Abstract: The present invention involves annealing methods for doped gallium nitride (GaN). In one embodiment, one method includes placing, within a heating unit, a silicon carbide (SiC) wafer as a susceptor in close proximity with a doped GaN epilayer, wherein the doped GaN epilayer is either a GaN layer grown on a substrate or a GaN layer that is free standing; and heating, at a heating rate of at least about 100° C./s, the wafer and the doped GaN epilayer to at least about 1200° C. In another embodiment, another method includes placing, within a heating unit, a doped GaN epilayer, wherein the doped GaN epilayer is either a GaN layer grown on a conducting substrate or a GaN layer that is free standing; and heating, at a heating rate of at least about 100° C./s, the doped GaN epilayer to at least about 1200° C.

Abstract: There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.

Abstract: A laser emitter arranged to face a plastic substrate makes relative movement along a surface of the plastic substrate, while it is emitting a laser, so as to laser-cut the plastic substrate. In this process, a shield member is arranged outside a laser irradiation region on the plastic substrate.

Abstract: A method for laser shock peening an article, such as a gas turbine engine airfoil, with varying thickness by varying a surface fluence of a laser beam over a laser shock peening surface as a function of the thickness beneath a laser shock peened spot formed by the beam on the surface. The fluence may be equal to the thickness multiplied by a volumetric fluence factor, the volumetric fluence factor being held constant over the laser shock peening surface. The volumetric fluence factor may be in a range of about 1200 J/cm3 to 1800 J/cm3 and more particularly about 1500 J/cm3. The method may include varying energy in the laser beam using a computer program controlling firing of the laser beam. A device such as an optical attenuator external to a laser performing firing may be used to vary the energy.

Abstract: The invention relates to a method for monitoring a processing region of a workpiece (10) on which laser processing is being carried out, in which method the radiation emitted by the processing region (11) is detected by a detector system (22) in a space-resolved manner, wherein the radiation of the processing region (11) is detected for each elemental area of the processing region (11) imaged onto the detector system at least two wavelengths simultaneously. Accurate process monitoring may thereby be carried out.

Abstract: The invention relates to a stent with a structure of a biocorrodible magnesium alloy or tungsten alloy, which comprises a multiplicity of web sections connected to one another, wherein (i) the structure has a support structure of a number of first web sections connected to one another, which are designed to perform a function supporting the vascular wall or preserving the mechanical integrity of the stent after an expansion of the stent for a predetermined period of time and (ii) at least one second web section is present, which a) is directly connected to a selected first web section, b) does not perform a function supporting the vascular wall or preserving the mechanical integrity of the stent after the expansion of the stent for the predetermined period of time, and c) has a smaller average grain size than the first web sections of the support structure from (i).

Abstract: A novel silicon crystallization apparatus and a silicon crystallization method renders it is possible to form alignment key without additional photolithography, and to adjust a substrate to a correct position by sensing a deviation of the substrate when the substrate is loaded. The silicon crystallization apparatus includes a moving stage being moved in a horizontal direction, and a fixing plate provided in the moving stage, to fix a substrate. A rotating frame is provided in the moving stage, to rotate the fixing plate.

Abstract: According to the present invention, a method of working material with high-energy radiation is provided, wherein a polymer matrix (1) is irradiated with high-energy radiation, in particular with a laser beam (9), wherein the radiation is focused onto a focal point (11) and the focal point (11) is set such that the focal point (11) lies behind the surface (3) of the polymer matrix (1) facing the radiation, and material removal is brought about at the polymer matrix (1), and consequently a reaction space (13) is created within the polymer matrix (1).

Abstract: A laser peening process for the densification of metal surfaces and sub-layers and for changing surface chemical activities provides retardation of the up-take and penetration of atoms and molecules, particularly Hydrogen, which improves the lifetime of such laser peened metals. Penetration of hydrogen into metals initiates an embrittlement that leaves the material susceptible to cracking.

Abstract: The invention provides a substrate treatment method and apparatus. Embodiments show a substrate in the form of a rotary encoder ring having a pattern of marks producable by means of a laser treatment device controllable to produce the pattern in the correct manner whilst there is continuous relative displacement between the ring and the laser treatment device.

Abstract: A laser processing apparatus according to the present invention includes a laser oscillator that emits a continuous-wave or pulsed-wave laser beam for heat processing or a pulsed-wave laser beam for surface treatment, an incident optical system that causes the laser beam emitted from the laser oscillator to enter an optical fiber, a condenser lens that condenses the laser beam emitted from the optical fiber, and a processing unit that moves close to a processing object by carrying the condenser lens and irradiates a surface of the processing object with a laser beam, in which the laser oscillator emits the laser beam for the heat processing when performing the heat processing and emits the laser beam for the surface treatment when performing a pre-treatment or a post-treatment for the heat processing.

Abstract: A system for machining objects using a laser, including a supply of objects, an object support tray, a galvanometric head, a laser source, and a computer on which a shape recognition software is installed. The galvanometric head includes a first wide field camera, with a first filter located at the output of the first camera, a second narrow field camera, with a second filter located at the output of the second camera, guide mirrors, and a lens that displays at least one object or the part to be machined, located on the support tray.

Abstract: An industrial robot, having an end-effector supporting mechanism for holding an end-effector and accommodating an imaging device of a visual sensor, which is free from the interference with the periphery and capable of taking an image of the working position. A container-shaped adaptor of the end-effector supporting mechanism is attached to a distal end of a wrist flange provided in a robot wrist supported by a robot arm. The adaptor has a first attachment section provided with a first attachment surface to be attached to the wrist flange, and a second attachment section provided with a second attachment surface disposed generally parallel to a wrist flange surface at a position apart from the first attachment section by a predetermined distance along a rotary center axis of the wrist flange. On the second attachment surface, a tool holding member of the end-effector supporting mechanism for holding the working tool is attached.

Abstract: An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When an outer-circumferential surface of a welded portion of a cylindrical tubular body (2) is irradiated with a laser beam that circles around an outer circumference of the tubular body (2), a heating width W in a circumferential direction heated by the laser-beam irradiation and a laser-beam moving speed V in the circumferential direction are set so that a stress in the circumferential direction in an inner surface of the tubular body (2) produced by the heating with the laser beam is at least larger than a yielding stress of a material that the tubular body (2) is made of.

Abstract: Laser machining a tubular construct comprising a polymer layer to form a stent pattern in the construct with localized cooling of the machined surface to reduce or prevent heat transfer to uncut polymer of the polymer layer is disclosed.

Abstract: A permanent invisible magnetic marking and positioning system of unfinished ferrous rods, bars, workpieces, and the like. A midpoint, center or other point of the workpiece is automatically located and a high-energy pulse is applied for installing an embedded magnetic marker. The magnetizing heads can also be repositioned to various points on a workpiece for imparting digital manufacturing and product identification in a data strobe pulse, that is analogous to a picket fence, where each picket provides a weighted binary representation in a data array comprised of data cells.

Abstract: A cutter including a base, a holder, a cutter blade portion, and a laser generator. The holder is supported on the base portion in an upright posture. The cutter blade portion supports a moving blade. The cutter blade portion is supported on the holder movable between an upper position and a lower position. The cutter blade portion is moved into the lower position to cut a workpiece supported on the base using the moving blade. The laser generator is attached to the holder or the cutter blade portion in an orientation to direct at least a portion of the laser light onto a position on the workpiece that is directly beneath the cutter blade portion when the cutter blade portion is in the upper position. Alternatively, a holder has a shaft support portion, and a slide shaft is axially slidably supported by the shaft support portion. A front end of the slide shaft has a hinge holder which pivotally supports the cutting blade portion. A laser generator is fixed to a front side of the hinge holder.

Abstract: A first portion of a continuous material strip is indexed through a stamping press and the stamping press is cycled so as to undertake a stamping operation on a section of the material strip during each cycle. A length of the continuous strip is accumulated in an accumulator either upstream or downstream of the stamping press. A second portion of the strip is continuously fed at a non-zero speed through a laser micromachining station positioned such that the accumulator is between the stamping press and the laser micromachining station. The speed of the second portion of said strip is controlled so that this speed is constant for at least a portion of each cycle of the stamping press and so that the average speed of the first portion of said strip through the stamping press is equal to the average speed of the second portion of the strip through the laser micromachining station.

Abstract: An improved method for the production of single walled carbon nanotubes that utilizes an RF-induction heated side-pumped synthesis chamber for the production of such. Such a method, while capable of producing large volumes of carbon nanotubes, concurrently permits the use of a simplified apparatus that allows for greatly reduced heat up and cool down times and flexible flowpaths that can be readily modified for production efficiency optimization. The method of the present invention utilizes a free electron laser operating at high average and peak fluence to illuminate a rotating and translating graphite/catalyst target to obtain high yields of SWNTs without the use of a vacuum chamber.

Abstract: A method of modifying the structure of workpiece (1) is provided. The method comprises a first step of causing relative movement between a power beam and the workpiece (1) so that a region (3) of the workpiece (1) is melted and the melted material displaced to form a projection (2) at a first location in the region (3) and a hole (4) at a different location in the region. The melted material is then allowed to at least partially solidify after which the first step is repeated one or more times, with the region corresponding to each repeat intersecting the region (3) of the first step.

Abstract: A seal ring arrangement generally includes a pair of opposed seal rings which define a shaft seal to prevent leakage along the shaft of rotary equipment. A seal face treatment process has been developed using seal ring machining equipment which has a laser unit that forms micro-topography depth features in the seal face and then performs a material surface treatment process to selectively alter the conductivity of the seal face so as to virtually eliminate electro-corrosion in the seal rings. The seal rings preferably are provided in a conventional combination of a carbide seal ring material for one of the seal rings and a silicon carbide material for the other seal ring. The laser machining and the laser treatment processes are preferably applied to the silicon carbide material.

Abstract: An RF-induction heated side-pumped synthesis chamber for the production of carbon nanotubes. Such an apparatus, while capable of producing large volumes of carbon nanotubes, concurrently provides a simplified apparatus that allows for greatly reduced heat up and cool down times and flexible flowpaths that can be readily modified for production efficiency optimization.

Abstract: The present invention relates to a technique that remarkably increases the processing speed of a conventional ultra-fast laser micro process having a very high processing accuracy. According to the present invention, a laser processing method based on transient changes in the status of laser-induced material couples a pulse of a ultrafast laser to a pulse of at least one auxiliary laser other than the ultrafast laser to reversibly change a material to be processed.

Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating.

Abstract: There are described compositions and methods for the laser marking of products or their packaging. The compositions comprise transition metal oxides, saccharides and/or flame-retardant agents, optionally with other additives, dispersed in a carrier.

Abstract: The method of preventing cold-worked stress corrosion cracking in the iron steels and alloyed steels including stainless steels comprises removing a residual tensile stressed layer, optionally generating residual compression, through the impact of irradiation with the ultra-short femtosecond pulse and kW class high average-power laser, and removing a hardened surface layer extremely susceptible to stress corrosion cracking, whereby this susceptible hardened surface layer with many concentrated dislocation defects and the likes is removed without generating or introducing any of such hardened layer in the process of its removal. The method is free from the risk of damaging other equipment by peening with steel balls or other shaped shots, is almost unlimited in actual environment, effectiveness, work, place and other conditions for application, is inexpensive, and functions continuously for a much longer period than an ordinary nuclear reactor's service lifetimes.

Abstract: A process to chemically refine and consolidate tantalum, niobium and their alloys to a fabricated product of net shape or near-net shape with higher throughput, more consistency, and lower manufacturing costs compared to prior art routes or rejuvenate damaged and deteriorated refractory metal parts. Powder metal is loaded into hoppers to be fed into laser forming/melting equipment. A suitable substrate is loaded into a laser forming/melting chamber onto which the powder will be deposited and consolidated in a point-scan process. As the powder is fed onto successive points of the surface of the substrate in linear traces, the laser is used to heat and partially melt the substrate and completely melt the powder. A combined deposition and melt beam traces the substrate surface repeatedly over a selected area to build up a dense coating of controlled microstructure in multiple layers. A fully dense deposit is built up that becomes the desired shape.

Abstract: An annular gasket for use with a circular stapling apparatus in performing an anastomosis is disclosed. The annular gasket comprises a substantially circular body portion having an upper surface, a lower surface, an outer terminal edge, and an inner terminal edge defining an aperture therein. The body portion defines a central longitudinal axis through the aperture. The annular gasket also comprises a plurality of pores extending through the body portion. Each of the pores is disposed between the outer terminal edge and the inner terminal edge and extends from the upper surface to the lower surface such that each pore defines an axis that is substantially parallel to the central longitudinal axis. An outer region of the gasket is disposed radially outward of the plurality of pores and the outer region is substantially non-porous.

Abstract: In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused above the surface of a material where laser induced breakdown is desired.

Abstract: [PROBLEMS] To provide a method and an apparatus for cutting a conductive link of a redundant circuit in a semiconductor circuit. [MEANS FOR SOLVING PROBLEMS] A method is provided for selectively cutting a plurality of conductive links embedded in a protection layer which covers at least the conductive links in a semiconductor device formed on a semiconductor substrate. A focused beam is aligned with a target link, a first pulsed laser beam having a short laser wavelength of 400 nm or shorter and a second pulsed laser beam having a wavelength longer than 400 nm are generated, the first and the second pulsed laser beams are overlapped and applied onto the conductive link from over the protection layer. Preferably, the second pulsed laser is applied after the first pulsed layer in terms of time.

Abstract: In accordance with said control method, the transmission of the laser beam is periodically interrupted with the aid of means for masking the laser beam placed between the reference point and a source of the laser beam. Moreover, the transmission power of the source of the laser beam is varied between the minimum and maximum values, such that the emission times of the source of the laser beam at the minimum power substantially coincide with the masking times of the laser beam via the masking means. Preferably, the minimum value is at least equal to 10% and the maximum value at most equal to 90% of a maximum emission power of the source of the laser beam.

Abstract: The method uses a laser beam directed through the substrate to the conductive area of the substrate in order to bond the two together.

Abstract: A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, wherein the chuck table comprises a body and a workpiece holding member disposed on the top surface of the body, and the workpiece holding member is made of a material which transmits a laser beam having a predetermined wavelength.

Abstract: A method of operating a laser to obtain an output pulse having a single wavelength, comprises inducing an intracavity loss into a laser resonator having an amount that prevents oscillation during a time that energy from the pump source is being stored in the gain medium. Gain is built up in the gain medium with energy from the pump source until formation of a single-frequency relaxation oscillation pulse in the resonator. Upon detection of the onset of the relaxation oscillation pulse, the intracavity loss is reduced, such as by Q-switching, so that the built-up gain stored in the gain medium is output from the resonator in the form of an output pulse at a single frequency. An electronically controllable output coupler is controlled to affect output pulse characteristics. The laser acts a master oscillator in a master oscillator power amplifier configuration. The laser is used for laser peening.

Abstract: The invention relates to a method for producing shell segments with a particularly large length extend for forming a fuselage cell of an aircraft, comprising the following steps: a) Joining at least two skin segments to form a large-sized skin field, b) welding a plurality of integral stringers onto the skin field, and c) welding a plurality of integral ring frame segments to the skin field to finish the shell segment. By means of the shell segments with a large length according to the invention it is possible to reduce the number of fuselage sections that are necessary to form a fuselage cell of an aircraft and thereby reducing the number of necessary cross seams which are weight increasing due to the necessary overlaps and connection elements.

Abstract: Electrochromic device having at least one carrier substrate (S1) provided with a functional multilayer defining a deposition zone and comprising, in succession: a first electroconductive layer (1), (the one closest to the substrate); a first electrochemically active layer (2); an electrolyte layer (3); a second electrochemically active layer (4); and a second electroconductive layer (5), characterized in that the functional multilayer is deactivated, with the exception of the first electrochemically active layer (2), in at least a first, partial margination zone (A) located along at least one edge of said deposition zone.

Abstract: A process chamber for a processing of a material by means of a directed beam of electromagnetic radiation is provided, which comprises an optical element (9) for coupling the beam (7) into the process chamber (10), wherein the optical element has a surface (9a) facing the inside of the process chamber, a wall section (12) surrounding the optical element (9), a first inlet (16) for a gas that is arranged at one side of the optical element (9) and designed such that an escaping first gas flow (18) strokes substantially tangentially over the surface (9a) of the optical element (9), a second inlet (23) for a gas, which is designed and arranged such that an escaping second gas flow (25) flows at a distance to the surface (9a) in substantially the same direction as the first gas flow (18).

Abstract: A combination extrusion and laser marking system and corresponding method are provided for creating an extruded article with a surface graphic image. The system includes an extruder, a laser, and a controller or encoder. The extruder is operable to pass an extrudable material through a die and discharge an extrudate having a markable surface. The laser is operable with the extruder for forming an image on the markable surface of the extrudate discharged from the extruder. The encoding system is operable to measure a rate of speed at which the extrudate is discharged from the extruder and provide a feedback signal for controlling operation of the laser. The combination may further include an ink printer to form an additional image on the extruded article.

Abstract: A solid-state laser processing apparatus includes a solid-state laser oscillator, a laser beam diameter controller, an optical fiber, and a processing head. The solid-state laser oscillator oscillates a laser beam. The laser beam diameter controller controls a beam diameter of the laser beam, and includes an aperture. The aperture controls a beam quality of the laser beam defined by M2 so as to fall in a range of 85?M2?105. The optical fiber guides the controlled laser beam therein. The processing head includes a transfer optical system, and irradiates the guided laser beam to a surface of a workpiece to be processed by way of the transfer optical system.

Abstract: An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.

Abstract: The invention relates to a process for hardening an annular groove of a piston head (1) of a steel piston of an internal combustion engine by means of laser beams (4), in which, according to the invention, at least the annular groove to be hardened is provided before or directly during hardening with a coating which absorbs the energy of laser beams (4) and the coating is subsequently irradiated with the laser beams (4). The absorbing layer is preferably a manganese phosphate coating or is formed in situ by treating the component surface with a process gas comprising oxygen and inert gas. Furthermore, the laser beams are directed at the piston during hardening at an oblique angle to the direction of rotation. The advantages achieved are: avoidance of reflections and undesirable hardening of the bottom of the rotation. The advantages achieved are: avoidance of reflection and undesirable hardening of the bottom of the groove, an increased degree of absorption and reduced distortion of the piston.

Abstract: In the method, a support is provided that presents a base for an annular wiper, and a wiper is built up that presents height that varies around its circumference, by forming a plurality of projecting portions by performing following successive steps: a laser source connected to an optical head focused on a point on the top surface of the base is activated, as is a source of powder connected to the spray nozzle, thereby forming a localized melt at said point, into which the powder is injected, thus forming a localized region of extra thickness; and the optical head and the nozzle are aimed at another point adjacent to said region of extra thickness and the method returns to the preceding step until the layer of material is completed in the angular sector in question.

Abstract: Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

Abstract: The present invention relates to a method for smoothing and polishing surfaces by treating them with energetic radiation, in particular laser radiation, in which the to-be-smoothed surface is remelted in a first treatment step using said energetic radiation and employing first treatment parameters at least once down to a first remelting depth of approx. 5 to 100 ?m, which is greater than a structural depth of the to-be-smoothed structures of said to-be-smoothed surface, wherein continuous radiation or pulsed radiation with a pulse duration of ?100 ?s is employed. The method makes it possible to automatically polish any three-dimensional surface fast and cost effective.

Abstract: An apparatus and method for disassembling a container having sections joined at sealed thermoplastic joining surfaces, such as toner cartridges, by cutting between the joined sections with a computer controlled laser beam, the beam being variable in intensity and/or in speed of travel along the joining surfaces. The technique may be applied to other articles, such as inkjet cartridges and any thermoplastic container that should be opened with precision.

Abstract: A method may include providing an outer panel that may have a flange that defines at least one planar section. The flange may be heated at the at least one planar section, and the flange may be bent about the at least one planar section.

Abstract: The present invention relates to a continuous kiln coupled to a laser by a conventional optical means that allows for surface treatment of a part, such that it is possible to achieve temperatures of up to 3000° C. on the surface of the part while the remainder of the part is at a substantially lower temperature. The part in the kiln is heated to a temperature on the order of 500° C. and a laser beam bundle is applied to the part via an opening in the kiln. The laser beam scans a line perpendicular to the direction of movement of the part such that the entire surface is scanned by means of the mechanical advance of the part. The scanning may extend beyond the lateral ends of the part. The kiln may comprise different zones with independent temperature controls for successfully achieving desired values, both for heating and cooling.

Abstract: A carrier applicable to a laser releasing process and for carrying at least a flexible display panel is provided. The flexible display panel is formed on a transparent substrate and includes a display main body and a driving circuit module connected to an edge of the display main body. The carrier includes a carrying plate having at least a carrying area for carrying the flexible display panel and a protecting cover disposed on the carrying plate and located at an edge of the carrying area. A receiving space is formed between the protecting cover and the carrying plate for receiving the driving circuit module. The protecting cover is for shielding the driving circuit module to prevent the driving circuit module from being irradiated by a laser beam in the laser releasing process. A method for manufacturing flexible display panel also is provided.

Abstract: A method for producing a sealing ring in which a hollow cylinder is first formed from a sheet metal, the mutually contacting edges of the sheet metal being joined in a substance-to-substance bond, the bond being produced in such a way that a bead is formed at least on the outer periphery, along the mutually contacting edges, and is flattened in a subsequent working process.

Abstract: The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.