Abstract: A substrate cassette having a conventional form, an open container having an upper entrance and a narrow lower opening formed by two side panels and two end panels. A preferred embodiment includes a train of substrate alignment channels on the inner surfaces of the two side panels, each channel is U shaped and having planar surface with a left surface, a right surface, and a bottom surface. An arcuate curbing member disposed on a left surface in each of the substrate alignment channels. The arcuate curbing member includes a top end with a thinner sloped profile facing the upper open entrance of the cassette allowing a substrate to slide through and under a stepped lower end.

Abstract: A packaging device and method for absorbing and reducing moisture as well as a manufacturing process for such device. The packaging device is a container made from paperboard such as containerboards or linerboards with a corrugated medium. The paperboard is insulated with moisture absorbing additives comprising charcoal, activated charcoal, activated carbon, or substances mostly comprised of carbon. Perforations may be added in the boards to further permit moisture to reach the corrugated medium, permitting further absorption by the additives embedded within the corrugated medium in between the boards. This packaging device and method is favorable for storing or transporting objects which are sensitive to or would benefit from low moisture/humidity conditions.

Abstract: A frame of a wafer boat is retrofitted with brace assemblies. The frame has left and right vertically extending, horizontally spaced supports. Each support has a plurality of slots above one another. A plurality of substantially horizontal wafers are horizontally insertable above one another with respective left edges of the wafers in respective ones of the slots of the left support and respective right edges of the wafers in respective ones of the slots of the right support. Each brace assembly includes a plurality of braces. Each brace has a respective upper surface in a respective position to support a lower surface of a respective wafer between and distant from the slots in which the left and right edges of the wafer are inserted.

Abstract: The boat and boat handle of the present invention are cooperatively designed for automatic interlocking engagement and release upon manipulation by a user. The boat includes a side rail that is designed with a lip portion for engagement within a slot formed in the handle, and a handle contact surface for contacting a gripping block member of the handle. The handle includes at least one boat holding block that is formed with a boat lip holding slot therewithin. The handle also includes at least one boat gripping block that is rotatably engaged with the holding block, and which includes a frontwardly projecting rail gripping flange. When the boat lip is brought into the holding block slot, the gripping block is caused to rotate such that the flange is brought over the top of the rail. The boat rail is thereby held between the slot and the flange of the handle, such that the boat may be lifted and moved through movement of the handle.

Abstract: The present invention relates to a silicon wafer carrier consisting of a composition composed of (a) 100 parts by weight of a polyester, (b) 5 to 100 parts by weight of a polyether ester amide, (c) 10 to 2,500 ppm (based on the polyether ester amide) of an alkaline metal and (d) 0 to 40 parts by weight of a modified polyolefin, generating not more than 10 ppm of volatile gas by the heat-treatment at 150° C. for 60 minutes and eluting not more than 10 ppm of the alkaline metal by the immersion treatment in pure water at 80° C. for 120 minutes. The silicon wafer carrier has the generation of volatile gas and the elution of metal suppressed to an extent not to essentially cause the surface contamination of a silicon wafer and is provided with excellent permanent antistaticity and high mechanical properties and heat-resistance.

Abstract: A thermal processing jig 1 made from quartz for use in manufacturing semiconductor devices is provided, which may effectively prevent deposition of contaminating metals on the semiconductor devices during heat treatments thereof, and a method of manufacturing such jig in the form having a good structure for fabrication. The thermal processing jig 1 is designed to support silicon wafers 2 during heat treatments thereof. The body of the jig is made from a first type of quartz 8 having high heat resistance such as electric fusion quartz, while those portions of the jig coming adjacent to said silicon wafers 2 are made from a second type of quartz 7 such as oxyhydrogen flame fusion quartz and synthetic quartz which contains only a small amount of metal impurities and does not liberate metal impurities appreciably during the heat treatments.

Abstract: A composite can having improved “green” strength is made by pattern printing adhesive onto the exterior label or cover such that the adhesive covers less than 100 percent of the surface of the label. The total amount of adhesive applied between the label and the paperboard body wall is thereby reduced, so that less moisture is added on to the paperboard relative to conventional can-making processes in which adhesive is flooded onto the entire surface of the label. A preferred embodiment of the invention comprises an easy-open can, such as a dough can, having the adhesive applied with relatively denser coverage on the portion of the label that overlies the spiral butt joint that is formed between edges of the spirally wound paperboard body ply, and with relatively less dense coverage on other portions of the label.

Abstract: This invention anneals a vertical stack of two or more groups of unseparated wafers, with approximately 10 wafers in each group. The invention makes it possible to anneal more wafers in a single annealing operation under a variety of conditions, including: oxygen outer diffusion annealing to form a denuded zone; annealing to control bulk micro defects and provide intrinsic gettering functions; annealing to enhance gate oxide integrity by eliminating crystal-originated particles from the wafer surface and internal grown-in or as-grown defects; and suppression of dislocation and slip in elevated temperature environments.