, 2003
    Inventor: Chiang Chun Lin
  • Patent number: 6442035
    Abstract: A one-piece metal card cage has integral card guides provided by rows of formed projections that extend into the interior of the cage. The projections are hollow to provide ventilation openings through which air may flow to and from the interior of the cage. The card cage is fabricated from a one-piece sheet metal blank that is folded and joined together to provide top and bottom walls, opposite sidewalls, a backwall and a front opening.
    Type: Grant
    Filed: October 31, 2000
    Date of Patent: August 27, 2002
    Assignee: Marconi Communications, Inc.
    Inventors: Joseph C. Perry, Charles W. Atchison
  • Patent number: 6425178
    Abstract: A module integrated circuit (IC) carrier is used to move module ICs through a testing machine. The module IC carrier has a housing with a pair of installation elements installed parallel to one another in a receiving space of the housing. A plurality of holding members are installed on each of the installation elements. Each holding member on one of the installation elements faces a corresponding holding member on the other of the installation elements. Module ICs are held between corresponding pairs of the holding members. The holding elements can be biased towards each other to help hold the module ICs. Each holding element may include a rotator with a grooved edge which helps to hold a module IC, and which allows the module ICs to be easily inserted into and removed from the carrier.
    Type: Grant
    Filed: October 28, 1999
    Date of Patent: July 30, 2002
    Assignee: Mirae Corporation
    Inventors: Sang Soo Lee, Wan Gu Lee, Jong Won Kim, Hee Soo Kim, Young Hak Oh, Dong Chun Lee
  • Publication number: 20020084208
    Abstract: Methods and apparatus are provided in which a circuit board is mounted in a leader board via retaining elements that are coupled to a base, and wherein one or more support elements further support the circuit board.
    Type: Application
    Filed: December 28, 2000
    Publication date: July 4, 2002
    Inventor: Tony Charais
  • Publication number: 20020070144
    Abstract: The present invention discloses a test tray insert of a test handler comprising a housing, a locker, and a stopper, wherein one end side of the stopper is hinged on the inside of the mounting hole and the other end side of the stopper is protruded to the receiving hole so that the stopper fixes the device. The housing includes a receiving hole for loading a device in the center of the receiving hole, and a mounting hole, extended from both sides of the receiving hole, including a joint jaw. The locker inserted in the mounting hole of the housing, moves up and down. The stopper is placed in the bottom side of the locker.
    Type: Application
    Filed: October 17, 2001
    Publication date: June 13, 2002
    Inventors: Jae-Gyun Shim, Jeon Seung-won, Na Yun-sung, Jeon In-gu
  • Patent number: 6404651
    Abstract: An enclosure and method of making the same provides mounting provisions for shields of expansion cards in a general purpose computer that reduce the number of components and manufacturing steps to produce the enclosure, as well as reducing the time required to add or remove expansion cards. In particular, a housing of an enclosure incorporates a shield mount to receive a shield having an extending tongue and a lateral tab. A specific example of such a shield is tail stock for a Peripheral Component Interconnection (PCI) expansion card. In particular, a receptor is formed into the housing for receiving the extending tongue of the shield. A support member extends outward from the enclosure to abut an outwardly bent tab of the shield that projects out of the panel through a tab opening adjacent to the support member. The support member includes a locking detent that fits within a locking recess in the tab of the shield.
    Type: Grant
    Filed: November 27, 2000
    Date of Patent: June 11, 2002
    Assignee: International Business Machines Corporation
    Inventors: Bradley L. Martin, William Michael Monson, Stephen Peter Mroz
  • Patent number: 6399887
    Abstract: A stud assembly structure of a computer mother board capable of being assembled by an automatic machine includes a screw hole and a quick detaching cover. The stud is provided to be inserted in each assembling hole in a mother board and a penetrating hole is installed therein. A circular buckling trench is installed at an outer periphery of the stud. The quick detaching cover has a cover piece for covering an opening of the screw hole of the stud. The periphery of the cover piece being formed with elastic clamping pieces extending toward the stud for clamping the stud so that the quick detaching cover is detachably assembled to the stud temporarily. Therefore, the stud with quick detaching cover is provided to a SMT automatic machine for absorbing the cover piece by vacuum for picking the stud to a predetermined position. Then, the stud is inserted into the assembling hole. Then, the stud is released so as to complete the assembly work. Therefore, the whole assembly work is quick, accurate and quick.
    Type: Grant
    Filed: June 5, 2000
    Date of Patent: June 4, 2002
    Inventor: Chiang Chun Lin
  • Patent number: 6381142
    Abstract: An electronic component is disclosed, which is easily attached to or detached from a target body, without using a holding mechanism at the body side. The electronic component has an electronic circuit and is provided in a body of a device. The electronic component comprises a main portion having a plate shape which enables this portion to be inserted into the body; and elastic members, provided at the top and bottom faces of the main portion, for pushing the main portion towards an inner face of the body when the main portion is inserted into the body, so as to fit the main portion in the body.
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: April 30, 2002
    Assignee: NEC Corporation
    Inventor: Takumi Hasegawa
  • Patent number: 6356457
    Abstract: A support mechanism for a part of a circuit card includes a support member (slide) which forms a fixed part. The support member defines a guide. It also includes a slideable member for engaging the circuit card. The slideable member (slider) is slideable along the guide to a position for engaging the card. The slider defines a jaw for engaging the circuit card. The jaw can be provided with a protrusion for engaging with a hole in the corner of a circuit card, for example a PCI card. The mechanism enables the supporting of cards of different lengths due to the slideability of the slide along the guide. The guide and the slider can be formed with inter-engaging structures of appropriate shapes, for example, co-operating dovetail shapes.
    Type: Grant
    Filed: June 7, 1999
    Date of Patent: March 12, 2002
    Assignee: Sun Microsystems, Inc.
    Inventor: Stephen P Haworth
  • Patent number: 6343707
    Abstract: A memory card casing includes a plastic framework, and upper and lower metal covers that could be conveniently assembled to two sides of the plastic framework. The metal covers are fastened to each other via fastening means spaced on perpendicular wall portions of the metal covers. Each of the fastening means includes first and second fastening plates. The plastic framework is provided with retaining means, each of which includes a neck portion inward projected from and perpendicular to inner wall surface of the plastic framework and an expanded head portion in front of the neck portion.
    Type: Grant
    Filed: April 16, 2001
    Date of Patent: February 5, 2002
    Inventor: Tsung-Kan Cheng
  • Patent number: 6337797
    Abstract: A network interface card frame comprises chiefly an upper and a lower cover with a metal plate embedded inside respectively and a circuit board encapsulated between the two covers. At both lateral sides of metal plates designed a continuous first folding and second folding rim, a plurality of holes disposed on the second folding rim in order to make metal plates firmly secured within upper and lower plastic frame. At perimeter of the lower connection section of upper cover, a convex edge arranged there with an exterior angle on it. And a concave edge is mounted on the upper connection section of lower cover, corresponding to the convex edge, with a lead angle formed on the interior angle of the concave edge. The exterior angle of convex edge on upper cover could be mounted on the lead angle of the concave edge on lower cover, then the two covers are welded together by using sonic welding so as to avoid welding material spilling over on the surface of interface card.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: January 8, 2002
    Assignee: Teconn Electronics Inc.
    Inventor: Tzu-Sung Huang
  • Patent number: 6320759
    Abstract: A plastic, one-piece adapter for a printed circuit board (PCB) holds the PCB within a recessed area by means of a series of fixed, overhanging tabs and a series of snap latches, all of which are integrally molded as part of the one-piece adapter.
    Type: Grant
    Filed: August 24, 1999
    Date of Patent: November 20, 2001
    Assignee: ADC DSL Systems, Inc.
    Inventors: Robert D. Tusan, Thomas A. Herrington, Jerry Arreola
  • Patent number: 6314000
    Abstract: An enclosure having two walls an attenuation distance apart from each other perpendicular to the plate of the enclosure. At least one of the walls is orbitally riveted or soldered to the plate of the enclosure. Having two walls an attenuation distance from each other is particularly advantageous for RF components. The two walls can be placed to surround the RF component to reduce the RF energy generated by the component that escapes in to the atmosphere, or the two walls can be placed to separate the RF component from other component in the same enclosure to reduce the interference of the RF component with the other components. Alternatively, the enclosure can have a single wall orbitally riveted to the plate of the enclosure with an RF gasket attached to the entire length of the wall to reduce the amount of RF energy that is able to pass around the wall.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: November 6, 2001
    Assignee: Lucent Technologies Inc.
    Inventor: Michael Gunnar Johnson
  • Publication number: 20010027933
    Abstract: An accommodation container including: at least one first container body and at least one second container body which can be stacked onto the at least one first container body, respectively, and at least one accommodation part provided between the at least one first container body and the at least one second container body, the accommodation part being capable of accommodating a semiconductor device having a plurality of external connection terminals. The accommodation part is made of a soft material at least at a portion to be in contact with the external connection terminals of the semiconductor device.
    Type: Application
    Filed: May 26, 1999
    Publication date: October 11, 2001
    Inventors: KEIICHI SASAMURA, HIDEYASU HASHIBA, YUKIO ANDO, SHIGEO SUZUKI, YUUKI KANAZAWA
  • Patent number: 6285556
    Abstract: A molded circuit board securement and voltage isolation device is provided for use with one or more circuit boards or related electrical apparatus in an electrical enclosure. The device includes an open housing which has a base and opposing side walls positioned transversely with respect to the base. A stiffener such as a bridge is provided to provide the physical stiffness for the device and to resist mechanical vibration. The bridge spans the opposing side walls which have slots formed therein to permit the receipt of electrical apparatus such as circuit boards, for example. Circuit boards are secured in the device in substantially perpendicular alignment both with respect to the base and the opposing side walls. In another aspect of this device, at least two circuit boards can be positioned in a housing with a solid support wall formed between them to conserve available space.
    Type: Grant
    Filed: August 5, 1999
    Date of Patent: September 4, 2001
    Assignee: Eaton Corporation
    Inventors: Matthew T. Guth, Rolando F. Martinez
  • Publication number: 20010015327
    Abstract: In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are sealed, by heat-sealing, in a bag moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging. The devices are packaged in a moisture-proofing bag made of a laminate film, and a desiccant is sealed, by heat-sealing the bag, in the moisture-proofing bag together with the, e.g., surface mount semiconductor device having a plastic package encapsulating the semiconductor device. A caution is provided for the bag, that the devices should be presented from moisture absorption after opening the bag.
    Type: Application
    Filed: April 30, 2001
    Publication date: August 23, 2001
    Inventors: Wahei Kitamura, Gen Murakami, Kunihiko Nishi
  • Publication number: 20010013483
    Abstract: In a storage case 10 for enclosing a memory card, for example, there is provided a storage case which can reliably be prevented from being smudged by dusts and can reliably be prevented from being dropped unintentionally and which is also easy to handle.
    Type: Application
    Filed: December 14, 2000
    Publication date: August 16, 2001
    Inventors: Toshikazu Konno, Chika Nakata, Masahiro Kinoshita, Makoto Yamaguchi
  • Patent number: 6229710
    Abstract: A computer main board case including a main base seat. Lateral sides of the main base seat are disposed with upright boards. The upper edges of the upright boards are formed with flanges having latch slots. The edge of the base frame is formed with latch hooks and latch forks for respectively latching in the latch slots of the upright boards and clamping the upper and lower faces of the flanges so as to latch and mount the base frame on the first and second upright boards of the main base seat. The surface of the main base seat is formed with two guide channels and a stopper section. The bottom face of the main board base seat is formed with two guide channels slidably fitted with the guide channels of the main base seat, whereby the main board base seat and the main board mounted thereon are movable relative to the main base seat. A shifting lever is pivotally disposed on the bottom face of the main board base seat. The shifting lever has a cam section at one end.
    Type: Grant
    Filed: September 28, 1999
    Date of Patent: May 8, 2001
    Assignee: Chenbro Micom Co., Ltd.
    Inventor: Feng-Ming Chen
  • Patent number: 6202883
    Abstract: A tray for semiconductor integrated circuit devices, including a plurality of first partition walls extending in a first direction, a plurality of second partition walls extending in a second direction at right angles with the first direction, and circumferential frame portions connecting end portions of the first and second partition walls. The regions surrounded by the first partition walls and the second partition walls constitute seating portions for seating semiconductor integrated circuit devices. The first partition walls are disposed such that one first partition wall is disposed between two rows of the seating portions which are adjacent to each other in the second direction. The second partition walls are disposed such that two second partition walls are disposed between two rows of the seating portions which are adjacent to each other in the first direction, and opening portions are formed between the two second partition walls.
    Type: Grant
    Filed: January 28, 1999
    Date of Patent: March 20, 2001
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Norio Narazaki, Yutaka Shiraishi, Osamu Kakinoki
  • Patent number: 6193069
    Abstract: The present invention provides integrated packaging for storing or transporting a circuit assembly. In an embodiment of the invention, a housing comprises a first side portion attached to the circuit assembly, a second side portion and means for coupling the first side portion to the second side portion wherein the second side portion is moveable to a first position when the circuit assembly is operating and the second side portion is moveable to a second position when the circuit assembly is to be transported, so that the housing encloses the circuit assembly.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: February 27, 2001
    Assignee: Compaq Computer Corporation
    Inventors: John L. Guenther, Donald D. Campbell, Brian D. Perry
  • Patent number: 6188581
    Abstract: An expandable housing for plug-in protectors for accommodating printed wiring board of varying length. The improved housing comprises a shell unit and a base unit. Both the shell and base units have a hollow longitudinally extending body with an opening at the front and rear portions, respectively. On at least one of the inner sidewalls in the cavity of the body of the shell unit is a first set of teeth running horizontally to the longitudinal axis of the body. On at least one of the outer sidewalls on the body of the base unit is a corresponding second set of teeth running horizontally to the longitudinal axis of the body. The cavity of the base unit supports and receives a portion of a printed wiring board containing surge protective devices, which is connected to pins extending from the front portion of the body of the base unit.
    Type: Grant
    Filed: January 13, 1999
    Date of Patent: February 13, 2001
    Assignee: Avaya Technology Corp.
    Inventor: Bassel Hage Daoud
  • Patent number: 6169662
    Abstract: The card removal method and system easily removes a PCA card from a powered on computer system while minimizing damage to the computer system and to the individual removing the PCA. The printed circuit assembly card removal system is comprised of: an ejection card including at least a first ejector extending from the surface of the ejection card, the ejector having a first surface for pressing against the edge of the PCA card to be removed, and an ejection card holder for mechanically supporting the ejection card. To remove the PCA, the ejection card is pulled outward causing the ejector to apply a force to the edge of the PCA card to be removed, forcing the card edge fingers of the PCA card out of the PCA connector.
    Type: Grant
    Filed: October 24, 1997
    Date of Patent: January 2, 2001
    Assignee: Hewlett-Packard Company
    Inventors: Thomas J. Clark, Alisa C. Sandoval
  • Patent number: 6164454
    Abstract: A storage container for semiconductor objects is disclosed. The invention has a mounting structure having an inner frame, a temperature sensitive adherent film and an outer frame. Semiconductor objects are placed on the temperature sensitive adherent and covered. The cover does not touch the semiconductor objects because it has a spacer made of non-stick material. The invention stores semiconductor objects for a relatively long period of time in a safe and secure manner with minimal threat of breakage.
    Type: Grant
    Filed: August 17, 1998
    Date of Patent: December 26, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Joseph Michael Freund, George John Przybylek, Dennis Mark Romero
  • Patent number: 6166916
    Abstract: An adjustable circuit board support frame utilizes an adjustable frame assembly for receiving various size circuit boards having the desired interface connectors and logic circuits thereon so as to allow for necessary repair, expansion, or upgrade of the computer system. The present invention provides for the removability and replacement of any size circuit board within the computer housing at any time during manufacturing or in the field. A base computer system may be easily upgraded when more features are desired by interchanging the circuit board within the system and adjusting the frame assembly to the desired position.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: December 26, 2000
    Assignee: Unitrend, Inc.
    Inventor: Conrad A. H. Jelinger
  • Patent number: 6157543
    Abstract: The present invention generally provides a case for a printed circuit board which forms a single in-line pin configuration from an edge connected circuit board. The case includes a frame enclosing the edges of the circuit board and a base at a mounting plane side of the frame. Connector pins affixed to the edge connectors of a printed circuit board are secured to the printed circuit board and extend from the base. A tab extending generally parallel to the frame from an edge of the base provides a smooth vacuum pick up engagement surface for handling and placement of the present case.
    Type: Grant
    Filed: April 14, 1997
    Date of Patent: December 5, 2000
    Assignee: Power Trends, Inc.
    Inventors: Glynn Russell Ashdown, John Brett Barry
  • Patent number: 6153070
    Abstract: An environmental sensor apparatus and method of making same is disclosed in which an environmentally sensitive silicon die is sandwiched between an elastomeric media seal and a conductive elastomeric pad contained within a housing. The conductive elastomeric pad contacts a printed circuit board (PCB) which leads from the housing. The die, elastomers and PCB are secured by a press fit plug which contacts the PCB and is heat staked to the housing to provide a substantially flush hermetic seal.
    Type: Grant
    Filed: May 7, 1998
    Date of Patent: November 28, 2000
    Assignee: Honeywell Inc
    Inventors: D. Joseph Maurer, Said Karbassi, Richard W. Gehman
  • Patent number: 6144563
    Abstract: A host electronics device has slot for receiving an IC card. An IC protection or dummy card is provided for insertion into the slot. The card is a one-piece, substantially planar molded body. One end of the body receives a portion of the connector of the device in a manner such that a surface of the body exerts a frictional force on the connector. Portions of the body provide reinforcement for the slot.
    Type: Grant
    Filed: June 19, 1997
    Date of Patent: November 7, 2000
    Assignee: 3M Innovative Properties Company
    Inventors: Steven Feldman, Charles E. Connoley, Michael Bashkin, Philip Lindsay Powell
  • Patent number: 6137689
    Abstract: A protective enclosure apparatus includes a base and a cover. The base includes a plurality of pins each including cap portion. The cap portion includes a contact surface. A cover includes a plurality of cover openings formed therein for receiving the pins and a latch portion communicating with each of the cover openings. The latch portion is angled to allow an end portion of the latch portion to engage with the contact surface and to allow the latch portion to be biased toward the plurality pins when the cover is pulled away from the base.
    Type: Grant
    Filed: May 28, 1998
    Date of Patent: October 24, 2000
    Assignee: 3Com Corporation
    Inventors: Kevin J. Schechtel, David R. Zeiger, Michael B. Grimm
  • Patent number: 6128196
    Abstract: A chassis system for housing a plurality of circuit boards, such as PCI standard bus boards, provides a rack-mountable chassis having an open front side and a motherboard with a plurality of board connectors arranged side-by-side with respect to the front end. The boards are mounted in individual frameworks that facilitate ready installation and removal from the chassis. In particular, the chassis includes a plurality of receiving blocks at the bottom rear of the chassis, aligned with each of the motherboard connectors. The receiving blocks receive pivots mounted on the back of each framework. The framework is inserted into, and removed from the front opening of the chassis in an upwardly pivoted position that clears the motherboard connectors and other obstructions in the chassis. The framework is pivoted into and out of engagement with the motherboard when the pivot is located in the receiving blocks. The chassis can include top-mounted tracks. The tracks receive rollers on the framework.
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: October 3, 2000
    Assignee: Stratus Computer, Inc.
    Inventors: Willard O. Hoyle, Jr., Robert Craig Abraham, Keith A. St. Pierre, Vincent T. Curran
  • Patent number: 6116427
    Abstract: A tray is adapted to receive a plurality of ball grid array devices therein, and includes a base plate having a device-receiving portion and a peripheral portion around the device-receiving portion. The device-receiving portion has a top side formed with a device-receiving recess. The top side of the device-receiving portion is further formed with a partition unit in the device-receiving recess for dividing the device-receiving recess into a plurality of cavities adapted for receiving the ball grid array devices respectively therein. The device-receiving portion further has a bottom side formed with a plurality of openings. Each of the openings is aligned with a corresponding one of the cavities and is adapted to receive an array of ball contacts formed on a bottom side of the ball grid array device that is disposed in the corresponding one of the cavities therein.
    Type: Grant
    Filed: January 31, 2000
    Date of Patent: September 12, 2000
    Assignee: Silicon Integrated Systems Corp.
    Inventors: Chung-Ju Wu, Wei-Feng Lin, Chen-Wen Tsai
  • Patent number: 6035513
    Abstract: For economic reasons, space saving and simplicity in design, an assembly is provided of an electronic device and a flexible container with the electronic device inside the container and having electrical conductors extending from the chamber for connection to electrical equipment outside the container. To prevent overheating, the assembly also includes a heat transfer device. This device has a first heat conductive element-inside the chamber, and thermally connected to the electronic device, and a second heat conductive element disposed outside the container. The two heat conductive elements are fastened together with the wall of the container clamped between them for conduction of heat to the second element. To avoid forming apertures in the wall for connection purposes, the second heat conductive element is formed with channels at its edges which receive edges of the first element and with the wall in between and lying within the channels.
    Type: Grant
    Filed: February 23, 1999
    Date of Patent: March 14, 2000
    Assignee: Nortel Networks Corporation
    Inventors: L. Eugene Batten, Jr., Patrick L. Downie, Dennis A. McCullock
  • Patent number: 5982627
    Abstract: A frame is provided at the front end of the adapter card receiving area of a personal computer which includes card guides, a flex bar for retaining inserted cards and a dual function blocking member which has opposed blocking surfaces so arranged that they retain the locking bar respectively in a lock and open position respectively and transition between the two with simple, one-hand activation.
    Type: Grant
    Filed: May 14, 1998
    Date of Patent: November 9, 1999
    Assignee: International Business Machines Corporation
    Inventors: Peter Torgil Haughton, Rodrigo Samper, Joel Edwin Walker, Jacklin Ann Adams, Timothy S. Farrow
  • Patent number: 5978233
    Abstract: An apparatus is provided for coupling a printed circuit board within a printed circuit board cage. The apparatus includes a baseplate and a latch. The baseplate is mounted to the printed circuit board. The latch is rotably coupled to the baseplate. The latch includes a pivoting portion, a shaft, and a swell nut. The pivoting portion includes an ejector extending from an end of the pivoting portion. The ejector is engageable with the printed circuit board cage. The shaft is coupled to the pivoting portion. The swell nut is coupled to the shaft and engageable with the printed circuit board cage.
    Type: Grant
    Filed: June 18, 1998
    Date of Patent: November 2, 1999
    Inventors: Brett D. Roscoe, George D. Megason, Joseph R. Allen
  • Patent number: 5973934
    Abstract: An apparatus is provided for coupling a printed circuit board within a printed circuit board cage. The apparatus includes a first portion coupled to the printed circuit board cage. A second portion is rotatably coupled to the printed circuit board, and includes a cam surface formed on a first end portion thereof. The cam surface is engageable with an interior surface of a bore in the first portion to urge the second portion and the printed circuit board from a first position to a second position. The second portion also includes a latch formed on a second end portion thereof. The latch is engageable with a corresponding latch on the printed circuit board in response to the second portion being located in the second position.
    Type: Grant
    Filed: June 18, 1998
    Date of Patent: October 26, 1999
    Assignee: Compaq Computer Corporation
    Inventor: Brett Roscoe
  • Patent number: 5967814
    Abstract: An adjustable angle extender card is used to hot-test a circuit pack having electrical connectors that connect to back plane electrical connectors in an electrical cabinet when the circuit pack is inserted into the electrical cabinet. The extender card comprises a rigid basic board that can be inserted into the electrical cabinet and a rigid circuit pack card guide that accepts the circuit pack. The basic board includes plural replication electrical connectors, arranged along one edge of a substrate, for connection to the back plane electrical cabinet connectors when the basic board is inserted into the electrical cabinet, and plural basic board electrical connectors arranged along an opposite edge of the substrate. Corresponding replication connectors and basic board connectors are electrically connected.
    Type: Grant
    Filed: June 9, 1998
    Date of Patent: October 19, 1999
    Assignee: Lucent Technologies Inc.
    Inventor: Theodore Joseph Sikorski, Jr.
  • Patent number: 5927504
    Abstract: An apparatus for carrying plural printed circuit boards (PCBs) for semiconductor modules is disclosed. The apparatus comprises a main frame which is formed with an inside space for the PCBs. The main frame includes receivers for supporting one shorter edge of the PCBs. A clamp frame joined to the main frame includes a support plate for the other shorter edge of the PCBs. Movable clamps are elastically connected to the clamp frame so as to push the PCBs by elastic force when the PCBs are loaded into the apparatus. A adjustable mounting such as a slot or holes is provided in the main frame for fasteners joining two frames each other. Therefore, the apparatus can carry the PCBs of different size. The elastic connection between the clamp and the clamp frame is preferably made by slide bars and elastic members. Clamp holes, sub-walls, partition walls, hollow corners, and so forth may be preferably provided for the apparatus.
    Type: Grant
    Filed: June 23, 1998
    Date of Patent: July 27, 1999
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seong Chan Han, Dong Chun Lee, Kwang Su Yu, O Kyung Kwon
  • Patent number: 5926374
    Abstract: There is provided an IC card where a pair of, upper and lower metal panels are respectively fixed to the frame; edge portions of the metal panel are provided with bend portions; grooves each of which comprises a pair of uneven vertical walls having a plurality of depressions and projections extending in the direction of the width of the frame are provided on the top and bottom surfaces of the frame; the distance between the projections on both the uneven vertical walls in the direction of the width of the frame is set so as to be smaller than the thickness of the bend portions by a given amount; and the metal panel is fixed to the frame with the bend portions press-fitted into the grooves along the projections. The IC card is advantageous in the manufacturing cost and is capable of stably providing a fixing force sufficient to withstand a long-term use, with regard to the fixation of upper and lower panel members to a frame.
    Type: Grant
    Filed: April 17, 1998
    Date of Patent: July 20, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeo Onoda, Tomomi Morii, Kiyotaka Nishino
  • Patent number: 5921385
    Abstract: A housing for a personal computer card has a U-shaped plastic frame including flexible lateral arms and a connecting stay connecting the lateral flexible arms. The flexible lateral arms and the connecting stay define a plane of the plastic frame and delimit an inner receiving space for a personal computer card. The U-shaped plastic frame has an open end opposite the connecting stay for inserting a personal computer card into the plastic frame. The plastic frame has a guide arrangement open inwardly relative to the inner receiving space. The guide arrangement positions and secures the personal computer card in the plastic frame laterally and in a direction perpendicular to the plane of the plastic frame after insertion of the personal computer card into the inner receiving space.
    Type: Grant
    Filed: September 5, 1997
    Date of Patent: July 13, 1999
    Assignee: Stocko Metallwarenfabriken
    Inventors: Stefan Plotz, Walter Gross
  • Patent number: 5918746
    Abstract: A one side resin sealing type semiconductor device has a semiconductor element which is mounted on one side of a circuit board. Wiring patterns are provided on both sides of the circuit board. The semiconductor element mount portion is sealed with resin. External connecting terminals, such as soldering balls, are joined to the wiring pattern on the-other side of the circuit board. The method of manufacturing one side resin sealing type semiconductor devices includes the steps of: positioning and disposing the circuit board formed into an individual piece corresponding to a through-hole formed in a rectangular carrier frame; and conveying the circuit board supported by the carrier frame so as to conduct a series of processing steps such as mounting the semiconductor element, electrically connecting the semiconductor element with the wiring pattern, sealing the semiconductor element mount portion with resin, and connecting the wiring pattern with the external connecting terminals.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: July 6, 1999
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Masakuni Tokita, Mitsutoshi Higashi
  • Patent number: 5914864
    Abstract: A shock and vibration attenuating structure and method is provided for an electronic assembly including a distribution circuit and at least one electronic component mounted on a surface of the distribution circuit. The shock and vibration attenuating structure includes a layer of elastomer material adapted to overlay the distribution circuit and substantially conform to the at least one electronic component. The layer includes a negative image of at least part of the at least one electronic component to allow the elastomer material to envelope the at least part of the at least one electronic component, and at least one relief formed in the elastomer material. The at least one relief is spaced from the negative image of the at least one electronic component and has a predetermined size, shape, and location in the elastomer material selected to protect the electronic component from shock and vibration induced loads and deflections with the layer overlaying the electronic assembly.
    Type: Grant
    Filed: December 22, 1997
    Date of Patent: June 22, 1999
    Assignee: Ericsson Inc.
    Inventors: James D. MacDonald, Jr., Walter M. Marcinkiewicz, Rahul Gupta
  • Patent number: 5909359
    Abstract: An apparatus to extend printed circuit board length allows for secure mounting of the printed circuit boards. More particularly, the extender bracket apparatus (30) is for stabilizing small or short, commercial off the shelf (COTS) circuit boards (20) for personal computers (PC). The apparatus will aid in operation of small circuit boards for rugged applications such as high vibration conditions in vehicles. The extender bracket apparatus (30) is first fastened to an adjustable clamp (60), which is then fastened to a COTS circuit board. The adjustable clamp has holes that facilitate attaching to slots in the extender bracket apparatus. The clamp and extender board may have a dielectric surface to prevent electrical conduction. The dielectric can be an adhesive to hold the printed circuit board. The apparatus can then be fastened to a computer chassis (40) for rigidly mounting the circuit board.
    Type: Grant
    Filed: September 22, 1997
    Date of Patent: June 1, 1999
    Assignee: Motorola, Inc.
    Inventors: Mark David Summers, Ronald Newell Hamilton, Craig Bayman McIntosh
  • Patent number: 5811184
    Abstract: A particle getter is presented for protecting electronic circuitry from damage caused by particles or debris. An adhesive film is used to capture and retain particles, such as solder balls and wire trimmings, that pose a danger to the functioning of electronic circuitry, and thereby prevent short circuits and other malfunctions. The particle getter does not interfere with access to the circuitry, and thus may be used when conformal coating is not practicable. The particle getter is particularly useful for protecting electronic circuitry aboard a spacecraft, since particles that can cause a circuit malfunction float freely in the zero-gravity environment, where they can be captured and retained by the getter. The preferred adhesive film is space-qualified, and has outgassing properties that are within limits imposed by NASA specifications. The particle getter has applications in many places where debris is present, both in space and earthbound.
    Type: Grant
    Filed: June 4, 1996
    Date of Patent: September 22, 1998
    Assignee: Hughes Electronics Corporation
    Inventors: Edward A. Anderson, Mitchell T. Hatai, Mehrdad Mohtasham
  • Patent number: 5738219
    Abstract: Protective molded resilient flexible plastic package for a printed circuit board with a base and a cover member. The base and cover members have border regions with locking elements to detachably hold base and cover together to close the package. The border regions of one member has a wall which defines a step surface for contacting a marginal region of a surface of the board and a projection spaced from the step surface to engage the other surface of the board when this is in contact with the step surface. The other member has a rigid board engaging element for engaging the other surface of the board when the package is closed.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: April 14, 1998
    Assignee: Northern Telecom Limited
    Inventors: Biagio Arsena, Randall C. Gordon, Steve D. Tadge, Anthony H. J. Robinson
  • Patent number: 5727685
    Abstract: A cassette or box for containing and holding a planar substrate such as a reticle having a clamp bar coupled to corner supports by a spring or flexure and a linkage. A clamp bar is pivotally attached to bottom corner supports and a spring or flexure and linked to a top corner support, such that movement of the load bar causes the corner supports to pivot away from a reticle being held only at the corners. An elevation bar is also used to preposition the reticle in one direction. The present invention greatly facilitates the positioning and handling of a reticle as used in photolithography to manufacture semiconductor devices. Additionally, the present invention greatly reduces particulate contamination.
    Type: Grant
    Filed: July 24, 1996
    Date of Patent: March 17, 1998
    Assignee: SVG Lithography Systems, Inc.
    Inventors: Joseph Laganza, Hoon-Yeng Yap, Teodorico A. Cruz, Erik Magnussen, Craig S. Dunning
  • Patent number: 5719746
    Abstract: An IC card comprises a module with an electric circuit and two panels adhered to each other to cover the module between them. The two panels are adhered with an adhesive with a sufficient adhesion strength and seals the module with no path of air to the outside of the IC card. Airtight sealing of the IC card in realized in various ways. For example, a groove having a varying width is provided in one of the panels for applying an adhesive, while a groove engaging to the groove is provided in the other of the panels. When the two panels are adhered to each other, gas channels may be formed in the groove at portions with narrower widths, while an adhesive in the groove at portions with wider widths fills the gas channels due to viscosity. In another way, a protrusion provided in one of the panels has an edge opposite to a groove provided in the other of the panels. Thus, the groove is kept air-tight. In a different way, an adhesive having a high viscosity at curing temperature is used.
    Type: Grant
    Filed: January 17, 1996
    Date of Patent: February 17, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Jun Ohbuchi, Shigeo Onoda, Katsunori Ochi, Makoto Omori, Tetsuro Washida, Kiyotaka Nishino
  • Patent number: 5593040
    Abstract: A pallet holds one or more circuit boards for processing. A pallet opening for receiving the circuit board has grooves at one side to retain an edge of the circuit board and rotary clips at the other side to receive and hold the opposite edge of the board. Each clip is a disk which is mounted for rotation about a central axis and is constrained to two angular positions by a detent. A notch in the disk receives the circuit board when in one position and clamps the board against a seat when in the other position. The notch is deep enough to allow the board to be shifted laterally for alignment with test apparatus.
    Type: Grant
    Filed: December 4, 1995
    Date of Patent: January 14, 1997
    Assignee: Delco Electronics Corporation
    Inventors: Gary R. Shelton, Kyle R. Street
  • Patent number: 5531328
    Abstract: The present invention is a container for containing a PCMCIA card, or an electronic card similar thereto. The container comprises a box that has a bottom portion for holding the card, and a cover portion that is rotatably connected with the bottom portion in order to fit over the bottom portion in the closed position. In the closed position, the cover and bottom portions form a box compartment. The bottom portion comprises opposite side walls that have flexible arms, wherein each arm has a clasp and a cam member, as a single unit and integral with each arm's distal end. A PCMCIA card fits within the area defined by the bottom portion's side walls. The area within which the PCMCIA card fits is slightly smaller than the area of the compartment in order to allow flex spaces for the arms to flex when a PCMCIA card has been fitted between the arms.
    Type: Grant
    Filed: October 20, 1994
    Date of Patent: July 2, 1996
    Inventors: Donald R. Rochelo, Robert W. Jones
  • Patent number: 5450959
    Abstract: An apparatus for use in manufacturing an array of parts, such as printed circuit boards arranged in a multi-board panel. The array includes a plurality of the parts joined by frangible connections at a plurality of connection sites, and comprises a receptacle having a profiled upper face configured to generally retain the array in the receptacle in a predetermined orientation with each respective part having a predetermined locus when the array is in the predetermined orientation. The receptacle includes a plurality of apertures traversing the receptacle which are substantially in register with the connection sites when the array is in the predetermined orientation. The apertures are configured to accommodate punching severance of the frangible connections and passing of punched material from the punching severance through the apertures.
    Type: Grant
    Filed: August 30, 1994
    Date of Patent: September 19, 1995
    Assignee: Paragon Electric Company, Inc.
    Inventor: Keith C. Philippi
  • Patent number: 5447229
    Abstract: Industry-standard COT/TAB integrated circuit part carrier frame members are receivable into a shipping tube member in a stack which rests at one end on paired retaining pins and at the other end is retained by a closure member of the shipping tube. As so disposed in the shipping tube, the carrier frames are securely held with virtually no risk that they will slip out of place within the shipping tube. The shipping tube member includes side walls which define plural pairs of apertures spaced along the length of the shipping tube so that: the paired pins may be relocated to adapt the shipping tube to various shipment sizes. The remainder of the shipping tube remains empty to reduce both the cost of carrier frames conventionally used just as filler, as well as reducing shipping costs by eliminating the weight of these filler carrier frames which are shipped empty.
    Type: Grant
    Filed: June 28, 1993
    Date of Patent: September 5, 1995
    Assignee: LSI Logic Corporation
    Inventors: Brian Lynch, Patrick O'Brien, Adrian Murphy