Abstract: A method for joining conventionally unsolderable surfaces, comprising the steps of coating the surfaces with an adhesive, coating the adhesive with solderable metallic particles while the adhesive is tacky, and, after the adhesive is cured, soldering said surfaces together, the solder adhering to the metallic particles and forming a bond between the surfaces. The adhesive is preferably a high-temperature resistant adhesive. The solderable metallic particles are preferably a combination of granules and powder preferably of copper. The conventionally unsolderable surfaces include, but are not limited to, glass, porcelain, conventionally unsolderable metals such as steel, wood and paper products.

Abstract: A method for providing at room temperature a hermetic bonded seal between the surfaces of glass, ceramics, metals or any combination of these. The method comprises the steps of polishing the surfaces to be bonded and then plasma cleaning the surfaces. Next, a chemically cleaned bonding material such as indium is applied to the surfaces and a force is applied to the surfaces to be sealed at room temperature for a limited period of time to affect the bonded seal.

Abstract: A method of forming a hard vacuum seal for use in a gas laser but not limited thereto. The method comprising the steps of polishing the surfaces to be joined together and then cleaning the surfaces with a plasma cleaner. Next, a force is applied to hold the surfaces in contact and then molten indium is applied onto the adjoining surface and allowed to cool in order to set the seal. In the method of forming the gas laser seal for fine alignment of the mirror surfaces, the seal is reheated, the mirrors realigned by sliding across the laser cavity while the laser is operative and the laser output is measured for maximum laser output. Then the seal is allowed to reset.

Abstract: The capacitive fluid pressure transducers described herein comprise quartz bodies and diaphragms having suitable electrodes deposited thereon to form both sensing and reference capacitors in appropriate configurations for high fidelity measurement of relative blood pressure, said transducers being substantially unaffected by temperature and other environment factors.

Abstract: Method and material for fabricating composite structures and cutting tools containing super hard filaments using a modified brazing process that employs liquid phase sintering to alloy a mixture of metals about groups of the filaments in side by side parallelized arrangement to produce preforms or bundles of the filaments secured spaced apart in a strong tough metal matrix. A plurality of the completed bundles may then be bonded together by like method and materials into larger structures, tools or cutting portions thereof.

Abstract: Material and method for securely attaching boron filaments to other like filaments and to a substrate with preservation of the filament integrity for cutting and abrading by coating them with a mixture of matrix metals essentially containing copper, tin and titanium and joining the filaments by the matrix metals and/or to the substrate into an integral structure by liquid-phase-sintering of the matrix metals which grip and adhere the filaments in a strong, tough alloy with the integrity of the filaments essentially preserved. Boron-filament-containing tools for cutting, grinding, abrading, or the like may be fabricated using the materials of the invention and the methods disclosed.

Abstract: A method for manufacturing a multilayer ceramic which is particularly suitable for carrying semiconductor chips. In order to join a semiconductor chip to a multilayer ceramic substrate, it is necessary that the projected site for the semiconductor chip be substantially flat. If there is a bulge, it becomes difficult to make a good joint thereto. The method involves depositing a particulate mixture containing a metal and the metal's oxide in a ratio of between 1:1 to 9:1 in a pattern on at least a portion of the plurality of ceramic layers. The patterns are then dried. The plurality of substrates or layers of ceramic are then laminated under substantial pressure and fired at an elevated temperature. The addition of the metal oxide to the metal powder allows the shrinkage of the metallization compound so that it may more nearly match that of the ceramic it is coated upon during the firing step. This matching of the shrinkage during firing prevents cracking of the ceramic.

Abstract: A liquid crystal cell, the liquid-crystal substance of which is contained between two cell plates coated on their inner sides with electrodes, separated from each other by spacing elements and hermetically sealed by sealing material, the electrodes of the two cell plates being connected to each other by means of electrically conducting material, in which the bonded inserts serving as spacing elements are so arranged that between the cell plates there is a hole for introducing the liquid-crystal substance, and that on the edge surface of each cell plate in the region of this hole there is provided at least one conducting film which extends over the edges of the cell plates to the electrodes to be connected and is in electrical contact with these electrodes, and further that in this region there is provided a solderable metal coating extending from one cell plate across the bonded insert to the other cell plate, a conductive sealing substance being applied to this coating in order to seal the hole hermetically.

Abstract: A method of bonding two crystals together is disclosed. A bond enhancing material such as chromium (Cr) is vapor deposited on one crystal, and on this is vapor deposited a noble metal such as gold (Au). On the other crystal a low melting point metal such as tin (Sn) or indium (In) is vapor deposited. In the case of In this can either be directly on the crystal or on a layer of bond enhancing material; in the case of Sn this must be on a bond enhancing material. On top of the low melting point metal a layer of the same noble metal is deposited to prevent oxidation thereof. The noble metal layers are brought into contact with each other in vacuum or inert atmosphere and pressure applied thereto at a temperature of 100.degree. C to 150.degree. C in the case of In and 100.degree. C to 200.degree. C in the case of Sn. The low melting point metal will diffuse into the noble metals and across the interface causing a bond to form by elimination of the boundary between the crystals.

Abstract: A method of manufacturing a suction pipette of sinterable material for receiving substantially rectangular, semiconductor crystal plates. The pipette is formed with a rectangular recess and has walls defining the recess which narrow towards the floor of the recess; an evacuation channel communicates with the floor. The method includes the steps of inserting a binder into the material to be sintered, and fabricating first and second parts for assembly of the pipette, the first part being formed with an open channel and having sidewalls defining the channel. The second part is insertable into the first part and has cam-shaped end projections formed with respective inner walls, and outer walls for making contact with the sidewalls upon insertion of the second part into the first part.

Abstract: The liquid crystal display device comprises a pair of spaced parallel insulating substrates, at least one of which being transparent, opposing electrodes formed on the inner surfaces of the substrates, a peripheral sealing member for sealing the peripheries of the substrates and provided with a filling port for filling a liquid crystal into a space between the substrates, a metal layer formed across the full width of the side surfaces of the substrates sandwiching the sealing member surrounding the filling port, and a solder layer formed on the metal layer to seal the filling port. The solder layer has an amount of 0.1 to 1.2mg/mm.sup.2, and is formed by applying a molten solder ball having a predetermined weight.

Abstract: An acousto-optical component or other high frequency and wide-band ultrasonic component comprises a piezoelectric transducer and a crystalline or glass sound medium which are bonded together by a multi-layer metal molecular adhesion bond. During fabrication, the surfaces of the piezoelectric body and the sound medium which are to be connected are first polished to a degree of smoothness which is well below that of a Newton ring. These surfaces are then completely cleansed and a first metal layer having a thickness of 0.5-2 nm is vapor deposited onto each the cleansed surfaces. Next, a second metal layer having a thickness of 5-20 nm is vapor deposited onto each of the first layers. The transducer is then applied, by molecular adhesion, to the sound medium. To form a strong and reliable bond, only moderate pressures of about 250 to 1500 psi are necessary. A metal layer having a thickness of 0.3-0.6 .mu.

Abstract: A method of manufacturing a body of conglomerated particles has a primary step of coating the particles with very fine polycrystalline metal whiskers, which are sintered in place. The coated particles are then mixed with other filaments, of slightly larger size, which form a matrix. This is made coherent by metallic bonding of the filaments together and to the embedded coated particles. The resultant porous body may be compressed to reduce the porosity.

Abstract: The present invention relates to the joining of a first glass member, such as an optical fiber, to a second member by means of solderable splices and terminations which additionally can form hermetic seals. To form the splice, termination or seal, the peripheral surface of the glass member is coated in the area of the intended joint between members with a thin adhering metallic layer. The coated glass member is properly positioned adjacent the second member and solder is flowed around the joint between the members. Where the second member is also formed of glass, a thin adhering metallic coating layer is similarly formed on the peripheral surface thereof in the area of the intended joint prior to solder being applied.

Abstract: In magnetic disk equipment or the like, the read/write magnetic heads are each bonded to the wall of a thru-hole of a carrier plate adapted to act as a "flying" member maintained by an aerodynamical action in close proximity to the surface of the rotating disk. In a device according to the invention, the bond between the lateral surface of the head and said wall is made to ensure magnetostatic and electrostatic shielding of the head against spurious magnetic, electromagnetic and electrostatic fields. Said bond may comprise thin films of a high permeability anisotropic material coating at least the facing surfaces of the head and the wall and a layer of solder intervening between said films. Such a shield may partially extend over selected areas of the rear faces of the plate and head.

Abstract: Method for forming a bond (hermetic seal) between sapphire and glass. In the preferred form of the invention, the sapphire and glass surfaces to be bonded each have applied to them thin films of chromium, copper, nickel and gold. The inner chromium film is several hundred angstroms thick, the copper and nickel films have a total thickness of about 10,000 angstroms and together comprise an intermediate film, and the outer gold film is about 20,000 angstroms thick. The thin films are applied in a vacuum by direct evaporation or vapor plating or by sputtering. A bond or hermetic seal is effected between the gold films on the respective sapphire and glass materials. An indium wire is inserted between the gold films and a clamping force is applied to the sapphire and glass materials to cause the indium wire to deform to increase substantially the indium surface area. In a vacuum, heat is applied to the sapphire, glass and indium materials sufficient to cause the indium to liquify.

Abstract: A high temperature cement for carbon articles comprising aluminum, and tantalum or silicon, in a specific weight percent ratio such that when heated in an inert atmosphere, the tantalum or silicon will react with the carbon in the articles to be joined to form, in situ, tantalum carbide or silicon carbide, respectively, in the presence of aluminum.

Abstract: Providing a high strength, hermetic ceramic to metal seal by essentially heating a wire-like metal gasket and a ceramic member, which have been chemically cleaned, while simultaneously deforming from about 50 to 95 percent the metal gasket against the ceramic member at a temperature of about 30 to 75 percent of the melting temperature of the metal gasket.

Abstract: Graphite is joined to graphite by employing both fine molybdenum powder as the brazing material and an annealing step that together produce a virtually metal-free joint exhibiting properties similar to those found in the parent graphite. Molybdenum powder is placed between the faying surfaces of two graphite parts and melted to form molybdenum carbide. The joint area is thereafter subjected to an annealing operation which diffuses the carbide away from the joint and into the graphite parts. Graphite dissolved by the dispersed molybdenum carbide precipitates into the joint area, replacing the molybdenum carbide to provide a joint of virtually graphite.