Abstract: A method for controlling an induction heating system, particularly an induction heating system of a cooktop on which a cooking utensil with a certain contents is placed for heating/cooking purposes, comprises the steps of carrying out a predetermined number “n” of electrical measurements of a first electrical parameter of the heating system on the basis of a predetermined electrical value of a second electrical parameter, “n” being ?2, repeating the above set of measurements at a predetermined time after the first measurements, and estimating at least one thermal parameter of the heating system, particularly of the contents of the cooking utensil, on the basis of the above set of measurements.

Abstract: Methods for measuring a temperature of a wafer chuck and calibrating temperature and a temperature measuring system are provided. The measuring method includes: placing a test wafer on a wafer chuck, where a plurality of semiconductor devices having electrical parameters varying as a function of temperature are formed on the test wafer; making the temperature of the wafer chuck reach set temperatures; measuring the semiconductor devices respectively to obtain electrical parameters corresponding to the semiconductor devices; obtaining actual temperatures of the semiconductor devices according to the electrical parameters and variations, of the electrical parameters, as the function of temperature; and obtaining an actual temperature distribution of the wafer chuck according to the actual temperatures of the semiconductor devices.

Abstract: A cooking system includes an operator interface configured to enable input of an identification characteristic for a placement unit for placement on a cooking surface for purpose of a heating operation, and a control unit configured to release or block a cooking function for the placement unit as a function of the identification characteristic input via the operator interface.

Abstract: A cooking appliance includes a cooktop having at least one heating element for heating a cookware member on or to be placed on the cooktop, the at least one heating element being adjustable between a working-power level wherein the at least one heating element is energized to generate heat and a zero-power level wherein the at least one heating element is not energized. The cooking appliance further includes a temperature sensor configured to detect a temperature or rate of temperature change of a cooking element. The cooking appliance further includes a control device configured to adjust the at least one heating element from the working-power level to the zero-power level based on the temperature or rate of temperature change of the cooking element. The at least one heating element will remain at the zero-power level until a user intervenes to re-energize the at least one heating element.

Abstract: A system and method for limiting welding output and ancillary features is provided. In one embodiment, a portable generator system includes a power generator configured to generate electrical power appropriate for welding or plasma cutting. The generator system also includes power conversion circuitry coupled to the power generator and configured to receive power from the power generator and to provide output power. The generator system includes at least operator accessible input for receiving an operator input parameter. The generator system also includes an output power limiting device not adjustable by the operator and configured to selectively limit output power from the power conversion circuitry.

Abstract: A cooking appliance includes a plurality of electrically controlled heating elements operable to elevate a temperature of food items. A user interface includes a touch-sensitive circuit that is operatively-connected to an external surface of the cooking appliance for altering operational settings of the electrically controlled heating elements. An electrovibration feedback circuit is coupled to the external surface that generates a vibratory feedback that is sensible by the user's finger at the external surface in response to adjustments of the operational settings. The electrovibration feedback circuit creates an electrostatic force on the user's finger that simulates friction between the user's finger and the external surface.

Abstract: The disclosure provides an anti-short-circuit integrated chip and terminal facility. The integrated chip comprises: a control unit having a first output terminal configured for outputting a first signal and a second output terminal configured for outputting a second signal; and an insurance apparatus having a first insurance part connected to the first output terminal and a second insurance part connected to the second output terminal. The insurance parts are configured for limiting the currents flowed through the insurance parts when the currents flowed through the insurance parts exceed the current threshold. The chip device can be protected from being damaged when there is short circuit.

Abstract: In one embodiment, a thermal array comprises a first heating element and a second heating element, each surrounded by insulators which cover five sides of each heating element, held in position by a cooling block. Two thermal arrays are placed opposite each other creating a conduction channel wherein a sample vessel is transported between the heating elements and cooling block as the reaction requires. Due to the low energy consumption of each array, the thermal array system may function using standard D-cell batteries.

Abstract: A build chamber of a three-dimensional printer uses directed heat to preheat a region within the chamber where a build will be initiated, and then uses circulating, heated air to maintain a target temperature for the entire build volume after the build is initiated. A fixed heating element and blower may advantageously be used for both heating steps, and preheating may be accomplished more quickly by initially directing heat at the locus of build initiation rather than diffusing heat throughout an entire build volume.

Abstract: In a method for setting an inrush current of a domestic appliance to a region-specific inrush current, the domestic appliance is switched to a setting mode, in which the inrush current is limited at the domestic appliance to one of a number of region-specific inrush currents that are selectable at the domestic appliance.

Abstract: A control module suitable for controlling a manual switch type automatic drip coffeemaker (ADC) enabling the addition of fully automatic brewing start, programmable brewing strengths, programmable heater levels for keeping the coffee warm after the brewing cycle is complete, programmable shut-off time periods, automatic cleaning detector, automatic self cleaning cycle with automatic shut-off, and programmable twelve hour AM/PM or twenty-four hour time format. The control module contains a micro-controller, application specific firmware, a keypad, a liquid crystal display, a control relay, a current or a voltage sensor, indicator LED's, a piezo audible alarm, and power supply components.

Abstract: Traditional thermocyclers are heating devices that change sample temperatures by adding heat energy into a sample block that is usually a large metal block and then extracting that heat energy out of the block in a process called ramping the temperature. Presented herein is a technology that eliminates the large mass sample block and ramping temperatures in a sample block and thus in a sample vessel. This design called a Thermal Array requires a fraction of the energy used to process a sample. In addition, the array allows a much smaller thermal cycler to be designed leading to portability of a device. This technology is designed to allow optimal polymerase chain reactions to be executed.

Abstract: The disclosure includes an HVAC data processing and communication network, and a method of manufacturing the same. In one embodiment the HVAC data processing and communication network includes a system device and a user interface. The system device is configured to store alarm data in local memory in response to an alarm event. The user interface is configured to send an alarm request message to the system device, and to receive an alarm reporting message including alarm data from the system device via a data bus.

Abstract: Methods and apparatuses that decouple wafer temperature from pre-heat station residence time, thereby improving wafer-to-wafer temperature uniformity, are provided. The methods involve maintaining a desired temperature by varying the distance between the wafer and a heater. In certain embodiments, the methods involve rapidly approaching a predetermined initial distance and then obtaining and maintaining a desired final temperature using closed loop temperature control. In certain embodiments, a heated pedestal supplies the heat. The wafer-pedestal gap may be modulated may be varied by moving the heated pedestal and/or moving the wafer, e.g., via a movable wafer support. Also in certain embodiments, the closed loop control system includes a real time wafer temperature sensor and a servo controlled linear motor for moving the pedestal or wafer support.

Abstract: A heating appliance includes a heating structure having a lower surface and a flat upper surface for supporting and imparting heat into an object, such a pot or pan used to cook food. The heating structure includes an array of heating elements arranged on the lower surface of the heating structure in an m×n array having m columns and n rows. Each element is thermally coupled to a region of the structure for heating its respective region of the structure independently of other regions of the structure associated with the other heating elements.

Abstract: A light-emission output of a flash lamp for performing a light-irradiation heat treatment on a substrate in which impurities are implanted is increased up to a target value L1 over a period of time from 1 to 100 milliseconds, is kept for 5 to 100 milliseconds within a fluctuation range of plus or minus 30% from the target value L1, and is then attenuated from the target value L1 to zero over a period of time from 1 to 100 milliseconds. That is, compared with conventional flash lamp annealing, the light-emission output of the flash lamp is increased more gradually, is kept to be constant for a certain period of time, and is then decreased more gradually. As a result, a total heat amount of a surface of the substrate increases compared with the conventional case, but a surface temperature thereof rises more gradually and then drops more gradually compared with the conventional case.

Abstract: A method of operating a heating plate for a substrate support assembly used to support a semiconductor substrate in a semiconductor processing apparatus, wherein the heating plate comprises power supply lines and power return lines and respective heater zone connected between every pair of power supply line and power return line. The method reduces maximum currents carried by the power supply lines and power return lines by temporally spreading current pulses for powering the heater zones.

Abstract: A cooking appliance includes an oven cavity and a control system having a control display adapted to display an interactive sequence of display screens through which a user enters a cooking recipe. The sequence of display screens includes a cooking mode selection screen, a cooking temperature selection screen, a cooking monitoring selection screen from which a user selects from a probe monitoring process or a timer monitoring process, and a review screen for prompting the user to review the cooking mode, cooking temperature, and method of monitoring selections. The system allows a user to add additional stages to create a multi-stage recipe.

Abstract: A heating plate for a substrate support assembly in a semiconductor plasma processing apparatus, comprises multiple independently controllable planar heater zones arranged in a scalable multiplexing layout, and electronics to independently control and power the planar heater zones. Each planar heater zone uses at least one diode as a heater element. A substrate support assembly in which the heating plate is incorporated includes an electrostatic clamping electrode and a temperature controlled base plate. Methods for manufacturing the heating plate include bonding together ceramic or polymer sheets having planar heater zones, power supply lines, power return lines and vias.

Abstract: In an operating method for a hob having a plurality of heating elements, an operating action for a heating element, such as heating with an additional region on the cooktop or invoking a parboiling step, is selected in an initial step by providing input to a general input sensor element that is not associated with any specific heating element. In a subsequent step, the selected operating action is allocated or associated with a specific heating element by operating a cooking element specific sensor element, for example when setting the power level for that heating element. Therefore, sensor elements can be provided with an advantageous multiple-use effect for general operating actions. Furthermore, the operating sequence permits simple and convenient operation.

Abstract: A method and device for determining temperature of a substrate in a vacuum processing apparatus during a process of the substrate are disclosed, the substrate to be measured is placed on a susceptor in the vacuum processing apparatus for a manufacture process, and the method includes: selecting i wavelengths from radiance emitted from the susceptor through a substrate, where i is a natural number greater than 1; obtaining at least i pieces of radiance corresponding to the selected i wavelengths; and calculating the temperature of the substrate based on the i pieces of radiance and the i wavelengths, by using a mathematical equation: E(?i)=T(d)×M(?i,T), where E(?i) is the ith radiant quantity corresponding to the ith wavelength ?i, T(d) is transmittance of the substrate, which is a function of thickness d of a film grown on the substrate, and M(?i,T) is blackbody radiation equation, which is a function of the ith wavelength ?i and the substrate temperature T.

Abstract: Methods and apparatus for controlling the temperature of multi-zone heater in a process chamber are provided herein. In some embodiments, a method is provided to control a multi-zone heater disposed in a substrate support, wherein the multi-zone heater has a first zone and a second zone. In some embodiments, the method may include measuring a current drawn by the first zone at a first time; measuring a voltage drawn by the first zone at the first time; calculating the resistance of the first zone based upon the measured current and voltage drawn by the first zone at the first time; determining a temperature of the first zone based upon a predetermined relationship between the resistance and the temperature of the first zone; and adjusting the temperature of the first zone in response to the temperature determination.

Abstract: A heater unit is adapted to determine if a humidification chamber thermally coupled to a hot plate of the heater unit is effectively dry based on determining a thermal response of a hot plate of the heater unit. Also, the activation period during which the hot plate is being heated is adjusted toward an optimum period by adjusting the energization or power level to the heater element thereof in relation to the duration of a prior activation period. Further, the air flow rate of gas through the humidification chamber may be estimated based on a temperature of the hot plate determined in predetermined relationship to the beginning of an activation period.

Abstract: An electrical heating device has an integrally manufactured support made from insulating material. Depressed paths for introducing a heating element are provided. A klixon functioning as a thermally actuated switch is inserted from above into an opening in the central area of the support and its electrical terminals project over the bottom side and are bent round for mechanical fixing.

Abstract: An energy conservation system to selectively control the operation of the heating elements of a water heater including a water storage tank operable in an automated mode to control the temperature of water within the water storage tank comprising a flow detector such as temperature sensor to sense the inlet or outlet water temperature to detect a change in temperature measured in time and duration and a tank temperature to sense the water temperature within the storage tank and generate corresponding temperature signals and a microprocessor coupled to the flow detector and tank temperature sensor to receive the corresponding signals including means to determine when there is a demand for hot water and means to determine a pattern of hot water usage over a water usage cycle to maintain the water in the water storage tank at a minimum temperature to supply a minimum quantity of hot water and increase the temperature of the water to a maximum temperature to supply a maximum quantity of hot water corresponding to

Abstract: A temperature control interface for a stove top is provided. The temperature control interface includes a numerical temperature setting to which a temperature of an object heated on the stovetop will be regulated for a predetermined period of time. A method of cooking on a stovetop is provided in which a recipe includes a numerical temperature to which a cookware object should be regulated during cooking for a predetermined period of time.

Abstract: The present invention relates to a household appliance for performing a housekeeping task. The household appliance comprises a data input device (16) adapted to remotely sense a property in a sensing area (18), and a controller (22) coupled to the data input device and adapted to control an operation of the household appliance in accordance with the sensed property.

Abstract: In the present invention, temperature drop amounts of heating plate regions when the substrate is mounted on a heating plate are detected to detect a warped state of the substrate. From the temperature drop amounts of the heating plate regions, correction values for set temperatures of the heating plate regions are calculated. The calculation of the correction values for the set temperatures of the heating plate regions is performed by estimating steady temperatures within the substrate to be heat-processed on the heating plate from the temperature drop amounts of the heating plate regions using a correlation obtained in advance. From the estimated steady temperatures within the substrate and the temperature drop amounts of the heating regions, the correction values for the set temperatures of the heating plate regions are calculated. Based on the correction values for the set temperatures, the set temperatures of the heating plate regions are changed.

Abstract: An electronic temperature-sensing probe comprises a shell, a control base plate, a probe and a key group, wherein the control base plate is placed inside the shell; the probe with one end extending outside of the shell and the other end connected to the control base plate electrically is mounted in the shell; the key group with their inner ends connected to control contacts of the control base plate are depressibly mounted on the surface of the shell; the key group comprises a power switch key, temperature-adjusting keys and a high temperature switch key; the control base plate controls the power on/off of the heating element based on the temperature control signals provided by the temperature-adjusting keys and the high temperature switch key and the temperature signal provided by the probe and the switch control signal provided by the power switch key.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: A temperature control interface for a stove top is provided. The temperature control interface includes a numerical temperature setting to which a temperature of an object heated on the stovetop will be regulated. A method of cooking on a stovetop is provided in which a recipe includes a numerical temperature to which a cookware object should be regulated during cooking.

Abstract: A cooking appliance includes a plurality of heating elements and a plurality of user interface devices for receiving heating element settings. An input device for allows a user to arbitrarily selectively associate any one or more of the heating elements with any one or more of the user interface devices.

Abstract: A thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and an in-plane tendency of the measured line widths is decomposed into a plurality of in-plane tendency components using a Zernike polynomial. From the calculated plurality of in-plane tendency components, in-plane tendency components improvable by changing the temperature correction values are extracted and added together to calculate an improvable in-plane tendency of the measured line widths within the substrate.

Abstract: Provided are an apparatus and a method for monitoring a hot surface of a cook top. The apparatus includes a display unit, a temperature detecting sensor, and a microprocessor. The display unit displays a state of a hot surface and an operation error of a hot plate as a heater operates. The temperature detecting sensor is installed closely to the heater to detect heater temperature greater than set temperature. The microprocessor compares the heater temperature greater than the set temperature that is detected by the temperature detecting sensor with heater temperature greater than the set temperature that is expected by an elapse of an operating time of the heater to judge one of a hot surface and an operation error of the hot plate, and controls the judgment results to be displayed using the display unit.

Abstract: Temperature setting of a thermal plate is performed so that the line width of a resist pattern is uniformly formed within a wafer. The thermal plate of a PEB unit is divided into a plurality of thermal plate regions so that the temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the wafer mounted on the thermal plate is set for each of the thermal plate regions of the thermal plate. The temperature correction value for each of the thermal plate regions of the thermal plate is set after calculation by a calculation model created from a correlation between a line width of the resist pattern formed by thermal processing on the thermal plate and the temperature correction value. The calculation model M calculates the temperature correction value to make the line width uniform within the wafer, based on a line width measured value of the resist pattern.

Abstract: This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.

Abstract: A thermal processing apparatus includes a chamber for accommodating a semiconductor wafer and a radiant fitting. The radiant fitting includes a plurality of first radiant sources having a first reflectivity positioned in a center region of the radiant fitting and a plurality of second radiant sources having a second reflectivity. The second reflectivity is larger than the first reflectivity.

Abstract: A temperature control method for a heating apparatus including a chamber which can be evacuated and has a conductive portion, a filament which is positioned in the chamber, a first power supply which supplies a current to the filament, a second power supply which applies, to the filament, a voltage for acceleration to the chamber, an ammeter which measures a current of the filament, and a voltmeter which measures the acceleration voltage, the method comprises a first step of evacuating an interior of the chamber; a second step of supplying the filament current from the first power supply to the filament after the first step; a third step of applying the acceleration voltage to the filament after the second step; and a fourth step of controlling the acceleration voltage to keep a surface temperature of the chamber to be lower than a temperature of the filament after the third step while keeping constant the filament current from the first power supply.

Abstract: A fluid heating system configured to regulate a temperature of a fluid within a fluid receptacle having a fluid reservoir includes a processing unit, at least one fluid temperature sensor in electrical communication with the processing unit, and a heating element in electrical communication with the processing unit. The at least one fluid temperature sensor is configured to detect a temperature of one or both of the fluid receptacle and/or fluid retained within the fluid receptacle. The processing unit selectively activates and deactivates the heating element to regulate the temperature of the fluid within the fluid receptacle.

Abstract: In the present invention, a thermal plate is divided into a plurality of thermal plate regions, and a temperature is settable for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the thermal plate is settable for each of the thermal plate regions of the thermal plate. The line widths within the wafer for which the photolithography process has been finished are first measured, and Zernike coefficients of a Zernike polynomial indicating a plurality of in-plane tendency components are calculated from the measured values of the line widths within the wafer. Then, the temperature correction values for the regions of the thermal plate to bring the calculated Zernike coefficients close to 0 are calculated using a calculation model indicating a correlation between change amounts of the Zernike coefficients and the temperature correction values.

Abstract: A substrate holder for supporting a substrate in a processing system includes a temperature controlled support base having a first temperature, and a substrate support opposing the temperature controlled support base and configured to support the substrate. Also included is one or more heating elements coupled to the substrate support and configured to heat the substrate support to a second temperature above the first temperature, and a thermal insulator disposed between the temperature controlled support base and the substrate support. The thermal insulator includes a non-uniform spatial variation of the heat transfer coefficient (W/m2-K) through the thermal insulator between the temperature controlled support base and the substrate support.

Abstract: In one aspect, a cooktop heating system that include a first cooktop heating element, a second cooktop heating element, and an interface device. The system also includes a controller for selectively associating the interface device with any one or both of the first cooktop heating element and the second cooktop heating element. In another aspect, the system includes at least one cooktop heating element, a potentiometer, and controller arrangement operatively connected between the potentiometer and the at least one cooktop heating element to determine heating of the at least one cooktop heating element responsive to the input provided by the potentiometer and control power provision to the at least one cooktop heating element responsive to the determination.

Abstract: An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.

Abstract: A food heating warmer includes a placing section divided into a plurality of divided sub-sections in a warming compartment so that food is placed on the placing section, a plurality of constant temperature heating units located so as to correspond to the divided sub-sections of the placing section, each unit including a heater for heating the divided sub-section, a divided section temperature sensor detecting a temperature in each divided sub-section, and a switching element turning the heater on and off according to the temperature detected by the divided sub-section temperature sensor, a failure detecting unit which detects failures of the constant temperature heating units provided for the respective divided sub-sections of the placing section, and a notifying unit which specifies and notifies the constant temperature. heating unit for which failure has been detected by the failure detecting unit.

Abstract: A method for controlling a heating cooking apparatus, in which an operation of a heating unit is appropriately controlled according to presence/absence or kinds of a load applied to a plate. When no load is applied to the plate, the duty cycle of a heat source is reduced, thereby preventing unnecessary operation of the heat source. Accordingly, power consumption is reduced. On the other hand, when a load is applied to the plate, the duty cycle of the heat source is increased. Speedy cooking may be possible with this control method.

Abstract: This invention relates to a method and a device for the thermal treatment of substrates in which the substrates are held in contact with or a small distance away from a heating plate, which is heated by a plurality of separately controllable heating elements on the side of the heating plate facing away from the substrate, the heating plate being surrounded, at least in its plane, by a frame spaced apart therefrom, and gas being conveyed, in a controlled manner, through a gap between the frame and at least one edge of the heating plate.

Abstract: A cooking stove that prevents a burner from being ignited when a touch switch shifts from a non-sensing to a sensing state. An operation portion having a touch switch is provided on a glass top plate of a cooking stove main body which accommodates burners. The touch switch allowing a user to give instruction on actuation and stoppage of the burners and sensing an object that contacts or approaches the top surface of the glass to plate. Heating control means for determining whether the touch switch is on (a sensing state) or off (a non-sensing state) to control actuation of the heating means. While the burner is at a stop, when the touch switch is turned on and then off again, the heating control means ignites the burner. While the burner is in operation, when the touch switch is turned on, the heating control means extinguishes the burner.

Abstract: A touch switch which prohibits a child from actuating heating means, while permitting a child to deactivate heating means. A cooking stove including an electrical capacitance operation switch 10 which switches the cooking stove between an operation state in which an ignition instruction is enabled and a standby state in which the ignition instruction is disabled; the operation switch is used to instruct the cooking stove to be extinguished. When the cooking stove is inactive, a switch circuit 63 selects a resistance element 61 offering a higher resistance to set the cooking stove in a “lower sensitivity set state” in which the operation switch 10 has a sensitivity sl. When the cooking stove is active, the switch circuit 63 selects a resistance element 62 offering a lower resistance to set the cooking stove in a “higher sensitivity set state” in which the operation switch 10 has a sensitivity sh (>sl).

Abstract: A thermal plate of a heating unit is divided into a plurality of thermal plate regions, and a temperature can be set for each of the thermal plate regions. A temperature correction value for adjusting a temperature within the thermal plate can be set for each of the thermal plate regions of the thermal plate. The line widths within the substrate which has been subjected to a photolithography process are measured, and an in-plane tendency of the measured line widths is decomposed into a plurality of in-plane tendency components using a Zernike polynomial. From the calculated plurality of in-plane tendency components, in-plane tendency components improvable by changing the temperature correction values are extracted and added together to calculate an improvable in-plane tendency of the measured line widths within the substrate.

Abstract: Disclosed are apparatus and methodology for reducing the chances of a fire during the operation of heating or cooking appliance. Motion sensitive circuitry incorporated into control circuitry for the appliance monitors activity near the appliance. If activity near the appliance is not detected within a preselected time period, heat producing elements associated with the appliance are disengaged. A manual override mechanism may be provided to permit longer term use of the appliance, as special occasions require.