Abstract: A system comprises a working laser beam, a sensing laser beam, first and second optical elements, an optical sensor, an aperture and a controller. The first optical element generates a coaxial beam from the working laser beam and the sensing laser beam. The second optical element focuses the coaxial beam onto a workpiece, such that the working laser beam machines the workpiece and the sensing laser beam reflects from the workpiece. The optical sensor senses an intensity of the reflected sensing beam. The aperture determines a focus position by translating along the reflected sensing beam, such that the reflected intensity is maximized. The controller determining a machining parameter of the working laser beam, based on the focus position.

Abstract: In the method for cutting a material layer (20) along a given cutting line (21), a cutting beam is moved so as to impinge on the material layer (20) laterally offset by a distance (W) from the cutting line (21). The distance (W) is determined as a function of the variations of the cutting speed at which the cutting beam is moved, and/or as a function of the deviations of the effective cutting beam cross-section from a circular shape.

Abstract: The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.

Abstract: An exemplary brittle non-metallic workpiece (80) defines a through hole (82). An inner surface (822) for forming the through hole has no microcracks and burrs. A method for making a through hole in a brittle non-metallic substrate (50) is also provided. The method includes as follows: forming an enclosing sketched etch (66) engraved into a brittle non-metallic substrate with a given depth (H) from a surface of the brittle non-metallic substrate; placing a cooling object (74) on an excess portion (68) inside the enclosing sketched etch (66); and extending the enclosing sketched etch through the brittle non-metallic substrate.

Abstract: A trimmer for trimming a book has a support for supporting a book, at least one laser for scoring an edge of the book so as to produce a score, and a trimming station for trimming the book at the score.

Abstract: A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 100 utilizes a beam expander 220, two half-wave plates 224, 238, a polarizing beam splitter 228, a mirror 236, and two lenses 234, 242 to provide two identical laser beams 202, 204 from a single laser source 214. The identical laser beams 202, 204 are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates 224 is rotated to yield laser beams with the same power. The other half-wave plate 238 is rotated to yield laser beams with the same polarization direction.

Abstract: A system for removing a stator vane includes a platform, a cutting tool connected to the platform, and a sliding connection between the cutting tool and the platform. The system further includes means for advancing the cutting tool with respect to the platform. A method for removing a stator vane includes positioning a platform inside a casing that surrounds at least a portion of the stator vane. The method further includes pivoting a cutting tool with respect to the platform, sliding the cutting tool in a plane with respect to the stator vane, and cutting the stator vane with the cutting tool.

Abstract: To create a metal section (P3) of complex shape, a three-dimensional drawing is made of the final size, then plane drawings are developed and made of each of the elements that form a distinct part of the section. These elements are then cut out (A3, B3) in at least one metal plate. Cutting operations are preferably executed flat in the flat plate. If necessary, at least one of the elements (A3, B3) is then formed. Lastly, the elements (A3, B3) are assembled together by welding for example, to form the section (P3).

Abstract: In some aspects, methods includes forming intersecting apertures in a workpiece with a laser beam by moving the laser beam along intersecting line paths, and cutting out a portion of a shape from the workpiece by moving the laser beam along a continuous final path extending around an intersection point of the intersecting line paths.

Abstract: A laser woodworking machine for cutting wood is disclosed. The machine includes a laser cutting head having two sections structurally configured to include sensors for measurements of depth and of reflected frequencies, a laser unit for supplying power to the laser cutting head, a cabinet enclosure for housing the laser unit and including a table surface, a radial arm supported by a column secured to the inside rear portion of the cabinet enclosure and including a pair of radial supports extending perpendicularly from opposite sides of the column and parallel to each other, and a glider carriage secured to the radial supports and including two substantially flat surfaces above and below the radial supports so that the glider carriage slides along the radial supports via sleeves, the glider carriage further comprising support for the laser cutting head so that the laser cutting head is moveable along the radial arm.

Abstract: A laser-based workpiece processing system includes sensors connected to a sensor controller that converts sensor signals into focused spot motion commands for actuating a beam steering device, such as a two-axis steering mirror. The sensors may include a beam position sensor for correcting errors detected in the optical path, such as thermally-induced beam wandering in response to laser or acousto-optic modulator pointing stability, or optical mount dynamics.

Abstract: The invention relates to a method for laser-cutting sheet steel (1), wherein a sheet steel (1) is gradually inserted in a defined position into the cutting area (2) of a laser cutter in a direction of advance V in order to machine it. The sheet steel (1) is machined by laser cutting in a machinable area corresponding to the length of the cutting area (2), in the entire machinable area or only in a section thereof. The machined part (8) and the non-machined part (8) of the sheet steel may also only overlap in some sections (10). An automatic discharge device is also provided. The manufactured parts and the remaining grid are likewise cut from the sheet steel (1) by laser cutting. The method can be repeated in several machining steps until the sheet steel (1) is completely machined, the results of the preceding machining step being taken into consideration for the subsequent machining step. The invention allows to optimally utilize the sheet steel (1) even when using smaller laser cutters.

Abstract: There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device.

Abstract: A rotatable workpiece holder for holding a hollow cylindrical workpiece thereon functions as a chiller for cooling the hollow cylindrical workpiece. A coolant, e.g., water, is supplied to the hollow cylindrical workpiece through second coolant passages and branch passageways defined in the workpiece holder, thereby cooling the hollow cylindrical workpiece. The coolant forms a film in a clearance between the outer surface of an annular side wall of the workpiece holder and the inner circumferential surface of the hollow cylindrical workpiece.

Abstract: Electronic devices may be provided with display structures such as glass and polymer layers in a liquid crystal display. The glass layers may serve as substrates for components such as a color filter layer and thin-film transistor layer. The polymer layers may include films such as a polarizer film and other optical films. During fabrication of a display, the polymer layers and glass layers may be laminated to one another. Portions of the polymer layers may extend past the edges of the glass layers. Laser cutting techniques may be used to trim away excess portions of the polymer layer that do not overlap underlying portions of the glass layers. Laser cutting may involve application of an adjustable infrared laser beam.

Abstract: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. At least one of the predefined temporal pulse profiles may be triangular. The target class may include, for example unpassivated electrically conductive links or other bare metal structures. Based on the target class associated with the selected target, a laser pulse is generated having a triangular temporal pulse profile. The generated laser pulse is used to process the selected structure.

Abstract: A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.

Abstract: An exemplary cutting apparatus for cutting components from a sprue includes a sprue retainer, a laser cutting unit, and a rotating driving unit. The sprue retainer has a supporting surface. The supporting surface defines a receiving hole, and grooves extending across the entire supporting surface. The grooves are in communication with the receiving hole. The laser cutting unit is disposed above the sprue retainer and is configured for emitting a laser beam to cut the sprue carried on the sprue retainer. The sprue retainer is coupled to the rotating driving such that the rotating driving unit is capable of driving the sprue retainer to rotate.

Abstract: A laser blanking system for cutting material stock includes a first series of conveyor lanes that include a plurality of support conveyors which are situated in parallel, generally spaced apart relationships. A second series of conveyor lanes is situated downstream from the first series. The second series includes a plurality of support conveyors situated in parallel, generally spaced apart relationships with respect to each other. The laser blanking system further includes a multiple-axis gantry system. The multiple-axis gantry includes a moveable transverse-axis component is supported by and moveable along a longitudinal-axis component that is situated adjacent to a longitudinal edge of the first and second series. A moveable laser head is supported by the transverse-axis component. A controller operatively controls movements of each one conveyor of the first and second lanes, the transverse-axis component, and the laser head as stock material is indexed downstream and supported by the system.

Abstract: Because of extreme hardness, diamonds have a number of important industrial applications. Generally experts work on it. Experts do marking after examining each rough diamond to decide how it should be cut to yield the greatest value. But in this process, there can be lots of wastage as it is only an image of the stone in the mind of the person. The present invention comprises Laser planner which scans each and every point of diamond by rotating it 360° and thus gives individual coordinate of that diamond. It shows us the wire frame image on the computer monitor. is a machine to scan the stone and to plan and mark for the best-fit diamond from that stone. All the data of the diamond is stored in the computer. It is material saving, time saving, mass processing increase in productivity.

Abstract: A robot for machining a part of structure under water, comprising a machine tool having a chamber receiving a machining element, a support and guiding structure of the machine tool fixable with respect to the part to be machined and having submersible mobile elements and corresponding submersible guiding elements defining axes along which the mobile elements are movable to position the machine tool with respect to the part to be machined, displacement units for displacement of the mobile elements along the axes, a gas supply connecting to the machine tool to inject gas in the chamber, and a programmable control unit for operating the displacement units and the machine tool based on a closed-loop control mode in order to achieve the machining of the part.

Abstract: Systems and methods are provided for adjusting a laser beam applied to a workpiece in a processing operation. A laser processing system receives the laser beam that is associated with a beam quality property. The laser processing system adjusts the laser beam to change the beam quality property based on a characteristic of the workpiece, a characteristic of the processing operation, or a combination thereof. The adjusted laser beam can also be delivered to the workpiece.

Abstract: An object is to obtain a laser cutting device and a laser cutting method with which a thick processing item can be cut by using laser light whose wavelength is shorter than that of CO2 laser light. With a laser cutting device (10), a laser emitting unit (24) emits a laser beam (YAG-based laser light whose wavelength is shorter than that of CO2 laser light) for cutting a processing item (30), an optical system (26) focuses the laser beam so that the laser beam has an elliptical cross-sectional shape and so that a long-axis direction of the ellipse is aligned with a direction in which cutting of the processing item (30) progresses, and thus, the elliptically-focused laser beam contributes to raising the temperature of a molten pool inside the processing item (30).

Abstract: An orthogonal integrated cleaving apparatus and methods of controlling such an apparatus are taught. The cleaving apparatus includes two cleaving devices mounted at right angles with respect to a mount facing a substrate to be processed. The non-metallic and/or brittle substrate is separated along two orthogonal axes without rotating or moving the substrate to a second machine by moving the mount or the substrate along the axes. Each cleaving device laser sequentially heats a surface of the substrate along a respective cutting axis, cools the cut area and then laser re-heats the cut area to form a clean break.

Abstract: A laser machining system useful for machining internal cavities where visual monitoring is difficult or impossible may include a laser generator, a rod configured to extend from and retract towards the laser generator, an articulated mirror mounted on the rod and configured to reflect a laser beam generated by the laser generator, one or more sensors, and a controller that may receive data from the sensor and determine how and whether to manipulate, based on the data, the rod and the articulated mirror to direct the laser beam generated by the laser generator.

Abstract: A modulation device for directing a mobile tracking device away from an asset is provided. The modulation device includes a continuous wave laser source whose output is directed at a seeker head of the mobile tracking device. The modulation device causes the generation of localized sources within the mobile tracking device and confuses the mobile tracking device as to the true location of the asset. A portable cutting device is disclosed. The portable cutting device may include a portable power supply and a laser source. The portable power supply and laser source of the portable cutting device may be positioned within a backpack and carried by a user. A handheld unit which is coupled to the laser source may be supported by the hands of the operator. The handheld unit provides power generated by the laser source to a barrier to be cut.

Abstract: A laser processing apparatus in which a workpiece is placed on a work support base that supports the workpiece at a plurality of support points and performs, while moving a processing head in a horizontal direction with respect to the workpiece, laser processing on the workpiece on the work support base by the processing head, includes a tilt judging unit that judges, based on a positional relationship between a product chip that is to be separated from the workpiece when the workpiece is subjected to laser processing and support points, whether the product chip tilts in a height direction and projects upward on a side of the processing head from the workpiece before laser processing; and a drive control unit that controls a height of the processing head with respect to the workpiece when moving the processing head to a processing position for a next product chip after completing laser processing on the product chip based on a judgment result of the tilt judging unit.

Abstract: The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.

Abstract: A device forms grooves or slits in a material web as it moves in a longitudinal direction. The grooves or slits, which are spaced apart from one another in the longitudinal direction, are formed by a laser beam. A laser beam source generates a continuous laser beam and a deflection mirror directs the laser beam onto the material web. The mirror rotates about an axis of rotation and it is displaceable along the axis. The mirror has a first mirror face, the line of intersection of which with a sectional plane perpendicular with respect to the axis of rotation forms a circular arc which varies depending on the axial position of the sectional plane. A second mirror face deflects the laser beam towards an absorber. Focusing optics focus the laser beam, after reflection from the first mirror face, onto the moving material web.

Abstract: An improved apparatus and method for laser assisted machining are provided, by utilizing a computer to develop interrelated heating and machining plans, from a variety of input data describing the material to be machined, the properties of lasers and pyrometers used for heating the material, and computer models of the machining arrangement, workpiece and final part to be produced. An iterative process continues until the machining and heating plans result in the cutting zone of the workpiece being maintained at a desired temperature with no obstruction in the line-of-sight of at least one laser and pyrometer throughout the machining process, while also maintaining the cutting tool at or below a desired maximum temperature.

Abstract: The invention relates to a laser machining head (1) with an integrated sensor device for monitoring the focus position, wherein laser machining head (1) has a focusing lens (4) and a downstream protective glass (5) in order to focus a machining beam (9) that strikes focusing lens (4) as a parallel beam into a resultant focal point (11) of focusing lens (4) with downstream protective glass (5), in which focal point a workpiece (12) is arranged. A beam splitter (3), arranged upstream of focusing lens (4) in the beam path, is transmissive for a first portion of a laser beam (8) coupled into laser machining head (1), the machining beam (9), and is reflective for a second portion, a measurement beam (10).

Abstract: To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.

Abstract: A cardboard-handling system with a rule-die associated to a first drum and a counter die associated to a second drum for pre-treating cardboards. A cardboard-alignmentor on a first side of the rule-die and counter-die aligns and conveys a cardboard together with one or more synchronized-cardboard transferors toward a side-gripper conveyor. The side-gripper conveyor transfers the cardboard toward and through the rule-die and counter-die drums for pre-treatment of the cardboard. Next the side-gripper conveyor conveys the cardboard toward and through a laser-treatment module to be further pre-treated. The side gripper conveyor movement is synchronized with a laser-treatment module for which a base with a plurality of protruding elements has moving capabilities and is synchronized with the side-gripper conveyor (via a timing belt for example).

Abstract: A substrate cutting apparatus includes a stage configured to support a substrate to be cut along a virtual cutting line, a laser generator configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line.

Abstract: A device for cutting, using laser beams (B1, B2), a material (A) such as a material for manufacturing sanitary products comprises a supporting formation for the material (A), such as a motor-driven belt, including a net (72) for supporting said material (A) in a position corresponding to the area of cutting where the laser beam (B1, B2) acts. Typically said net is a wire net, e.g., made of steel, bronze or a combination of the two, to which there is preferentially associated a rotary cleaning brushes (9) and suction and/or air jets systems.

Abstract: A laser cutting machine includes a platform and a motion system. The motion system includes a first prismatic joint facilitating a first motion of the platform along a first direction and a second prismatic joint facilitating a second motion of the platform along a second direction. A galvano arranged on the platform, such that a motion of the platform causes a motion of the galvano, the galvano including a first mirror, wherein a third motion of the first mirror positions the laser beam along a third direction, and a second minor, wherein a fourth motion of the second mirror positions the laser beam along a fourth direction. A control module controls concurrently the motion system and the galvano, such that a position of the laser beam on the workpiece is a vector sum of the first motion, the second motion, the third motion, and the fourth motion.

Abstract: Cutting a workpiece with a laser beam includes using the laser beam to melt and/or vaporize at least a portion of the workpiece, and moving at least one of the workpiece and the laser beam relative to one another to form a cutting front on the workpiece, in which the laser beam includes either at least two different radially polarized beam portions offset relative to each along an advancing direction of the laser beam, or multiple laser beam strips extending along the advancing direction of the laser beam. Each laser beam strip has a different linear polarization direction, and the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam.

Abstract: A manipulator at low inertia for laser cutting machines of flat sheet metals is described, which comprises a longitudinal movement axis X and a transversal movement axis Y perpendicular to said longitudinal axis and parallel to the plane of the sheet metal, and a supporting equipment (15) for a laser cutting head (14) which is displaceable along said axes. The supporting equipment (15) comprises two sliding blocks (5, 6) driven by respective independent actuators (7, 8) to move along the axis Y at a variable mutual distance, and rods (9, 10) for the articulated connection of said sliding blocks (5, 6) to said laser cutting head (14).

Abstract: A mechanical device is used for mounting and/or dismounting a laser nozzle on and/or from a nozzle mount of a laser processing machine for processing workpieces, especially metal sheets. The mechanical device includes a nozzle magazine having a nozzle holder support on which a nozzle holder for a laser nozzle is supported. In addition, the mechanical device has a support positioning drive by means of which the nozzle holder support is positionable together with the nozzle holder in a support positioning direction. A lifting device of the mechanical device serves to position the nozzle holder, when positioned in the support positioning direction in a lifting stand-by position, relative to the nozzle holder support in a positioning lifting direction extending perpendicular to the support positioning direction.

Abstract: Laser processing machines, such as laser cutting machine (LM), including a work table receiving workpiece (W), and work arm (1) with a laser cutting head (2). Laser cutting head (2) includes nozzle receiving device (7) and nozzle (D). Via nozzle (D) laser beam (11) may be directed onto work piece (W). Machine (LM) includes main drives moving work arm (1) and/or the laser cutting head (2) on X-Y-Z axes to process work piece (W), as well as an alignment unit to adjust laser beam (11). An adjusting station (3) includes receiving unit (31) fixing nozzle (D) and/or the nozzle receiving device (7) during centering of nozzle (D). The alignment unit has head element (5B) in laser cutting head (2). Head element (5B) receives nozzle (D) and/or the nozzle receiving device (7) and is slidable in X-Y directions, via the main drives. Head element (5B) may be fixed in a selected position, within the laser cutting head (2), via clamping device (12) releasable during nozzle centering at adjusting station (3).

Abstract: A portable cutting device is disclosed. The portable cutting device may include a portable power supply and a laser source. The portable power supply may be a lithium ion battery pack. The laser source may be a Ytterbium Fiber laser. The portable power supply and laser source of the portable cutting device may be positioned within a backpack and carried by a user. A handheld unit which is coupled to the laser source may be supported by the hands of the operator. The handheld unit provides power generated by the laser source to a barrier to be cut.

Abstract: A processing information supply apparatus 10 is prepared for a laser processing apparatus for forming a modified region, which becomes a starting point of cutting, along a line to cut within an object to be processed by irradiating the object with laser light while locating a light-converging point within the object. The processing information supply apparatus 10 includes an object information input unit 12 for inputting processing object information on the object to be processed, a processing condition database 19 in which data on processing conditions corresponding to the processing object information is accumulated, a processing condition setting unit 16 for referring to the processing condition data in the database 19 and setting the processing condition for the object based on the processing object information, and a condition information output unit 13 for outputting processing condition information for the set processing condition.

Abstract: According to embodiments of the present invention, there are disclosed a laser repairing apparatus and a laser repairing method for a substrate. The laser repairing apparatus comprises: a laser emitter; and a light transmission sheet with a light-shielding pattern, wherein a laser emitted by the laser emitter is used to cut a superfluous remainder of an electrode on the substrate, the light transmission sheet is located between the laser emitter and the substrate, and as compared with a pattern of the electrode on the substrate, the light-shielding pattern on the light transmission sheet has the same shape and a size at a predetermined ratio.

Abstract: An optical device wafer processing method including a laser processed groove forming step of applying a laser beam for performing ablation to the front side or back side of a substrate of an optical device wafer along streets, thereby forming a laser processed groove as a break start point on the front side or back side of the substrate along each street, and a wafer dividing step of applying an external force to the optical device wafer after performing the laser processed groove forming step to thereby break the wafer along each laser processed groove, thereby dividing the wafer into individual optical devices. In performing the laser processed groove forming step, an etching gas atmosphere for etching a modified substance produced by applying the laser beam to the substrate is generated, whereby an etching gas in the etching gas atmosphere is converted into a plasma by the application of the laser beam to thereby etch away the modified substance.

Abstract: A laser processing apparatus removes a sapphire substrate from an optical device wafer configured by forming an optical device layer on the front side of the sapphire substrate through a buffer layer. A chuck table holds the optical device wafer. A pulsed laser beam is applied to the optical device wafer to break the buffer layer, and the light intensity of plasma light produced in the buffer layer by the application of the pulsed laser beam is detected and displayed. The light intensity of a predetermined wavelength region of the plasma light generated from a substance forming the buffer layer is detected.

Abstract: A modulation device for directing a mobile tracking device away from an asset is provided. The modulation device includes a continuous wave laser source whose output is directed at a seeker head of the mobile tracking device. The modulation device causes the generation of localized sources within the mobile tracking device and confuses the mobile tracking device as to the true location of the asset. A portable cutting device is disclosed. The portable cutting device may include a portable power supply and a laser source. The portable power supply and laser source of the portable cutting device may be positioned within a backpack and carried by a user. A handheld unit which is coupled to the laser source may be supported by the hands of the operator. The handheld unit provides power generated by the laser source to a barrier to be cut.

Abstract: A method for forming a lead or lead extension includes forming an arrangement of elongated conductors. Each of the conductors extends from a proximal end of the arrangement to a distal end of the arrangement. Each of the conductors includes a layer of insulation disposed over a conductive core. A conductor-separating element is disposed over either the proximal end or the distal end of the arrangement. The conductor-separating element includes a plurality of ablation windows defined in a body. An end of at least one of the elongated conductors is radially extended over a portion of the conductor-separating element such that a portion of the at least one elongated conductor extends across at least one of the ablation windows. Insulation from the portion of the at least one conductor extending across the ablation window is ablated to expose a portion of the conductive core of the elongated conductor.

Abstract: A description is given of a modular laser processing system (10) for processing a workpiece (20) by means of a processing laser beam (14), which system has a multiplicity of functional modules (100) with a beam passage region (102) which can be connected to one another in series along a processing laser beam path, comprising a functional module (100) embodied as a fiber connection module (104) and serving for accommodating a fiber end from which the processing laser beam (14) emerges, and a functional module (100) embodied as a collimator module (106) and having a collimator lens (16a, 16b, 16c), which collimates the processing laser beam (14), wherein the collimator lens (16a, 16b, 16c) is selected from a group of collimator lenses having different focal lengths which correspond to a raster dimension (L1) or to an integer multiple thereof, characterized in that the length (A) of the beam passage region (102) of a functional module (100) along the processing laser beam path corresponds to the raster dimension

Abstract: Multiple beamlet laser beam delivery systems and methods may be used in laser machining systems and methods to machine multiple regions on a workpiece simultaneously. One embodiment of a laser machining system and method may be used, for example, to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost. The multiple beam delivery systems may be movable to scribe multiple lines simultaneously in the workpiece.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.