Abstract: A multi-zone heater with a plurality of thermocouples such that different heater zones can be monitored for temperature independently. The independent thermocouples may have their leads routed out from the shaft of the heater in a channel that is closed with a joining process that results in hermetic seal adapted to withstand both the interior atmosphere of the shaft and the process chemicals in the process chamber. The thermocouple and its leads may be enclosed with a joining process in which a channel cover is brazed to the heater plate with aluminum.

Abstract: A method for joining two or more segments of a bone implant comprises the steps of placing a plurality of thin layers of an intermetallic material between first and second segments of the bone implant and applying a mechanical load to the plurality of layers. In a subsequent step, the plurality of layers are ignited by applying an external activation energy thereto, the ignition heating the plurality of layers to a reaction temperature and causing the segments to become affixed to one another after cooling.

Abstract: A method of producing a bonded body is disclosed in which a ceramic member made of ceramics and a Cu member made of Cu or a Cu alloy are bonded to each other, the method including: a laminating step of laminating the ceramic member and the Cu member in a state where a Cu—P-based brazing filler material containing 3 mass % to 10 mass % of P and an active metal material are interposed therebetween; and a heating step of heating the ceramic member and the Cu member which are laminated.

Abstract: A jointed structure comprises a first metal layer and a second metal layer. The first metal layer and the second metal layer are jointed together and have different coefficients of thermal expansion. The first metal layer and the second metal layer are jointed together by solid-phase joining via a jointing interface microstructure, wherein the jointing interface microstructure includes an amorphous oxide phase and having a thickness of 50 nm or less.

Abstract: A process of assembly by direct bonding of a first and second element, each having a surface including copper portions separated by a dielectric material, the process includes: polishing the surfaces such that the surfaces to be assembled allow assembly by bonding; forming a diffusion barrier selectively in copper portions of the first and second elements, wherein the surface of the diffusion barrier of the first and second elements is level with the surface, to within less than 5 nanometers; and bringing the two surfaces into contact, such that the copper portions of one surface cover at least partly the copper portions of the other surface, and such that direct bonding is obtained between the surfaces.

Abstract: An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included.

Abstract: A method is provided for the forming of a metallic solder joint without a liquid flux to create a solder joint that has minimal voids and can be reflowed multiple times without void propagation. This process can be done for any solder alloy, and is most specifically used in the application of first level thermal interface in a IC or micro processor or BGA microprocessor.

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

Abstract: A brazing structure for an electrochemical cell is described. It includes a nickel or nickel alloy component; a ceramic component; a braze alloy layer, containing an active metal element, between the nickel and the ceramic component, and a barrier layer disposed between the nickel layer and the braze alloy layer. The barrier layer is capable of preventing or minimizing the diffusion of the active metal element into the nickel or nickel alloy component. Electrochemical cells that include such a brazing structure are also described, as are related methods for joining nickel components to ceramic components in the manufacture of thermal batteries.

Abstract: A method of sealing a ceramic component to a metal component for a metal halide battery is provided. The method involves the steps of coating a portion of the ceramic component with a metallic coating, and then bonding the coated ceramic component to the metal component. The metallic coating includes a reactive metal. A sealing structure formed by using such a method is also presented.

Abstract: The present invention relates to a method for printing a substrate, in particular a printed circuit board, with a printing paste, in particular a solder paste, comprising the following steps: —applying a printing screen to the substrate, —printing the substrate using screen printing technology through openings in the printing screen so as to achieve at least one printed structure consisting of printing paste, —separating the printing screen and the substrate by lifting these parts off from one another, —inserting an optical inspection unit between the printing screen and the substrate, —checking the printed structure in terms of the printing paste thickness thereof by means of the inspection unit, —ending the printing when the result of the printing corresponds to at least one preset value. The invention furthermore relates to an inspection unit (1) and a printing device (2).

Abstract: Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Abstract: In a method for producing an electronic component device, a heat bonding step is performed in a state in which low melting point metal layers including low melting point metals including, for example, Sn as the main component, are arranged to sandwich, in the thickness direction, a high melting point metal layer including a high melting point metal including, for example, Cu as the main component, which is the same or substantially the same as high melting point metals defining first and second conductor films to be bonded. In order to generate an intermetallic compound of the high melting point metal and the low melting point metal, the distance in which the high melting point metal is to be diffused in each of the low melting point metal layers is reduced. Thus, the time required for the diffusion is reduced, and the time required for the bonding is reduced.

Abstract: In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

Abstract: The present disclosure generally relates to methods of using active braze techniques on beta-alumina. In some specific embodiments, the present disclosure relates to a method of sealing a portion of beta-alumina electrolyte, insulated collar and metal rings of a sodium-based thermal battery.

Abstract: The invention relates to a method for assembling at least one part made of a porous carbon material with at least one part made of a copper-rich metal material, and to an alloy paste used to implement same. The method according to the invention includes a step comprising the use of an alloy based on copper and silicon, having formula I CuxSiy, wherein x and y are atomic percentages with 25?x?60, 40?y?75 and x+y?95%, in order to assemble at least one part made of a porous carbon material with at least one part made of a copper-rich metal material. The invention is particularly suitable for use in the field of thermal engineering.

Abstract: Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board.

Abstract: A material composite has at least one region of copper or a copper alloy, at least one region of a predominantly graphitic material, and at least one boundary region between them. The boundary region has one or more carbides from the group of the IVb, Vb, VIb transition metals and one or more elements of the group consisting of Si, B, Al, Ge, Mn, Sn. In a preferred implementation of the invention, the composite is produced with a back-casting process.

Abstract: A method for manufacturing a pressure sensor, comprising: providing a ceramic platform, a ceramic measuring membrane, and an intermediate ring; providing an active braze material by means of gas phase deposition at least on a first surface section of a first surface and on a second surface section of a second surface. The first surface is a platform surface, which is to be connected with the intermediate ring by means of the active hard solder, or braze, or a surface of the intermediate ring, which is to be connected with the platform by means of the active hard solder, or braze. The second surface is a measuring membrane surface, which is to be connected with the intermediate ring by means of the active hard solder, or braze, or a surface of the intermediate ring, which is to be connected with the measuring membrane by means of the active hard solder, or braze.

Abstract: This invention relates to a method for joining a first electronic component with a second component using an active brazing alloy. It is the object of this invention to provide a simplified method for achieving a reliable, stress-reduced joint of a high-temperature stable piezoelectric oxidic mono-crystal. According to the method of the invention, a first component (1, 1a, 1b) and a second component (1, 2, 2a, 2b, 4, 4a) are provided, wherein the first component (1, 1a, 1b) includes a piezoelectric oxidic mono-crystal, wherein the piezoelectric oxidic mono-crystal of the first component (1), is joined with the second component (1, 2, 2a, 2b, 4, 4a) using an active brazing alloy (3), wherein the active brazing alloy (3) directly contacts the piezoelectric oxidic mono-crystal of the first component (1, 1a, 1b).

Abstract: A core layer has on its front surface a pair of connecting electrodes forming a wiring pattern and a resist formed between the pair of electrodes; an electronic component having a pair of connecting terminals; a solder part joining between electrodes and connecting terminals; and a sealing resin part filling a gap between the bottom surface of the electronic component and the front surface of the core layer and covering the resist and the solder part, to prevent a defect of a component built-in printed circuit substrate.

Abstract: Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.

Abstract: A micromachined switch is provided including a base substrate, a bond pad on the base substrate, a cantilever arm connected to the bond pad, the cantilever arm having a conductive via from the bond pad, a first actuation electrode on the base substrate, and a second actuation electrode on the cantilever arm connected to the bond pad by way of the conductive via, positioned such that an actuation voltage applied between the first actuation electrode and the second actuation electrode will deform the cantilever arm, wherein the first actuation electrode is facing a side of the cantilever arm opposite the second actuation electrode.

Abstract: A sealing and bonding material structure for joining semiconductor wafers having monolithically integrated components. The sealing and bonding material are provided in strips forming closed loops. There are provided at least two concentric sealing strips on one wafer. The strips are laid out so as to surround the component(s) on the wafers to be sealed off when wafers are bonded together. The material in the strips is a material bonding the semiconductor wafers together and sealing off the monolithically integrated components when subjected to force and optionally heating. A monolithically integrated electrical and/or mechanical and/or fluidic and/or optical device including a first substrate and a second substrate, bonded together with the sealing and bonding structure, and a method of providing a sealing and bonding material structure on at least one of two wafers and applying a force and optionally heat to the wafers to join them are described.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, a. providing a frame including a tensioned wire, b. providing a holding jig including at least one seat in which the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode.

Abstract: Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

Abstract: Ceramic armor having a ceramic material encapsulated within a metal frame assembly and an alloy joint formed therebetween. A hot pressing procedure is carried out on the metal frame assembly containing the ceramic material and braze composition to cause the metal to plastically deform about the encapsulated ceramic material and form a diffusion bonded metal frame assembly and an alloy joint formed in-situ from the braze composition, which melts and wets the ceramic material and the metal frame assembly during the process of diffusion bonding the components of the metal frame assembly together. In instances of a titanium frame assembly, a silicon carbide ceramic material, and a copper-silicon braze composition, the alloy joint formed in-situ during the diffusion bonding process has an alloy gradient including a Cu—Ti component, a Ti—Cu—Si component, and a Cu—Si component.

Abstract: A method of sealing a ceramic component to a metal component for a metal halide battery is provided. The method involves the steps of coating a portion of the ceramic component with a metallic coating, and then bonding the coated ceramic component to the metal component. The metallic coating includes a reactive metal. A sealing structure formed by using such a method is also presented.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: A metal/ceramic substrate made up of a multilayer, plate-shaped ceramic material and at least one metallization provided on a surface side of the ceramic material. The at least one metallization is bonded to the ceramic material by direct copper bonding or reactive brazing and the ceramic material is made of a base layer made of silicon nitride ceramic. The at least one metallization is formed from at least one intermediate layer of an oxidic ceramic applied to the at least one base layer.

Abstract: To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e.

Abstract: A reactive foil is used to assemble the components of rock bit cutters and to affix cutting elements to rock bit bodies. A small pulse of localized energy ignites the foil in a fraction of a second to deliver the necessary amount of heat energy to flow solder or braze and form a strong, true metallic joint. The reaction in the foil may be activated using optical, electrical, or thermal sources.

Abstract: A method for making thermally conductive high aspect ratio large area contact between devices while reducing the heating of the devices. The method of the invention includes the use of reactive foils to solder two devices together at room temperature while imparting significantly less temperature rise and resultant residual stress in the bulk devices when compared with conventional reflow solder techniques.

Abstract: A laser diode package according to the present invention is composed of CTE mismatched components soldered together. The laser diode package includes a laser diode bar, at least one heat sink, and at least one exothermic layer. Solder layers are adjacent the heat sink(s) and laser diode bar, respectively. The exothermic layer(s) are positioned between the solder layers. The exothermic layer(s) are exposed to an energy source which causes an exothermic reaction to propagate through the exothermic layer thereby melting the solder layers and solder layers. The exothermic layer(s) may be designed to provide sufficient heat to melt the solder layers and solder layers but provide only minimal heat to the laser diode bar and heat sink(s). Several packages can be stacked together to form a laser diode array.

Abstract: A method for joining two ceramic parts, or a ceramic part and a metal part, and the joint formed thereby. The method provides two or more parts, a braze consisting of a mixture of copper oxide and silver, a diffusion barrier, and then heats the braze for a time and at a temperature sufficient to form the braze into a bond holding the two or more parts together. The diffusion barrier is an oxidizable metal that forms either a homogeneous component of the braze, a heterogeneous component of the braze, a separate layer bordering the braze, or combinations thereof. The oxidizable metal is selected from the group Al, Mg, Cr, Si, Ni, Co, Mn, Ti, Zr, Hf, Pt, Pd, Au, lanthanides, and combinations thereof.

Abstract: A material composite has at least one region of copper or a copper alloy, at least one region of a predominantly graphitic material, and at least one boundary region between them. The boundary region has one or more carbides from the group of the IVb, Vb, VIb transition metals and one or more elements of the group consisting of Si, B, Al, Ge, Mn, Sn. In a preferred implementation of the invention, the composite is produced with a back-casting process.

Abstract: A method is provided for connecting components particularly in the field of aerospace wherein a first component is connected to a second component, comprising the following steps: arranging at least one nano- or microstructured material between the first and the second component, initiating an exothermic reaction of the nano- or microstructured material for connecting both components with each other.

Abstract: Composite conductor comprising a metallic conductor and a ceramic conductor or non-conductor, at least one of them being elongate, the two being connected with each other in an electrically conductive manner. The ceramic conductor or non-conductor and the metallic conductor are hard-soldered to each other by a contact surface extending obliquely to the longitudinal direction of the at least one elongate conductor, and has one of the conductors tapers at its end and the other conductor has a matching tapering recess. The tapering end of the conductor is fitted into the tapering recess.

Abstract: Problem is to provide a ceramic-metal composite and a semiconductor device that exhibits high bonding strength, heat cycle resistance, durability, and reliability even if the ceramic-metal composite is used in a power module. A ceramic-metal composite includes a ceramic substrate, an active metal brazing alloy layer, and a metal plate bonded to the ceramic substrate through the active metal brazing alloy layer disposed therebetween. The active metal brazing alloy layer contains a transition metal.

Abstract: Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os, superior combination of electrical and mechanical properties as well as reworkability. Sol-gel and electroless processes were developed to demonstrate film bonding interfaces between metallic pads and nano interconnects. Solution-derived nano-solder technology is an attractive low-cost method for several applications such as MEMS hermetic packaging, compliant interconnect bonding and bump-less nano-interconnects.

Abstract: A forced air induction system for use with a powered vehicle is disclosed as including a centrifugal supercharger supported by the vehicle's engine and a recirculating induction coolant system that cools the supercharger and the compressed induction fluid provided by the supercharger. The induction coolant system operates by providing coolant to the supercharger and to an intercooler of the forced air induction system. The supercharger case includes internal passageways for cooling the transmission and compressor. The forced air induction system further includes spacers and radiant heat shields for rejecting heat transferred conductively and radiantly from the engine.

Abstract: A process for soldering an electronic component onto a support which includes at least one heat drain for the component. The method uses a solder paste which incorporates a stripping flux activated at a first temperature, and a solder alloy melted at a second temperature. The process includes preheating the support on the face opposite the component through the heat drain up to the first temperature, placing the component on the support with the solder paste, heating the component by applying a hot gas at a sufficiently high temperature to bring the solder alloy to the melting temperature.

Abstract: This invention is directed to a process for joining materials comprising providing an assembly comprising at least one material layer; at least one metal heat source; and at least one solder layer, each solder layer disposed between each metallic heat source and each material layer; placing the assembly in a controlled atmosphere; and initiating a chemical reaction in the metal heat source so as to enable the solder to join the material layer.

Abstract: There is provided a method for producing a reliable metal/ceramic bonding substrate at low costs by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. After an active metal containing brazing filler metal 12 is applied on a ceramic substrate 10 to bond a metal member 14 thereto, a resist 16 is applied on a predetermined portion of a surface of the metal member 14 to etch unnecessary portions, and then the resist is removed. Thereafter, unnecessary part of a metal layer 12b, which is formed of a metal other than an active metal of the active metal containing brazing filler metal 12, is etched with a chemical to be removed. Then, unnecessary part of an active metal layer 12a, which is formed of the active metal and a compound thereof, is selectively etched with a chemical, which inhibits the metal member 14 and the metal layer 12b from being etched and which selectively etch the active metal layer 12b, to form a metal circuit on the ceramic substrate 10.

Abstract: When a diamond is brazed to a metal substrate, while obtaining a stable joining strength, a joined interface of the diamond is not eroded to provide a good joint with a beautiful view. A brazing-filler material containing at least one selected from a group consisting of gold and silver, and copper as principal components, and further containing 0.001 to 5 mass % of vanadium is used. Preferably, a vanadium content is not more than 2.0 mass %, and more preferably not more than 0.5 mass %. Using this brazing-filler material, unidirectional solidification is performed from a side of diamond to form vanadium carbide in a joined interface in a shape of islands, and thereby an interface having a beautiful view with stable joining strength can be obtained. In addition, strong joining is possible also by a usual solidification method.

Abstract: A brazed product has a metal substrate, a ceramic or graphite substrate, and a brazing alloy containing one of a high nickel content and cobalt content joining the ceramic or graphite substrate to the metal substrate. A method of joining these materials include providing a metal layer coating of titanium or nickel on the surface of the ceramic or graphite substrate to be joined or using a high nickel content or high cobalt content and containing titanium. The brazing alloy contains a high nickel content 70-95% by weight, or a high cobalt content between 45-55% by weight. This brazing alloy can contain titanium in the range between 0.5-5% by weight.

Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.

Abstract: A coating composition and its use in a metallization process that facilitates bonding of brazing filler metals to treated refractory surfaces, such as ceramics. The coating can be applied in preselected areas of the refractory surface to define a target area for brazing. In one embodiment, the coating composition is applied to a refractory material prior to brazing, the composition including (i) a group IVB transition metal component selected from the group consisting of a group IVB transition metal, a hydride thereof, and mixtures of group IVB metals and/or hydrides thereof, (ii) a binder material, and (iii) a fluid carrier, disclosed embodiments, the group IVB transition metal component is titanium, and the binder material is a combination of a styrene block copolymer and a hydrocarbon resin.