Abstract: A method, comprises drilling a set of one or more microvias in a semiconductor package with an aperture, wherein drilling the set of microvias comprises to use an aperture that has a phase shift region to reduce a spot size of a drilling beam that is used to form the set of microvias.

Abstract: The present invention discloses a coating layer removing apparatus and a method for the same. The apparatus of the present invention comprises a transport device displacing an electrode plate; a laser device having a laser head arranged above the displacement path of the electrode plate; and a control center electrically connected to the transport device and the laser device. The method of the present invention comprises mounting an electrode plate on the transport device; using the control center to set the speed of displacing the electrode plate, and program the time interval, count and penetration depths of the laser beams; and using the device of the present invention to form exposed areas equidistantly on the electrode plate. The apparatus of the present invention automatically removes a coating layer with a laser beam without directly contacting the electrode plate. Therefore, the present invention can fast form exposed areas of high quality.

Abstract: Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.

Abstract: A predictive pulse triggering (PPT) method enables precise triggering of a laser beam in a link-processing system. The PPT method entails triggering the laser beam based on estimated relative motion parameters of the target and laser beam axis. The PPT method allows for a six-fold improvement in laser positioning accuracy over the conventional, entirely measurement-based method.

Abstract: Provided are: a table on which a workpiece is placed, a laser oscillator emitting a laser beam; a light-guide optical system deflecting the beam emitted from the oscillator; a cylindrical extensible bellows surrounding an optical path of the beam after the light-guide optical system deflects the beam; a bend mirror moving in an axial direction of the bellows while extending/contracting the bellows and deflecting the beam having passed through the bellows toward the table; a machining head irradiating the workpiece with the beam deflected by the mirror; an abnormality detector including a beam-sensor light-emitting unit emitting a beam advancing parallel with an axis of the bellows and a beam-sensor light-receiving unit measuring the amount of received light of the beam; and a control device bringing down the laser oscillator when the amount of received light of the beam in the beam-sensor light-receiving unit falls below a first threshold.

Abstract: A fiber cutting mechanism prevents secondary utilization of a fiber laser light source that is incorporated in a device that uses a laser light. With a characteristic fiber cutting mechanism, when a laser device is separated from a laser light source application apparatus, at least a fiber is cut in an specific area from a point within a fiber grating to a connection point between the fiber grating and the fiber containing a laser activating substance.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: A method for stabilizing an output of a pulsed laser system includes a directly modulated laser diode by mitigating the effect of switching transients on the temporal shape of the outputted pulses. The method includes controlling a pulse shaping signal to define, over time, processing and conditioning periods. During the processing periods, the pulse shaping signal has an amplitude profile tailored to produce the desired temporal shape of the output. Each conditioning period either immediately precedes or follows a processing period. During a given processing period, the amplitude profile of the pulse shaping signal is tailored so that the drive current of the laser diode is lower than its maximum value during the corresponding processing period, and is of the same order of magnitude as the laser threshold current of the laser diode. In this manner, the stability of the output during the corresponding processing period is improved.

Abstract: An insulator for a sensor arrangement of a laser processing machine comprises an outer insulating part of plastics material for electrical shielding and an inner shielding part of a non-conductive heat-resistant material for shielding against laser irradiation and/or heat.

Abstract: A laser method of printing a pattern on works which is read at a high read rate by optical readers and a system for implementing the laser processing method are described. Print pattern data is generated based on printing conditions including at least an original print pattern such as a character string that are specified by users and then converted into data representing an actual print pattern to be actually printed on works according to a three dimensional profile of the works so that an orthogonal projection of that actual print pattern is identical with the original print pattern.

Abstract: Mastering tools and systems and methods for forming a plurality of cells on the mastering tools are provided. In particular, the systems vary the geometry of the cells or the placement of the cells, or both, for forming a textured surface on a mastering tool.

Abstract: The invention relates to a laser treatment apparatus including a laser oscillator, an interlock provided in the laser oscillator, a movable table which moves with a certain movement period, a timer, an interlock provided in the timer, a sensor which can detect movement of the movable table, and a computer, in which the timer starts measuring time when the sensor senses passage of the movable table, and when the movable table does not pass the sensor even after the movement period, conduction between contacts of the interlock provided in the timer is blocked to operate the interlock in the laser oscillator, thereby stopping laser output. The invention also relates to a laser treatment method using the laser treatment apparatus.

Abstract: A roll forming system which roll-forms a shaped beam by a roll forming unit including a plurality of roll formers is disclosed. A laser welding device for the roll forming system may include: front and rear guide means disposed apart from each other at the rear of the roll forming unit, and guiding movement of the shaped beam; laser welding means mounted above and between the front and rear guide means, reciprocatedly rotating a mirror by controlling a mirror motor so as to irradiate a laser beam to a welding position of the shaped beam, and thereby forming a welding bead having a predetermined welding pattern; forming speed detecting means detecting a forming speed of the shaped beam and transmitting a signal corresponding thereto to a controller; a camera disposed at the rear of the laser welding means, photographing a welding portion of the shaped beam, and transmitting an image signal corresponding thereto to the controller.

Abstract: A thin beam directional crystallization system configured to process a substrate comprises a laser configured to produce laser light, the laser configured to have a high energy mode and a low energy mode. The high energy mode is configured to produce light energy sufficient to completely melt a substrate coated with amorphous silicon film, while the low energy mode is configured to produce light energy that is not sufficient to completely melt a substrate coated with amorphous silicon film. The system further comprises beam shaping optics coupled to the laser and configured to convert the laser light emitted from the laser into a long thin beam with a short axis and a long axis, a stage configured to support the substrate and film, and a translator coupled with the stage, the translator configured to advance the substrate and film so as to produce a step size in conjunction with the firing of the laser.

Abstract: Various embodiments of the invention include methods and systems for trimming electronic circuits using short laser pulses of near-infrared wavelength at a high repetition rate. The laser pulses ablate material from a spot on a circuit with minimal thermal and photoelectric disturbances to circuit performance. Minimal disturbance to circuit performance allows for repeated trimming and testing without pausing for circuit reinitialization. To optimize trimming, the laser pulses can also be adjusted responsive to the composition of the material ablated. In some embodiments, the system is configured to trim a plurality of circuits in parallel.

Abstract: A laser processing device (100) comprises a laser light source (101) for emitting a laser light (L) and a laser light source controller (102) for controlling the pulse width of the laser light (L) and irradiates an object to be processed (1) with the laser light (L) while locating a converging point (P) within the object (1), so as to form a modified region along a line to cut (5) of the object (1) and generate a fracture extending in a thickness direction of the object (1) from the modified region as the modified region is formed. In the laser processing device (100), the laser light source controller (102) changes the pulse width of the laser light (L) according to a data table in which the fracture length, the thickness of the object (1), and the pulse width of the laser light (L) are associated with each other. That is, the pulse width is changed according to the fracture length generated from the modified region.

Abstract: An autofocus imaging apparatus (200) for three-dimensional imaging on a surface of a flexible media mounted on a cylindrical drum (104) includes a carriage (210) which moves parallel to a surface of the drum and an imaging stage (208) mounted on the carriage. The imaging stage includes a displacement sensor (112) for measuring a distance to the surface of the flexible media; imaging optics (216) for producing a three-dimensional image on the flexible media; and an autofocus drive (220) for changing a focus of the imaging optics. Encoders (256, 260) provide data on the drum and carriage position. A controller (116) receives and processes data from the displacement sensor and the encoders. A computer (236) receives data from the controller, processes controller data, and transmits instructions to the controller. The controller receives computer instructions and transmits focus commands to the autofocus drive or the imaging stage.

Abstract: A method is disclosed for on-the-fly processing at least one structure of a group of structures with a pulsed laser output, The method includes the steps of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity, and applying the pulsed laser output to the at least one structure of the group of structures during the step of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity.

Abstract: A laser machining method and apparatus that allow accurate and fine scribing without the need of a large-scale dust collector and a large quantity of cleaning fluid when a thin film on a substrate is scribed by a laser beam. A laser beam from a laser beam source is focused by a lens, introduced into a window of piping and propagated through cleaning fluid, and the thin film is illuminated with the laser beam from the nozzle. Concurrently with this beam illumination, a jet of the cleaning fluid supplied using a fluid flow controller is discharged from the nozzle that is disposed about substantially the optical axis of the focused laser beam and sized in inside diameter such that the focused laser beam does not make a contact with the nozzle. By these processes, laser-scribing is performed.

Abstract: Provided is an etching system and a method of controlling etching process condition. The etching system includes a light source that irradiates incident light into a target wafer, a light intensity measuring unit that measures light intensity according to the wavelength of interference light generated by interference between reflected light beams from the target wafer, a signal processor that detects a time point at which an extreme value in the intensity is generated when the intensity of interference light varies according to the wavelength, and a controller that compares the extreme value generating time point detected from the signal processor with a reference time point corresponding to the extreme value generating time point and controls a process condition according to the comparison result.

Abstract: A processing area of a structural component, such as a gas turbine component, is heated by irradiation with several laser sources prior to and/or during and/or after carrying out a processing such as a deposit welding or machining of the component on the processing area. For the heating, each laser source directs a respective energy beam onto the processing area, which respectively produces an energy spot on the processing area. The respective positions of the energy spots are static or quasi-static on the processing area. The energy spots jointly heat the processing area.

Abstract: The invention relates to a method for the generation of raised and/or recessed structures on workpieces comprising the steps: applying a pressure difference between one side of a wall of the workpiece and another side substantially opposite thereto; local heating of the wall of the workpiece to a softening temperature of the workpiece by a heat source in order to induce local deformation of the wall of the workpiece; and cooling of the workpiece. The invention relates, moreover, to an apparatus for carrying out this method.

Abstract: A monitoring device (10) for a laser machining device (12) that has one or more laser beams (13) that are displaced along a predetermined adjustable trajectory (14, 16) along a workpiece (18) includes one or more sensors (20, 22) which monitor(s) the processing signal (24) of the machining process in a three-dimensional section (26). The one or more sensors (20, 22) activate an alarm device or interrupter (28) for the one or more laser beams (13) of the laser machining device (12) if the one or more process signals (24) in the section (26) exceed a predetermined threshold value or fall short of it, the one or more sensors (20, 22) being independent of the laser machining device (12).

Abstract: Systems and related methods of programming a laser processing device for automated processing of a workpiece including indicating a processing location on a workpiece with a processing location indicator. The processing location is detected with a processing location detector. The scanner optics of the laser processing device are adjusted to a set position corresponding to the detected processing location. A set position of the scanner optics is detected with a processing location evaluator, and a control program corresponding to the detected set position of the scanner optics is generated with the processing location evaluator.

Abstract: Systems and methods automatically modify a laser-based system for processing target specimens such as semiconductor wafers. In one embodiment, the laser-based system detects a trigger associated with a processing model. The processing model corresponds to a set of wafers. In response to the trigger, the system automatically adjusts one or more system parameters based on the processing model. The system then uses the modified system parameters to selectively irradiate structures on or within at least one wafer in the set of wafers. In one embodiment, the trigger includes variations in a thermal state related to a motion stage. In response to the variations in the thermal state, the system operates the motion stage in a series of movements until a thermal equilibrium threshold is reached. The sequence of movements may, for example, simulate movements used to process a particular wafer.

Abstract: A laser welding apparatus is provided with a multiple axis robot having an arm and a scanner attached to a tip end of the arm of the multiple axis robot. The scanner includes an optical system that emits a laser beam onto a work piece. The scanner includes a preset coordinate system with an origin of the coordinate system coinciding with an intersection point between an optical axis of the laser beam and a fixed element of the optical system.

Abstract: A method for stabilizing an output of a pulsed laser system includes a directly modulated laser diode by mitigating the effect of switching transients on the temporal shape of the outputted pulses. The method includes controlling a pulse shaping signal to define, over time, processing and conditioning periods. During the processing periods, the pulse shaping signal has an amplitude profile tailored to produce the desired temporal shape of the output. Each conditioning period either immediately precedes or follows a processing period. During a given processing period, the amplitude profile of the pulse shaping signal is tailored so that the drive current of the laser diode is lower than its maximum value during the corresponding processing period, and is of the same order of magnitude as the laser threshold current of the laser diode. In this manner, the stability of the output during the corresponding processing period is improved.

Abstract: A system and method processes a structure comprising embedded material. The system includes a laser adapted to generate light and to irradiate an interaction region of the structure. The system further includes an optical system adapted to receive light from the interaction region and to generate a detection signal indicative of the presence of embedded material in the interaction region. The system further includes a controller operatively coupled to the laser and the optical system. The controller is adapted to receive the detection signal and to be responsive to the detection signal by selectively adjusting the laser.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: An extreme ultraviolet light generation system is an extreme ultraviolet light generation system which is used with a laser apparatus and is connected to an external device so as to supply extreme ultraviolet light thereto, and the extreme ultraviolet light generation system may include: a chamber provided with at least one inlet through which a laser beam is introduced thereinto; a target supply unit provided to the chamber for supplying a target material to a predetermined region inside the chamber; a discharge pump connected to the chamber; at least one optical element disposed inside the chamber; an etching gas introduction unit provided to the chamber through which etching gas passes, the etching gas being introduced to etch debris of the target material which is emitted when the target material is irradiated with the laser beam inside the chamber and adheres to the at least one optical element; and at least one temperature control mechanism for controlling a temperature of the at least one optical eleme

Abstract: A method and device for processing materials with laser pulses having a large spectral bandwidth and a device for carrying out said method. The aim of the invention is to create an easy, flexible method enabling universally applicable processing which can, however, be adapted to specific processing and methodological requirements. According to the invention, one or several spectral parameters of the laser pulses, i.e. the spectral amplitude and/or spectral phase and/or spectral polarization thereof, is/are specifically modified, preferably according to a measuring process variable, in order to process material or during the occurrence of said processing. The invention is used in order to process material with laser pulses having a large spectral bandwidth, particularly femto-second pulses and pico-second pulses.

Abstract: A method and a device for producing a tear line in a vehicle interior trim part, in which a laser beam is guided along a tear line and a material ablation in the form of holes with a residual wall thickness is effected. On the side facing the laser beam, the complete extent of the tear line is detected by a stationary matrix camera. In the machining at a machining site, only pixels of a CMOS matrix camera that are known in advance, for which the incidence of a measurement radiation is expected at this machining site, are read out. The laser is preferably scanned and non-adjacent machining sites are machined successively.

Abstract: An apparatus and method for processing a plurality of semiconductor parts in a laser-based system adjusts a default recipe to account for work to be performed on at least one part of the plurality of parts. The work to be performed on a part is analyzed using the default recipe and a part-specific recipe including a modified parameter of the default recipe. The default or part-specific recipe is selected based on a desired processing result, and the selected recipe replaces the default recipe to perform the work using the laser-based system.

Abstract: Various methods and systems measure, determine, or align a position of a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be selectively processed by delivering a processing laser beam to a processing laser beam spot. The various methods and systems utilize those structures themselves to perform the measurement, determination, or alignment.

Abstract: A method and apparatus is described that allows accurate control of the width of fine line structures ablated by lasers in thin films on substrates when using scanner and focussing lens systems. The method provides dynamic compensation for optical distortions introduced by the scan lens at off axis points by increasing the laser power or energy in the beam in order to overcome the reduction in power or energy density.

Abstract: An abnormality determination and estimation device for a weld product in a welding process includes a jig device and an AE sensor. The jig device holds the product by a holding face, through which the jig device and the product are in close contact with each other. The AE sensor detects an elastic wave in the jig device. Accordingly, abnormality detection accuracy can be improved, and abnormalities can be discriminated.

Abstract: A method for producing a surface structure for a metallic press plate, endless belt or a cylindrical embossing roller through at least one laser and a device for using the method. In order to provide a cost effective production for the surface structure while using environmentally friendly techniques, it is proposed to use a laser which produces the entire surface structure through partial removal of a surface of a metallic press plate, endless belt or embossing roller to be processed. Thus, the laser is controlled by a provided 3D topography, wherein control of the laser is performed through obtained x, y and z coordinates in order to produce a depth structure, so that high portions and low portions are formed.

Abstract: The invention relates to a machine tool for processing a plate-like workpiece, including a processing tool. The processing tool is movable relative to the workpiece and the workpiece is movable relative to the processing tool along a common movement axis. A control unit selectively actuates the processing tool and the workpiece in such a manner that in a first processing mode both the processing tool and the workpiece are moved along the common movement axis and, in a second processing mode the processing tool alone is moved along the common movement axis. The invention further relates to a method for processing a workpiece of the kind mentioned above, to a method for creating a processing program, and to a computer program product having code for performing all steps of the method for creating the processing program.

Abstract: A process control apparatus controls a focus position of a laser beam, while a laser processing mechanism converges the laser beam into a predetermined focus position and performs a laser processing on a workpiece. The process control apparatus includes: a calculator that, based on the magnitude of an output of the laser beam that changes during the laser processing, calculates a change amount of a positional deviation of the focus position in an optical axis direction that changes during the laser processing at a laser beam radiation position; and a control unit that, based on the change amount of the positional deviation that has been calculated by the calculator, controls the focus position of the laser beam during the laser processing so as to resolve the positional deviation of the focus position.

Abstract: A system includes a cutting station having a laser cutter for cutting surface marks, score lines, holes, slots, flaps, panels, etc. into a selected substrate, an image capture device for capturing digital image data associated with the selected substrate, and a computing system for controlling the cutting process. The computing system 32 initiates a calibration test cycle that 1) cuts a test pattern into the selected substrate; and 2) analyzes the test pattern that was cut into the selected substrate. Based on the results of the analysis of the captured image, the system adjusts the operational parameters of the laser cutter during a subsequent packaging production run utilizing the same substrate type.

Abstract: A method for the recovery of energy from a laser machining system and a device for performing the same, in which the method includes operating the laser machining system and generating thermal energy having a maximum temperature Tmax, removing at least a portion of the thermal energy, and recirculating the at least a portion of the thermal energy to the laser machining system.

Abstract: A method for forming an epitaxial layer in a capacitor over interconnect structure, includes selecting a laser having a suitable wavelength for absorption at a seeding layer/annealing layer interface of the capacitor over interconnect structure, and directing laser energy from the selected laser at the capacitor over interconnect structure. The laser energy anneals a feature of the capacitor over interconnect structure to form an epitaxial layer. The annealing is accomplished at a temperature below about 450° C. The selected laser can be an excimer laser using a pulse extender. The capacitor over interconnect structure can be a ferroelectric capacitor formed over a conventional CMOS structure.

Abstract: A quality assurance system includes an internet/wide area network interface configured to provide bidirectional communication with user terminals; a wireless interface configured to provide bidirectional communication with mobile user terminals; and a quality assurance database cooperatively coupled with a database manager. The data base manager is configured to populate the quality assurance database with identifications of individual ones of a plurality of construction project welders, weld inspectors and a plurality of weld data logs individual ones of which are associated with a specific welding operation of a construction project. Each weld data log is configured to store information that is at least descriptive of a welder, material used during the specific welding operation, specifics of a completed weld including at least weld location, weld type and weld dimensions, and information descriptive of a weld examination.

Abstract: A medical laser system and related methods of monitoring optical fibers to determine if an optical fiber cap on the optical fiber is in imminent danger of failure. The laser system includes a photodetector for converting returned light from the optical fiber cap to an electronic signal for comparison to a trigger threshold value known to be indicative imminent fiber cap failure. The returned light can be the main laser treatment wavelength, an auxiliary wavelength such as an aiming beam or infrared wavelengths generated by a temperature of the optical fiber cap. In the event the electronic signal reaches the trigger threshold value, the laser system can be temporarily shut-off or the power output can be reduced.

Abstract: The invention relates to a method for production of a multi-layer analysis element for liquid samples, with at least one test field for the analysis of the liquid samples, in which method an analysis element blank composed of at least two superposed material layers is made available. The multi-layer analysis element or a constituent part of the multi-layer analysis element is cut out from the analysis element blank by means of laser radiation. The laser radiation cuts through different material layers in at least two areas and has a laser power which is effective for the cutting and which is varied as a function of the thickness and the material of the different material layers to be cut in the areas.

Abstract: A laser crystallization apparatus and a crystallization method with a high throughput are provided. Laser light having a predetermined light intensity distribution is irradiated to a semiconductor film to melt and crystallize, wherein a irradiation position is placed very quickly and with a high positional accuracy, thereby forming the semiconductor film having a large crystal grain size. A laser crystallization apparatus according to one aspect of the present invention comprises a crystallizing laser light source, a phase shifter modulating pulse laser light to have the predetermined light intensity distribution, an excimer imaging optical system, a substrate holding stage mounting a processing substrate and continuously moving in the predetermined direction, a position measuring means, and a signal generating means indicating generation of the pulse laser light based on the position measurement of the stage by the position measuring means.

Abstract: In a method for processing brittle material, a laser light from a laser light source irradiates the brittle material and transports an irradiating position of the laser light along a predetermined line, wherein the laser light L from a plurality of laser light sources 11, 12 . . . m1, m2 . . . mn is irradiated simultaneously onto the surface of the brittle material W, and an irradiating range of the laser light, which is set to a predetermined shape, is moved over the surface of the brittle material. Furthermore, a plurality of optical wave guides 10 . . . 10 that guide the laser light from the laser light sources 11, 12 . . . m1, m2 . . . mn to the brittle material are provided, and composite laser light L irradiates the surface of the brittle material, with these optical wave guides 10 . . . 10 bundled together.

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 ?m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 ?m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 ?m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.