Abstract: Provided is a method for bonding an insulated coating wire, which is capable of stably bonding a metal wire in an insulated coating wire and an electrode. One aspect of the present invention provides a method for bonding an insulated coating wire for electrically connecting a first electrode 12 and a second electrode to each other by an insulated coating wire 11 in which a metal wire is coated with an organic substance, the method including: a step (a) for placing the insulated coating wire 11 onto the first electrode 12; a step (b) for exposing a metal wire from the insulated coating wire; and a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.

Abstract: A hard disk drive flexure assembly includes a metal substrate having a gap between a root side and a slider side, a base layer and a first conductive layer that each bridges the gap, and a plurality of electrical pads where the pads extend to the slider side of the flexure so as to positionally overlap with a slider end edge and corresponding slider electrical pads. Pre-solder bumps are formed on each pad. This configuration facilitates formation of a functional solder bridge between the flexure and the slider because the melted solder can readily spread on the extended flexure pad surface and reach the slider pad when the pre-solder bump is heated, as the pad material has higher solder wettability than that of a cover layer material. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.

Abstract: A method and fixture for welding a battery foil-tab assembly is disclosed. The fixture includes a first clamp member having a first clamping surface defining an opening extending into the first clamp member and a second clamp member having a protrusion surrounding a weld slot. The opening of the first clamp member is configured to receive a portion of the protrusion with the battery foil-tab assembly disposed therebetween. The second clamp member is moveable toward the first clamp member to align the weld slot of the second clamp member with the opening of the first clamp member, thereby causing the protrusion to cooperate with the opening of the first clamp to deflect a portion of the battery foil-tab assembly out of a plane parallel with the battery foil-tab assembly. A laser beam is directed at the out of plane portion to laser weld the battery foil-tab assembly.

Abstract: A light emitting device includes: a base comprising a first lead, a second lead, and a supporting member; a light emitting element mounted on the first lead; a protection element mounted on the second lead; a wire including a first end and a second end, wherein the first end is connected to an upper surface of the first lead, and the second end is connected to a first terminal electrode of the protection element; a resin frame located on an upper surface of the base, wherein the resin frame covers at least part of the protection element and surrounds the light emitting element and the first end of the wire; a first resin member surrounded by the resin frame and covering the light emitting element and the first end of the wire; and a second resin member covering the resin frame and the first resin member.

Abstract: A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 9.6 to 10.2 weight % of antimony; from 0.01 to 0.25 weight % of manganese; and tin.

Abstract: A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 ?m or less.

Abstract: A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

Abstract: A method of manufacturing a semiconductor device includes: a wire tail forming step of forming a wire loop 130 between a first bonding point and a second bonding point with a bonding tool 40, and then cutting a portion of a wire 42 extending from a tip of the bonding tool 40 to thereby form a wire tail 43 at the tip of the bonding tool 40; and a wire tail bending step of bending the wire tail 43 so as to direct a tip 43a of the wire tail 43 upward by descending the bonding tool 40 toward the second bonding point with the wire loop 130 formed thereat and pressing the wire tail 43 against a portion of the wire loop 130 located above the second bonding point. Thus, the wire tail can be bent easily and efficiently.

Abstract: A conductor loop and a conveyor belt including the conductor loop. The conductor loop is embedded in an article having a base of a polymer material with elastic properties. The conductor loop includes at least one hybrid yarn having at least a textile first material and a conductive second material closed in an endless manner.

Abstract: An apparatus and method for producing an insulating structural element from substrates is provided. The substrates may be connected to one another at a periphery by applied pieces and may be insulated from one another by a vacuum. The apparatus may include a washing device, a cleaning device, a heating device for pre-heating the substrates, a positioning device for positioning the applied pieces on the substrates, an ultrasonic soldering device for soldering the applied pieces to the substrates, an automatic spacer and getter element setting unit, a plasma sputtering device in a vacuum, a substrate displacing device for transporting the substrates, a mechanical substrate placing device for joining the substrates, and a connecting device for welding or soldering the applied pieces of the substrates to each other.

Abstract: Interconnection assemblies and methods are provided. An interconnection assembly includes a first cell tab constructed of a first metal, and a second cell tab disposed against the first cell tab. The second cell tab is constructed of a second metal having a hardness greater than the first metal. The assembly further includes an interconnect member disposed against the second cell tab. The assembly further includes a weld assisting layer disposed against the first cell tab such that the first and second cell tabs are disposed between the weld assisting layer and the interconnect member.

Abstract: An arrangement of a substrate with at least one optical waveguide and with an optical coupling location for coupling in and/or coupling out an optical a radiation into and/or out of the at least one optical waveguide, and of at least one optoelectronic component which is assembled on the substrate and a method for manufacturing such an arrangement is suggested. The optical coupling location is designed in a manner such that the radiation is coupled in and/or coupled out with a coupling-in and/or coupling-out angle of greater than 2° to the perpendicular to the substrate surface. The optoelectronic component is assembled over the coupling location on the substrate in a manner tilted obliquely to the substrate surface, wherein the tilt angle to this surface corresponds to the coupling-in angle and/or coupling out-angle.

Abstract: The present invention relates to a reflow film containing a thermoplastic resin which is dissolvable in a solvent, and solder particles, wherein the solder particles are dispersed in the film, and also relates to a solder bump formation method which comprises: (A) a step of mounting the reflow film on the electrode surface side of a substrate, (B) a step of mounting and fixing a flat plate, (C) a step of heating, and (D) a step of dissolving and removing the reflow film, and herewith, a reflow film is provided which, by causing localization of the solder component on the electrodes of the substrate by self-assembly, exhibits excellent storage properties, transportability and handling properties during use, and can form solder bumps or solder joints selectively on only the electrodes.

Abstract: A method to electrically and mechanically connect at least one wire conductor to a terminal includes the steps of cutting and stripping a portion of an insulation outer layer along an end section of the at least one wire conductor to expose a lead of the at least one wire conductor. A further step includes applying a bonding process to the exposed lead to break down oxides disposed on the lead. A further step in the method is crimping the lead having the applied bonding process to the terminal to form a crimp connection connecting the at least one wire conductor to the terminal.

Abstract: Methods of attaching cutting elements to earth-boring tools, comprising abutting a portion of a cutting element against at least one surface of an earth-boring tool with a braze material disposed therebetween; and brazing the cutting element to the earth-boring tool by applying high-frequency vibrations to cause the braze material to become flowable. Methods of securing cutting elements to earth-boring tools may comprise at least partially coating a cutting element with a braze material. The cutting element may be at least partially disposed in a pocket formed in a body of an earth-boring tool with the braze material adjacent surfaces defining the pocket. The cutting element and the braze material may be ultrasonically torsionally oscillated to braze the cutting element within the pocket.

Abstract: The invention relates to a method for the cohesive connection of a first element (16, 18) to a second element (10), wherein the elements are located one on the other during the connection process and are connected by means of a solder material which is subjected to ultrasonic vibrations during connection by means of a tool (32, 34). In order to allow cohesive connection in an energy-efficient manner, it is proposed that the first element (16, 18) used is one which has through-passage openings (28, 30), that for the purpose of connection the first element and the second element (10) are placed one on the other with through-passage openings open towards the second element, and that molten solder material is located in the through-passage openings during connection and in the through-passage openings the molten solder material is subjected to the ultrasonic vibrations.

Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.

Abstract: Provided is a semiconductor device and a method of manufacturing the semiconductor device, in which the semiconductor device has a semiconductor element having a plurality of wires bonded to the semiconductor element with sufficient bonding reliability and has a good heat dissipation property. A semiconductor device in which a first wire is ball bonded on an electrode, and a second wire is further bonded on the ball-bonded first wire, and the first wire or an end of the second wire defines a space between itself and the ball portion of the first wire.

Abstract: An apparatus and a process for the manufacture of a solder-bump adhered wafer substrate for use in the semiconductor industry, comprising one or more of the following steps including: arranging a first compressive member and a second compressive member in an opposed, compressibly displaceable, spaced-apart relationship, with a pattern plate disposed therebetween with the pattern plate having a plurality of aligned through-holes arranged thereon; filling the through-holes with a molten solder; compressing the solder and the pattern plate between the first and second opposed compressive members to compact the solder therein and cleans the pattern plate of excess solder; chilling the pattern plate to solidify the molten solder in the through-holes; and removing the pattern plate from the spaced-apart compressive members to produce a wafer with solder bumps thereon.

Abstract: Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

Abstract: A method for sealing the tempered vacuum glass comprises: first preparing metallized layer bonded with the glass plate on the edge surface of the tempered glass to be sealed by locally heating the metal slurry coating; then air-tightly sealing the edges of two glass plates by using the metal brazing technology, or air-tightly sealing the edges of two glass plates by air-tightly welding the metal sealing sheet between the metallized layers of two glass plates to be sealed. A tempered vacuum glass is also provided. The method makes the sealing part have firm connection, good air tightness and good thermal shock resistance. The sealing structure made of the metal sealing sheet is well compatible with the temperature deformation caused by the temperature difference between the internal and external glass plates of the vacuum glass.

Abstract: A method is provided for forming a metallurgical bond. A first metal workpiece and one or more second metal workpieces are brought into proximity to one another such that a first portion of the first workpiece is in general overlying relationship with a second portion of the one or more second workpieces. A suitable material is provided between said first portion and said second portion, said material being in the form of particles or foil. At least a first part of said first workpiece comprising said first portion is forced toward said a part of the one or more second workpiece comprising said second portion by means of any one of a suitable high pressure joining process and a high speed joining process, such as to cause the said first metal workpiece and said one or more second metal workpieces to become joined or welded to one another to form a metallurgical bond therebetween.

Abstract: The invention relates to an adjusting ring (1) for adjusting the blades of the VTG distributor of exhaust gas turbochargers, comprising a bearing ring (2) and a lever engagement ring (3) connected to said bearing ring (2), the bearing ring (2) and lever engagement ring (3) being separately manufactured individual parts which are connected to each other by means of a separate connection means (4).

Abstract: An apparatus and method for producing an insulating structural element from substrates is provided. The substrates may be connected to one another at periphery by applied pieces and may be insulated from one another by a vacuum.

Abstract: A target assembly comprising—a support body having a carrying surface;—a sputtering target having an attaching surface, said carrying surface and said attaching surface being arranged in opposing facing relation to one another, thereby defining an intermediate space between said carrying surface and said attaching surface; and—a bonding material disposed in the intermediate space for binding said attaching surface to said carrying surface,—wherein distinct areas of one or both of said attaching surface and said carrying surface are selectively, superficially treated to enhance the bonding strength of said bonding material in said distinct areas.

Abstract: A flat panel X-ray detector that comprises an X-ray panel and a scintillator layer disposed on a first surface of the X-ray panel, is disclosed herein. The flat panel X-ray detector further comprises a hermetic cover that covers the scintillator layer. The hermetic cover comprises a top surface and at least one sidewall extending away from the top surface. The flat panel X-ray detector further comprises a solder seal disposed between the hermetic cover and the X-ray panel. A rim of the sidewall is substantially embedded within the solder seal such that the rim does not directly contact the X-ray panel. A method for fabricating a flat panel X-ray detector is also disclosed.

Abstract: Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Abstract: A risk of an electrical short between electrode pads of a semiconductor device can be reduced to thereby improve quality of the semiconductor device. During ball bonding in wire bonding, in each of the electrode pads of a semiconductor chip which are arrayed along an ultrasonic wave application direction (ultrasonic vibration direction), a ball at the tip of a copper wire and the electrode pad are coupled to each other while being rubbed against each other in a direction intersecting the ultrasonic wave application direction. Thus, the amount of AL splash formed on the electrode pad can be minimized to make the AL splash smaller. As a result, the quality of the semiconductor device assembled by the above-mentioned ball bonding can be improved.

Abstract: In an electronic component soldering method of connecting a terminal provided on a flexible substrate to an electrode of a rigid substrate, after solder-mixed resin in which solder particles are mixed in thermosetting resin has been applied onto the rigid substrate so as to cover the electrode, the flexible substrate is put on the rigid substrate and heat-pressed, whereby there are formed a resin part that bonds the both substrates by thermosetting of the thermosetting resin, and a solder part which is surrounded by the resin part and has narrowed parts in which the peripheral surface is narrowed inward in the vicinity of the terminal surface and in the vicinity of the electrode surface. Hereby, the solder parts are soldered to the electrodes and the terminal at acute contact angles so that the production of shape-discontinuities which lowers fatigue strength can be eliminated.

Abstract: A method of soldering battery cell tabs to a conductor is provided. The battery cell tab and the conductor are made of a material independently selected from aluminum, copper, or nickel-plated copper. The method include preparing an assembly of the battery cell tabs and the conductor with a first joining surface of one battery cell tab face-to-face with a first joining surface of the conductor, at least one joining surface having a layer of solder thereon; pressing the assembly so that the facing joining surfaces engage the solder, and heating the solder to a temperature above a melting temperature of the solder in the absence of a fluxing agent while limiting the displacement of the joining surfaces to a predetermined value; and holding the joining surfaces against each other and solidifying the solder to form a soldered joint between the battery cell tabs and the conductor.

Abstract: In the soldering method, metal-powder-contained flux is disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprising a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Abstract: An apparatus and a process for the manufacture of a solder-bump adhered wafer substrate for use in the semiconductor industry, comprising one or more of the following steps including: arranging a first compressive member and a second compressive member in an opposed, compressibly displaceable, spaced-apart relationship, with a pattern plate disposed therebetween with the pattern plate having a plurality of aligned through-holes arranged thereon; filling the through-holes with a molten solder; compressing the solder and the pattern plate between the first and second opposed compressive members to compact the solder therein and cleans the pattern plate of excess solder; chilling the pattern plate to solidify the molten solder in the through-holes; and removing the pattern plate from the spaced-apart compressive members to produce a wafer with solder bumps thereon.

Abstract: The invention discloses the internal structures and processes to synthesize the structure of self-healing materials, specially metallic materials, metal matrix micro and nanocomposites. Self healing is imparted by incorporation of macro, micro or nanosize hollow reinforcements including nanotubes, filled with low melting healing material or incorporation of healing material in pockets within the metallic matrix; the healing material melts and fills the crack. In another concept, macro, micro and nanosize solid reinforcements including ceramic and metallic particles, and shape memory alloys are incorporated into alloy matrices, specially nanostructured alloy matrices, to impart self healing by applying compressive stresses on the crack or diffusing material into voids to fill them.

Abstract: There is provided a method for manufacturing a recording apparatus which includes an actuator, a flexible flat cable connected to the actuator, and a circuit element mounted on the flexible flat cable, the method including: applying a conductive material for connection to the actuator and the circuit element, on terminal electrodes formed on one surface of the flexible flat cable; and forming bumps for joining the actuator to the terminal electrodes while joining the circuit element to the terminal electrodes. This makes it possible to mount the circuit element for preventing a malfunction of the recording apparatus, without any great increase in the number of manufacturing processes of the recording apparatus.

Abstract: A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn.

Abstract: Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.

Abstract: An annealed platinum free air ball is bonded to a first contact and to a second contact. The bonding work hardens the platinum so that a work hardened platinum ball is resistant to temperature induced creep.

Abstract: Methods for minimizing warpage of a welded foil carrier structure used in the packaging of integrated circuits are described. Portions of a metallic foil are ultrasonically welded to a carrier to form a foil carrier structure. The ultrasonic welding helps define a panel in the metallic foil that is suitable for packaging integrated circuits. Warpage of the thin foil can be limited in various ways. By way of example, an intermittent welding pattern that extends along the edges of the panel may be formed. Slots may be cut to define sections in the foil carrier structure. Materials for the metallic foil and the carrier may be selected to have similar coefficients of thermal expansion. An appropriate thickness for the metallic foil and the carrier may be selected, such that the warpage of the welded foil carrier structure is limited when the foil carrier structure is subjected to large increases in temperature. Foil carrier structures for use in the above methods are also described.

Abstract: Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder connection portion and a solder paste are melted, but are not fused with each other. During melting of a solder, a target component is clamped, ultrasonic oscillation is directly applied only to the target component. Further, start of solidification of the solder connection portion is detected by change of an electric impedance of a transducer while applying the ultrasonic oscillation, and the clamp is released before a substrate is warped.

Abstract: A method of ultrasonic brazing metal matrix composite, which forms a reinforced composite bond without filling welding wire with reinforcement or adding alloy element to generate ceramic phase, includes the steps of setting a filler metal; introducing ultrasonic vibration to braze in air; dissolving the base materials, and introducing ultrasonic wave again. The method performs the aluminum brazing at low temperature. The periodic time of brazing is shorter and the cost is lower than the conventional brazing methods. The strength, service temperature and dimensional stability of the joint are close to the base article.

Abstract: A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of electronic parts having connection terminals with different metal compositions are connected by soldering, a plurality of solder pastes comprising solder components with different compositions are used, and when the electronic parts are connected by soldering to the substrate, a solder paste having a solder component with a different composition is used for each of the metal compositions for the connection terminals of the electronic parts.

Abstract: Apparatus for use in welding a pour spout fitment (22) to a container (32) comprises an ultrasonic welding horn (18) formed with a recess (20) at one end for receiving part of the fitment (22), an anvil (2) between an annular surface portion of which and that one end of the horn (18) are vibratingly pressed a wall off the container (32) and the flange (28) to each other, a head (14) at the opposite end of the head (14) for maintaining an annular, radially inner portion of the flange (28) spaced axially outwards from the annular surface portion of the anvil (2), the outer periphery of the ring (16) being radially dimensioned to be received in the recess (20).

Abstract: A method of ultrasonic brazing metal matrix composite, which forms a reinforced composite bond without filling welding wire with reinforcement or adding alloy element to generate ceramic phase, includes the steps of setting a filler metal; introducing ultrasonic vibration to braze in air; dissolving the base materials, and introducing ultrasonic wave again. The method performs the aluminum brazing at low temperature. The periodic time of brazing is shorter and the cost is lower than the conventional brazing methods. The strength, service temperature and dimensional stability of the joint are close to the base article.

Abstract: In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.

Abstract: One object of the present invention is to realize a heat discharger having a high precision and in which heat conduction efficiency is maintained at the bonding between the heat pipe and heat sink. A heat discharger comprises a heat pipe and a heat sink formed separately from the heat pipe and bonded to the heat pipe via solder. The contact surface portion between the heat pipe and the solder and the contact surface portion between the heat sink and the solder are made of a wettable material having a wettablility such that the contacting angle with respect to the solder is 90 degrees or less.

Abstract: When a substrate electrode (6) formed on a semiconductor substrate (5) and a device electrode (14) formed on an optical device (13) are joined to each other by solder to mount the device (13) on the substrate (5), a solder piece attached to the substrate electrode (6) is melted in inactive liquid (9) to form a solder bump (12). The substrate electrode (6) on which the solder bump (12) is formed and the device electrode (14) are matched with each other, and the device (13) is disposed so as to confront the substrate (5) in the inactive liquid (9). Thereafter, when the solder bump (12) is melted in the inactive liquid (9) and ultrasonic vibration (11) is applied to join the device electrode (6) and the substrate electrode (14) to each other, the positioning of the device electrode (14) to the substrate electrode (6) is performed by the surface tension of the melted solder bump (12), and then the solder bump (12) is solidified.

Abstract: A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle that is performed on the component for another purpose. A manufacturing solution heat treatment, a pre-weld heat treatment, a post-weld heat treatment, or a rejuvenating heat treatment may be used as the brazing heat treatment. The composition of the powder material is selected so that a desired set of material properties is achieved when the powder material is subjected to the dual-purpose heat cycle. In one embodiment, a 50/50 mixture of AM775 and IN939 powder is diffusion brazed to an IN939 superalloy component using a heat treatment which also functions as the post-casting solution heat treatment for the IN939 component.

Abstract: An apparatus and method for ultrasonically welding workpieces that reduces sonotrode adhesion during the ultrasonic welding process. The sonotrode includes a contact surface wherein a fluid is deposited on the contact surface prior to the welding process. The fluid may be applied in different ways, including providing an aperture in the contact surface of the sonotrode. In addition, the sonotrode may be cooled below the dew point of the surrounding atmosphere thus causing moisture to form on the contact surface of the sonotrode. Cooling the sonotrode to a temperature above the dew point also reduces sonotrode adhesion during the ultrasonic welding process.

Abstract: A new soldering technique and solder alloy for wetting and joining hard-to-wet materials including titanium alloys such as nitinol uses a solder alloy containing tin and an active wetting promoting element such as aluminum in the presence of ultrasound. As shown in the Figure, molten solder alloy (10) is applied to the hard-to-wet material (18) with the application of ultrasonic energy (14) which removes coatings (20) such as tenacious surface oxides to leave the base material (18) which is readily wetted by the solder alloy (20).

Abstract: A process of forming a solder bump on a semiconductor device including vibrating a solder reservoir carrier in a vertical direction while pressure and heat are applied to the solder reservoir. An engagement surface of the solder reservoir is contacted with an engagement surface of the semiconductor device and the semiconductor device is vibrated in a horizontal direction to reflow a portion of the solder reservoir on the engagement surface. The solder reservoir carrier and the semiconductor device are moved away from each other so that additional solder is deposited and a solder column is grown on the semiconductor device. The solder column is cut off from the solder reservoir by vibrating the solder reservoir carrier in a horizontal direction to form a solder bump on the semiconductor device.