Abstract: Disclosed are a mold assembly for making alkali metal wax packets, a method for preparing same, and a method for using same. The mold assembly comprises a silicon substrate (10), the silicon substrate (10) comprising a mold isolator (11) at the edge of the silicon substrate (10) and a silicon substrate central portion (18). The upper surface of the silicon substrate central portion (18) is indented to form a plurality of wax packet receiving cavities (12). A cavity isolator (13) locates between adjacent wax packet receiving cavities (12). A release sacrificial layer (15) is formed on the upper surface of the silicon substrate (10), and a paraffin layer (16) is formed on the upper surface of the release sacrificial layer (15) away from the silicon substrate (10). Cavities (121) for containing alkali metal are formed on a side of the paraffin layer (16) away from the release sacrificial layer (15). The mold isolator (11) is provided with corrosion release holes (14).

Abstract: A manufacturing process for blades of a turbomachine, e.g. a gas turbine engine for an aircraft. In the process: a) a ceramic core piece that comprises at least two ceramic core elements and a clamping part that connects the ceramic core elements, is positioned in a wax forming device, subsequently; b) a molten wax material is applied to the outside of the ceramic core piece in the wax forming device and the wax is allowed to solidify, and subsequently; c) at least two turbomachine blades are cast using a crystallographically-oriented metal casting process and the wax and the ceramic core piece are removed.

Abstract: An example welding system includes: a visual acquisition system comprising an imaging device and configured to acquire a visual representation of a weld part and to convert the visual representation into data representative of weld part features; and a part recognition component comprising processing circuitry configured to: receive the digital data; identify one or more features of the weld part in response to receipt of the digital signal; compare the digital signal to stored data of a plurality of weld parts stored in a weld part database to match one or more identified features to a known weld part of the plurality of weld parts stored in the weld part database; identify weld settings stored in a weld parameter database associated with the matching known weld part of the plurality of weld parts stored in the weld part database; and send the weld settings to a welding power supply.

Abstract: A golf club head includes a face portion including a striking face for hitting a ball, a back face opposite the striking face, and a head outer peripheral surface extending between the striking face and the back face. The back face includes a cavity recessed on a striking face side and a frame portion extending along the head outer peripheral surface so as to surround the cavity. The frame portion is provided with at least one recess that extends along the striking face and opens to the head outer peripheral surface.

Abstract: A multi-metallic pressure-controlling component and a hot isostatic pressure (HIP) manufacturing process and system are disclosed. An example multi-metallic component for use in the oil field services industry includes a first metal alloy that forms a first portion of the multi-metallic pressure-controlling component, and a second metal alloy that forms a second portion of the multi-metallic pressure-controlling component. A diffusion bond is disposed at an interface between the first metal alloy and the second metal alloy that joins the first metal alloy to the second metal alloy within the multi-metallic pressure-controlling component.

Abstract: A defective product determination method for a vehicle wheel includes: locating, as a locating step by a controller, a lowest point on a welding mark due to radiation of a laser beam within a target range from an inner peripheral surface of a wheel rim to a position spaced away by a specified distance inward in a radial direction of the vehicle wheel; and determining, as a determination step by the controller, that the vehicle wheel is a defective product when a defective product determination condition is satisfied. The defective product determination condition includes, as a necessary condition, a condition that a relative distance of the lowest point with respect to the inner peripheral surface of the wheel rim in the radial direction of the vehicle wheel is equal to or smaller than a reference distance.

Abstract: Methods of forming a desired geometry at a location on a superalloy part are disclosed. The method may include directing particles of a powder mixture including a low melt temperature superalloy powder and a high melt temperature superalloy powder to the location on the superalloy part at a velocity sufficient to cause the superalloy powders to deform and to form a mechanical bond but not a metallurgical bond to the superalloy part. The directing of particles continues until the desired geometry is formed. Heat is applied to the powder mixture on the repair location. The heat causes the low melt temperature superalloy powder to melt, creating the metallurgical bonding at the location. Another method uses the same directing to form a preform for repairing the location on the part. The low melt temperature superalloy powder melts at less than 1287° C., and the high melt temperature superalloy powder melts at greater than 1287° C.

Abstract: Aspects of the present disclosure include methods for producing an output laser beam having two or more angularly deflected laser beams (e.g., for irradiating a sample in a flow stream) with a predetermined intensity profile. Systems for practicing the subject methods having a laser, an acousto-optic device, a radiofrequency generator and a controller for adjusting the amplitude of the radiofrequency drive signals to produce an output laser beam of angularly deflected laser beams with a predetermined intensity profile are also described.

Abstract: A method for producing a component is disclosed. In a first step, a planar component layer is produced on a base surface from a metal material which is above the melting temperature thereof. In a second step, shear stresses are introduced into the component layer produced in the first step by a friction pin which rotates about a rotation axis and which is pressed with a predetermined force onto an outer surface of the component layer opposite the base surface and which is moved along the entire outer surface of the component layer. Finally, in a third step, the first step is repeated on the outer surface as a base surface.

Abstract: The application discloses a light-emitting device including a carrier which includes an insulating layer, an upper conductive layer formed on the insulating layer, a plurality of conducting vias passing through the insulating layer, and a lower conductive layer formed under the insulating layer; four light-emitting elements arranged in rows and columns flipped on the carrier; and a light-passing unit formed on the carrier and covering the four light-emitting elements; wherein each of the light-emitting elements including a first light-emitting bare die emitting a first dominant wavelength, a second light-emitting bare die emitting a second dominant wavelength, and a third light-emitting bare die emitting a third dominant wavelength; and wherein two adjacent first light-emitting bare die in a row has a first distance W1, two adjacent first light-emitting bare die in a column has a second distance W2, and W1 is the same as W2.

Abstract: Methods of forming a desired geometry at a location on a superalloy part are disclosed. The method may include directing particles of a powder mixture including a low melt temperature superalloy powder and a high melt temperature superalloy powder to the location on the superalloy part at a velocity sufficient to cause the superalloy powders to deform and to form a mechanical bond but not metallurgical bond to the superalloy part. The directing of particles continues until the desired geometry is formed. Heat is applied to the powder mixture on the repair location. The heat causes the low melt temperature superalloy powder to melt, creating the metallurgical bonding at the location. Another method uses the same directing to form a preform for repairing the location on the part. The low melt temperature superalloy powder melts at <1287° C., and the high melt temperature superalloy powder melts at >1287° C.

Abstract: An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.

Abstract: A micro/nanoparticle-reinforced composite solder for low-temperature soldering and a preparation method thereof belong to the manufacturing field of lead-free low-temperature soldering solders. Micro/nanoparticle-reinforced tin-based alloy solder powder is formed by diffusely mixing micro/nano-sized Cu, Ag and Sb particles with a molten metal tin and atomizing the mixture, and then blended with low-melting-point SnBi-based alloy solder powder and a conventional flux to prepare a micro/nanoparticle-reinforced composite solder. In soldering at a temperature below 200° C.

Abstract: A thermal transfer apparatus includes a controller to control a transfer tool and a pressing body conveyor. The controller controls the pressing body conveyor to press a predetermined region of a transfer object, and controls the transfer tool and the pressing body conveyor to press at least a portion of thermal transfer foil placed on the predetermined region pressed by the transfer tool and a light absorption film having a light absorption property and placed on the thermal transfer foil and to apply light to the light absorption film.

Abstract: A semiconductor wafer suppressed in voids produced in the interface between a passivation film and an electroless nickel plating film, and configured such that an electrode pad is entirely covered by the electroless nickel plating film. The semiconductor wafer includes, on a substrate, an electrode pad and a passivation film covering the upper surface of the substrate and an opening from which the electrode pad is exposed. The semiconductor wafer sequentially includes, on the electrode pad, an electroless nickel plating film, an electroless palladium plating film and an electroless gold plating film. A void, present in the interface between the passivation film and the electroless nickel plating film, has a length from the forefront of the void to the surface of the electrode pad of 0.3 ?m or more and a width of 0.2 ?m or less. The electrode pad is entirely covered by the electroless nickel plating film.

Abstract: A friction stir welding equipment according to an embodiment includes a spindle unit, a holder, and a moving part; the spindle unit is capable of rotating a tool; the holder is connectable to the tool via a radial bearing and is capable of holding at least one of a side surface of a processing member or a rim of an upper surface of the processing member; and the moving part is capable of changing relative positions of the tool and the holder with respect to the processing member.

Abstract: A semiconductor device may include a first conductor plate, a first semiconductor element that is a sole semiconductor element disposed on a main surface of the first conductor plate, an encapsulant encapsulating the first semiconductor element and a first power terminal connected to the first conductor plate within the encapsulant and projecting from the encapsulant along a first direction. The main surface of the first conductor plate may include a first side located close to the first power terminal and a second side located opposite the first side with respect to the first direction. With respect to the first direction, a distance from the first semiconductor element to the first side may be larger than a distance from the first semiconductor element to the second side.

Abstract: An object of the present invention is to provide a flux which does not precipitate a crystal and can improve solder wettability. A flux comprising 0.4 to 10.0 mass % of ditolylguanidine and 1.0 to 10.0 mass % of an organic acid, and not comprising diphenylguanidine as an amine compound.

Abstract: The object of the invention is a heater of a corrosive fluid comprising at least one heat diffuser having at least a first portion intended to be immersed in a corrosive fluid, and at least a second portion intended to be arranged out of the corrosive fluid, at least one heating block comprising at least one heating member configured to heat the corrosive fluid, said heat diffuser comprising at least one housing in which the at least one heating block is housed at least partially, at least the first portion of the heat diffuser being made of anodized aluminum or of anodized aluminum alloy and is configured to be in direct contact with the corrosive fluid. The object of the invention is also a corrosive fluid tank comprising a heater according to the invention and a method for manufacturing a heat diffuser of the heater according to the invention.

Abstract: Methods comprising forming a cobalt formation on an active feature of a semiconductor device, wherein the semiconductor device comprises an inactive feature above the cobalt formation; forming a cap on the cobalt formation; removing at least a portion of the inactive feature, wherein the cobalt formation is substantially not removed; forming a dielectric material above the cap; and forming a first contact to the cobalt formation. Systems configured to implement the methods. Semiconductor devices produced by the methods.

Abstract: An metal fabrication resource performance monitoring method includes: acquiring data representative of arc on time and wire deposition quantity associated with metal fabrication operations of a plurality of metal fabrication resources; via at least one computer processor, analyzing a first subset of the acquired data and a second subset of the acquired data for the plurality of metal fabrication resources; via the at least one computer processor, populating a user viewable page with graphical indicia representative of at least the arc on time and the wire deposition quantity, the user viewable page facilitating a visual comparison of the analysis of the first subset of the acquired data and the analysis of the second subset of the acquired data; and transmitting the user viewable page to a user viewable display.

Abstract: An metal fabrication resource performance monitoring method includes: acquiring data representative of a plurality of parameters sampled during metal fabrication operations of a plurality of metal fabrication resources, the parameters comprising arc on time and wire deposition quantity; via at least one computer processor, analyzing a first subset of the acquired data and a second subset of the acquired data for the plurality of metal fabrication resources; via the at least one computer processor, populating a user viewable page with graphical indicia representative of at least the arc on time and the wire deposition quantity, the user viewable page facilitating a visual comparison of the analysis of the first subset of the acquired data and the analysis of the second subset of the acquired data; and transmitting the user viewable dashboard page to a user viewable display.

Abstract: A method for matching signatures based on motion signature information including acquiring a first signature and at least one second signature that are to be matched, wherein the first signature and the second signature are generated based on a motion object's motion signature information; and matching the first signature and the second signature based on the motion signature information to obtain a corresponding match result.

Abstract: A precious metal paste which does not cause contamination of a member, which can be uniformly coated to a member to be bonded, and which is in good condition after bonding is provided. The present invention relates to a precious metal paste for bonding a semiconductor element, of the paste including a precious metal powder and an organic solvent, in which the precious metal powder has a purity of 99.9 mass % or more and an average particle diameter of 0.1 to 0.5 ?m, the organic solvent has a boiling point of 200 to 350° C., and a thixotropy index (TI) value calculated from a measurement value of a viscosity at a shear rate of 4/s with respect to a viscosity at a shear rate of 40/s at 23° C. by means of a rotational viscometer is 6.0 or more.

Abstract: An oxide superconducting wire, includes a laminate including a base material, an intermediate layer, and an oxide superconducting layer, the intermediate layer being laminated on a main surface of the base material, the intermediate layer being constituted of one or more layers having an orientation, the intermediate layer having one or more first non-orientation regions extending in a longitudinal direction of the base material, the oxide superconducting layer being laminated on the intermediate layer, the oxide superconducting layer having a crystal orientation controlled by the intermediate layer, the oxide superconducting layer having second non-orientation regions located on the first non-orientation regions, and a metal layer which covers at least a front surface and side surfaces of the oxide superconducting layer in the laminate.

Abstract: An integrated circuit structure and formation thereof. The integrated circuit structure includes a substrate and a front-end-of-the-line (FEOL) portion. The FEOL portion rests on top of and in contact with the substrate. The integrated circuit structure includes a memory level portion. The memory level portion rests on top of and in contact with the FEOL portion. The integrated circuit structure includes a back-end-of-the-line (BEOL) portion. The BEOL portion rests on top of and in contact with the memory level portion. The integrated circuit structure includes a multiple layer that includes one or more pairs of reactive materials. The multiple layer is one or more of: i) on top of the BEOL portion; ii) within the BEOL portion; iii) within the memory level portion; iv) within the FEOL portion; v) embedded in the substrate; and vi) on bottom of a thinned substrate.

Abstract: In a first aspect, the invention provides aluminum alloy comprising the following composition, all values in weight %: Si 0.25-1.5 Cu 0.3-1.5 Fe up to 0.5 Mn up to 0.1 all other elements including Mg being incidental and present (if at all) then in an amount less than or equal to 0.05 individually, and less than or equal to 0.15 in aggregate, the balance being aluminum. In a second aspect, the invention provides a composite aluminum sheet product comprising a core layer and at least one clad layer wherein the at least one clad layer is an aluminum alloy comprising the following composition, all values in weight %: Si 0.25-1.5 Cu 0.3-1.5 Fe up to 0.5 Mn up to 0.1 all other elements including Mg being incidental and present (if at all) then in an amount less than or equal to 0.05 individually, and less than or equal to 0.15 in aggregate, the balance being aluminum.

Abstract: Structures based upon periodic cellular materials that provide a potential for defeating combinations of both air blast loading and ballistic attack either sequentially or simultaneously, or combination of both. The cellular structures may also be configured to meet the stiffness and strength support requirements of particular vehicle or other applications, systems or structures. The armor is therefore potentially able to support normal service loads and defeat blast and ballistic threats when necessary. The structure provides for using efficient load support capabilities of the material (without a high armor protection level) in low threat conditions, as well as the ability to modify the system to increase its level protection to a desired or required level. This would reduce the weight of the protection system in normal (low threat) conditions which reduces vehicle wear and tear, as well as cost savings in fabrication of applicable structures or systems.

Abstract: The disclosure is directed to a method of forming high-aspect-ratio metallic glass articles that are substantially free of defects and cosmetic flaws by means of rapid capacitive discharge forming. Metallic glass alloys that are stable against crystallization for at least 100 ms at temperatures where the viscosity is in the range of 100 to 104 Pa-s are considered as suitable for forming such high-aspect-ratio articles.

Abstract: A fixing apparatus for respot welding is provided. The fixing apparatus includes a base plate on which electrically-powered cylinders are mounted, lower pin jigs mounted upright on the electrically-powered cylinders to support a workpiece and the workpiece is fixed at a position by allowing pin units mounted on upper portions of the lower pin jigs to penetrate the workpiece. Further a pressing hanger is positioned to be spaced apart from the upper portions of the lower pin jigs, and moves downward toward the pin units to apply a force to the workpiece when the workpiece is seated on the lower pin jigs.

Abstract: An oxide superconductor includes: a substrate made of a metal; an insulating intermediate layer provided on the substrate; an oxide superconducting layer provided on the intermediate layer; a metal stabilizing layer provided on the oxide superconducting layer; and a plurality of dividing grooves which divide the metal stabilizing layer and the oxide superconducting layer along a longitudinal direction of the substrate, reach the inside of the intermediate layer through the oxide superconducting layer from the metal stabilizing layer, and do not reach the substrate. The metal stabilizing layer and the oxide superconducting layer are divided to form a plurality of filament conductors by the plurality of dividing grooves, and in each dividing groove of the plurality of dividing grooves, a width of a groove opening portion of the dividing groove is equal to or greater than a width of a groove bottom portion of the dividing groove.

Abstract: An analyzing method of a spot welded portion, includes: acquiring bar elements as the spot welded portion; extracting other bar elements existing at a periphery of a target bar element which is targeted among the acquired bar elements; determining whether or not there is a bar element which shares the same end point with the target bar element among the extracted bar elements; determining that the target bar element and the bar element which shares the same end point with the target bar element are a three-layer spot welded portion when it is determined that there is the bar element which shares the same end point with the target bar element; and determining whether or not there is a bar element whose distance between elements with the target bar element is within a predetermined distance among the extracted bar elements when it is determined that there is not the bar element which shares the same end point with the target bar element, and determining that the target bar element and the extracted bar element

Abstract: Techniques described herein may allow for the single-input capture of clips during the presentation of content, such as video content. The single-input capture may be based on an analysis of clips captured by users in the same video content, such that popular clips can be identified and used for subsequent users. A user may select a button to capture, or to begin capturing, a clip during the presentation of content. Based on the single selection of the button, an entire clip may be captured, which may correspond to a previously detected popular clip.

Abstract: A stringing device and stringing method usable for manufacturing photovoltaic modules efficiently with an easy configuration, and a photovoltaic module manufacturing device and manufacturing method. A stringing device for electrically connecting electrodes formed respectively in adjacent photovoltaic cells via a conductive member includes: number one joining unit which joins the photovoltaic cell supplied with its light receiving surface facing up and the conductive member to each other; and number two joining unit which joins the photovoltaic cell supplied with its light receiving surface facing down and the conductive member to each other.

Abstract: This is to provide an aqueous metal surface treatment agent for a lithium ion secondary battery which can improve interlaminar adhesiveness between a metal member and a resin coating layer such as a film or a coated film, and solvent resistance without using trivalent chromium. The aqueous metal surface treatment agent for a lithium ion secondary battery comprises a polyvinyl alcohol resin containing 2 to 15 mol % of a 1,2-diol structural unit represented by the formula (1): Having a degree of saponification of 90 to 99.9 mol % and an average degree of polymerization of 250 to 3000; and a metallic crosslinking agent.

Abstract: An actuator includes a housing assembly, an actuator shaft, an actuation member, and an anti-rotation rod. The actuator shaft is rotationally mounted in the housing assembly, is adapted to receive a drive torque, and is configured, upon receipt of the drive torque, to rotate. The actuation member is mounted on the actuator shaft, and is configured to translate in response to rotation of the actuator shaft. The anti-rotation rod is coupled to the actuator housing and extends therefrom. The anti-rotation is rod configured to at least selectively engage, and thereby prevent rotation of, the actuation member.

Abstract: An exemplary method for navigating among photos includes determining, using one or more computing devices, visual characteristics of a person depicted in a first image associated with a first location. These visual characteristics of the person are detected in a second image associated with a second location. Using the one or more computing devices, a series of intermediate images are identified based on the first location and the second location. Each intermediate image is associated with a location. The series of intermediate images and the second image are provided. Images of an intermediate destination from the series of intermediate images are selected based on a density of images at the intermediate destination. A 3D reconstruction of the intermediate destination is then generated based on the selected images. Thereafter, a visual presentation of images traversing through the 3D reconstruction of the intermediate destination to the second image is prepared for display.

Abstract: The present invention is directed to methods of manufacturing bioactive gels from ECM material, i.e., gels which retain bioactivity, and can serve as scaffolds for preclinical and clinical tissue engineering and regenerative medicine approaches to tissue reconstruction. The manufacturing methods take advantage of a new recognition that bioactive gels from ECM material can be created by digesting particularized ECM material in an alkaline environment and neutralizing to provide bioactive gels.

Abstract: A vibration mode control method for a thin plate-reinforcement structure utilizes a reinforcing effect of a weld bead, wherein the thin plate-reinforcement structure comprises two welded components at least one of which includes a thin plate portion. After a first (thin plate) component and a second (another) component are arc-welded discontinuously at several positions, a stress direction and level in one of the resulting weld areas located to be subject to stress concentration is preliminarily verified. Then, a stress-dispersing weld bead (f) is laid to extend between the weld area which is an area subject to stress concentration and the first (thin plate) component, wherein the stress-dispersing weld bead (f) is set to a direction and length capable of preventing fatigue crack from occurring in the first (thin plate) component.

Abstract: A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 ?m. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.

Abstract: To provide a substrate treatment apparatus capable of suppressing adherence of dust to a film coated on a substrate. As an aspect of the present invention is a substrate treatment apparatus provided with a spin-coating treatment chamber 4a for coating a film on the substrate by spin-coating, a first air-conditioning mechanism that regulates an amount of dust in the air in the spin-coating treatment chamber, an annealing treatment chamber 7a for performing lamp annealing treatment on the film coated on the substrate, a conveying chamber 2a that is connected to each of the spin-coating treatment chamber and the annealing treatment chamber and is for conveying the substrate between the spin-coating treatment chamber and the annealing treatment chamber each other, and a second air-conditioning mechanism that regulate an amount of dust in the air in the conveying chamber.

Abstract: Disclosed is an aluminum alloy brazing sheet for heat exchanger which excels in resistance to corrosion from its inside and simultaneously attains satisfactory erosion resistance and high strength. This includes a core material of an Al alloy containing predetermined amounts of Si, Mn, Cu, Mg, and Ti; a clad material of an Al alloy containing predetermined amounts of Si, Mn, and Zn, having a predetermined thickness, and lying on one side of the core material so as to constitute an inner side of a tube member of the heat exchanger; and a filler material of an Al alloy containing a predetermined amount of Si, having a predetermined thickness, and lying on the other side of the core material so as to constitute an outer side of the tube member. The crystal grain size of the core material after brazing under specific conditions is 50 ?m or more but less than 300 ?m in a rolling direction.

Abstract: Disclosed is an anti-corrosion treatment method for a heat exchanger, in which even if an aluminum material-made heat exchanger having been flux-brazed by the NB process, in particular, an aluminum material-made heat exchanger to be used for automobile air conditioner is not subjected to a chemical conversion treatment in advance, not only corrosion resistance can be significantly enhanced without impairing hydrophilicity, but deodorizing properties can be enhanced. The anti-corrosion treatment method for an aluminum material-made heat exchanger includes bringing an aluminum material-made heat exchanger having been flux-brazed by the NOCOLOK brazing process into contact with a hydrophilic treatment liquid and then applying a baking treatment, thereby forming a hydrophilic film on the surface of the aluminum material-made heat exchanger, wherein the hydrophilic treatment liquid contains a hydrophilic resin and a lithium ion, and a lithium concentration in the hydrophilic film is from 0.05 to 25% by mass.

Abstract: An aluminum alloy brazing sheet having a good brazing property that prevents diffusion of molten filler material in a core material of the aluminum alloy brazing sheet during a brazing process and which has a superior corrosion resistance to an exhaust gas condensate water after the brazing process is disclosed. A method of manufacturing of the aluminum alloy brazing sheet also is disclosed. A high corrosion-resistant heat exchanger that employs the aluminum alloy brazing sheet also is disclosed.

Abstract: An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die.

Abstract: A joint for a double wall tube assembly includes an adapter having an inner wall and an outer wall connected by a web, and a flange extending from the outer wall. The inner wall is configured to receive an inner tube of a double wall tube assembly. The outer wall is configured to be connected to an outer tube of the double wall tube assembly.

Abstract: A metal chemistry includes an amount of chromium weight of between about 9.0% and about 16% by weight, an amount of cobalt of between about 7.0% and about 14% by weight, an amount of molybdenum of between about 10% and about 20% by weight, an amount of iron of between about 1.0% and about 5.0% by weight, an amount of aluminum of between about 0.05% and about 0.75% by weight, an amount of titanium of between about 0.5% and about 2.0% by weight, an amount of manganese not to exceed about 0.8% by weight, an amount of carbon of between about 0.02% and about 0.10% by weight, an amount of a titanium+aluminum alloy of between about 0.55% and about 2.75% by weight, and an amount of nickel.

Abstract: Provided by the present invention is a laminated structure with good use efficiency, in which diffusion of tin from an indium-tin solder material to an indium target is favorably suppressed, and a method for producing the same. The laminated structure has a backing plate, an indium-tin solder material, and an indium target laminated in this order, and the concentration of tin in the 2.5 to 3.0 mm thickness range of the indium target from the indium-tin solder material side surface is 5 wtppm or less.

Abstract: A method of manufacturing an electronic device in which a gyro element as an electronic component is accommodated in an internal space provided by a base and a lid as a lid body, includes: preparing the lid as the lid body in which a groove is provided in the surface which is a surface on the opposite side to the rear surface which is a surface on a side which is joined to the base; seam-welding the base and the lid at a site except for an unwelded site which includes a site corresponding to at least a portion of the groove, of a site planned to join the base and the lid; and welding the base and the lid at the unwelded site.

Abstract: A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on a surface which is welded with the base, and an opening area of the groove on the inner space side which is smaller than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed.