Method Patents (Class 219/121.85)
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Patent number: 8304686Abstract: There is provided an improved laser shock hardening method and apparatus which can eliminate spattering of a liquid and waving of the liquid surface upon laser irradiation, and can stably irradiate a workpiece with a laser beam. Thus, the present invention provides in a laser shock hardening method for carrying out surface processing of a workpiece in contact with a liquid by irradiating through the liquid the surface of the workpiece with a pulsed laser beam intermittently emitted from a laser irradiation device, the improvement comprising: providing a solid transparent to the wavelength of the laser, serving as an entrance window to the surface of the liquid; allowing the liquid to be present in the light path of the laser beam between the solid and the surface of the workpiece; and allowing the laser beam to enter through the solid and irradiating through the liquid the surface of the workpiece with the laser beam, thereby shock-hardening the surface of the workpiece.Type: GrantFiled: March 16, 2010Date of Patent: November 6, 2012Assignee: Kabushiki Kaisha ToshibaInventors: Yuji Sano, Naruhiko Mukai, Masaki Yoda, Yoshiaki Ono, Ryoichi Saeki, Hideki Naito
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Patent number: 8294063Abstract: In a contact for a connector, a metal material id processed to be bent in a predetermined shape in a manner so that a terminal portion is formed in the vicinity of an end and a contacting portion is formed in the vicinity of the other end. A nickel plating layer as a foundation plating layer and a gold plating layer are formed on substantially entire surface of the contact including the terminal portion and the contacting portion. Laser beams are irradiated at a portion between the terminal portion and the contacting portion, and especially in the vicinity of the terminal portion so that the nickel plating layer as the foundation plating layer is unsheathed by removing the gold plating layer or gold in the gold plating layer and nickel in the foundation layer are alloyed. Nickel and the alloy of nickel and gold respectively have low wetting property with respect to solder, so that diffusion of melted solder stops at the portion.Type: GrantFiled: October 10, 2003Date of Patent: October 23, 2012Assignee: Panasonic CorporationInventors: Yasunori Miki, Hiroshi Yanagida, Shouichi Nagata, Shin Sato, Yoshiyuki Uchinono, Kenji Jonen, Masaharu Ishikawa, Hiroshi Iwano, Syunichi Nakayama
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Publication number: 20120265122Abstract: Methods and apparatuses to produce graphene and nanoparticle catalysts supported on graphene without the use of reducing agents, and with the concomitant production of heat, are provided. The methods and apparatuses employ radiant energy to reduce (deoxygenate) graphite oxide (GO) to graphene, or to reduce a mixture of GO plus one or more metals to to produce nanoparticle catalysts supported on graphene. Methods and systems to generate and utilize heat that is produced by irradiating GO, graphene and their metal and semiconductor nanocomposites with visible, infrared and/or ultraviolet radiation, e.g. using sunlight, lasers, etc. are also provided.Type: ApplicationFiled: December 10, 2010Publication date: October 18, 2012Inventors: M. Samy El-Shall, Victor Abdelsayed, Saud I. Al-Resayes, Zeid Abdullah M. Alothman
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Publication number: 20120248075Abstract: Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.Type: ApplicationFiled: March 31, 2011Publication date: October 4, 2012Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.Inventors: Mehmet E. Alpay, Hisashi Matsumoto, Mark A. Unrath, Guangyu Li
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Patent number: 8278589Abstract: A continuous furnace 4 to which a laser is coupled by conventional optical means that allows the surface treatment of a part, with which it is possible to achieve temperatures of up to 3000° C. on said surface while the remainder of the part is at a substantially lower temperature. The part in the furnace is heated to a temperature of the order of 500° C. and, via an opening 5, a laser-beam bundle is applied to the part, scanning a line perpendicular to the direction of movement of the part such that the entire surface is scanned by means of the mechanical advance of the part. This scanning should extend beyond the lateral ends of the part. This type of laser-beam generator must be made compatible with the various colors with which the surface of the part is decorated. The furnace is divided into different zones, with independent temperature controls, for successfully achieving the desired values, both for heating and for cooling.Type: GrantFiled: March 6, 2007Date of Patent: October 2, 2012Assignee: Consejo Superior De Investigaciones CientificasInventors: Luis Carlos Estepa Millan, German Francisco Fuente Leis
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Patent number: 8277574Abstract: There is provided a method for manufacturing a grain-oriented electromagnetic steel sheet whose iron losses are reduced by laser beam irradiation, capable of improving the iron losses in both the L-direction and the C-direction while easily ensuring high productivity. The method for manufacturing a grain-oriented electromagnetic steel sheet reduces iron losses by scanning and irradiating a grain-oriented electromagnetic steel sheet with a continuous-wave laser beam condensed into a circular or elliptical shape at constant intervals in a direction substantially perpendicular to a rolling direction of the grain-oriented electromagnetic steel sheet, wherein when an average irradiation energy density Ua is defined as Ua=P/(Vc×PL) (mJ/mm2), where P (W) is average power of the laser beam, Vc (m/s) is a beam scanning velocity, and PL (mm) is an irradiation interval in a rolling direction, PL and Ua are in the following ranges: 1.0 mm?PL?3.0 mm, 0.8 mJ/mm2?Ua?2.0 mJ/mm2.Type: GrantFiled: December 11, 2008Date of Patent: October 2, 2012Assignee: Nippon Steel CorporationInventors: Tatsuhiko Sakai, Hideyuki Hamamura, Masao Yabumoto
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Publication number: 20120241427Abstract: A method of processing material of device elements by laser interaction is disclosed. According to one aspect, the method includes generating a pulsed laser processing output along a laser beam axis, the output including a plurality of laser pulses triggered sequentially at times determined by a pulse repetition rate. A trajectory relative to locations of device elements to be processed is generated. A position of one or more designated device elements relative to an intercept point position on the trajectory at one or more laser pulse times is determined, and a laser beam is deflected based on the predicted position within a predetermined deflection range. According to some aspects, the predetermined deflection range may correspond to a compass rose or cruciform field shape. As a result, a deflection accuracy for laser processing may be improved.Type: ApplicationFiled: February 24, 2012Publication date: September 27, 2012Applicant: GSI Group CorporationInventors: Dimitry Maltsev, Dmitry N. Romashko, Michael Plotkin, Jonathan S. Ehrmann, James J. Cordingley
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Publication number: 20120237387Abstract: The disclosure mainly relates to a stainless steel sheet containing a minimum of 10.5% by weight of Cr and a maximum of 1.2% by weight of C, the microstructure of which is martensitic or austeno-martensitic and comprises at least 2% by volume of martensite, essentially characterized in that it comprises at least one local portion of lesser mechanical resistance, having a martensitic content at least 10% lower than that of the remainder of said sheet; said local portion being at least partly with a thickness equal to that of said sheet. The disclosure also relates to a method for manufacturing this steel sheet and to a steel part which may be obtained by deformation of this sheet.Type: ApplicationFiled: September 21, 2009Publication date: September 20, 2012Applicant: APERAMInventors: Pierre-Olivier Santacreu, Aurelien Pic, Fabrice Pinard
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Publication number: 20120234810Abstract: The present invention provides an efficient heat treatment such as activation treatment of impurities on a substrate such as a thick silicon wafer with large heat capacity by laser annealing. Provided is a laser annealing apparatus 1 for heat-treating a surface of a substrate 30 comprising: a pulse oscillation laser source 10 which generates a pulse laser with gentle rise time and long pulse width; a continuous wave laser source 20 which generates a near-infrared laser for assisting annealing; optical systems 12, 22 which shape and guide beams 15, 25 of the two types of lasers respectively so as to irradiate the surface of the substrate 30 therewith; and a moving device 3 which moves the substrate 30 relatively to the laser beams 15, 25 to allow scanning of the combined irradiation of the two types of laser beams.Type: ApplicationFiled: September 9, 2010Publication date: September 20, 2012Applicant: The Japan Steel Works, Ltd.Inventors: Toshio Kudo, Naoyuki Kobayashi, Kazuya Sano, Toshiaki Seino, Mitsuhiro Toyoda
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Publication number: 20120236458Abstract: A method for processing a metal film (1) embedded in a carrier (2) includes the step of heating the metal film (1) in such a way that the metal film (1) is transformed in a subregion into at least one insulator section (3). The metal film (1) is preferably locally heated by laser radiation (4). Also described is a component (10, 11, 12, 13) which is produced by the method and includes an electrostatic clamp, a drive mechanism which is adapted for moving a workpiece under the action of electrical fields, a resistor element or a display device, for example.Type: ApplicationFiled: March 16, 2012Publication date: September 20, 2012Applicant: Berliner Glas KGaA Herbert Kubatz GmbH & Co.Inventor: Jan INGWERSEN
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Publication number: 20120234802Abstract: A technique for machining work pieces with a laser apparatus and an electric arc apparatus includes generating a plasma gas jet with the electric arc apparatus, generating a laser beam with the laser apparatus, generating an electric arc with the electric arc apparatus, guiding the electric arc through the laser beam to a machined spot inside or on a work piece, and cutting the work piece with the electric arc or the plasma gas jet.Type: ApplicationFiled: March 14, 2012Publication date: September 20, 2012Applicant: TRUMPF WERKZEUGMASCHINEN GMBH + CO. KGInventors: Eberhard Wahl, Arnd Szelagowski, Uwe Stute
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Publication number: 20120234809Abstract: A laser processing method for a nonlinear crystal substrate having a plurality of crossing division lines which includes the step of applying a pulsed laser beam to a work surface of the nonlinear crystal substrate along the division lines to thereby form a plurality of laser processed grooves on the work surface along the division lines. The pulse width of the pulsed laser beam is set to 200 ps or less and the repetition frequency of the pulsed laser beam is set to 50 kHz or less.Type: ApplicationFiled: March 7, 2012Publication date: September 20, 2012Applicant: DISCO CORPORATIONInventors: Hiroshi Morikazu, Yoko Nishino
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Patent number: 8269140Abstract: In accordance with an aspect of the invention, a solder paste feeding device feeds solder paste to a ring-like terminal surrounding a through-hole and a rod terminal fitted in the through-hole so as to fill in the through-hole, the laser beam irradiation device irradiates the solder past with a laser beam, and wire solder is further fed from above the solder past at the same time as melting of the solder paste is started, thereby fusing the wire solder and the solder paste to solder the ring-like terminal and the rod terminal.Type: GrantFiled: June 15, 2009Date of Patent: September 18, 2012Assignee: Japan Unix Co., Ltd.Inventor: Kotaro Matsushita
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Patent number: 8263903Abstract: A method for stabilizing an output of a pulsed laser system includes a directly modulated laser diode by mitigating the effect of switching transients on the temporal shape of the outputted pulses. The method includes controlling a pulse shaping signal to define, over time, processing and conditioning periods. During the processing periods, the pulse shaping signal has an amplitude profile tailored to produce the desired temporal shape of the output. Each conditioning period either immediately precedes or follows a processing period. During a given processing period, the amplitude profile of the pulse shaping signal is tailored so that the drive current of the laser diode is lower than its maximum value during the corresponding processing period, and is of the same order of magnitude as the laser threshold current of the laser diode. In this manner, the stability of the output during the corresponding processing period is improved.Type: GrantFiled: May 18, 2010Date of Patent: September 11, 2012Assignee: Institut National d'OptiqueInventors: Pascal Deladurantaye, Louis Desbiens, Yves Taillon, Dany Lemieux, Brian W. Baird
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Publication number: 20120223062Abstract: Apparatuses and methods are provided for processing a surface of a substrate. The substrate may have a surface pattern that exhibits directionally and/or orientationally different reflectivities relative to radiation of a selected wavelength and polarization. The apparatus may include a radiation source that emits a photonic beam of the selected wavelength and polarization directed toward the surface at orientation angle and incidence angle selected to substantially minimize substrate surface reflectivity variations and/or minimize the maximum substrate surface reflectivity during scanning. Also provided are methods and apparatuses for selecting an optimal orientation and/or incidence angle for processing a surface of a substrate.Type: ApplicationFiled: May 15, 2012Publication date: September 6, 2012Applicant: Ultratech, Inc.Inventor: Andrew M. Hawryluk
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Patent number: 8258431Abstract: An implantable lead may have a distal assembly including a coupler, a terminal pin and a conductive member rotatably secured to both the coupler and the terminal pin. The conductive member may include a coating that is at least partially removed before securing the conductive member to the coupler and the terminal pin. The coating may be removed in a process combining, in sequence, an IR laser and a UV laser.Type: GrantFiled: July 29, 2010Date of Patent: September 4, 2012Assignee: Cardiac Pacemakers, Inc.Inventors: Haiping Shao, Kenneth L. Gunter
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Patent number: 8242406Abstract: A method for manufacturing integrally bladed rotors by laser brazing a rotor disk (1) made of a nickel or titanium-base material to blades (3) made of titanium aluminide. A brazing metal similar to the blade material is used, which is introduced into the laser beam (4) as brazing power jet (5) and whose heat capacity, which is controlled by the melting temperature and the volume of the molten metal bath This provides for melting of the disk material and alloying with this material, but not for melting of the blade material, to which it is connected by adhesion. Such blisk features a low blade weight, reduced centrifugal effects and enhanced service life.Type: GrantFiled: May 15, 2009Date of Patent: August 14, 2012Assignee: Rolls-Royce Deutschland Ltd & Co KGInventors: Karl Schreiber, Hermann Mohnkopf
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Patent number: 8237086Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.Type: GrantFiled: January 16, 2008Date of Patent: August 7, 2012Assignees: International Business Machines Corporation, Suss MicrotecInventors: Jerome D. Cohen, Robert G. Haas, Enrico Herz, Michael Teich, Christopher L. Tessler
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Publication number: 20120196427Abstract: An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.Type: ApplicationFiled: January 31, 2012Publication date: August 2, 2012Applicant: HAMAMATSU PHOTONICS K.K.Inventors: Makoto Nakano, Koji Kuno, Tetsuya Osajima, Takashi Inoue, Masayoshi Kumagai
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Patent number: 8222566Abstract: Alternative designs, materials and manufacturing methods for guidewires. Some embodiments pertain to a composite guidewire having proximal and distal section, and a connector adapted and configured for permanently joining the proximal section to the distal section. In some embodiments, at least one of the sections is made of a linear-elastic nickel-titanium alloy. Several alternative guidewire tip constructions and/or designs including methods and techniques of construction are also disclosed.Type: GrantFiled: February 15, 2005Date of Patent: July 17, 2012Assignee: Boston Scientific Scimed, Inc.Inventors: Brice L. Shireman, Brian R. Reynolds, Dave B. Johnson, Alan D. Eskuri, Virgil F. Voeller, Jeffrey A. Miller
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Patent number: 8222567Abstract: A system for laser shock peening includes a laser positioned to direct a laser pulse at a first side of a work piece and a coupler on a second side of the work piece. The system further includes a Doppler shift detector positioned to measure a velocity of the coupler. A method for laser shock peening includes depositing an amount of energy from a laser pulse into a first side of a work piece and transmitting a pulse having a first frequency at a second side of the work piece. The method further includes receiving a reflected pulse having a second frequency from the second side of the work piece and determining the velocity of the work piece based on the difference between the first frequency and the second frequency.Type: GrantFiled: May 12, 2010Date of Patent: July 17, 2012Assignee: General Electric CompanyInventors: Manu Mathai, Paul Stephen DiMascio, Gabriel Della-Fera
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Patent number: 8217303Abstract: A system prevents oxidation of a laser cut workpiece by utilizing a laser source that utilizes laser source with an inert gas, such as argon or helium, rather than air or oxygen, to create the slots or kerfs which form the pattern cut into the workpiece. The system introduces oxygen gas through the workpiece as it is being laser cut to oxidize any slag or dross created during the laser cutting process. Oxygen or a mixture of oxygen with other gases cools the slag and the workpiece while at the same time oxidizing the slag to either completely burn or partial burn the slag before it strikes an exposed surface of the tubular member.Type: GrantFiled: March 16, 2009Date of Patent: July 10, 2012Assignee: Abbott Cardiovascular Systems Inc.Inventors: Jeffrey W. Baxter, David Wackiewicz
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Patent number: 8207474Abstract: A method of operating a laser to obtain an output pulse having a single wavelength, comprises inducing an intracavity loss into a laser resonator having an amount that prevents oscillation during a time that energy from the pump source is being stored in the gain medium. Gain is built up in the gain medium with energy from the pump source until formation of a single-frequency relaxation oscillation pulse in the resonator. Upon detection of the onset of the relaxation oscillation pulse, the intracavity loss is reduced, such as by Q-switching, so that the built-up gain stored in the gain medium is output from the resonator in the form of an output pulse at a single frequency. An electronically controllable output coupler is controlled to affect output pulse characteristics. The laser acts a master oscillator in a master oscillator power amplifier configuration. The laser is used for laser peening.Type: GrantFiled: July 21, 2009Date of Patent: June 26, 2012Assignees: Metal Improvement Company, LLC, Regents of the University of California, Lawrence Livermore National Security, LLCInventors: C. Brent Dane, Lloyd A. Hackel, Fritz B. Harris
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Patent number: 8196807Abstract: Method of identifying a container (1) obtained by a process comprising the following steps: (A) starting from a blank (2) of the container (1), at least part of the said container (1) is formed; (B) a two-dimensional or three-dimensional marking zone (4), the temperature of which is maintained at a value below the glass transformation temperature of the constituent substrate, is provided in or on the substrate of the blank (2) and, in the said marking zone (4), an identification code (5) is reproduced by illumination (6) of the said marking zone (4) with at least one beam (7) of coherent monochromatic localized electromagnetic radiation to which the substrate is at least partially transparent, the said beam (7) being operated and controlled in order to remove or modify the constituent substrate of the wall (3) and to leave the identification code (5), in positive or negative form, in the said wall so that the said code is readable; and (C) at least the said marking zone (4) is annealed so as at least to reducType: GrantFiled: April 26, 2006Date of Patent: June 12, 2012Assignee: Becton Dickinson France S.A.S.Inventor: Jean-Pierre Grimard
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Patent number: 8193468Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.Type: GrantFiled: October 11, 2005Date of Patent: June 5, 2012Assignee: GSI Group CorporationInventors: James J. Cordingley, Joseph J. Griffiths, Donald V. Smart
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Publication number: 20120132631Abstract: A selective layer melting or other additive layer fabrication method in which powdered material is fused by heating it with a pulsed laser, the pulses being modulated whilst the laser is traversing the substrate so as to control the thickness and/or width of the layer being formed. Initial layers of the fabrication structure may be formed more thickly than subsequent layers, e.g. by means of a CW laser, to reduce distortion. This aspect of the invention may be employed independently of the use of a pulsed laser to form the subsequent layers.Type: ApplicationFiled: April 27, 2010Publication date: May 31, 2012Applicant: BAE SYSTEMS PLCInventors: Andrew David Wescott, Benjamin Richard Moreland, Jagjit Sidhu
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Patent number: 8187400Abstract: Disclosed herein are a microtubular honeycomb carbon material obtained by heat-treating cellulose fiber, a production method thereof, a microtubular reactor module fabricated using the microtubular honeycomb carbon, a method for producing the microtubular reactor module, and a microcatalytic reactor system comprising the microtubular reactor module. A carbon material having a new structure is produced by heat-treating cellulose fiber, and a catalytic reactor system having a new structure is constructed by coating the surface of the carbon material with a metal catalyst. Cellulose carbide, used as the reactor material, is very simple to produce. Because it has a micro honeycomb structure having a large number of microchannels and a large number of mesopores, it can be loaded with a large amount of a catalyst compared to the prior material having the same area, and thus it is useful as a catalyst support, and the reaction efficiency can be maximized.Type: GrantFiled: February 19, 2008Date of Patent: May 29, 2012Assignee: Korea Institute of Energy ResearchInventors: Nam Jo Jeong, Seong Ok Han, Hong Soo Kim, Hee Yeon Kim
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Publication number: 20120111865Abstract: A method, an apparatus and/or a system of laser marking of an interior cavity of a securing means of a substance container is disclosed. In one embodiment, a solid-state laser marking system to mark a securing means of a substance container includes a semiconductor laser to emit a pumping laser beam. The solid-state laser marking system also includes a resonator to create the laser beam that is then focused through a lens to mark the securing means of the substance container having a maximum diameter of 5 cm. Further, the solid-state laser marking system includes a solid-state laser crystal doped with a rare-earth element, to produce a laser beam in response to being pumped by the pumping laser beam and a laser resonator. The laser resonator is configured to focus the laser beam of a spot size of less than 150 microns and a beam quality of M2 less than 1.3.Type: ApplicationFiled: November 4, 2010Publication date: May 10, 2012Applicant: Telesis Technologies, Inc.Inventors: ASHOT MESROPYAN, Michael Lloyd Watts
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Publication number: 20120113561Abstract: The present invention related to a method for forming a capacitor device, comprising steps of: providing a substrate, forming a first metal layer on the substrate, forming a dielectric on the first metal layer, applying a laser-annealing to the dielectric, and forming a second metal layer on the dielectric.Type: ApplicationFiled: November 4, 2010Publication date: May 10, 2012Applicant: NATIONAL CHIAO TUNG UNIVERSITYInventor: Albert Chin
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Patent number: 8174130Abstract: Disclosed herein is a laser dicing sheet comprising a base material comprising a polyurethane acrylate film and a shape-restoring film; and an adhesive layer formed on a surface of said polyurethane acrylate film of the base material.Type: GrantFiled: December 3, 2007Date of Patent: May 8, 2012Assignee: Lintec CorporationInventors: Yosuke Sato, Yoji Wakayama, Naoki Taya
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Publication number: 20120097653Abstract: (Problem to be solved) A laser refining apparatus and the laser refining method for efficiently collecting evaporant other than oxygen from an oxidized compound. (Means for solving the problem) The laser refining apparatus comprises a stage inside a processing chamber where an oxidized compound is placed; an irradiation means for irradiating a laser under the condition that the oxidized compound placed on the stage is heated to a temperature at or above the boiling point of said oxidized compound; an attaching medium to which non-oxygen evaporant evaporated by the laser irradiated by the irradiation means attaches; and a feeding means for feeding gas that prevents the non-oxygen evaporant from becoming an oxidized compound into the processing chamber. The attaching medium is positioned so that the non-oxygen evaporant can attach to the attaching medium before becoming an oxidized compound, and the oxidized compound is metal oxide or silicon oxide.Type: ApplicationFiled: October 27, 2009Publication date: April 26, 2012Applicant: Electra Holdings Co., Ltd.Inventors: Takashi Yabe, Baasandash Choijil, Yuji Satoh
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Publication number: 20120096774Abstract: The present invention relates to an abrasive product and to a method of manufacturing same. Such an abrasive product comprises a structured abrasive coating provided on an upper side (6) comprised by the abrasive product. Herein, abrasive grains (8) and glue (7) are molded on a backing such that the upper side of the abrasive product is provided with a three-dimensional product-specific pattern. This pattern is created by said abrasive grains and glue, which constitute an individual composite grain (9). In generating the pattern, a special computer program is utilized in a computer program product for placing said composite grains randomly over the upper side of the abrasive product. The invention also relates to a casting mould with which the thus obtained pattern may be transferred onto the upper side of the abrasive product. The invention further comprises an arrangement for manufacturing said casting mould.Type: ApplicationFiled: December 27, 2011Publication date: April 26, 2012Applicant: Oy KWH Mirka AbInventors: Göran Johannes HÖGLUND, Caj Erik Mikeel NORDSTRÖM
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Publication number: 20120100348Abstract: The present invention relates to laser marking articles. In particular it relates to laser marking articles by laser ablating a coating applied to the article which reveals the surface of the article underneath, thereby forming the mark by the contrasting appearance between the revealed surface of the article and the adjacent remaining coating. Laser parameters are selected to provide uniform, commercially desirable appearance and avoid damage to the underlying surface while maintaining acceptable system throughput. In particular the laser pulse envelope is tailored to provide desirable appearance while maintaining acceptable system throughput.Type: ApplicationFiled: October 21, 2010Publication date: April 26, 2012Applicant: Electro Scientific Industries, Inc.Inventors: James Brookhyser, Kyle Ball
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Patent number: 8164023Abstract: An exemplary method for making backlight module frame includes: providing a plurality of metallic sheets cooperatively defining a frame shape, and a positioning device comprising a worktable and a plurality of positioning portions defined at corners of the worktable, wherein each metallic sheet comprises a first positioning protrusion corresponding to the positioning portions, positioning the metallic sheets on the worktable of the positioning device with the first positioning protrusions of the metallic sheets engaging with the positioning portions of the positioning device, welding the metallic sheets together to form a semi-manufactured frame, and pressing the semi-manufactured frame to form a backlight module frame.Type: GrantFiled: October 14, 2008Date of Patent: April 24, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Tung-Ming Hsu, Chien-Min Chen, Ming-Fu Hsu
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Publication number: 20120091106Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.Type: ApplicationFiled: January 5, 2007Publication date: April 19, 2012Inventors: Thomas Beck, Silke Settegast
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Patent number: 8153929Abstract: The invention relates to a method for the laser welding of a composite material (V) to a component (11) in particular for the production of a solar collector element (E), wherein the composite material (V) comprises a strip-shaped substrate (1) composed of a metal having high reflectivity to laser radiation, said substrate having a first side (A) and a second side (B), wherein a dielectric coating (7) is situated at least on the first side (A), and wherein, in order to produce a weld seam, a laser beam (L) is projected at an acute orientation angle (?) at least onto the first side (A) of the substrate (1) provided with the dielectric coating (7).Type: GrantFiled: November 20, 2009Date of Patent: April 10, 2012Assignee: Alanod Aluminium-Veredlung GmbH & Co. KGInventors: Harald Küster, Dimitrios Peros
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Publication number: 20120074111Abstract: There are provided a flux-cored wire for welding different materials, a method for laser welding of different materials and a method for MIG welding of different materials which can improve tensile shear strength of a welded joint portion and peeling strength of a welded portion interface in welding aluminum or an aluminum alloy material and a steel material. The flux-cored wire has a cylindrical sheath comprising an aluminum alloy which contains Si in an amount of 1.5 to 2.5% by mass and Zr in an amount of 0.05 to 0.25% by mass, with the remainder being aluminum and inevitable impurities, and a flux filling inside this sheath and containing cesium fluoride in an amount of 20 to 60% by mass, and the packing fraction of the flux being 5 to 20% by mass of the total mass of the wire.Type: ApplicationFiled: September 6, 2011Publication date: March 29, 2012Applicant: Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.)Inventors: Seiji SASABE, Tsuyoshi Matsumoto
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Patent number: 8143551Abstract: An exemplary method for making backlight module frames includes: method includes: providing a first metallic sheet and a second metallic sheet, each of the first and second metallic sheets having at least two L-shaped portions connected side by side and oriented in the same direction; welding the two metallic sheets to form a plurality of connected semi-manufactured frames corresponding to s subsequent backlight module frame; and pressing the connected semi-manufactured frames to form a plurality of backlight module frames. The method costs less welding time and it is convenient for the backlight module frames to be mass-produced.Type: GrantFiled: September 29, 2008Date of Patent: March 27, 2012Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Tung-Ming Hsu, Chien-Min Chen, Ming-Fu Hsu, Hsiang-Feng Teng
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Patent number: 8142251Abstract: A laser beam irradiation apparatus irradiates a laser beam onto a sealing unit disposed between a first substrate and a second substrate so as to seal the first substrate and the second substrate. The laser beam has a beam intensity which increases from a center portion to an end portion of the laser beam on a surface which is perpendicular to a proceeding direction of the laser beam. The beam intensity at the center portion of the laser beam is half of the beam intensity at the end portion of the laser beam or less, and the laser beam has a beam profile which is symmetrical relative to the proceeding direction of the laser beam.Type: GrantFiled: January 4, 2011Date of Patent: March 27, 2012Assignee: Samsung Mobile Display Co., Ltd.Inventors: Jung-Min Lee, Jang-Hwan Shin, Tae-Wook Kang, Jin-Hwan Jeon
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Publication number: 20120061361Abstract: A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region on through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.Type: ApplicationFiled: September 1, 2011Publication date: March 15, 2012Applicant: DISCO CORPORATIONInventors: Satoshi Usuda, Kiyoshi Ohsuga, Masaru Nakamura
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Publication number: 20120055097Abstract: A method of forming an abrasive article includes directing a beam of electromagnetic radiation at a starting location on an abrasive preform comprising a bonding layer and abrasive grains within the bonding layer, and increasing the power of the beam of electromagnetic radiation to a scanning power while directed at the starting location. The method further includes changing the position of the beam relative to the abrasive preform from the starting location to a second location on the abrasive preform.Type: ApplicationFiled: November 19, 2009Publication date: March 8, 2012Applicants: SAINT-GOBAIN ABRASIVES, INC.Inventors: Yinggang Tian, Krishnamoorthy Subramanian
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Patent number: 8124912Abstract: A processing area of a structural component, such as a gas turbine component, is heated by irradiation with several laser sources prior to and/or during and/or after carrying out a processing such as a deposit welding or machining of the component on the processing area. For the heating, each laser source directs a respective energy beam onto the processing area, which respectively produces an energy spot on the processing area. The respective positions of the energy spots are static or quasi-static on the processing area. The energy spots jointly heat the processing area.Type: GrantFiled: December 11, 2004Date of Patent: February 28, 2012Assignee: MTU Aero Engines GmbHInventors: Erwin Bayer, Wolfgang Becker, Bernd Stimper
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Patent number: 8104385Abstract: The brittle workpiece splitting system 1 includes a substrate holding mechanism 10 for holding a substrate 51, and a processing unit 5 for splitting the substrate 51 held by the substrate holding mechanism 10 by a splitting process. The substrate holding mechanism 10 has an edge damper 12 adapted to clamp an edge part of the substrate 51 from the sides of the opposite surfaces of the edge part, and support members 19 for supporting the substrate 51 thereon at a predetermined height. The support members 19 are disposed on the side opposite the side of the edge damper 12 with respect to the intended split line 61 parallel to the edge part of the substrate 51. The edge damper 12 has an edge holder 15 on which the substrate 51 is seated, and a pressure bar 14 for pressing the substrate 51 against the edge holder 15 to hold the substrate 51 between the edge holder 15 and the pressure bar 14.Type: GrantFiled: October 7, 2005Date of Patent: January 31, 2012Assignees: Shibaura Mechatronics Corporation, Kabushiki Kaisha ToshibaInventors: Masakazu Hayashi, Shinji Nakata, Susumu Yahagi
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Patent number: 8097830Abstract: The invention relates to a method for material processing and/or material analysis of an object (18) made from condensed matter by means of a laser (12). A laser pulse (14) is generated by a laser, emitted in the direction of the object. The laser pulse is spatially and temporally focussed such as to give a peak power for the laser pulse at a point between the laser and the object which exceeds the critical power for a self-focussing effect of the laser pulse. The laser pulse thus forms a filament (88) of high power density. The filament (88) is directed at the object and generates an aggregation state change there (evaporation or plasma formation) for a part of the material of the object. The method can be applied to both material processing (cutting, drilling, welding, hardening) and material analysis (analysis of the plasma light).Type: GrantFiled: February 28, 2003Date of Patent: January 17, 2012Assignee: Freie Universitaet BerlinInventors: Ludger Wöeste, Jean-Pierre Wolf
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Patent number: 8088633Abstract: A method of aligning a wafer when lithographically fabricating a light-emitting diode (LED). The method includes forming on the wafer at least one roughened alignment mark having a root-mean-square (RMS) surface roughness ?S. The roughened alignment mark is formed as a consequence of forming a plasma etch to roughen a LED surface on which the wafer alignment mark resides. The method also includes imaging the at least one roughened wafer alignment mark with alignment light having a wavelength ?A that is in the range from about 2?S to about 8?S. The method also includes comparing the detected image to an alignment reference to establish wafer alignment. Once wafer alignment is established, p-contacts and n-contacts can be formed on the LED upper surface in their proper locations.Type: GrantFiled: December 2, 2009Date of Patent: January 3, 2012Assignee: Ultratech, Inc.Inventors: Robert L. Hsieh, Khiem Nguyen, Warren W. Flack, Andrew M. Hawryluk
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Patent number: 8088455Abstract: A drain port and an exhaust port arranged at the bottom of a cup surrounding a substrate holding unit. A drainage tray is arranged below the cup so as to cover the moving area of the drain port when the substrate holding unit and the cup move in X-directions and Y-directions. An exhaust unit is arranged at a position corresponding to the position of the exhaust port of the cup when the substrate holding unit is in its spin-drying position. The exhaust unit is connected to the exhaust port to suck the interior of the cup when the spin-drying of the substrate is executed. The use of a flexible tube which is always connected to the exhaust port is no longer necessary.Type: GrantFiled: October 8, 2008Date of Patent: January 3, 2012Assignee: Tokyo Electron LimitedInventors: Norihisa Koga, Shinji Koga, Naoto Yoshitaka, Akira Nishiya
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Patent number: 8084714Abstract: A laser processing unit includes a first working area for laser processing of a workpiece, a second working area for laser processing of a workpiece, and a dividing wall adapted to separate the first working area from the second working area between, the dividing wall having individual interconnected sections and being moveable in a vertical direction.Type: GrantFiled: September 13, 2005Date of Patent: December 27, 2011Assignee: Trumpf Laser-und Systemtechnik GmbHInventors: Thomas Brauchle, Markus Wirnitzer, Gunter Fischer, Wolfgang Staiger
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Patent number: 8084706Abstract: A method is disclosed for on-the-fly processing at least one structure of a group of structures with a pulsed laser output. The method includes the steps of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity, and applying the pulsed laser output to the at least one structure of the group of structures during the step of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity.Type: GrantFiled: September 15, 2006Date of Patent: December 27, 2011Assignee: GSI Group CorporationInventors: Shepard D. Johnson, Bo Gu
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Patent number: 8084710Abstract: A laser, aimed at a flyer plate tab, causes optical energy to be directed at the tab, specifically, at a top surface thereof. Energy impacting the tab accelerates the tab out of an initial bent position, straightening it into an impact with a target sheet. The impact occurs in excess of 100 m/s, resulting in a metallurgical bond between the tab and the target sheet. The laser preferably strikes the top surface in a normal direction, based upon an initial angularity of the tab relative to the target. The laser emission, preferably in the range of 1 to 100 Joules delivered in a microsecond, may be augmented by an ablative layer on the top surface or a transparent covering on the top surface that reacts against the expanding gas from ablative activity on the top surface. The weld is formed without physical contact between the welding device and the tab.Type: GrantFiled: March 9, 2009Date of Patent: December 27, 2011Assignee: The Ohio State UniversityInventors: Glenn S. Daehn, John C. Lippold
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Patent number: RE43176Abstract: The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use.Type: GrantFiled: January 11, 2008Date of Patent: February 14, 2012Assignee: LSP Technologies, Inc.Inventors: Richard D. Tenaglia, Jeff L. Dulaney, David F. Lahrman