Abstract: In this method, a vertical stack is formed on an axis coinciding substantially with the gravity direction and comprising, from top to bottom: the element; the mass in a solid state; and the substrate. The mass is then heated so as to cause it to pass into a liquid state enabling it to spread on the substrate. More particularly, after the stack has been formed, the element is left free to move vertically, and during heating, variation in the vertical position of the element is measured.

Abstract: An acoustic-wave measuring apparatus includes a holding unit configured to hold a subject and an irradiation unit configured to irradiate the subject with light. An acoustic-wave detecting unit detects acoustic waves generated in the subject due to irradiation with the light; an image pickup unit acquires an image of the subject; and a measurement position on the image acquired by the image pickup unit is designated. A coordinate transforming unit transforms the coordinates of the measurement position on the image to coordinates of a corresponding position on the holding unit; and a position control unit moves at least one of the irradiation unit and the acoustic-wave detecting unit to the corresponding position on the holding unit.

Abstract: Systems and methods for laser based processing of layered materials. Methods may include selectively adjusting ultrafast laser output of an ultrafast laser device based upon one or more physical attributes of a layer of the layered material, applying the ultrafast laser output of the ultrafast laser device to the layer of the layered material along a tool path to ablate the layer along the tool path, and then re-executing the steps to ablate one or more additional layers, the re-execution occurring for each distinct layer of the layered material that is to be ablated.

Abstract: The invention relates to a laser machining head for a laser machining machine, comprising a mount (2) for a sensor part (3) formed from electrically conductive material, an outer insulation part (4) made from electrically insulating material, preferably made from plastic, for electrical shielding and an inner insulation part (5) inserted within the outer insulation part (4) as radiation shield, wherein the inner insulation part (5) is formed from metal and is electrically insulated from the sensor part (3).

Abstract: The laser cutting system for cutting a workpiece with a laser beam along a cutting line at a variable cutting speed includes a movable machining head for placing the laser beam on the respective workpiece, a user interface for specifying the respective cutting line and for specifying a minimum path accuracy of the laser beam, and a control device for controlling a movement of the machining head along the cutting line relative to the respective workpiece and for controlling a plurality of process variables of a cutting process. A second subset of the process variables comprises exclusively one or more process variables which have no influence on the power of the laser beam available for cutting. At least one process variable of the second subset can be controlled by way of the control device as a function of at least one variable control parameter.

Abstract: A laser machining system and a method thereof are disclosed. The disclosed laser machining system comprises a laser generator, an array photo detector, a processer, and a position controller. The laser generator is configured to emit laser via a first light path onto a work piece. The array photo detector is configured to receive the thermal radiation from the work piece via a second light path, different from the first light path, to generate a thermal radiation image. The processor, electrically coupled to the laser generator and the array photo detector, is configured to calculate a temperature centroid of the thermal radiation image and generate a distance control signal according to the temperature centroid. The position controller, electrically coupled to the processor, is controlled by the distance control signal to make a present distance between the laser machining system equal to a working distance.

Abstract: The present invention relates to a device for guiding a laser beam along a target path, particularly a joint. It has a laser beam input module that guides an incident laser beam onto a swiveling beam guiding device downstream from the laser beam input module. The beam guiding device projects the laser beam onto the target path. Said beam guiding device comprises a tactile sensor connected to the swiveling optic that is designed to perform a tactile scan of the target path and to deflect the swiveling optic appropriately. According to the invention, an intermediate focal point is located in the beam path of the laser beam between laser beam input module and swiveling optic. Moreover, the swivel axis of the swiveling optic runs through the intermediate focal point.

Abstract: Provide a pulse laser processing device which facilitates stable microfabrication of the surface of a large target processing material, and an increase in the speed of microfabrication. The pulse laser processing device includes a reference clock oscillating circuit which generates a clock signal, a laser oscillator which emits a pulse laser beam synchronized with the clock signal, a laser scanner which scans a pulse laser beam only in a one-dimensional direction in synchronization with the clock signal, a stage on which the target processing material can be placed and which moves in a direction orthogonal to the one-dimensional direction, and a pulse picker which is provided on an optical path between the laser oscillator and laser scanner and which switches pass and block of the pulse laser beam in synchronization with the clock signal.

Abstract: The invention relates to a device and to an associated method for joining sheet metal parts, each with a flange, by laser, wherein the flanges of the sheet metal parts (2) are joined into one connecting flange. The device has a clamping device (5) for clamping the sheet metal parts (2) to be joined in a main clamping direction running transversely to the connecting flange and a beam guidance system for a laser beam (1). Moreover, the device has a compensation shaft (9) which tracks the laser beam (1) according to a relative movement between the connecting flange and a guidance apparatus.

Abstract: A process is disclosed for controlling the length of chips or shavings on materials that is inherent to produce long undesired chips when machined. Based on the work piece configuration and surface area to machine a determined outlay and process application for a continuous scribe or arrangements of different scribe pattern or patterns for the part and or surface is selected to provide optimal chip control during the machining operation. Engineered Interruptions are applied to the work object prior to the machining operation to maximize optimal chip control. Controlling the depth of scribe of the laser is accomplished and managed through the interface of hardware, software and electronics.

Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.

Abstract: A laser machining apparatus for manufacturing a light guide plate includes a laser source, a first prism, a detector, and a processor. The laser source is configured to emit a laser beam. The first prism includes a first optical surface, a first reflective surface and a second reflective surface. A sub wavelength grating is arranged and fixed on the second reflective surface. A portion of the laser beam is diffracted by the grating forming a diffraction beam. The detector captures and detects a real-time energy value of the diffraction beam. The processor receives the detected energy value, compares it with a preset energy value, calculates a to-be-increased value of the laser beam, and sends an instruction about the calculated value to the laser source.

Abstract: A method of detecting a condensing spot position in a laser beam processing apparatus, including: a detection position setting step of setting a plurality of Z-axis directional positions in a range from a starting point to an ending point of detection positions into which the condenser is positioned; a laser beam processed groove forming step of sequentially positioning the condenser into the detection positions in the range from the starting point to the ending point, performing a predetermined interval indexing feeding by operating indexing feeding means each time the detection position for the condenser is changed, and forming a laser beam processed groove of a predetermined length in the plate-shaped body at each of the detection positions for the condenser; and a laser beam processed groove imaging step of imaging the laser beam processed grooves formed in the plate-shaped body by imaging means.

Abstract: A laser machining device includes a laser oscillator for oscillating a laser beam to have a variable output according to a machining condition, an optical fiber for propagating the laser beam, a sensor for detecting an intensity of a light leaking from a cladding side face of the optical fiber and outputting a detection signal indicating that intensity, and an oscillation control unit for controlling an operation of that laser machining device based on the detection signal. The oscillation control unit compares a first threshold that is set in correspondence to that output with an intensity or an amount of light obtained from the detection signal, compares a second threshold that is set in correspondence to that output with an intensity or an amount of light obtained from the detection signal, and controls the operation of that laser machining device based on a result of comparing.

Abstract: Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

Abstract: A laser processed hole is formed in a workpiece. The workpiece has a first member formed of a first material bonded to a second member formed of a second material. A value is set representing the minimum number of shots of a pulsed laser beam when the spectral wavelength of plasma has changed from the spectral wavelength inherent in the first material to that of the second material. A maximum shot number is set representing a maximum value of the number of beam shots when the spectral wavelength of the plasma has completely changed. The beam is stopped if the number of shots has reached the minimum value and the spectral wavelength of the plasma has changed whereas the beam is continued until the number of shots reaches the maximum value if the spectral wavelength of the plasma has not changed even after the number of shots has reached the minimum value.

Abstract: A roll forming system which roll-forms a shaped beam by a roll forming unit including a plurality of roll formers is disclosed. A laser welding device for the roll forming system may include: front and rear guide means disposed apart from each other at the rear of the roll forming unit, and guiding movement of the shaped beam; laser welding means mounted above and between the front and rear guide means, reciprocatedly rotating a mirror by controlling a mirror motor so as to irradiate a laser beam to a welding position of the shaped beam, and thereby forming a welding bead having a predetermined welding pattern; forming speed detecting means detecting a forming speed of the shaped beam and transmitting a signal corresponding thereto to a controller; a camera disposed at the rear of the laser welding means, photographing a welding portion of the shaped beam, and transmitting an image signal corresponding thereto to the controller.

Abstract: An apparatus for reducing resources for selecting seed to be produced in commercial quantities or for research is disclosed. Samples of seed which are candidates for selection are collected and given an identifier. Specific tissue or structure from candidate seed is removed. A test or analysis is performed on the candidate seed or the removed tissue or structure. Results of the test or analysis are recorded and correlated to the seed's identifier. The results are evaluated and a decision is made whether to select a candidate seed for commercial production or for research. Time, space, and labor associated with growing plants in an experimental plot or greenhouse and taking tissue samples from growing plants is saved.

Abstract: A deburring system for removing burrs from a surface of a pipe is provided. The deburring system comprises: a shaft having an anterior end; a conduit contained in the shaft for carrying a laser beam generated from a laser; and a directing module to direct the laser beam emanating from the conduit radially from the shaft to the surface of the pipe. The deburring system is shaped to fit inside the pipe.

Abstract: Provided is a laser beam irradiation apparatus. The laser beam irradiation apparatus includes a laser source configured to emit light; a collimator configured to collimate the emitted light; a scanner configured to adjust the collimated light to change an irradiation direction thereof; a first lens part configured to focus the adjusted light to irradiate a laser beam on a sealing part; a camera configured to receive visible light passing through the scanner; a heat sensing part configured to receive infrared (IR) light passing through the scanner; and a control part configured to control a moving direction and an intensity of the laser beam.

Abstract: A welding arrangement and a welding process for forming a weld seam between two edge portions, wherein the edge portions form a Y joint having a root portion and a bevel portion, said root portion being welded by a hybrid laser electric arc welding process including directing a laser beam and an electric arc in a single interaction zone of plasma and molten metal. A hybrid laser electric arc welding head and welding submerged arc welding head are arranged on a common carrier structure for welding the Y joint.

Abstract: A laser machining method for cutting or cutting grooves on a workpiece using an apparatus having an X-Y table for mounting the workpiece, a laser source emitting a continuous wave or a quasi-continuous wave laser beam, modulator forming a pulsed laser beam by a high-speed modulation of the continuous wave or quasi-continuous wave laser beam, and an optical system capable of converging the pulsed laser beam on the workpiece, wherein the method comprising cutting with the pulsed laser beams along a locus including a portion where the moving speed of the X-Y table is decreased, and the pitch of holes machined with said laser pulses is kept constant by adjusting the intervals between successive said laser pulses in accordance with the moving speed of said workpiece, the method further comprising increasing the pulse widths of the laser pulses in accordance with the decrease in moving speed of the X-Y table in the portion where the moving speed of the X-Y table is decreased.

Abstract: Provided is an etching system and a method of controlling etching process condition. The etching system includes a light source that irradiates incident light into a target wafer, a light intensity measuring unit that measures light intensity according to the wavelength of interference light generated by interference between reflected light beams from the target wafer, a signal processor that detects a time point at which an extreme value in the intensity is generated when the intensity of interference light varies according to the wavelength, and a controller that compares the extreme value generating time point detected from the signal processor with a reference time point corresponding to the extreme value generating time point and controls a process condition according to the comparison result.

Abstract: A roll forming system which roll-forms a shaped beam by a roll forming unit including a plurality of roll formers is disclosed. A laser welding device for the roll forming system may include: front and rear guide means disposed apart from each other at the rear of the roll forming unit, and guiding movement of the shaped beam; laser welding means mounted above and between the front and rear guide means, reciprocatedly rotating a mirror by controlling a mirror motor so as to irradiate a laser beam to a welding position of the shaped beam, and thereby forming a welding bead having a predetermined welding pattern; forming speed detecting means detecting a forming speed of the shaped beam and transmitting a signal corresponding thereto to a controller; a camera disposed at the rear of the laser welding means, photographing a welding portion of the shaped beam, and transmitting an image signal corresponding thereto to the controller.

Abstract: A laser match honing system and method are provided for processing one of a pair of mechanically matching components (1, 2) having matching portions (12, 22, 16, 26) that will be fitted with each other. A dimension of the matching portion (12, 16) of the first component (1) is measured and is then used for calculating the desired dimension of the corresponding matching portion (22, 26) of the second component (2). An actual dimension of the matching portion (22, 26) of the second component (2) is also measured. Then, the matching portion (22, 26) of the second component (2) is honed by laser beam in the condition that the actual dimension is not equal to the desired dimension.

Abstract: An apparatus for manufacturing includes: a build chamber including a build platform; a material dispenser configured to distribute a layer of powdered material over the build platform; a mirror arranged over the build platform and defining a mirrored planar surface; a first laser output optic configured to output a first energy beam toward the mirror; a second laser output optic adjacent the first laser output optic and configured to output a second energy beam toward the mirror; a first actuator configured to maneuver the first laser output optic and the second laser output optic relative to the build platform; a lens arranged between the mirror and the build platform; and a second actuator configured to maneuver the mirror to scan the first and second energy beams across the lens, the lens outputting the first energy beam and the second energy beam toward and substantially normal to the build platform.

Abstract: A light-emission output of a flash lamp for performing a light-irradiation heat treatment on a substrate in which impurities are implanted is increased up to a target value L1 over a period of time from 1 to 100 milliseconds, is kept for 5 to 100 milliseconds within a fluctuation range of plus or minus 30% from the target value L1, and is then attenuated from the target value L1 to zero over a period of time from 1 to 100 milliseconds. That is, compared with conventional flash lamp annealing, the light-emission output of the flash lamp is increased more gradually, is kept to be constant for a certain period of time, and is then decreased more gradually. As a result, a total heat amount of a surface of the substrate increases compared with the conventional case, but a surface temperature thereof rises more gradually and then drops more gradually compared with the conventional case.

Abstract: A method of welding a fuel rod includes the following steps. An end plug and a cladding tube of the fuel rod are brought together to abut each other, and welded by applying a laser beam directed to a welding zone to melt material of the end plug and the cladding tube. The welding is sensed by sensing radiation within a first wavelength range, which includes the wavelength of the laser beam coming from reflections from the welding zone, sensing radiation within a second wavelength range different from the first wavelength range, which includes infrared radiation from melted material, and sensing radiation within a third wavelength range different from the first and second wavelength ranges, which includes radiation from plasma. The welding and melting of material is monitored by monitoring the sensed radiations.

Abstract: Methods and systems are provided for using optical interferometry in the context of material modification processes such as surgical laser or welding applications. An imaging optical source that produces imaging light. A feedback controller controls at least one processing parameter of the material modification process based on an interferometry output generated using the imaging light. A method of processing interferograms is provided based on homodyne filtering. A method of generating a record of a material modification process using an interferometry output is provided.

Abstract: In accordance with said control method, the transmission of the laser beam is periodically interrupted with the aid of means for masking the laser beam placed between the reference point and a source of the laser beam. Moreover, the transmission power of the source of the laser beam is varied between the minimum and maximum values, such that the emission times of the source of the laser beam at the minimum power substantially coincide with the masking times of the laser beam via the masking means. Preferably, the minimum value is at least equal to 10% and the maximum value at most equal to 90% of a maximum emission power of the source of the laser beam.

Abstract: A lid (2) for closing a cup (1) along a peripheral sealing edge (10) and a method for producing such a lid. The lid includes at least one aluminum film and an optionally multi-layered plastic layer which is co-extruded onto the aluminum film and has a closed predetermined tearing line (3). The plastic layer is made of plastic based on polyethylene (PE) or plastic based on polypropylene (PP), and the predetermined tearing line is introduced into the plastic layer preferably by means of a CO2 laser. The predetermined tearing line (3) may be provided directly in the region of the sealing edge (10).

Abstract: Provided are: a table on which a workpiece is placed, a laser oscillator emitting a laser beam; a light-guide optical system deflecting the beam emitted from the oscillator; a cylindrical extensible bellows surrounding an optical path of the beam after the light-guide optical system deflects the beam; a bend mirror moving in an axial direction of the bellows while extending/contracting the bellows and deflecting the beam having passed through the bellows toward the table; a machining head irradiating the workpiece with the beam deflected by the mirror; an abnormality detector including a beam-sensor light-emitting unit emitting a beam advancing parallel with an axis of the bellows and a beam-sensor light-receiving unit measuring the amount of received light of the beam; and a control device bringing down the laser oscillator when the amount of received light of the beam in the beam-sensor light-receiving unit falls below a first threshold.

Abstract: Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

Abstract: A system and method are disclosed for the precision fabrication of Micro-Electro-Mechanical Systems (MEMS), Nano-Electro-Mechanical Systems (NEMS), Microsytems, Nanosystems, Photonics, 3-D integration, heterogeneous integration, and Nanotechology devices and structures. The disclosed system and method can also be used in any fabrication technology to increase the precision and accuracy of the devices and structures being made compared to conventional means of implementation. A platform holds and moves a substrate to be machined during machining and a plurality of lasers and/or ion beams are provided that are capable of achieving predetermined levels of machining resolution and precision and machining rates for a predetermined application. The plurality of lasers and/or ion beams comprises a plurality of the same type of laser and/or ion beam.

Abstract: This invention relates to a method for cutting materials using a laser beam, which emerges from a cutting head comprising a cutting nozzle with an inner edge, and is absorbed by the cutting front. The axis of the laser beam is displaced in relation to a workpiece along a cutting line with a fixed orientation in the cutting direction of said workpiece. In this method the position (p) of the cutting head is modulated with regard to its time averaged value, or the laser power and gas pressure in the cutting head are modulated.

Abstract: According to example embodiments, a laser optical system includes a laser generator, at least one scan module, an objective lens, a relay lens, a review optical system, and a control device. The laser generator is configured to generate a laser beam. The at least one scan module is configured to reflect the laser beam generated by the laser generator and to direct the laser beam in different directions. The objective lens is configured to focus the laser beam on a substrate. The relay lens is configured to guide the laser beam scanned by the at least one scan module to within an incident range of the objective lens. The review optical system is configured to monitor, in real time, repair of the substrate using the laser beam. The control device is configured to control the at least one scan module.

Abstract: Systems and methods provide laser pulse energy control and/or monitoring. An example laser processing apparatus includes a laser system to generate a beam of laser pulses and a pulse energy control system to adjust the pulse energy of each laser pulse in the beam on a pulse-by-pulse basis. The pulse energy control system includes an open loop feedforward control path that selects a pulse energy transmission value for each laser pulse based on a calibrated transmission curve that maps laser pulse energy as a function of pulse repetition frequency. A laser energy monitor measures the laser pulse energy of each laser pulse in the beam of laser pulses. A power control loop may further adjust the pulse energy of one or more laser pulses in the beam of laser pulses based on feedback from the laser energy monitor.

Abstract: Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irradiating at least one location on a multi-layer work piece with a laser beam, ablating material at the at least one location, detecting one or more characteristics of the material ablated at the at least one location and analyzing the one or more characteristics to identify a change in at least one of the one or more characteristics that indicates a change in the type of material being ablated. Related systems are also described.

Abstract: An apparatus includes a probe tip configured to contact the mask, a cantilever configured to mount the probe tip wherein the cantilever includes a mirror, an optical unit having a light source projecting a light beam on the mirror and a light detector receiving a reflected light beam from the mirror, and an electrical power supply configured to connect the probe tip. The apparatus further includes a computer system configured to connect the optical unit, the electrical power supply, and the stage. The electrical power supply provides an electrical current to the probe tip and heats the probe tip to a predetermined temperature. The heated probe tip repairs a defect by smoothing and reducing a dimension of the defect, and inducing structural deformations of multilayer that cancel out the distortion (of multilayer) caused by buried defects using the heated probe tip as a thermal source canning the defect.

Abstract: A welding tool is configured with a housing enclosing a fiber laser system which is operative to produce a weld seam for connecting two workpieces. The fiber laser system includes a focusing optic configured to focus the output beam of the system so that it propagates through an elongated slit formed in the bottom of the housing. The fiber laser system is capable to move along a predetermined path extending parallel to the longitudinal direction of the slit and limited by the perimeter thereof. The output beam is generated only when the slit sits upon at least one of the workpieces.

Abstract: A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.

Abstract: Among other things, a system and method for adjusting the intensity of a laser beam applied to a semiconductor device are provided for herein. A sensor is configured to measure the intensity of a laser beam reflected from the semiconductor device. Based upon the reflection intensity, an intensity of the laser beam that is applied to the semiconductor device is adjusted, such as to alter an annealing operation performed on the semiconductor device, for example.

Abstract: A method and an arrangement for a firm bonding of a first material with a second material by means of soldering through focused laser radiation impacting on the first material, with the output controlled in dependence on the temperature measured in the area of the impacting focused laser radiation. To assure that surface properties will not lead to a noticeable distortion of the material temperature to be measured so that a reproducible, high quality soldering will be possible, it is provided for the temperature to be measured in an area of the first material that is adjacent to that in which the focused laser radiation impacts on the first material, with the area in which the temperature is measured and the area of impact of the laser radiation lying within the area of the soldering spot.

Abstract: A method and device for processing materials with laser pulses having a large spectral bandwidth and a device for carrying out said method. The aim of the invention is to create an easy, flexible method enabling universally applicable processing which can, however, be adapted to specific processing and methodological requirements. According to the invention, one or several spectral parameters of the laser pulses, i.e. the spectral amplitude and/or spectral phase and/or spectral polarization thereof, is/are specifically modified, preferably according to a measuring process variable, in order to process material or during the occurrence of said processing. The invention is used in order to process material with laser pulses having a large spectral bandwidth, particularly femto-second pulses and pico-second pulses.

Abstract: Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

Abstract: A manufacturing system for producing a reverse-tapered orifice is disclosed. The manufacturing system may have a mount configured to hold a workpiece, and a laser source configured to generate a laser beam. The manufacturing system may also have a delivery media operatively connected to the laser source. The delivery media may be configured to deliver the laser beam into a hollow portion of the workpiece to create the orifice through a wall of the workpiece having a laser beam entrance opening larger than a laser beam exit opening.

Abstract: A method for production of safety/rupture discs comprises the steps providing a foil element, selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut in the foil element by directly applying said laser beam to the foil element to remove material from the foil element thereby obtaining a safety/rupture disc.

Abstract: Systems and methods for forming apertures in microfeature workpieces are disclosed herein. In one embodiment, a method includes directing a laser beam toward a microfeature workpiece to form an aperture and sensing the laser beam pass through the microfeature workpiece in real time. The method can further include determining a number of pulses of the laser beam and/or an elapsed time to form the aperture and controlling the laser beam based on the determined number of pulses and/or the determined elapsed time to form a second aperture in the microfeature workpiece.

Abstract: A device and a process for processing and/or joining work pieces via laser radiation, with an effective power laser and a pilot target laser that emit laser beams of different wavelengths, with the laser beams being directed at the work pieces by laser optics. Regarding the laser beams, by the laser optics that comprise at least one diffractive optical element (DOE) as a masking system, the beam pattern of the pilot target laser is adjusted to match the beam pattern of the effective laser beam. This is accomplished preferably by removing the pilot laser beam from the effective laser beam for part of the path length by dichroic mirrors, and by expanding the diverging pilot laser beam on said part of the path length by deflecting mirrors whose distance from the dichroic mirrors is variable.

Abstract: A process control apparatus controls a focus position of a laser beam, while a laser processing mechanism converges the laser beam into a predetermined focus position and performs a laser processing on a workpiece. The process control apparatus includes: a calculator that, based on the magnitude of an output of the laser beam that changes during the laser processing, calculates a change amount of a positional deviation of the focus position in an optical axis direction that changes during the laser processing at a laser beam radiation position; and a control unit that, based on the change amount of the positional deviation that has been calculated by the calculator, controls the focus position of the laser beam during the laser processing so as to resolve the positional deviation of the focus position.