Abstract: An apparatus and method for forming a patterned graphene layer on a substrate. One such method includes forming at least one patterned structure of a carbide-forming metal or metal-containing alloy on a substrate, applying a layer of graphene on top of the at least one patterned structure of a carbide-forming metal or metal-containing alloy on the substrate, heating the layer of graphene on top of the at least one patterned structure of a carbide-forming metal or metal-containing alloy in an environment to remove graphene regions proximate to the at least one patterned structure of a carbide-forming metal or metal-containing alloy, and removing the at least one patterned structure of a carbide-forming metal or metal-containing alloy to produce a patterned graphene layer on the substrate, wherein the patterned graphene layer on the substrate provides carrier mobility for electronic devices.

Abstract: The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of creating an ultrasonic transducer by connecting one or more multi-layer printed circuits to an array of ultrasound transducer elements. In one embodiment, the printed circuits have traces in a single layer that are spaced by a distance that is greater than a pitch of the transducer elements to which the multi-layer printed circuit is to be connected. However the traces from all the layers in the multi-layer printed circuit are interleaved to have a pitch that is equal to the pitch of the transducer elements. The disclosed technology also features ultrasound transducers produced by the methods described herein.

Abstract: Systems, methods and apparatus are provided through which in some embodiments a mass spectrometer micro-leak includes a number of channels fabricated by semiconductor processing tools and that includes a number of inlet holes that provide access to the channels.

Abstract: Disclosed herein are a method for manufacturing a graphene transparent electrode and a graphene transparent electrode manufactured by the method. The method includes: providing a graphene oxide solution: forming a metal thin film on a glass substrate; coating the graphene oxide solution on the metal thin film, followed by drying; primarily reducing the thus obtained graphene oxide by using a reducing agent, to obtain reduced graphene oxide; secondarily reducing the reduced graphene oxide by heat treatment under the inert atmosphere, to form a reduced layer; compressing a transparent film on the reduced layer; and etching the metal film by an etching solution. The method enables a graphene transparent electrode having economical feasibility and excellent electric conductivity to be manufactured.

Abstract: A laminating structure, an electronic device having the laminating structure and a laminating method thereof are provided. The laminating structure comprises a bonding frame disposed on a peripheral area of a first substrate, wherein surface of the bonding frame comprises a plurality of protrusions and an interspace that is provided between each two adjacent protrusions for containing an overflow portion of a liquid adhesive. The present disclosure utilizes a method of forming a patterned bonding frame to prevent adhesive from overflowing during the process of laminating substrates. Therefore, in the present disclosure, steps of adhesive scraping and adhesive cleaning are omitted so as to reduce labor and material costs.

Abstract: A method of forming a device with a controlled electrode gap width includes providing a substrate, forming a functional layer on top of a surface of the substrate, forming a sacrificial layer above the functional layer, exposing a first portion of the functional layer through the sacrificial layer, forming a first spacer layer on the exposed first portion of the functional layer, forming an encapsulation layer above the first spacer layer, and vapor etching the encapsulated first spacer layer to form a first gap between the functional layer and the encapsulation layer.

Abstract: Disclosed herein is an electrode forming method including: an electrode layer forming process of forming a conductive transparent electrode layer by stacking a metal oxide on a transparent substrate; and an electrode pattern forming process of forming patterned electrodes by selectively applying a coating liquid including an oxidizing agent to the conductive transparent electrode layer and electrically inactivating the conductive transparent electrode layer.

Abstract: Provided are an antenna circuit constituent body for an IC card/tag capable of reducing environmental load in a manufacturing process for joining both end portions of an antenna circuit pattern layer and capable of enhancing reliability of joined portions of the both end portions of the antenna circuit pattern layer: and a method for manufacturing the antenna circuit constituent body for an IC card/tag. In the antenna circuit constituent body for an IC card/tag, an insulating layer (107) is formed so as to extend from an upper part of a first circuit pattern layer part (103), via an upper part of a third circuit pattern layer part (101), and to an upper part of a second circuit pattern layer part (104). A conductive layer (108) is formed on the insulating layer (107) so as to bring the first circuit pattern layer part (103) and the second circuit pattern layer part (104) into conduction.

Abstract: In accordance with an embodiment of the invention, there is provided an electrostatic chuck. The electrostatic chuck comprises an electrode, and a surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck, the surface layer including a charge control layer comprising a surface resistivity of greater than about 1011 ohms per square.

Abstract: A method of fabricating a circuit includes bonding an electrically conductive layer to a carrier film using an adhesive selected from acrylic polymer and silicone polymer, removing selected portions of the electrically conductive layer from the carrier film to provide a circuit arrangement, and transferring the circuit arrangement from the carrier film to a substrate.

Abstract: The present invention relates to a double-sided flexible printed circuit board in which circuit patterns are formed, including an insulating substrate, conduction layers sputtered on both sides of the insulating substrate, a through hole formed to connect circuits formed in the both sides, seed layers formed on the conduction layers of the both sides, and pattern plating layers formed on an inner wall of the through hole and on the respective seed layers, and a method of manufacturing the same. Accordingly, the loss of a circuit width can be minimized because a sputtering-type material not an adhesive is used between the insulating substrate and the thin copper (Cu) layer. Further, productivity can be improved because a roll-to-roll process can be used. In addition, the thickness of a circuit can be controlled and micro circuit patterns can be formed because a semi-additive method is used.

Abstract: A method for making a support plate for an electrowetting device includes providing the support plate with a hydrophobic layer; arranging a pattern of hydrophilic material on the hydrophobic layer; and removing a surface layer of the hydrophobic layer by a solvent. The electrowetting device may include a support plate with a hydrophobic layer having a thickness, and a pattern of hydrophilic material arranged on a first area of the hydrophobic layer, the thickness of the hydrophobic layer being larger within the first area than outside the first area.

Abstract: To peel an etching resist easily and reliably without damaging a transparent conductive layer coated with the etching resist. A method for manufacturing a transparent printed circuit in an embodiment of the present invention includes: providing a transparent conductive sheet 3 having a transparent base material 1 and a transparent conductive layer 2 formed on the transparent base material 1, forming an etching resist 4 having a specified pattern on the transparent conductive layer 2, etching the transparent conductive layer 2 with the etching resist 4 as a mask, forming a peeling film 5 on the etching resist 4 and on the transparent base material 1 exposed by etching of the transparent conductive layer 2 so as to cover an area where the etching resist 4 is formed, and peeling the peeling film 5 together with the etching resist 4.

Abstract: A MEMS is attached to a bonding wafer in part by forming a support layer over the MEMS. A first eutectic layer is formed over the support layer. The eutectic layer is patterned into segments to relieve stress. A second eutectic layer is formed over the bonding wafer. A eutectic bond is formed with the segments and the second eutectic layer to attach the bonding wafer to the MEMS.

Abstract: A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.

Abstract: A method for manufacturing a micro electro-mechanical system (MEMS) switch system (600, 700) includes etching each of a plurality of base circuit layers (425) and a plurality of passive component substrate layers (412, 418, 42, 426). The method continues with laser milling of a first dielectric film (406) to create a spacer layer (405). A metal cladding (402, 403) formed on a flexible dielectric film layer 404 is etched so as to form a plurality of switch component features. Further laser milling is performed with respect to the flexible dielectric film layer to form at least one switch structure (448, 450). Thereafter, a stack (400) is assembled which is comprised of the spacer layer disposed between the flexible dielectric film layer and the plurality of base circuit layers. Additional layers can also be included in the stack. When the stack is completed, heat and pressure are applied to join the various layers forming the stack.

Abstract: A method for manufacturing an antenna includes the steps of: providing a ceramic substrate and forming an antenna pattern on the ceramic substrate using screen printing with metallic material; firing the ceramic substrate and the antenna pattern by a high temperature; treating the ceramic substrate by chemical wet-etching process; pasting an adhesive tape to the antenna pattern, then detaching the antenna pattern from the ceramic substrate, and the combination of the adhesive tape with the antenna pattern forming a conductor tape; making the conductor tape attached to a first face of a ferrite plate.

Abstract: A method for manufacturing a plurality of holders each being for an LED package structure includes steps: providing a base, pluralities of through holes being defined in the base to divide the base into a plurality of basic units; etching the base to form a dam at an upper surface of each of the basic units of the base; forming a first electrical portion and a second electrical portion on each basic unit of the base, the first electrical portion and the second electrical portion being separated and insulated from each other by the dam; providing a plurality of reflective cups each on a corresponding basic unit of the base, each of the reflective cups surrounding the corresponding dam; and cutting the base into the plurality of basic units along the through holes to form the plurality of holders.

Abstract: A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion.

Abstract: Provided is a method of forming an electronic circuit, wherein a nickel or nickel alloy layer is formed on an etching side of a rolled copper foil or an electrolytic copper foil, the rolled copper foil or the electrolytic copper foil is bonded to a resin substrate to obtain a copper-clad laminate, a resist pattern for forming a circuit is subsequently applied on the copper foil, any unwanted portion of the copper foil and the nickel or nickel alloy layer of the copper-clad laminate other than the portion to which the resist pattern was applied is removed using an etching solution of an aqueous ferric chloride, the resist is further removed, and soft etching is additionally performed in order to remove the remnant nickel or nickel alloy layer and thereby form a circuit in which the space between copper circuit lines is of a width that is double or more from the thickness of copper.

Abstract: A method of manufacturing a narrow frame touch input sheet having very good anticorrosion properties and suitable for a narrow frame capacitance type touch sensor having a double-layer transparent conductive film pattern. The method uses an electrical conductivity sheet obtained by sequentially forming transparent and light blocking conductive films, and first resist layers, on both sides of a transparent base sheet, exposing and developing the resist layers on both sides simultaneously, etching the transparent and light blocking films simultaneously, removing the resist layers, laminating second resist layers with anticorrosion agent on the revealed light blocking films, etching the light blocking films in center windows and terminal portions to reveal the transparent films, and side etching revealed end faces of the light blocking films at center window and terminal portion boundaries to create visor structured second resist layers that are heat softened as an anticorrosion layer on the revealed faces.

Abstract: Provided is a substrate tray for supporting a flexible substrate during manufacturing of a flexible electronic device. The substrate tray comprises a tray baseboard, and the tray baseboard has a groove zone provided with a plurality of grooves. A method for manufacturing a flexible electronic device is also provided, in which the substrate tray is used to support a flexible substrate.

Abstract: An optical device includes a ridge-like optical waveguide portion, a mesa protector portion that is arranged in parallel to the optical waveguide portion, a resin portion that covers upper parts of the mesa protector portion and is disposed at both sides of the mesa protector portion, an electrode that is disposed on the optical waveguide portion, an electrode pad that is disposed on the resin portion located at an opposite side to the optical waveguide portion with respect to the mesa protector portion, and a connection portion that is disposed on the resin portion and electrically connects the electrode to the electrode pad.

Abstract: A method for making a plurality of touch panels one time which includes the following steps. A substrate is provided. The substrate has a surface defining a plurality of target areas with each including a touch-view area and a trace area. An adhesive layer is formed on the surface of the substrate. The adhesive layer on the trace areas is solidified. A carbon nanotube layer is formed on the adhesive layer. The adhesive layer on the touch-view area is solidified. The carbon nanotube layer on the trace areas is removed to obtain a plurality of transparent conductive layers spaced from each other. An electrode and a conductive trace are formed on each target area. A plurality of touch panels is obtained by cutting the substrate.

Abstract: Methods for performing damage etch and texturing of single crystal silicon substrates, particularly for use as solar cells or photovoltaic cells. Damage etch with a TMAH solution followed by texturing using solution of KOH or NaOH mixed with IPA is particularly advantageous. The substitution of some of the IPA with ethylene glycol further improves results. Also disclosed is a process that combines both damage etch and texturing etch into a single step.

Abstract: A multilayer wiring board includes: a functional area which includes a thin film capacitor having a dielectric layer between an upper electrode and a lower electrode; and a peripheral area other than the functional area, wherein a mooring portion in which the dielectric layer and a conductive layer are laminated is provided in at least a portion of the peripheral area, and a roughness of a surface of the conductive layer which contacts the dielectric layer is greater than a roughness of a surface of the upper electrode or the lower electrode which contacts the dielectric layer.

Abstract: A method for making a graphene composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing a polymer layer on the graphene film and combining the polymer layer with the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface.

Abstract: A method for making a graphene/carbon nanotube composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing at least one carbon nanotube film structure on the graphene film, and combining the at least one carbon nanotube film structure with the graphene film, coating a polymer layer on the at least one carbon nanotube film structure, and combining the polymer layer with the at least one carbon nanotube film structure and the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface.

Abstract: A method for making a graphene/carbon nanotube composite structure includes providing a metal substrate including a first surface and a second surface opposite to the first surface, growing a graphene film on the first surface of the metal substrate by a CVD method, providing at least one carbon nanotube film structure on the graphene film, and combining the at least one carbon nanotube film structure with the graphene film, and combining the polymer layer with the at least one carbon nanotube film structure and the graphene film, and forming a plurality of stripped electrodes by etching the metal substrate from the second surface.

Abstract: The present invention relates to a photomultiplier having a structure for making it possible to easily realize high detection accuracy and fine processing, and a method of manufacturing the same. The photomultiplier comprises an enclosure having an inside kept in a vacuum state, whereas a photocathode emitting electrons in response to incident light, an electron multiplier section multiplying in a cascading manner the electron emitted from the photocathode, and an anode for taking out a secondary electron generated in the electron multiplier section are arranged in the enclosure. A part of the enclosure is constructed by a glass substrate having a flat part, whereas each of the electron multiplier section and anode is two-dimensionally arranged on the flat part in the glass substrate.

Abstract: The present invention relates to thin membranes (such as graphene windows) and methods of aligned transfer of such thin membranes to substrates. The present invention further relates to devices that include such thin membranes.

Abstract: The present invention enables additional processes required for forming vertical wiring and rewiring in a double face package (DFP) or a wafer level chip size package (WLCSP) to be implemented through use of a component for vertical wiring and rewiring, to thereby simplify the manufacturing process and reduce cost. An electronic component for interconnection is incorporated into an electronic device package in which a circuit element including a semiconductor chip is disposed and which has external electrodes connected to the circuit element via vertical interconnects and horizontal interconnects.

Abstract: A display switch unit is provided for a vehicle comprising at least one first and one second light guide plate with first and second light sources disposed at the edges. The light guide plates have switch symbols and proximity sensors having sensor structures. The first light guide plate and the second light guide plate are disposed on one another. Respectively one sensor structure is assigned two switch symbols in both light guide plates. The material of the switch symbols is a plastic with light-sensitive nanoparticles, which is arranged distributed in the light guide plates in such a manner that under edge-side irradiation the switch symbols are visible illuminated in color and three-dimensionally in the light guide plates.

Abstract: A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. A reinforcement edge side of the reinforcement plate is located at the outside of an auxiliary edge side of the auxiliary layer.

Abstract: Provided is a touch panel manufacturing method wherein the number of exposure masks needed for pattern formation is reduced, and a method for manufacturing a display device provided with a touch panel. A transparent conductive film layer (11) and a metal layer (12) are laminated on a transparent substrate (1), and the transparent conductive film layer (11) and the metal layer (12) are formed into predetermined electrode patterns, with use of one resist pattern. A protective film (13) covering the transparent conductive film layer (11) and the metal layer (12) is formed, and openings (14, 15, and 16) are provided at predetermined positioned in the protective film (13). By etching with use of the protective film (13) having the openings (14, 15, and 16), the metal layer (12) is removed so that the transparent conductive film layer (11) is exposed, whereby at least either touch electrodes (2) or connection terminals (5) are formed.

Abstract: Methods of forming embedded, multilayer capacitors in printed circuit boards wherein copper or other electrically conductive channels are formed on a dielectric substrate. The channels may be preformed using etching or deposition techniques. A photoimageable dielectric is an upper surface of the laminate. Exposing and etching the photoimageable dielectric exposes the space between the copper traces. These spaces are then filled with a capacitor material. Finally, copper is either laminated or deposited atop the structure. This upper copper layer is then etched to provide electrical interconnections to the capacitor elements. Traces may be formed to a height to meet a plane defining the upper surface of the dielectric substrate or thin traces may be formed on the remaining dielectric surface and a secondary copper plating process is utilized to raise the height of the traces.

Abstract: The invention pertains to a new type of spectroscope comprising an array of Fabry-Perot cells having no moving parts and that can be fabricated inexpensively using semiconductor fabrication techniques.

Abstract: A micro-reflectron for a time-of-flight mass spectrometer including a substrate and integrated with the volume of the substrate, means for application of a potential gradient in a volume suitable for constituting a flight zone of the ions. The means of application includes at least two polarization electrodes and a wall of at least one resistive material that can be polarized between these electrodes so as to generate a continuous potential gradient, itself providing the function of reflectron, this flight zone, these electrodes and this wall being obtained by the technology of microelectromechanical systems (MEMS) and this micro-reflectron having a thickness of less than 5 millimetres while its other dimensions are less than 10 times this thickness.

Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Abstract: In a manufacturing method of a printed circuit board, a rigid substrate having a rigid-board metal layer is provided, an open slot is formed on the rigid substrate, and a flexible substrate is installed in the open slot, and the flexible substrate and the rigid substrate are securely bonded, and an increased-layer circuit layer is formed after electric circuits are manufactured on the rigid-board and flexible-board metal layers, and stacked on the rigid substrate and on an adjacent block where the flexible substrate is coupled to the rigid substrate, and an electric circuit is manufactured, and the increased-layer circuit layer is provided for electrically connecting and conducting the rigid and flexible substrates to overcome the issue of alignment errors.

Abstract: A method for manufacturing a multilayer PCB comprises the following steps. First, a PCB substrate includes a first circuit layer is provided. The first circuit layer includes a mounting portion. A first solder-resistant layer is formed on the mounting portion and a protective adhesive film is attached on the first solder-resistant layer. Next, a first copper foil, a first adhesive layer, a second copper foil, and a second adhesive layer are laminated on the PCB substrate, and the first and second copper foils are etched to form circuit layers. Then a cavity is defined and the protective adhesive film is exposed in it. After removing the protective adhesive film, an electronic component is mounted in the cavity. As such, a multilayer PCB with the electronic component embedded in is obtained.

Abstract: In order to provide a method of manufacturing a multilayer wiring substrate, a base member having a copper foil separably laminated thereon is prepared, and a solder resist layer is formed on the copper foil. Openings are formed in the solder resist layer, and a metal conductor portion is formed in each of the openings. By means of sputtering, a dissimilar metal layer is formed over the surface of the metal conductor portion and the entire surface of the solder resist layer. Copper electroplating is performed so as to form connection terminals and a conductor layer on the dissimilar metal layer. After a build-up step, the base material is removed, whereby the copper foil is exposed, and the exposed copper foil and the metal conductor portion are removed through etching, whereby the surfaces of the external connection terminals are exposed from the openings.

Abstract: A transducer assembly (10) is provided that includes a housing (12), a lens (14), an array of transducer elements (18), an interposer assembly (22), a transducer array 5 control assembly (30), and a heat sink assembly (32). The interposer assembly (22) includes a plurality of signals tracks (56) that provide electrical connections between the array of transducer elements (18) and the transducer array control assembly (30). The interposer assembly (22) further includes heat transporter bars (50) for transporting heat within the interposer (22) to the heat sink assembly (32). A flexible interconnection 10 assembly (28) is disposed between the interposer assembly (22) and the transducer array control assembly (30) providing re-workable electrical connections between the signal tracks (56) of the interposer assembly (22) and the transducer array control assembly (30).

Abstract: A manufacturing method for probe card according to the present invention includes following processes. A film is formed on the surface of a circuit board. A connecting terminal and joint member are formed by etching the film, and the surface of the joint member is polished. An inspection contacting structure is assembled. The inspection contacting structure is moved proximity to a circuit board. The lower surface of a contactor and joint member are attached so as to contact the front end of a probe penetrating and passing through the contactor to the connecting terminal.

Abstract: Disclosed is a manufacturing method of a printed circuit board. The method in accordance with an embodiment of the present invention includes: providing a laminated substrate having an insulator as well as a first metal layer and a second metal layer, which are sequentially laminated on one side of the insulator; processing a via hole in the laminated substrate; forming a seed layer on an inner wall of the via hole and on a surface of the second metal layer; plating an inside of the via hole and the surface of the second metal layer with a conductive material that is different from a material of the second metal layer; etching the seed layer and the conductive material, formed on the second metal layer; etching the second metal layer; and forming a first circuit pattern by selectively etching the first metal layer.

Abstract: A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.

Abstract: Infrared radiation micro device, cover for such a device and method for its fabrication, the device comprising a substrate and a cover and an infrared radiation detecting, emitting or reflecting infrared micro unit, the infrared micro unit being arranged in a cavity defined between the substrate and the cover, the cover comprising an antireflective surface texture to enhance the transmissibility of infrared radiation, wherein a distance frame formed in an additive process on the substrate side of the cover and/or the cover side of the substrate is arranged between substrate and cover.

Abstract: A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be driven by electronics to produce sound. The substrate can be used in standard microelectronic packaging applications.

Abstract: A method of fabricating a multilayer printed circuit board includes preparing a first substrate, and preparing a second substrate, in parallel to the formation of the first substrate, that is, at the same time of the formation of the first substrate, by forming a third inner circuit pattern on one surface of a third insulating layer and forming a window on the other surface of the third insulating layer.

Abstract: In accordance with an embodiment of the invention, there is provided an electrostatic chuck. The electrostatic chuck comprises a surface layer activated by a voltage in an electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface layer includes a plurality of polymer protrusions and a charge control layer to which the plurality of polymer protrusions adhere, the plurality of polymer protrusions extending to a height above portions of the charge control layer surrounding the plurality of polymer protrusions to support the substrate upon the plurality of polymer protrusions during electrostatic clamping of the substrate.