Abstract: Disclosed herein is a circuit board including: a core layer; first and second layers sequentially stacked on the core layer, wherein prominence-depressions having different sizes are formed on a surface of the first layer in each region of the core layer.

Abstract: The present invention provides a printed circuit board (PCB) board, a core for manufacturing the PCB board and a method for manufacturing the PCB board. The PCB board is in a shape of a rectangle and comprises a fiber layer formed of interlacedly weaved fiberglasses, a metal layer affixed onto a surface of the fiber layer, and a pair of differential signal traces formed on the metal layer, wherein extending directions of the fiberglasses lie at acute angles with respect to a length direction of the rectangle, and the pair of differential signal traces extends along a width direction or the length direction of the rectangle. The PCB board can effectively reduce the possibility of the skew distortion during the transmitting process of the differential signal through adjusting the angle between the fiberglasses and the edge of the core without adjusting or redesigning the original circuit layout.

Abstract: A printed circuit board (PCB) may be provided. The PCB may comprise a first electrically conductive layer comprising a first signal layer. Also, the PCB may comprise a second electrically conductive layer comprising a second signal layer or a plane layer associated with the first signal layer. The PCB may further comprise a waveguide layer disposed between the first electrically conductive layer and adjacent the second electrically conductive layer. The waveguide layer may transmit optical signals and function as a dielectric between the first electrically conductive layer and the second electrically conductive layer.

Abstract: Provided is a touch panel manufacturing method wherein the number of exposure masks needed for pattern formation is reduced, and a method for manufacturing a display device provided with a touch panel. A transparent conductive film layer (11) and a metal layer (12) are laminated on a transparent substrate (1), and the transparent conductive film layer (11) and the metal layer (12) are formed into predetermined electrode patterns, with use of one resist pattern. A protective film (13) covering the transparent conductive film layer (11) and the metal layer (12) is formed, and openings (14, 15, and 16) are provided at predetermined positioned in the protective film (13). By etching with use of the protective film (13) having the openings (14, 15, and 16), the metal layer (12) is removed so that the transparent conductive film layer (11) is exposed, whereby at least either touch electrodes (2) or connection terminals (5) are formed.

Abstract: A method for making a heater is provided. A support and a flexible substrate are provided. The flexible substrate is stretched along a first direction and is fixed on a surface of the support. An adhesive layer is coated on a surface of the flexible substrate. One end of a carbon nanotube film is attached on the flexible substrate via the adhesive layer. The carbon nanotube film is wrapped around the support by whirling the support to form a carbon nanotube structure. The flexible substrate is separated from the support and shrinks along the first direction. At least two electrodes are electrically connected with the carbon nanotube structure. A voltage is applied between the at least two electrodes to heat the carbon nanotube structure. The carbon nanotube structure heats and solidifies the adhesive layer.

Abstract: The invention provides a method of fabricating test strip for measuring biological fluid. The method comprises steps of: preparing a metallic membrane and an insulating material; adhering the metallic membrane on the insulating material; photolithographing for the metallic membrane; etching the metallic membrane to form a circuit layer; providing a sensing reagent on the circuit layer to form a sensing reagent layer; and adhering an intermediate layer and a cover to the insulating material to cover the circuit layer and expose part of the circuit layer. The circuit layer is provided in an adhering manner to enhance the stability of resistance and the test accuracy.

Abstract: Methods for fabricating analyte sensor components using IC- or MEMs-based fabrication techniques and sensors prepared therefrom. Fabrication of the analyte sensor component comprises providing an inorganic substrate having deposited thereon a release layer, a first flexible dielectric layer and a second flexible dielectric layer insulating there between electrodes, contact pads and traces connecting the electrodes and the contact pads of a plurality of sensors. Openings are provided in one of the dielectric layers over one or more of the electrodes to receive an analyte sensing membrane for the detection of an analyte of interest and for electrical connection with external electronics. The plurality of fabricated sensor components are lifted off the inorganic substrate.

Abstract: An implantable medical device formed from one or more layers of thin film polymer is assembled by providing by adhesively securely one or more polymer coupons on individual rigid backings. After each coupon is shaped or components mounted to the coupon, the coupons are bonded together. The adhesive is dissolved to remove the device from the backing or backings to which it is attached.

Abstract: A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion.

Abstract: A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads.

Abstract: An accelerometer, comprises, a measurement mass, a top cap silicon wafer and a bottom cap silicon wafer, which both are coupled with the said measurement mass; the measurement mass comprises a support frame, a mass, and a plurality of resilient beams; the mass and the resilient beams are located within the support frame; the mass and the support frame are connected by several sets of the resilient beams, and each set comprises two resilient folding beams; the resilient folding beams are symmetrically provided with respect to the midline of the mass; a connection beam is provided in between each set of the resilient folding beams to connect the resilient folding beams together. Silicon wafers with electrodes are bonded on the top and bottom surfaces of the measurement mass; and forms a capacitor with the measurement mass. The accelerometer in the present invention has a large mode isolation ratio, and it is symmetrical in high order vibrational modes , which further decreases the noise of the MEMS chip.

Abstract: A testing apparatus for a display device according to an embodiment of the present invention includes: a substrate; a driving chip mounted on the substrate; and a pad disposed on the substrate and electrically connected to the driving chip, wherein the pad includes a bottom layer electrically connected to the driving chip, and a sheet layer disposed on the bottom layer and electrically connected to the bottom layer, and wherein a lateral surface of the bottom layer is not covered by the sheet layer.

Abstract: A method for manufacturing a multilayer FPCB includes certain steps. A first printed circuit substrate is provided, the first printed circuit substrate includes a first copper layer and a first protective film, the film defining a first opening. A second printed circuit substrate is provided, this substrate includes a second copper layer and a second protective film. The second protective film defines a second opening. The first printed circuit substrate is laminated together with the second printed circuit substrate by an adhesive sheet. The adhesive sheet defines a third opening in communication with and aligned with the first opening and the second opening. The first copper layer is then etched to form a first outer wiring layer and the third copper layer is also etched to form a second outer wiring layer, thereby obtaining a multilayer FPCB.

Abstract: A etchant composition that includes, based on a total weight of the etchant composition, about 0.5 wt % to about 20 wt % of a persulfate, about 0.5 wt % to about 0.9 wt % of an ammonium fluoride, about 1 wt % to about 10 wt % of an inorganic acid, about 0.5 wt % to about 5 wt % of a cyclic amine compound, about 0.1 wt % to about 10.0 wt % of a sulfonic acid, about 5 wt % to about 10 wt % of an organic acid or a salt thereof, and a remainder of water. The etchant composition may be configured to etch a metal layer including copper and titanium, to form a metal wire that may be included in a thin film transistor array panel of a display device.

Abstract: A method of making a shaped electrical conductor (610, 630) includes providing a first sheet of metal (319) and applying a first and second thermoplastic adhesive pattern (311, 312) to a first and a second surface thereof. The second pattern is are fully justified with the applied first pattern. The first sheet is etched to remove metal not covered by the patterns so that no metal bridges remain between disconnected coated portions. A second sheet of metal (339) is provided and a third and fourth thermoplastic adhesive pattern (333, 334) is applied to a first and second surface thereof. The third and fourth patterns are fully justified. The second sheet is etched as for the first sheet. Contact regions (315, 335) in the second and third patterns are joined to form electrical contact between the first and second sheets.

Abstract: The present disclosure relates to a method for making pattern conductive element. The method includes steps. A substrate having a surface is provide. An adhesive layer is formed on the surface of the substrate. Part of the adhesive layer is solidified to form a solidified adhesive layer and a non-solidified adhesive layer. A carbon nanotube layer is applied on the adhesive layer. The non-solidified adhesive layer is solidified so that the carbon nanotube layer on the non-solidified adhesive layer forms a fixed carbon nanotube layer and the carbon nanotube layer on the solidified adhesive layer forms a non-fixed carbon nanotube layer. The non-fixed carbon nanotube layer is removed and the fixed carbon nanotube layer is remained to form a pattern carbon nanotube layer.

Abstract: In a method of manufacturing a chip resistor, a semi-product is formed by sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer. Resistor sections arranged in an array on the semi-product are formed by forming longitudinal first slots and transverse second slots through the semi-product. Slits are formed on a first layer of each resistor section to form a resistor main body. A dividing slot is formed on a second layer of each resistor section. Two electrodes are formed to be electrically connected to opposite ends of the resistor main body. The resistor sections are trimmed from the semi-product to obtain the chip resistors.

Abstract: A manufacturing method of a package carrier is provided. A supporting plate is provided, wherein a metal layer is already disposed on the supporting plate. A patterned dry film layer is formed on the metal layer. A portion of the metal layer is exposed by the patterned dry film layer. The patterned dry film layer is used as an electroplating mask to electroplate a surface treatment layer on the portion of the metal layer exposed by the patterned dry film layer. The patterned dry film layer is removed so as to expose the portion of the metal layer. The surface treatment layer is used as an etching mask to etch the portion of the metal layer not covered by the surface treatment layer so as to form a patterned metal layer.

Abstract: A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.

Abstract: A multilayer electronic support structure comprising a plurality of layers extending in an X-Y plane consisting of a dielectric material surrounding metal via posts that conduct in a Z direction perpendicular to the X-Y plane, wherein a stacked via structure crossing at least two via layers of the plurality of layers comprises at least two via posts in neighboring via layers wherein the at least two stacked via posts in neighboring layers have different dimensions in the X-Y plane, such that the stacked via structure tapers.

Abstract: A multilayer composite electronic structure comprising at least two feature layers extending in an X-Y plane and separated by a via layer comprising a dielectric material that is sandwiched between two adjacent feature layers, the via layer comprising via posts that couple adjacent feature layers in a Z direction perpendicular to the X-Y plane, wherein a first via has different dimensions in the X-Y plane from a second via in the via layer.

Abstract: A method for making a graphene/carbon nanotube composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing at least one carbon nanotube film structure on the graphene film, and combining the at least one carbon nanotube film structure with the graphene film, coating a polymer layer on the at least one carbon nanotube film structure, and combining the polymer layer with the at least one carbon nanotube film structure and the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface.

Abstract: A method for forming an interconnection element having metalized structures includes forming metalized structures in an in-process unit that has a support material layer with first and second spaced-apart surfaces defining a thickness therebetween, a handling structure, and an insulating layer separating at least portions of the first surface of the support material layer from at least portions of the handling structure. The metalized structures are formed extending through the thickness of the support material layer. The method also includes etching at least a portion of the insulating layer to remove the handling structure from the in-process unit and further processing the in-process unit to form the interconnection element.

Abstract: An embodiment of the invention provides a method for forming an antenna which includes: providing a workpiece having a surface; providing a compression head including a main body, a soft rubber head disposed on the main body, and at least a through-hole, wherein the through-hole penetrates through the main body and the soft rubber head; adsorbing and fixing a conducting film on the soft rubber head through the through-hole; moving the compression head against the surface of the workpiece to press the conducting film onto the surface of the workpiece; removing the compression head; and patterning the conducting film.

Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.

Abstract: A retinal prosthesis system can comprise: a flexible substrate; a nanowire light detector which is placed on the substrate, and comprises one or more nanowires of which the resistance changes according to the applied light; one or more micro-electrodes which are placed on the substrate, are electrically connected to the nanowire light detector, and come in contact with retinal cells; and an electric power supply source for applying electric power to the nanowire light detector and the micro-electrodes. The retinal prosthesis system can be implemented into a very thin and flexible substrate type high resolution retinal system by manufacturing a nanowire light detector on a substrate in which micro-electrodes are implemented.

Abstract: The transparent conductive film is capable of preventing a situation in which level differences formed due to patterning exceed a design value, even when the film base used is a thin film base having a thickness of 110 ?m or less or even when the transparent conductive layer has been crystallized by heating. Transparent conductive film with a pressure-sensitive adhesive layer comprises: a film base, a transparent conductive layer laminated on one surface of the film base and which is patterned and a pressure-sensitive adhesive layer laminated on the other surface of the film, wherein the film base has a thickness of 10 to 110 ?m, a total thickness of the film base and the pressure-sensitive adhesive layer is 30 to 300 ?m, and the pressure-sensitive adhesive layer has a storage modulus measured at 23° C. of 1.2×105 or more and less than 1.0×107 Pa.

Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.

Abstract: A method of making a shaped electrical conductor (610, 630) includes providing a first sheet of metal (319) and applying a first and second thermoplastic adhesive pattern (311, 312) to a first and a second surface thereof. The second pattern is are fully justified with the applied first pattern. The first sheet is etched to remove metal not covered by the patterns so that no metal bridges remain between disconnected coated portions. A second sheet of metal (339) is provided and a third and fourth thermoplastic adhesive pattern (333, 334) is applied to a first and second surface thereof. The third and fourth patterns are fully justified. The second sheet is etched as for the first sheet. Contact regions (315, 335) in the second and third patterns are joined to form electrical contact between the first and second sheets.

Abstract: A method for filling through hole interconnects in a substrate used in the manufacture of electronic devices uses a film filler material. The film comprises a resin matrix filled with conductive and/or dielectric particles, and can be a single or multi-layer film. The method comprises providing a substrate for an electronic device having one or more through hole interconnects; providing a film comprising at least one film filler material for the through hole interconnects; deposing the film filler material over the substrate; and pressing the film filler material into the through hole interconnects.

Abstract: A method of making a wire array includes the step of providing a tube of a sealing material and having an interior surface, and positioning a wire in the tube, the wire having an exterior surface. The tube is heated to soften the tube, and the softened tube is drawn and collapsed by a mild vacuum to bring the interior surface of the tube into contact with the wire to create a coated wire. The coated wires are bundled. The bundled coated wires are heated under vacuum to fuse the tube material coating the wires and create a fused rod with a wire array embedded therein. The fused rod is cut to form a wire array. A wire array is also disclosed.

Abstract: A thin plate type vibration device 10 includes a vibration layer 2 composed of an oxide single crystal. The vibration layer 2 includes a first main face 2a and a second main face 2b, and further includes a fixed end part 2e, a free end part 2c and a central vibration part 2d provided between the fixed end part and free end part. The device 10 further includes an anchor part 7 composed of an oxide single crystal or a silicon single crystal and bonded to the fixed end part 2e of the vibration layer 2 at the first main face 2a. The device further includes a weight part 6 composed of an oxide single crystal or a silicon single crystal and bonded to the free end part 2c at the first main face 2a.

Abstract: An electrophoretic display panel includes a driving substrate and an electrophoretic display substrate. The driving substrate includes a first base material, driving electrode patterns, conductive lines, and a shielding layer. The first base material has a first configuration region and a second configuration region. The driving electrode patterns are located inside the first configuration region. The conductive lines are respectively connected to the driving electrode patterns and respectively extend from the first configuration region to the second configuration region. The shielding layer shields the conductive lines and exposes the driving electrode patterns. The electrophoretic display substrate includes a second base material located opposite to the first base material, an electrode layer, and display media. The electrode layer is disposed on the second base material and between the first and second base materials.

Abstract: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.

Abstract: An electrical current sensor includes a first laminated body having a magnetic detection element disposed over a first substrate, a protective film formed over the first substrate and the magnetic detection element, and a coil formed over the protective film, and a second laminated body having a shield layer formed over a second substrate and which is formed by bonding the first laminated body and the second laminated body to each other with an adhesion layer interposed therebetween such that the magnetic detection element and the shield layer face each other.

Abstract: A copper foil for a printed wiring board, the copper foil being characterized by having, on at least one surface thereof, a roughed layer of the copper foil in which an average diameter at a particle root (D1) corresponding to a distance of 10% of a particle length from the root, is 0.2 ?m to 1.0 ?m, and a ratio of the particle length (L1) to the average diameter at the particle root (D1) is 15 or less when L1/D1. A copper foil for a printed wiring board, wherein a sum of area covered by holes on an uneven and roughened surface of a resin is 20% or more at a surface of the resin formed by laminating the resin and a copper foil for a printed wiring having a roughened layer and then removing the copper layer by etching. An object of the present invention is to develop a copper foil for a semiconductor package board in which the aforementioned phenomenon of circuit erosion is avoided without deteriorating other properties of the copper foil.

Abstract: A method for manufacturing a sensor web. A metal foil attached to a surface of a release web is die-cut to form electrically conductive areas and conductors. A first protective film is attached to the release web so that the first protective film covers the electrically conductive areas and conductors. The release web is replaced with a backing film.

Abstract: Object of the present invention is to provide a method for manufacturing a printed wiring board which enables fine wiring formation at low costs and with high yields without introducing any special equipment, and a printed wiring board manufactured by the method.

Abstract: A method for manufacturing a touch panel includes the following steps. A mother plate is provided. A plurality of adhesive materials are formed on the mother plate. A plurality of cover glasses are disposed on the adhesive materials respectively. The adhesive materials are cured, whereby the cover glasses are attached to the mother plate. A plurality of circuit units are formed on the cover glasses respectively. The cover glass having the circuit unit is removed from the mother plate, wherein the bonding strength of the cured adhesive material is within a range about between 5 g/25 mm and 600 g/25 mm, whereby the adhesive material provides enough adhesive force between the cover glass and the mother plate, and the adhesive material cannot be stayed on a surface of the cover glass during a removing process.

Abstract: A printed wiring board is formed by adhering a coverlay film having a resistance layer formed on a surface of the coverlay film body to a printed wiring board body having a conductive layer formed on a surface of a substrate through an adhesive layer. The resistance layer is separated from and opposed to the conductive layer through the adhesive layer.

Abstract: A method of fabricating a mounting substrate for a printhead die of an inkjet printhead, the method includes: forming an ink inlet hole in a first layer of a first dielectric material; patterning a plurality of electrical contact pads on a second layer of a second dielectric material; forming a slot through the second layer; forming a window through a third layer of a third dielectric material; aligning and laminating the second layer to the first layer such that the ink inlet hole is aligned with the slot; and aligning and laminating the third layer to the second layer such that the contact pads and the slot are exposed through the window.

Abstract: Provided are a method of forming a solder resist layer on a printed circuit board (PCB) and a PCB comprising the solder resist layer. The method includes: preparing a PCB of which at least one surface has a circuit layer formed thereon, bonding an insulation layer, including a material having a non-photosensitive characteristic, in a half-cured state on the circuit layer, forming a solder resist layer patterned by selectively removing the insulation layer, and curing the insulation layer.

Abstract: A method for providing acceleration data with reduced substrate-displacement bias includes receiving in an accelerometer an external acceleration, determining the acceleration data with reduced substrate displacement bias in a compensation portion in response to a first and a second displacement indicators from a MEMS transducer, and, in response to substrate compensation factors from a MEMS compensation portion, outputting the acceleration data with reduced substrate displacement bias, wherein the first displacement indicator and the second displacement indicator are determined by the MEMS transducer relative to a substrate in response to the external acceleration and to a substrate displacement, and wherein the substrate compensation factors are determined by the MEMS compensation portion relative to the substrate in response to the substrate displacement.

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. In an embodiment of the present invention, the method of manufacturing a printed circuit board can include: providing a pair of conductive layers, in which roughness of one surface of one of the pair of conductive layers is different from roughness of one surface of the other of the pair of conductive layers; and stacking the pair of the conductive layers on a dielectric layer such that one surface of one of the pair of conductive layers faces one surface of the dielectric layer and one surface of the other of the pair of conductive layers faces another surface of the dielectric layer.

Abstract: Methods of fabricating devices including a TFT array substrate are provided. For example, a method of fabricating a TFT array substrate may comprise adhering a protection film onto an upper surface of a glass substrate containing silicon dioxide as a principal constituent on which a thin film transistor (TFT) array has been fabricated; and etching the glass substrate through a lower surface thereof such that the glass substrate has a thickness greater than 0 micrometer, but equal to or smaller than 200 micrometers. The etching may comprise preparing an apparatus for etching a substrate; and etching said glass substrate at an etching rate equal to or higher than 2 micrometers per a minute by means of the apparatus.

Abstract: A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.

Abstract: A multi-layered printed circuit board and a method of manufacturing the multi-layered printed circuit board are disclosed. The multi-layered printed circuit board in accordance with an embodiment of the present invention includes: an insulation layer; an inner-layer pad disposed inside the insulation layer; an inner-layer circuit wiring disposed inside the insulation layer and formed to be thinner than that of the inner-layer pad; a via connected with the inner-layer pad by penetrating the insulation layer; and an outer-layer circuit wiring formed on an outside surface of the insulation layer.

Abstract: The present disclosure provides a micro device. The device has a micro-electro-mechanical systems (MEMS) movable structure, a plurality of metal loops over the MEMS movable structure, a piezoelectric element over the MEMS movable structure, and a magnet disposed over the plurality of metal loops. The MEMS movable structure, the plurality of metal loops, and the piezoelectric element are encapsulated.

Abstract: A method for producing an elastic plate for a liquid jet head, which includes etching a rolled metal plate based on a rolling direction of the rolled metal plate, to form an etched portion and a non-etched portion on the rolled metal plate. The thickness of the etched portion is thinner than the thickness of the non-etched portion and the rolling direction is substantially perpendicular to a long side of the rolled metal plate.

Abstract: A method of forming electrode structures comprising a plurality of electrode pads and a plurality of electrically conducting wires extending from the electrode pads. The method comprises coating an electrode structure with a relatively electrically insulating material, arranging each of the electrode pads in a first arrangement; arranging the wires relative to each other to provide a sufficient gap of separation between neighboring wires; securing the wires to a remotely positioned anchor member to preserve a gap of separation between neighboring wires, and applying a coating of relatively electrically insulating material to the electrode structure.