With Removing Or Reshaping Of Filler Material Or Flash After Bonding Patents (Class 228/125)
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Patent number: 11919090Abstract: A weld bead cutting device is configured such that, a liner made as liner portions are abutted on and welded to each other is rotated around a rotation axis extending in a direction along an abutting direction, and a weld bead is cut with a cutting tool arranged among rollers in a state where the rollers are pressed against an outer peripheral surface of the liner, the rollers being arranged on both sides of the weld bead on the liner in a direction along an extending direction of the rotation axis.Type: GrantFiled: October 3, 2019Date of Patent: March 5, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Miki Kimura
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Patent number: 11534857Abstract: A composite member is manufactured by a manufacturing method including adding, on a surface of a base member composed of a first material, a second material different from the first material, using additive manufacturing employing directed energy deposition as an additive manufacturing process. The manufacturing method is performed by placing the base member in a machining area of a machine tool configured to perform subtractive machining. Accordingly, a composite member can be obtained that is manufactured through additive manufacturing and that is in a state in which the composite member can be promptly machined.Type: GrantFiled: July 9, 2015Date of Patent: December 27, 2022Assignees: ADVANCED RESEARCH FOR MANUFACTURING SYSTEMS, LLC, DMG MORI CO., LTD.Inventor: Masakazu Soshi
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Patent number: 11529661Abstract: Spiral forming devices, systems, and methods can be used to join edges of a of a stock material, in a curved configuration, along one or more joints to form tubular structures, such as conical and/or cylindrical structures (e.g., frusto-conical structures). A planar form of the stock material can be formed from a plurality planar sheets coupled to one another in an abutting relationship. By controlling relative orientation and shapes of the plurality of planar sheets forming the stock material and/or by controlling a position of a roll bender used to curve the planar form of the stock material into the curved configuration, the curved configuration of the stock material can be controlled through transitions between sheets to facilitate rolling the sheets to a desired diameter with a reduced likelihood of dimples or other errors and to facilitate fit up between adjacent sheets in the curved configuration.Type: GrantFiled: September 30, 2020Date of Patent: December 20, 2022Assignee: Keystone Tower Systems, Inc.Inventors: Rosalind K. Takata, Loren Daniel Bridgers, Eric D. Smith
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Patent number: 11408448Abstract: A pressure vessel includes: (a) a cylindrical sidewall having a wall thickness, an inside surface, an outside surface, and the cylindrical sidewall extending between a first end and a second end, wherein one of the first end or the second end includes a sidewall edge that forms part of an outwardly opening weld groove; (b) an end cap constructed to engage the cylindrical sidewall edge, the end cap comprising an end cap edge corresponding to the sidewall edge and that, when combined with the sidewall edge, forms the outwardly opening weld groove; (c) a cylindrically extending backer bar located in support of the outwardly opening weld groove formed by the sidewall edge and the end cap edge; and (d) a weld joint formed in the outwardly opening weld groove and holding the cylindrical sidewall to the end cap. A method for welding a pressure vessel sidewall and end cap together is provided.Type: GrantFiled: June 29, 2020Date of Patent: August 9, 2022Assignee: JARP Industries, Inc.Inventors: Joseph W. Jackan, Jeremy J. Gabor, Christopher J. Krzewina
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Patent number: 11230062Abstract: A system for part location and long-range scanning of large additively manufactured structures and method for using the same. In some embodiments, the method for locating and scanning a three-dimensional (3D) object comprises scanning a first portion of the 3D object from a first position via a long-range scanner on a mobile platform, determining whether additional portions of the 3D object require scanning, moving the long-range scanner via the mobile platform to a second position based on said determination that additional portions of the 3D object require scanning, and aligning each portion of the scanned 3D object.Type: GrantFiled: February 20, 2019Date of Patent: January 25, 2022Assignee: LOCAL MOTORS IP, LLCInventors: Alexis Fiechter, Timofei Novikov, Robert Bedsole, Kyle Rowe, Charles Hill, David Riha
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Patent number: 11193337Abstract: The connector body attaches to the bowl for a rotating head assembly. The connector body welded to the bowl secures the conductor pipe to the bowl. An inner aperture of the connector body accepts the bowl and the conductor pipe. Fasteners insert into the connector body to secure the conductor pipe within the connector body. An attachment shoulder that extends inward from the outer wall narrows the inner aperture. The bowl rests on top of the attachment shoulder. The bowl inserts vertically downward into an upper opening of the connector body to the attachment shoulder. The conductor pipe inserts into a lower opening of the connector body. The fasteners insert radially into the connector body to secure the conductor pipe within the connector body. The attachment shoulder limits movement of the bowl and the conductor pipe within the inner aperture of the connector body.Type: GrantFiled: October 18, 2019Date of Patent: December 7, 2021Assignee: PRUITT TOOL & SUPPLY CO.Inventors: Grant Pruitt, Cris Braun
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Patent number: 11161196Abstract: A metallic member bonding device includes a pressurizing unit, a current supply unit, and a deformation suppressing unit. The pressurizing unit pressurizes a first metallic member toward a hole portion of a second metallic member to press the first metallic member therein. The current supply unit supplies a welding current between the first metallic member and the second metallic member. The deformation suppressing unit suppresses deformation of one of the first metallic member and the second metallic member, the one member having a constituent metallic material with at least one of a proof stress and a melting temperature lower than that of the other member, the deformation being in a direction of a cross section crossing a direction of the press-in. Then, the deformation suppressing unit is provided in a region covering at least a plastic flow range in the press-in direction.Type: GrantFiled: August 11, 2017Date of Patent: November 2, 2021Assignee: MAZDA MOTOR CORPORATIONInventors: Masanori Nakai, Akira Hashimoto
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Patent number: 11154931Abstract: A manufacturing method for a three-dimensional formed object for manufacturing the three-dimensional formed object by stacking layers includes supplying a first forming material of the three-dimensional formed object to a contour region of the three-dimensional formed object in the layers, applying energy to the first forming material supplied to the contour region to solidify the first forming material, supplying a second forming material to a region corresponding to the three-dimensional formed object, the region being a contact region in contact with the contour region, and applying energy to the second forming material supplied to the contact region to solidify the second forming material.Type: GrantFiled: October 12, 2016Date of Patent: October 26, 2021Assignee: Seiko Epson CorporationInventors: Masaya Ishida, Hajime Onishi, Eiji Okamoto, Kentaro Yamada
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Patent number: 10907752Abstract: A pipe body, wherein the pipe body (10) has a welded portion (11) at both ends of the pipe body, aligned in a widthwise direction of the pipe body (10). The thickness of the welded portion (11) decreases gradually from the inside to the outside of the pipe, and an outer end of the welded portion (11) is located at a center portion of the pipe body (10) in a thickness direction. The configuration of the welding structure enhances the strength of the welded portion of the pipe, so that the pipe will not crack easily when it is reworked by flaring or bending, thus having high reworkability. In addition, a pipe (100) made of the pipe body (10) and a method of making the pipe (100) are disclosed.Type: GrantFiled: January 20, 2017Date of Patent: February 2, 2021Assignee: Zhejiang Sanhua Intelligent Controls Co., Ltd.Inventors: Yiqi Wang, Xinyu Zhuang, Shengli Zhang, Yong Pan, Zhijun Zhang, Feng Chen
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Patent number: 10828710Abstract: A cold-weld burr removal system is disclosed according to various embodiments. The cold-weld burr removal system can include a clamping block having a clamping passage that extends along an alignment axis, and a removal block having a guide passage alignment axis centered about the alignment axis. The removal block can define a burr receiving chamber. The system also can include a cutting head insert having a cutting portion and a cutting passage. The cutting head insert can removably attach to the removal block and the cutting portion can protrude into the burr receiving chamber. The system can include a linear actuator that connects the clamping block to the removal block. The linear actuator can move the removal block in a direction along the alignment axis to increase a separation distance between the clamping block and the removal block when a linear actuation initiator initiates movement of the linear actuator.Type: GrantFiled: April 22, 2019Date of Patent: November 10, 2020Assignee: Southwire Company, LLCInventors: Shelby Glen McDaniel, Franklin Clarence Calhoun, Robert D. Autrey, Keefe M. Lane
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Patent number: 10807136Abstract: Spiral forming devices, systems, and methods can be used to join edges of a of a stock material, in a curved configuration, along one or more joints to form tubular structures, such as conical and/or cylindrical structures (e.g., frusto-conical structures). A planar form of the stock material can be formed from a plurality planar sheets coupled to one another in an abutting relationship. By controlling relative orientation and shapes of the plurality of planar sheets forming the stock material and/or by controlling a position of a roll bender used to curve the planar form of the stock material into the curved configuration, the curved configuration of the stock material can be controlled through transitions between sheets to facilitate rolling the sheets to a desired diameter with a reduced likelihood of dimples or other errors and to facilitate fit up between adjacent sheets in the curved configuration.Type: GrantFiled: November 22, 2019Date of Patent: October 20, 2020Assignee: Keystone Tower Systems, Inc.Inventors: Rosalind K. Takata, Loren Daniel Bridgers, Eric D. Smith
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Patent number: 10780612Abstract: A method 100 for generating and dispensing a powdered 60 release agent during an additive manufacturing build is disclosed. A solid body 28 of release agent material is ground insitu by a grinder 50 and dispensed on a surface of the part 72 to prevent adhesion of an adjacent layer of a base material 70. With the addition of the powdered 60 release agent, a support structure 76 is easily separated from the base material 70 when the part 72 is complete, saving time and preventing the part 72 from sustaining unintentional damage. Since no powdered 60 release agent is actually loaded or stored in the apparatus 20, the potential for spillage, waste, inconsistent dispensing, inadvertent dispensing, and clumping due to humidity is eliminated.Type: GrantFiled: August 21, 2018Date of Patent: September 22, 2020Assignee: UT-Battelle, LLCInventors: Randall F. Lind, Brian K. Post, Phillip C. Chesser, Andrew P. Reis, Alex C. Roschli
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Patent number: 10631879Abstract: A method of producing a coil for a flexible drive shaft includes: winding a roving into at least one helical groove of a mandrel; coating the roving with an uncured material; heating the coated roving to a curing temperature in the at least one helical groove of the mandrel to cure the uncured material and form a composite roving; and stripping the composite roving from the mandrel. A method of forming a flexible driveshaft for a surgical instrument is also provided and includes: feeding a plurality of flexible coils into a feeder such that each of the plurality of flexible coils are spaced from one another about a rod; rotating the rod to wind the plurality of flexible coils about the rod; and binding the wound plurality of flexible coils and rod together.Type: GrantFiled: October 10, 2018Date of Patent: April 28, 2020Assignee: Med X Composites, LLCInventors: Thomas W. Omohundro, C. Peter Darby
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Patent number: 10593601Abstract: Embodiments of the invention include a dye and pry process for removing quad flat no-lead (QFN) packages and bottom termination components (BTC) from card assemblies. Aspects of the invention include immersing a semiconductor package assembly in a solution comprising dye and placing the immersed semiconductor package assembly under vacuum pressure. Vacuum conditions ensure that the dye solution is pulled into any cracks in the solder formed between the semiconductor package assembly and the QFN package or BTC. The package assembly is dried and a hole is drilled to expose a bottom surface of the QFN package or BTC. The QFN package or BTC is then removed by applying a force to the exposed bottom surface. The semiconductor package assembly can then be inspected for the dye to locate cracks.Type: GrantFiled: January 23, 2019Date of Patent: March 17, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tim A. Bartsch, Jennifer Bennett, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo, Theron L. Lewis, Timothy P. Younger
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Patent number: 10468863Abstract: A duplex electrical connector having a one-piece connector body for securing electrical cables to a panel or junction box. The one-piece connector body includes a leading end with a nose portion having a bore therein and a trailing end with two bores therein. One or two tubular cable retainers secured in the trailing end enable snap in connection of electrical cables to the trailing end of the connector body. A fastening arrangement is included on the nose portion at the leading end of the connector body for securing the connector body to a knockout hole in a panel or an electrical box.Type: GrantFiled: April 3, 2009Date of Patent: November 5, 2019Assignee: ARLINGTON INDUSTRIES, INC.Inventor: Thomas J. Gretz
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Patent number: 10010958Abstract: A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot.Type: GrantFiled: September 30, 2016Date of Patent: July 3, 2018Assignee: ERSA GmbHInventors: Rainer Kurtz, Michael Schaefer
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Patent number: 10004955Abstract: Described herein is a golf club head devoid of a crown, the club head comprising: a front end having a bottom rail, a top rail, and a strikeface, the strikeface including a striking surface, a back surface, and a reinforcement element extending from the back surface of the strikeface; a rear end opposite the front end; a heel portion; a toe portion opposite the heel portion; a sole coupled to the front end along the bottom rail at a sole transition region, the sole extending toward the rear end of the golf club head and including a sole thickness, at least one weight member, and a perimeter wall extending from the front end near the heel portion to the front end near the toe portion along the rear end of the club head, wherein the perimeter wall decreases in height from the front end toward the rear end of the club head.Type: GrantFiled: November 11, 2016Date of Patent: June 26, 2018Assignee: Karsten Manufacturing CorporationInventors: Erik M. Henrikson, Eric J. Morales, Ryan M. Stokke, Eric V. Cole, Cory S. Bacon
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Patent number: 9803256Abstract: Embodiments of the present disclosure are directed to coiled steel tubes and methods of manufacturing coiled steel tubes. In some embodiments, the final microstructures of the coiled steel tubes across all base metal regions, weld joints, and heat affected zones can be homogeneous. Further, the final microstructure of the coiled steel tube can be a mixture of tempered martensite and bainite.Type: GrantFiled: February 26, 2014Date of Patent: October 31, 2017Assignee: TENARIS COILED TUBES, LLCInventors: Martin Valdez, Gonzalo Gomez, Jorge Mitre, Bruce A. Reichert
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Patent number: 9768658Abstract: A casing for a rotary electric machine and a rotating electric machine includes an inner casing part made of a metal or a metal alloy and which encloses a stator and a rotor of the rotary electric machine, an outer casing part made of plastic and which at least partially surrounds the inner casing part, and at least one connection point located between the inner casing part and the outer casing part and which mechanically connects the outer casing part to the inner casing part, wherein the at least one connection point has a first flange on the outer casing part and a second flange on the inner casing part.Type: GrantFiled: April 9, 2013Date of Patent: September 19, 2017Assignee: CONTINENTAL AUTOMOTIVE GMBHInventor: Michael Bulatow
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Patent number: 9713831Abstract: An external weld bead removal system for removing and chopping an external weld bead from a tube includes a weld bead cutting apparatus and a weld bead chopper apparatus for chopping the removed external weld bead. The weld bead cutting apparatus includes a cutting tool operative to cut and remove an external weld bead from a tube. The weld bead chopper apparatus, the weld bead chopper apparatus includes a first blade member, a second blade member mounted adjacent the first blade member, and a chopper actuator operable to forcibly rotate the first blade member about a rotation axis relative to the second blade member such that the first and second blade members cooperatively cut the removed external weld bead into smaller weld bead segments as the removed external weld bead is advanced through the chopper apparatus.Type: GrantFiled: July 15, 2014Date of Patent: July 25, 2017Assignee: Quartz Matrix, LLCInventors: Marian Martin Balta, Gheorghe Mihailescu
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Patent number: 9643288Abstract: Disclosed are a heat exchange reactor and a method of manufacturing the same, and a method of manufacturing a heat exchange reactor includes: preparing lateral plates provided with a plurality of slits formed in parallel in a longitudinal direction; disposing two lateral plates to be spaced apart from each other while facing each other in a vertical direction; forming a plurality of flow path channels by inserting flow path partition plates into one or more slits of the two lateral plates in a horizontal direction; forming a plurality of flow path channels by inserting printed circuit heat exchange plates, which autonomously include one or more heat exchange flow paths therein, into one or more slits of the two lateral plates in a horizontal direction; and bonding the lateral plates, the flow path partition plates, and the printed circuit heat exchange plates.Type: GrantFiled: December 12, 2014Date of Patent: May 9, 2017Assignee: Korea Institute of Energy ResearchInventors: Dong Joo Seo, Wang Lai Yoon, Woohyun Kim, Un Ho Jung, Kee Young Koo, Sang Ho Park, Young Jae Hwang
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Patent number: 9299680Abstract: An embodiment is an integrated circuit structure including a first die having a bump structure, and a second die having a pad structure. The first die is attached to the second die by bonding the bump structure and the pad structure. The bump structure includes a metal pillar, a metal cap layer on the metal pillar, a metal insertion layer on the metal cap layer, and a solder layer on the metal insertion layer. The pad structure includes at least one of a nickel (Ni) layer, a palladium (Pd) layer or a gold (Au) layer.Type: GrantFiled: May 23, 2013Date of Patent: March 29, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jing-Cheng Lin, Cheng-Lin Huang
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Publication number: 20150071752Abstract: A box-section arm of an excavator or the like has a pivot axis at one side. Two flat plates 25, 26 close the underside of the box-section adjacent the pivot axis, and are welded transversely from a pair of projections 28, 29 at one side, to corresponding pair of projections 28, 29 at the other side. The projections 28, 29 are partially but not wholly removed after welding.Type: ApplicationFiled: September 9, 2014Publication date: March 12, 2015Applicant: JC BAMFORD EXCAVATORS LIMITEDInventors: Mark Carthy, Dave Hurdman
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Patent number: 8975533Abstract: A printed wiring board has a solder-land group for placing a quad flat package IC, and the solder-land group consists of front solder-land groups and rear solder-land groups. The printed wiring board includes rear solder-drawing lands that are positioned adjacent to rear solder-land groups, that have front edges each of which is substantially parallel to a longitudinal direction of rear solder lands constituting the rear solder-land group and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective two separate lands is made wider in its rearward portion than that in its frontward portion, and that have a slit substantially parallel to the longitudinal direction near the front edge.Type: GrantFiled: October 13, 2011Date of Patent: March 10, 2015Assignee: Mitsubishi Electric CorporationInventors: Tsuyoshi Miura, Kazuo Namikoshi
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Publication number: 20150050511Abstract: Disclosed is a process for producing a wear-resistant layer, in particular on components of gas turbines or aero engines. The process comprises providing a component with a titanium material on at least part of a surface on which the wear-resistant layer is to be produced, applying a solder formed from a cobalt base material to the titanium material, soldering the solder to the titanium material by applying heat and producing at least one diffusion zone between solder and titanium material which comprises intermetallic phases.Type: ApplicationFiled: August 18, 2014Publication date: February 19, 2015Inventors: André WERNER, Bernd DANIELS, Michael STRASSER
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Patent number: 8851357Abstract: An apparatus and method for removing weld flash from a structural assembly are provided. The apparatus generally includes a tool with a head that defines an edge and first and second opposite surfaces disposed at an angle converging toward the edge. A shaft, which extends from the first surface of the head, is configured to be engaged to a shaft holder of an actuation device so that the head extends from the actuation device and is configured to lift the flash from a surface of the assembly as the tool is moved in a path along a surface of the assembly with the edge contacting the flash.Type: GrantFiled: February 7, 2007Date of Patent: October 7, 2014Assignee: The Boeing CompanyInventors: Christopher H. Swallow, Ryan L. Hanks
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Publication number: 20140170433Abstract: Methods for providing a near-surface cooling microchannel in a component include forming a near-surface cooling microchannel in a first surface of a pre-sintered preform, disposing the first surface of the pre-sintered preform onto an outer surface of the base article such that an opening of the outer surface of the base article is aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform, and, heating the pre-sintered preform to bond it to the base article, wherein the opening of the outer surface of the base article remains aligned with the near-surface cooling microchannel in the first surface of the pre-sintered preform.Type: ApplicationFiled: December 19, 2012Publication date: June 19, 2014Applicant: General Electric CompanyInventors: David Edward Schick, Srikanth Chandrudu Kottilingam, Benjamin Paul Lacy, John Wesley Harris, JR.
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Publication number: 20140076880Abstract: A method for producing a metal container includes providing first and second metals. The first metal has a first melting point, and the second metal has a second melting point higher than the first melting point. The first metal is adapted to form an engagement portion. The second metal is in the form of a container having a bottom plate. The first metal has first and second faces. The bottom plate has an outer face. The method further includes positioning the first metal on the bottom plate and heating the first and second metals until the first metal turns into a semi-molten state. The method further includes rotating and compressing a mold onto the first face in order to distribute the semi-molten first metal along the outer face to form the engagement portion. The method further includes removing the mold and engaging a heating member with the engagement portion.Type: ApplicationFiled: September 19, 2012Publication date: March 20, 2014Inventor: Kao Yao-Tsung
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Publication number: 20140034708Abstract: A process for dressing a solder pad removes excess solder from locations that should be free of solder, such as circuit traces, other solder pads, and components near the solder pad being dressed. A first area of a substrate comprises solder to be removed and is heated to a first temperature. A second area of the substrate is heated to a second temperature. A vacuum nozzle is heated to a third temperature sufficient to melt the solder and is scanned across the area to be dressed, melting and vacuuming away the excess solder. The scanning process is controlled using a computer numerical controlled (CNC) machine.Type: ApplicationFiled: July 29, 2013Publication date: February 6, 2014Applicant: Flextronics AP, LLCInventors: Dason Cheung, Murad Kurwa, Richard Loi, Tor Krog
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Publication number: 20130221521Abstract: A method includes heating a solder bump above a melting temperature of the solder bump. The solder bump is stretched to increase a height of the solder bump. The solder bump is cooled down to form a solder bump joint in an electrical device.Type: ApplicationFiled: March 14, 2013Publication date: August 29, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventor: Taiwan Semiconductor Manufacturing Company, Ltd.
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Publication number: 20130221074Abstract: A method includes heating a solder bump above a melting temperature of the solder bump. The solder bump is stretched to increase a height of the solder bump. The solder bump is cooled down.Type: ApplicationFiled: February 27, 2012Publication date: August 29, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Cheng-Chang WEI, Su-Chun YANG, Hsiao-Yun CHEN, Chih-Hang TUNG, Da-Yuan SHIH, Chen-Hua YU
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Patent number: 8453327Abstract: Fabricating a turbine component (50) by casting a core structure (30), forming an array of pits (24) in an outer surface (32) of the core structure, depositing a transient liquid phase (TLP) material (40) on the outer surface of the core structure, the TLP containing a melting-point depressant, depositing a skin (42) on the outer surface of the core structure over the TLP material, and heating the assembly, thus forming both a diffusion bond and a mechanical interlock between the skin and the core structure. The heating diffuses the melting-point depressant away from the interface. Subsurface cooling channels (35) may be formed by forming grooves (34) in the outer surface of the core structure, filling the grooves with a fugitive filler (36), depositing and bonding the skin (42), then removing the fugitive material.Type: GrantFiled: February 5, 2010Date of Patent: June 4, 2013Assignee: Siemens Energy, Inc.Inventor: David B. Allen
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Publication number: 20130127041Abstract: Ball grid array to pin grid array conversion methods are provided. An example method can include coupling a plurality of solder balls to a respective plurality of pin grid array contact pads. Each of the plurality of solder balls is encapsulated in a fixed material. A portion of the plurality of solder balls and a portion of the fixed material is removed to provide a plurality of exposed solder balls. The exposed solder balls are softened and each of a plurality of pin members is inserted in a softened, exposed, solder ball. The plurality of pin members forms a pin grid array package.Type: ApplicationFiled: November 22, 2011Publication date: May 23, 2013Applicant: STMicroelectronics Pte Ltd.Inventor: Kim-Yong Goh
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Publication number: 20130119012Abstract: An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of the conductors. Each bump has at least one edge bounding the bump in at least a second direction transverse to the first direction. The low melting point (LMP) metal layer has a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps. The edges of the bumps and the LMP layer are aligned in the first direction, and the LMP metal layer has a melting temperature substantially lower than the conductors.Type: ApplicationFiled: October 26, 2012Publication date: May 16, 2013Applicant: TESSERA INTERCONNECT MATERIALS, INC.Inventor: TESSERA INTERCONNECT MATERIALS, INC.
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Publication number: 20120298628Abstract: A method of laying a pipeline is described in which both internal and external weld passes are performed in order to weld together the pipe sections. The method includes arranging a pipe section adjacent to the end of a pipeline thereby defining a circumferential joint to be welded, performing an external weld pass, with for example GMAW—MIG torches, on the root of the joint to be welded during which weld material is deposited in the root of the joint to be welded, thereby forming a root weld, and then performing an internal weld pass, with for example a GTAW—TIG torch, on the root weld during which the root weld is melted and re-shaped. The method has particular application in relation to pipes clad with corrosion resistant alloy.Type: ApplicationFiled: November 30, 2010Publication date: November 29, 2012Applicant: SAIPEM S.p.AInventor: Jonathan Bowers
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Publication number: 20120186728Abstract: A connecting point between first and a second devices is sealed with respect to the passage of liquids through the connecting point by applying a soft solid onto the surface and pressing the soft solid into depressions in the surface for sealing purposes.Type: ApplicationFiled: September 28, 2010Publication date: July 26, 2012Inventor: Peter Kummeth
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Publication number: 20120181069Abstract: A printed wiring board has a solder-land group for placing a quad flat package IC, and the solder-land group consists of front solder-land groups and rear solder-land groups. The printed wiring board includes rear solder-drawing lands that are positioned adjacent to rear solder-land groups, that have front edges each of which is substantially parallel to a longitudinal direction of rear solder lands constituting the rear solder-land group and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective two separate lands is made wider in its rearward portion than that in its frontward portion, and that have a slit substantially parallel to the longitudinal direction near the front edge.Type: ApplicationFiled: October 13, 2011Publication date: July 19, 2012Applicant: Mitsubishi Electric CorporationInventors: Tsuyoshi MIURA, Kazuo Namikoshi
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Publication number: 20120138665Abstract: A method for fabricating an optical semiconductor device, including: melting a solder supplied on a carrier; mounting a semiconductor laser chip on the melted solder with a tool for holding the semiconductor laser chip; cooling the solder; releasing the tool from the semiconductor laser chip after the solder is cooled; remelting the solder after the tool is released from the semiconductor laser chip; and recooling the remelted solder.Type: ApplicationFiled: December 5, 2011Publication date: June 7, 2012Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.Inventor: Yoshiki Oka
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Publication number: 20120048912Abstract: Embodiments of a method for forming an MCrAlY coating on a gas turbine engine component are provided, as are embodiments of a method for repairing a structurally-damaged region of a gas turbine engine component utilizing an MCrAlY material. In one embodiment, the method includes the step of preparing an MCrAlY slurry containing an MCrAlY powder, a low melting point powder, a binder, and a dilutant. After application over the gas turbine engine component, the MCrAlY slurry is heated to a predetermined temperature that exceeds the melting point of the low melting point powder to form an MCrAlY coating on the gas turbine engine component. The MCrAlY powder may have any one of a number of different compositions.Type: ApplicationFiled: August 26, 2010Publication date: March 1, 2012Applicant: HONEYWELL INTERNATIONAL INC.Inventors: Yiping Hu, Richard L. Bye
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Patent number: 8123106Abstract: An external weld bead is removed and processed from a welded pipe traveling in a downstream direction. The weld bead is separated from the pipe, allowed to flow in a downstream direction, and is guided downstream and cut into chips at a location downstream of where the weld bead is separated from the pipe. Also disclosed is weld bead cutting tool including a cutting edge at an upstream end of the tool, a guide feature disposed downstream of the cutting edge and extending toward a downstream end of the tool, wherein the guide feature widens from the upstream end toward the downstream end.Type: GrantFiled: June 9, 2011Date of Patent: February 28, 2012Assignee: Lumco Manufacturing CompanyInventor: Patrick J. Gleason
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Publication number: 20120018494Abstract: A method includes providing a substrate carrier including work piece holders, and placing a first plurality of work pieces into the work piece holders. A second plurality of work pieces is picked up and placed, with each of the second plurality of work pieces being placed on one of the first plurality of work pieces. Solder bumps between the first and the second plurality of work pieces are then reflowed to simultaneously bond the first and the second plurality of work pieces together.Type: ApplicationFiled: July 22, 2010Publication date: January 26, 2012Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Bor-Ping Jang, Kuei-Wei Huang, Wei-Hung Lin, Chung-Shi Liu
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Patent number: 8091201Abstract: A unique tubular work piece is disclosed along with a novel method and apparatus for manufacturing tubular work pieces from sheet metal stock lighter and stronger structures with less waste and less cost than prior methods.Type: GrantFiled: June 29, 2006Date of Patent: January 10, 2012Assignee: Middleville Tool & Die Co, IncInventors: Douglas M Johnson, Robert L Middleton, Sr., Robert L Middleton, Jr., Robert E. Leedy, John A. Nobel
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Patent number: 7988029Abstract: An external weld bead is removed and processed from a welded pipe traveling in a downstream direction. The weld bead is separated from the pipe, allowed to flow in a downstream direction, and is guided downstream and cut into chips at a location downstream of where the weld bead is separated from the pipe.Type: GrantFiled: December 11, 2008Date of Patent: August 2, 2011Assignee: Lumco Manufacturing CompanyInventor: Patrick Joseph Gleason
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Patent number: 7935908Abstract: A method of joining dissimilar materials of the present invention has a step of lapping a high melting point material on a low melting point material with a third material interposed therebetween. The third material is different from the high and low melting point materials. Further, the method has a step of irradiating an energy beam onto the high melting point material and a step of pressing the high and low melting point materials to cause eutectic melting between at least one of the high and low melting point materials and the third material and to join the high and low melting point materials in the form of a line.Type: GrantFiled: December 5, 2006Date of Patent: May 3, 2011Assignee: Nissan Motor Co., Ltd.Inventors: Shigeyuki Nakagawa, Minoru Kasukawa, Kenji Miyamoto, Masayuki Inoue
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Publication number: 20110052935Abstract: In joining a magnesium alloy material 1 (first material) and a steel material (second material), a zinc-plated steel plate 2 plated with zinc (metal C) is used as a steel material, Al (metal D) is added to the magnesium alloy material 1. Next, eutectic melting of Mg and Zn is caused so as to remove a product produced by the eutectic melting with an oxide film 1f and impurities from a joint interface. Moreover, an Al—Mg system intermetallic compound such as Al3Mg2 and an Fe—Al system intermetallic compound such as FeAl3 are produced, whereby regenerated surfaces of both materials 1 and 2 are joined via a compound layer 3 containing those intermetallic compounds.Type: ApplicationFiled: January 16, 2009Publication date: March 3, 2011Inventors: Shigeyuki Nakagawa, Kenji Miyamoto, Minoru Kasukawa, Masao Aihara, Sadao Yanagida, Akio Hirose
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Publication number: 20100308103Abstract: A system for manufacturing electrical components includes a reflow chamber having an inlet port and an outlet port. The inlet port receives a web of interconnected electrical components having a conductive coating into the reflow chamber. The outlet port discharges the web from the reflow chamber. The reflow chamber directs the web of interconnected electrical components along a predetermined pathway through the reflow chamber. The reflow chamber retains a heated and saturated vapor to heat the conductive coating as the web passes along the pathway through the chamber to reflow the conductive coating about the electrical components.Type: ApplicationFiled: June 8, 2009Publication date: December 9, 2010Applicant: TYCO ELECTRONICS CORPORATIONInventors: GEORGE JYH-SHANN CHOU, ROBERT DANIEL HILTY
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Publication number: 20100207280Abstract: After forming a pressure-bonded ball and a ball neck by bonding an initial ball to a pad, a capillary is moved upward, away from a lead, and then downward, thereby the ball neck is trodden on by a face portion that is on the lead side of the capillary. Subsequently, the capillary is moved upward and then toward the lead until the face portion of the capillary is positioned above the ball neck, thereby a wire is folded back toward the lead. Then, the capillary is moved downward such that a side of the wire is pressed by the capillary against the ball neck that has been trodden on. After the capillary is moved obliquely upward toward the lead and then looped toward the lead, the wire is pressure-bonded to the lead.Type: ApplicationFiled: October 21, 2009Publication date: August 19, 2010Inventors: Tatsunari Mii, Shinsuke Tei, Hayato Kiuchi
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Publication number: 20100147927Abstract: An external weld bead is removed and processed from a welded pipe traveling in a downstream direction. The weld bead is separated from the pipe, allowed to flow in a downstream direction, and is guided downstream and cut into chips at a location downstream of where the weld bead is separated from the pipe.Type: ApplicationFiled: December 11, 2008Publication date: June 17, 2010Inventor: PATRICK J. GLEASON
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Patent number: 7600666Abstract: The present invention is a low heat energy input repair system. The system utilizes a V-shaped feedstock that conforms to the shape of grooves in damaged parts. The V-shape of the feedstock conforms closely to the damaged region of various components and reduces the heat input needed to bond the surfaces. The repair system is deployable onsite, at a military depot, industrial manufacturing facility or other location where a mobile repair system would be beneficial. The present system provides onsite, in-situ, low heat input repair of wear, fatigue and corrosion cracks, or impact surface damage of large components. The present invention is particularly useful for components with thin walls and results in low distortion.Type: GrantFiled: May 27, 2003Date of Patent: October 13, 2009Inventor: Joshua E. Rabinovich
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Publication number: 20090017264Abstract: A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.Type: ApplicationFiled: July 9, 2008Publication date: January 15, 2009Applicant: OCCAM PORTFOLIO LLCInventor: Joseph C. Fjelstad