Abstract: A laser system including various optical components providing for beam alignment and process monitoring of a stent cutting process is described. The various aspects of the invention provide for monitoring of a beam of laser light reflected from the surface of a stent tube so as monitor the properties of the cutting beam, location of the beam, system cleanliness, optical defects in the system, and cutting efficiency of the laser.

Abstract: An apparatus and a method using a laser beam to produce a substantially vertical edge on a workpiece using a laser beam. The apparatus comprises a galvanometer for directing the laser beam and at least one substantially straight minor disposed in a substantially vertical position. The substantially straight mirror being positioned to redirect the laser beam on the workpiece at a selected incline, the incline being sufficient to produce the substantially vertical edge.

Abstract: A telecentric F-theta lens is added to the optical chain of a laser used to cut stent patterns into a stent tube to facilitate positioning and alignment of the laser beam and to compensate for lateral and angular shift of the beam spot.

Abstract: A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.

Abstract: A method of creating thin wafers of single crystal silicon wherein an ingot of single-crystal silicon with a (111) axis is flattened and polished at one end normal to the axis, and a notch with a vertex in the (111) plane is produced on a side or edge of the ingot, such that the distance between this vertex and said end is the desired thickness of a wafer to be cleaved from the ingot and such this vertex is in the desired plane of cleavage. Light of a wavelength able to penetrate into the silicon crystal without significant absorption, when the intensity of the beam is low, but is efficiently absorbed and converted to heat when the intensity of the beam is high, is focused to an elongated volume with an axis of elongation in the desired cleavage plane, parallel to and a short distance from said notch edge.

Abstract: The head (9) of the cutting apparatus (4) of the laser comprises a gas supply through a device such as a barrel dispenser which chops the blowing flow rate, which produces a better discharge of the liquid slag melt by the laser beam (16, 18) out of the plate (19) to be cut. A measurement (36) of backscattered light is made in order to check the good quality of cutting, the amount measured being smaller if the cutting actually passes through the plate (19), and the frequency or the pressure of the blowing pulses is adjusted by a controlling device (39) to keep the measure to a minimum by optimizing the slag discharge conditions.

Abstract: A method of manufacturing a helical bar concave from a flat, rolled laser cut arrangement that provides a net helical concave functionality. Laser cutting a flat metal sheet to form helical cutouts defining a percent open area having a helical geometry in combination with configurable rub bars mounted in a helical fashion results in a configurable helical bar concave in which the number or aggressiveness of the threshing surface on the inside radius of the grate may be changed and/or the rub bars may be moved to the outside of the grate to change the percent open area and hence the separation characteristics of the concave.

Abstract: A stent manufacturing device and methods for making intravascular stents and other medical devices. The stent manufacturing device may include a base, a laser or other cutting device coupled to the base, a horizontal motor coupled to the base, and a rotary motor coupled to the horizontal motor. A workpiece can be attached to the cutting device, for example adjacent the rotary motor, and the workpiece can be cut with the cutting device.

Abstract: There is provided high power laser systems, high power laser tools, and methods of using these tools and systems for cutting, sectioning and removing structures objects, and materials, and in particular, for doing so in difficult to access locations and environments, such as offshore, underwater, or in hazardous environments, such as nuclear and chemical facilities. Thus, there is also provided high power laser systems, high power laser tools, and methods of using these systems and tools for removing structures, objects, and materials located offshore, under bodies of water and under the seafloor.

Abstract: Moving enclosures for laser equipment are provided. A machine tool installation is disclosed, including (a) a laser cutting head configured to be movable in three dimensions; (b) a workpiece support configured to support a workpiece in operative relationship with the laser cutting head; (c) a skirt configured to surround the laser cutting head on three sides and intercept light that passes from the head and is reflected off of the workpiece or workpiece support; and (d) a protective cover positioned to intercept light that is reflected off of the workpiece or workpiece support and is not intercepted by the skirt. The skirt and protective cover are configured to move laterally with the laser cutting head.

Abstract: Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

Abstract: A pulse-operated laser emitting device for cutting a sapphire substrate includes a picoseconds laser for emitting a laser beam and a collimator lens positioned in a path of the laser beam and which cuts the sapphire substrate cleanly so as not to require any grinding or polishing processes afterwards.

Abstract: To provide a laser cutting method that is capable of cutting the substrates high accurately with high throughput at a low cost. It is a laser cutting method for cutting a laminated substrate that is formed by laminating at least a pair of substrates. The method comprises the steps of: providing a pattern member with a characteristic of absorbing light of a wavelength that transmits each of the substrates, between each of the substrates along a cutting position of the laminated substrate; and irradiating a laser of the wavelength that transmits the substrates along the pattern member, whereby the laminated substrate is cut along the pattern member.

Abstract: Systems and methods are described for efficient laser processing of a moving web-based material. In one embodiment, a moving web is provided at a selected speed. A laser beam is generated having a focal point positioned to provide either a score or cut in the web. The focal point of the laser beam is moved at a speed less than the selected speed for a selected distance thereby producing a discreet score or cut in the web in the machine direction. The focal point is repositioned to form another discreet score or cut once the prior discreet score or cut is formed. The repositioned focal point is moved at a speed less than the selected speed for another selected distance. The step of repositioning is repeated to form a plurality of discreet scores or cuts in the web moving at the selected speed. The laser beam is therefore able to be generated using less power than would be needed to produce the same type of discreet score or cut if the focal point were stationary as the web is moved at the selected speed.

Abstract: The present invention relates to a device for the treatment of a workpiece, in particular of a substantially flat substrate, comprising a table (2) for supporting the workpiece (5), a flow generation apparatus (6, 11) producing a gas flow (22) on a top face (17.1, 17.2) of the table (2) in a region between the workpiece (5) and the top face (17.1, 17.2) of the table (2), on which gas flow the workpiece (5) is supported during the treatment.

Abstract: In a method and system for slitting thin strip magnetic steel such as transformer core material, a laser is mounted above the material and the material is wound from a pay-out reel to one or more take-up reels.

Abstract: Safety confinement equipment for laser radiation includes a safety confinement enclosure having two laterally opposite openings through which at least one metal strip can pass, the enclosure including first and second jaw devices for clamping the strip disposed on a path of travel of the strip between the two openings, the jaws being transversely disposed at least over the width of the strip. A cutting or welding equipment head emits a beam of laser radiation to be confined, in which the beam can be moved transversely between a pair of jaws disposed opposite each other on one side of a surface of the strip. In the position in which the jaws clamp the strip, the engagement of the jaws on the surfaces of the strip induces the formation of a physical screen against the laser radiation, which prevents the radiation from passing through the two openings of the chamber.

Abstract: The invention relates to a method for producing a contour cut in a sheet metal web (BB) transported in a direction of transport (T) by means of a conveying apparatus (3). To accelerate the production of the contour cut, it is proposed in accordance with the invention to divide the sheet metal web (BB) into a plurality of overlapping processing strips and to assign successively two laser cutting units (10, 11) to at least two processing strips in the direction of transport (T).

Abstract: A device for removing a coating formed in a slot of a stator core. The device includes a carriage movably attached to a first guide rail assembly to enable movement of the carriage in a longitudinal direction. The device also includes a first drive screw wherein rotation of the first drive screw moves the first guide rail assembly in the longitudinal direction. In addition, the device includes a second guide rail assembly that is attached to the carriage wherein the second guide rail assembly enables movement of the carriage in a direction transverse to the longitudinal direction. Further, the device includes a second drive screw wherein rotation of the second drive screw moves the carriage in the transverse direction. The carriage includes a laser beam emitting head that moves within the slot in either or both the longitudinal or transverse directions wherein the laser beam emitting head emits a laser beam to remove the coating.

Abstract: There are provided using high power laser systems for performing decommissioning welding and repair of structures in boreholes, off-shore, and other remote and hazardous locations. In a particular embodiment the laser system is a Class I system.

Abstract: A system prevents oxidation of a laser cut workpiece by utilizing a laser source that utilizes laser source with an inert gas, such as argon or helium, rather than air or oxygen, to create the slots or kerfs which form the pattern cut into the workpiece. The system introduces oxygen gas through the workpiece as it is being laser cut to oxidize any slag or dross created during the laser cutting process. Oxygen or a mixture of oxygen with other gases cools the slag and the workpiece while at the same time oxidizing the slag to either completely burn or partial burn the slag before it strikes an exposed surface of the tubular member.

Abstract: The present invention relates to a fiber laser system for processing materials involving a system of interconnected operational components for combining and optionally distributing beams from multiple beam emitters. More particularly, the present invention provides a system for combining and distributing fiber laser beams having different wavelengths and a method for operating the system thereof. Multiple beam combiners may be optionally linked with a beam distribution system. In exemplary use, multiple fiber laser sources generating different wavelength outputs are combined in a single beam incident of a work piece comprising multiple layers.

Abstract: Embodiments of methods and systems for processing a semiconductor wafer are described. In one embodiment, a method for processing a semiconductor wafer involves performing laser stealth dicing on the semiconductor wafer to form a stealth dicing layer within the semiconductor wafer and after performing laser stealth dicing, cleaning the semiconductor wafer from a back-side surface of the semiconductor wafer with a blade to remove at least a portion of the stealth dicing layer. Other embodiments are also described.

Abstract: An object to be processed 1 comprising a substrate 4 and a plurality of functional devices 15 formed on a front face 3 of the substrate 4 is irradiated with laser light L while locating a converging point P within the substrate 4, so as to form at least one row of a divided modified region 72, at least one row of a quality modified region 71 positioned between the divided modified region 72 and the front face 3 of the substrate 4, and at least one row of an HC modified region 73 positioned between the divided modified region 72 and a rear face 21 of the substrate 4 for one line to cut 5. Here, in a direction along the line to cut, a forming density of the divided modified region 72 is made lower than that of the quality modified region 71 and that of the HC modified region 73.

Abstract: This invention pertains to machinery and methods for cutting a workpiece utilizing a cutting tool into at least two parts having prescribed shapes from a metal plate comprising the steps of: identifying each of the parts by one or more contour lines; cutting a workpiece along one of the identifying contour lines into one of the parts; creating at least one path diversion, wherein the diversion has an associated bounded region or opportunity; cutting the workpiece along a contour line associated with the opportunity; resuming the cutting of the part along the identifying contour line with minimal damage to the part being cut; finishing the cutting of the part and then moving the cutting tool to the opportunity and hence to an associated adjacent identifying contour line and then repeating the process until all parts have been manufactured.

Abstract: A method for dividing a thin film device having a first lower electrode layer, a second active layer and a third upper electrode layer, all three layers being continuous over the device, into separate cells which are to be electrically interconnected in series, at least the dividing of the cells being carried out in a single pass of a process head across the device, the process head performing at least the following steps in the single pass: a) making a first cut through the first, second and third layers; b) making a second cut through the second and third layers, the second cut being adjacent to the first cut; c) making a third cut through the third layer, the third cut being adjacent to the second cut and on the opposite side of the second cut to the first cut; wherein at least one of the first and second cuts is formed using two laser beams sequentially during the single pass of the process head across the device, the first laser beam forming a cut through at least one of the layers and the second laser b

Abstract: A switchable compound laser working machine comprises a machine body, a first output module, a second output module, a switch module, and a control module. The first and second output modules are respectively provided with a laser tube. The switch module has at least one lens. It is able to change the output direction of laser beams by moving the lens. The control module is used for controlling the laser tubes of the first and second output modules to perform output operation respectively and used for moving the lens of the switch module into output pathway of the laser beams from the first or the second output module to alter the output direction of the laser beams.

Abstract: A method for manufacturing a semiconductor device is provided. The method contains steps of providing the semiconductor device including a working area; directing a medium flow onto the working area; configuring a lens in contact with the medium flow; and directing a laser beam to the working area through the lens and the medium flow. A laser processing for manufacturing a semiconductor device is also provided.

Abstract: This robot system includes a robot, a laser emitting portion moved by the robot, emitting a laser beam to a target workpiece, and a control portion controlling the laser emitting portion to emit the laser beam on the basis of information regarding an arbitrarily-shaped work locus and movement information of the laser emitting portion.

Abstract: While a converging lens 108 is relatively moved along a line 50 including a line to cut 5, measuring laser light L2 is converged with the lens 108 when the lens 108 is positioned on a processing region 30 having an outer shape between an object to be processed 1 and a frame 22, and a reflected light component of the laser light L2 reflected by a front face 3 of the object 1 is detected. While keeping a substantially constant distance between the front face 3 and the lens 108 such that a converging point P of processing laser light L1 is positioned at a constant distance from the front face 3 according to the detection, the laser light L1 is converged by the lens 108, so as to form a molten processed region 13 within the object 1.

Abstract: This laser cutting apparatus is a laser cutting apparatus that cuts a workpiece by radiating a laser beam thereon, and is provided with a laser entrance portion to which an optical fiber that transmits the laser beam is fixed and an optical system through which the laser beam radiated from the optical fiber fixed by the laser entrance portion passes, wherein the laser entrance portion includes a moving portion that moves or tilts the optical fiber with respect to the optical system and a fixing portion that fixes the moved or tilted optical fiber with respect to the optical system.

Abstract: There is disclosed a method of processing a security item 1. The security item comprises a holographic security feature 2 having at least one metallised layer. The holographic security feature 2 is applied to the reverse of a substantially transparent film through which the holographic security feature is viewed in use of the security item. The transparent film protects the holographic security feature from the environment in the finished security item. The method includes the step of applying laser radiation to the metallised layer of the holographic security feature through the transparent film to remove a portion of the metallisation to define a pattern of identifying information on the holographic security feature. The method has the advantage that the hologram can be customised with identifying information after manufacture of the security item.

Abstract: Provided are an optical system and a laser processing apparatus with which the energy intensity distribution of laser light at a processing point can be made higher in a peripheral region than in a center region in a simple manner. An optical system is provided with a collimating lens group that emits laser light including parallel rays; an axicon lens that has a circular conical shape and into which the light emitted from the collimating lens group enters; and a focusing lens group that focuses the light emitted from the axicon lens, wherein a conical surface of the axicon lens is positioned on the collimating lens group side, and a flat surface of the axicon lens is positioned on the focusing lens group side.

Abstract: Vision correction and tracking systems may be used in laser machining systems and methods to improve the accuracy of the machining. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The vision correction and/or tracking systems may be used to provide scribe line alignment and uniformity based on detected parameters of the scribe lines and/or changes in the workpiece.

Abstract: An apparatus and a method are provided for cutting, cutting-out and perforating web or sheet substrates. The apparatus has a laser cutting device disposed above or below a transport plane for processing a substrate. The laser cutting device includes at least one laser array extending over the width of the substrate and having individually drivable lasers. The laser array is composed, in particular, of a plurality of individual arrays. The lasers are, in particular, constructed as vertical-cavity surface-emitting lasers. In this way, processing of the substrate at high transport speeds is made possible.

Abstract: A head for the continuous precision machining on three-dimensional bodies includes a fastening means to a flange of a machining equipment, having a first mechanical rotation axis, an intermediate means having a second mechanical rotation axis in series to the first mechanical rotation axis. The second mechanical rotation axis is orthogonal to the first mechanical rotation axis which intersects at a point of intersection. A terminal processing means has in series with the first and second mechanical rotation axes a third mechanical translating axis. The intermediate means has an arc configuration of a circumference with its centre at the point of intersection. The first mechanical rotation axis and the third mechanical translating axis are radially oriented to the arc.

Abstract: A laser machining apparatus includes a main control unit executing NC program; a laser oscillator oscillating laser light according to instruction from the main control unit; a distance sensor measuring distance L between a nozzle and a workpiece; a sensor-data processing unit sampling a measured value of the distance sensor; and a copying control unit moving a machining head to maintain the distance constant based the measured value, wherein the sensor-data processing unit samples the measured value with an operation period shorter than that of the main control unit and, when a portion corresponding to the through hole in the workpiece comes off and the distance becomes larger than a predetermined value during the inner hole machining, causes oscillation of laser light to be stopped by outputting a stop signal to the laser oscillator.

Abstract: The invention relates to a laser cutting method for cutting a C—Mn steel workpiece, characterized in that laser beam generation means comprising at least one silica fiber with an ytterbium-doped core is used to generate the laser beam. Preferably, the ytterbium-based fiber has a wavelength between 1.07 and 1.1 ?m, preferably 1.07 ?m, the quality factor of the laser beam is between 0.33 and 8 mm.mrad, and the laser beam has a power of between 0.1 and 25 kW. The assistance gas for the laser beam is chosen from nitrogen, helium, argon, oxygen, CO2 and mixtures thereof, and, optionally, it further contains one or more additional compounds chosen from H2 and CH4.

Abstract: A laser beam machining apparatus includes laser beam irradiation unit for irradiating a wafer held on a chuck table with a laser beam, and control unit. The laser beam irradiation unit includes a laser beam oscillator for oscillating a laser beam with such a wavelength as to be transmitted through said wafer, repetition frequency setting section for setting a repetition frequency of pulses in the laser beam oscillated from the laser beam oscillator.

Abstract: A positioning device of the type described characterised by the incorporation of the puck into a closed circuit gas system from which the puck establishes the flow of fluid to provide the fluid cushion. Typically the positioning device is characterised by the provision of a heat transfer mechanism incorporated in the closed circuit to provide for heat exchange between the heat transfer mechanism and gas flowing around the system. The puck is coupled to a lens and a mask to provide for close following of a surface of a work-piece so as to keep a magnified image of the mask stable; the combination of puck, lens and mask forming a unit counterbalanced by a counterweight acting to provide for adjustment of focus of the laser beam relative to the surface of the work-piece.

Abstract: A laser processing machine has an expanded operating space so that larger workpieces can be processed and/or the spatial requirement for the laser processing machine is reduced.

Abstract: The invention relates to a method for fracture splitting workpieces and to a workpiece that is produced according to such a method. According to the invention, the feed rate and/or the laser pulse is modulated during the laser machining process dependent on the workpiece geometry and/or the laser power.

Abstract: A device for laser cutting materials, including metals. The device provides for independent simultaneous operation of two or more laser heads at one machine. The machine includes a support, at least one longitudinal slide, at least two transversal slides, at least two laser heads, and a controlling computer. Each transversal slide is mounted on the longitudinal slide to permit longitudinal horizontal movement, and each laser head is mounted on the transversal slide to permit transverse horizontal and vertical movement. Drives of the transversal slides and laser heads are connected to the computer, which is configured to independently control each of those drives. As a result, in versions having two laser heads, the machine allows three dimensional control of each of two lasers, thus controlling laser head movement along a total of six axises.

Abstract: Methods and systems for imaging and cutting semiconductor wafers and other microelectronic device substrates are disclosed herein. In one embodiment, a system for singulating microelectronic devices from a substrate includes an X-ray imaging system having an X-ray source spaced apart from an X-ray detector. The X-ray source can emit a beam of X-rays through the substrate and onto the X-ray detector, and X-ray detector can generate an X-ray image of at least a portion of the substrate. A method in accordance with another embodiment includes detecting spacing information for irregularly spaced dies of a semiconductor workpiece. The method can further include automatically controlling a process for singulating the dies of the semiconductor workpiece, based at least in part on the spacing information. For example, individual dies can be singulated from a workpiece via non-straight line cuts and/or multiple cutter passes.

Abstract: An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.

Abstract: There is provided pressure control systems, methods and apparatus for the use of high power laser energy to server structures, such as rods, tubes, wireline, slickline and braided line in well and pipeline pressure control situations.

Abstract: Provided is a technology for manufacturing cutting tools that is capable of providing cutting tools that have a cut surface whose surface is uniformly smooth and that have a stable performance.

Abstract: Methods of dicing substrates having a plurality of ICs. A method includes forming a mask and patterning the mask with a femtosecond laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. The substrate is etched through the gaps in the patterned mask to singulate the IC. The mask is removed and metallized bumps on the diced substrate are contacted with an inorganic acid solution to remove mask residues.

Abstract: A device and a process for processing and/or joining work pieces via laser radiation, with an effective power laser and a pilot target laser that emit laser beams of different wavelengths, with the laser beams being directed at the work pieces by laser optics. Regarding the laser beams, by the laser optics that comprise at least one diffractive optical element (DOE) as a masking system, the beam pattern of the pilot target laser is adjusted to match the beam pattern of the effective laser beam. This is accomplished preferably by removing the pilot laser beam from the effective laser beam for part of the path length by dichroic mirrors, and by expanding the diverging pilot laser beam on said part of the path length by deflecting mirrors whose distance from the dichroic mirrors is variable.

Abstract: A system and method is provided to use a laser system to remove excess weld bead build up from a workpiece after a welding operation. After a weld bead is formed a weld bead can have a protrusion which extends above a surface of a workpiece and it is desirable to remove the protrusion. A system and method is provided which uses a laser beam oriented at an angle and delivered with an intensity sufficient eliminate or remove the excess weld bead build up.