Abstract: A method for attaching a roof panel to a roof rail of a vehicle bodyside frame, wherein the roof rail prohibiting access to an underside of an area at which the roof panel attaches to the roof panel, can include applying a single-component adhesive to a roof rail or to a portion of a roof panel that rests on the roof rail, placing the roof panel onto the roof rail, attaching the roof panel to the roof rail using single-sided spot welds, and heating the roof panel and vehicle bodyside frame to a temperature that cures the single-component adhesive.

Abstract: A method and system for securing a flexible circuit to a mounting structure is disclosed. The system can include a surface-mount device, flexible circuit, stiffener, and bracket. The stiffener is used as an intermediate coupling device between the flexible circuit and bracket. The flexible circuit is coupled to the stiffener with a heat-activated adhesive. Next, the surface-mount device is mounted to the flexible circuit with surface-mounting techniques. A peripheral area of the stiffener is then welded to the bracket. The bracket in turn can be fastened to the enclosure of an electronic device.

Abstract: A brazing process and plate assembly are disclosed. The brazing process includes positioning a braze foil on a first workpiece, then securing the braze foil to the first workpiece to form a brazable component, then positioning a second workpiece proximal to the brazable component, and then brazing the second workpiece to the brazable component. Additionally or alternatively, the brazing process includes positioning the braze foil on a tube, then securing the braze foil to the tube to form a brazable tube, then positioning a plate of a plate assembly proximal to the brazable tube, and then brazing the plate to the brazable tube. The plate assembly includes a plate and a tube brazed to the plate by a braze foil secured to the tube.

Abstract: A blade for a gas turbine engine comprises a blade portion having a first end and a second end and an engagement portion including a first surface coupled to the second end of the blade portion and a second surface coupled to the second end of the blade portion, the first and second surfaces arranged to extend divergently away from one another. The engagement portion is adapted for coupling to a wheel included in a gas turbine engine wheel.

Abstract: The present invention is a laser light source device having: a silicon substrate having a first flat surface and a second flat surface which is formed at a position lower than the first flat surface by a level difference in the thickness direction; a first junction having a microbump structure comprising Au formed on the first flat surface; a second junction having a microbump structure comprising Au formed on the second flat surface; a first optical element and a second optical element for emitting laser light, which are joined to the first junction by a surface activation technique; a reflective member for reflecting the laser light from the first optical element toward a multiplexer, the reflective member being joined to the second junction by the abovementioned technique; and a multiplexer for directly receiving the laser light from the second optical element and multiplexing the laser light from the first optical element and the laser light from the second optical element, the multiplexer being joined to

Abstract: The present invention relates to a method for manufacturing Ni/In/Sn/Cu multilayer structure, in which a Ni/In/Sn/Cu multilayer structure is formed between a first substrate (copper substrate) and a second substrate (such as silicon wafer), and further, a plurality of intermetallic layers are formed in the Ni/In/Sn/Cu multilayer structure through a reflow bonding process and an aging heat treatment, wherein the intermetallic layers comprises a first intermetallic layer of (Cu,Ni)6(Sn,In)5, a second intermetallic layer of (Cu,Ni)6(Sn,In)5 and a third intermetallic layer of (Cu,Ni)3(Sn,In)4. Therefore, the formed intermetallic layers makes the Ni/In/Sn/Cu multilayer structure performs good wettability, ductility, creep resistance, and fatigue resistance.

Abstract: A heat-curable structural adhesive includes at least one non-rubber-modified epoxy resin; an optional rubber or toughener, one or more epoxy curing agents, one or more epoxy curing catalysts; and a flame retardant mixture that includes (i) alumina trihydrate, (ii) zinc borate and (iii) melamine or a melamine derivative. The structural adhesive is useful for bonding metals to other materials or metals to other metals. The structural adhesive strongly resists ignition when welding is performed in the presence of the uncured material, and does not interfere significantly with weld performance.

Abstract: A heat-curable structural adhesive includes a non-rubber-modified epoxy resin, a reaction product of a carboxyl- or amine-terminated butadiene polymer or copolymer and a bisphenol F-based epoxy resin, a elastomeric toughener containing capped isocyanate groups, one or more epoxy curing agents a moisture scavenger and a heat activatable catalyst comprising a mixture of a solid or liquid tertiary amine compound that has a boiling temperature of at least 130° C. and a novolac resin. The structural adhesive develops excellent bonding properties when cured at moderate temperatures, especially from 120 to 170° C., and in addition performs very well in environmental aging stress testing. The adhesive is particularly good for bonding aluminum to another metal, or bonding aluminum to aluminum.

Abstract: An object is to restrain an adhesive from dropping or from being scraped off when a joining portion is adhered to a joined portion. A panel joining structure of the present invention includes: a first panel including a stepped portion extending in an intersecting direction with a vertical direction, and a joining portion extending toward a vertical direction upper side from one end of the stepped portion in the intersecting direction; and a second panel including a facing portion extending in the intersecting direction and superimposed on the stepped portion from the vertical direction upper side, a joined portion extending toward the vertical direction upper side from one end of the facing portion in the intersecting direction and joined to the joining portion by adhesion and welding, and a suspended portion extending toward a vertical direction lower side from the other end of the facing portion in the intersecting direction.

Abstract: A method for sealing vacuum glass and a vacuum glass product processed by said method are provided. The method specifically is: preparing metallized layers (6) consolidated with glass plates on the surface to be sealed at the edge of the glass plates by the known sintering process; enabling hermetically sealing the edges of the two glass plates (1, 2) by welding and connecting metal sealing sheet (7) between the metallized layers (6) of the tow glass plates to be hermetically sealed. A brand new technology for manufacturing vacuum glass is provided by sintering metallized layers on the surface of the glass plates, and hermetically sealing the edges of the glass plates by use of the metallized layers and metal sealing sheet.

Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.

Abstract: A method for sealing the curved vacuum glass comprises: first preparing metallized layer bonded with the glass plate on the edge surface of the curved glass to be sealed by locally heating the metal slurry coating; then air-tightly sealing the edges of two glass plates by using the metal brazing technology, or air-tightly sealing the edges of two glass plates by air-tightly welding the metal sealing sheet between the metallized layers of two glass plates to be sealed. A curved vacuum glass is also provided. The method makes the sealing part have firm connection, good air tightness and good thermal shock resistance. The sealing structure made of the metal sealing sheet is well compatible with the temperature deformation caused by the temperature difference between the internal and external glass plates of the vacuum glass.

Abstract: One aspect relates to a contacting arrangement for use in a housing of a medically implantable apparatus. Said contacting arrangement includes an electrical feedthrough device that includes at least one electrically insulating main feedthrough member and at least one electrical conducting element. The conducting element is designed to establish at least one electrically conducting connection between an interior of the housing and an exterior through the main feedthrough member. The conducting element is hermetically sealed with respect to the main feedthrough member. The at least one conducting element comprises at least one cermet. The contacting arrangement further includes an electrical filter structure which is arranged on a face of the feedthrough device. Furthermore, said filter structure is connected to the conducting element by means of at least one electrical surface connection.

Abstract: Hybrid welding apparatuses include a laser that produces a leading laser beam, and, an arc welder that produces a trailing backhand weld arc, wherein the leading laser beam and the trailing backhand weld arc are directed towards a common molten pool, and wherein the trailing backhand weld arc trails the leading laser beam as the leading laser beam progresses in a weld direction.

Abstract: In various embodiments, protective layers are bonded to a steel layer, overlapped, and at least partially covered by a layer of unmelted metal powder produced by cold spray.

Abstract: An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink.

Abstract: Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the insulation film to form a base material; forming via holes in the base material; and forming a circuit pattern layer on the upper adhesive layer, so it is effective to improve adhesion power between the molding resin and the insulation film at the time of manufacturing a chip package later.

Abstract: A rosin composition includes a gum rosin, an emulsifier, a randomizing additive and a bonding agent. This rosin composition may be used as a temporary or permanent adhesive for the soldering of components. The rosin composition may be temporary as it is easily removed from a surface without damaging the surface.

Abstract: In order to lower the substantial heating temperature of a thermosetting adhesive and to realize favorable connection reliability during connecting an electrical element to a circuit board by anisotropic conductive connection with using solder particles, a product in which solder particles having a melting temperature Ts are dispersed in an insulating acrylic-based thermosetting resin having a minimum melt viscosity temperature Tv is used as an anisotropic conductive adhesive in producing a connection structure by connecting the circuit board and the electrical element to each other by anisotropic conductive connection.

Abstract: The sealing component 1 of the invention is provided with a metallic housing 19 that comprises a base part 19a, a side wall 19b connected to the base part 19a and an opening portion 19c facing to the base part 19a, and a metallic lid 20 to cover the opening portion 19c, wherein a melted portion 24 is formed around the boundary between the lid 20 and the upper edge 19b1, the melted portion 24 is formed to reach the corner 19b3 of the side wall 19b, and the melted portion 24 has a convexly-curved outward form 24a from the top face of the lid 20 to the corner 19b3 in the longitudinal cross-sectional view of the sealing component 1.

Abstract: An apparatus and method of welding a tab of a battery pack, is disclosed. Batteries are placed on a main body of a jig, having a wing unit attached to the jig. A tab is attached to the wing unit, the wing unit being rotatably connected to the main body of the jig. The method includes attaching the tab to a wing unit of the jig by using an adhesive member, welding the terminals of the batteries to the tab, and separating the wing unit from the tab.

Abstract: An optical sensor is disclosed for measuring pressure and/or temperature. The optical sensor is adapted for use in high temperature environments, such as gas turbines and other engines. The optical sensor comprises an optical assembly having a sensor element, a spacer and a lens arranged along the optical axis. The sensor element is spaced from the lens by the spacer. An optical fibre is coupled to the optical assembly for illuminating the sensor element. The optical assembly is resiliently mounted in a housing such that the optical assembly is insulated from shock to the housing. There is also disclosed a method of assembling the optical sensor.

Abstract: The present disclosure relates to a pipe element with a trimmed edge for welding onto a carrier, wherein the trimmed edge is cut from a base tube so that the pipe element can be arranged on the surface of the carrier and welded to it along the trimmed edge, wherein the trimmed edge has a first cam with which the pipe element can be placed on the surface of the carrier. It is further provided that the trimmed edge has at least one second cam with which it can be placed on the surface of the pipe element, so that an air gap remains between the surface of the carrier and the trimmed edge in a region lying between the first cam and the second cam.

Abstract: A visually seamless method of joining a first piece of metal and a second piece of metal is described. The first piece of metal is placed in contact with an edge of the second piece of metal. In some embodiments, the edge includes a sacrificial lip. The first piece of metal forming a junction area with the edge of the second piece of metal, applying a forging force to the first piece of metal, the forging force having an effect of creating an extremely tight fit up between the first and the second pieces of metal, welding the first and the second pieces to form an assembly and forming a cosmetically enhancing protective layer on the surface of the assembly, the protective layer obscuring any visible artifacts on the surface of the assembly, the obscured visible artifacts including any discoloration or discontinuity created by the laser welding.

Abstract: Some exemplary implementations of this disclosure pertain to an integrated circuit package that includes a substrate, a first die and a second die. The substrate includes a first set of traces and a second set of traces. The first set of traces has a first pitch. The second set of traces has a second pitch. The first pitch is less than the second pitch. In some implementations, a pitch of a set of traces defines a center to center distance between two neighboring traces, or bonding pads on a substrate. The first die is coupled to the substrate by a thermal compression bonding process. In some implementations, the first die is coupled to the first set of traces of the substrate. The second die is coupled to the substrate by a reflow bonding process. In some implementations, the second die is coupled to the second set of traces of the substrate.

Abstract: A method for bonding a heat-conducting substrate and a metal layer is provided. A heat-conducting substrate, a first metal layer and a preformed layer are provided. The preformed layer is between the heat-conducting substrate and the first metal layer. The preformed layer is a second metal layer or a metal oxide layer. A heating process is performed to the preformed layer in an oxygen-free atmosphere to convert the preformed layer to a bonding layer for bonding the heat-conducting substrate and the first metal layer. The temperature of the heating process is less than or equal to 300° C.

Abstract: A method for manufacturing an electronic device is provided, in which a base and a lid as a cover body are bonded together while forming an interior space between the base and the lid. The method includes: a step of preparing the lid including a groove communicating the interior space with the outside, the groove being in a back surface of the lid; a step of accommodating a gyro element as an electronic component in the interior space; a first bonding step of bonding the base and the lid together by seam welding at an area for bonding except for a portion corresponding to the groove; and a second bonding step of bonding the base and the lid by welding using a laser beam at a portion of the area for bonding, the portion including an end of the groove on the outside side, to thereby close the groove.

Abstract: A method for attaching a roof panel to a roof rail of a vehicle bodyside frame, wherein the roof rail prohibiting access to an underside of an area at which the roof panel attaches to the roof panel, can include applying a single-component adhesive to a roof rail or to a portion of a roof panel that rests on the roof rail, placing the roof panel onto the roof rail, attaching the roof panel to the roof rail using single-sided spot welds, and heating the roof panel and vehicle bodyside frame to a temperature that cures the single-component adhesive.

Abstract: A method for producing an inkjet head may include, the inkjet head having: a head substrate having a plurality of piezoelectric elements, a wiring substrate having wiring lines through which electric power is fed to the respective piezoelectric elements through the drive electrodes, the method having: pressure-welding the wiring substrate to the head substrate by heat through resin adhesive sections made of a thermosetting resin so that the drive electrodes are electrically connected to the wiring lines through solder bumps; and joining the head substrate to the wiring substrate, wherein a melting point TB[° C.] of the solder bumps and a cure initiation temperature TR[° C.] of the resin adhesion sections meet a relation (TR[° C.]?TB[° C.]?TR+30[° C.]).

Abstract: A case assembly includes a plurality of segments, at least one braze joint, and one or more welds. The braze joint connects the plurality of segments together and the one or more welds extend across adjacent segments.

Abstract: Cloth electronic product, by which physiological information can be examined through cloth, includes a packaging cloth or a heat melt adhesive film as circuit, at least an electronic component, such as resistors, microprocessors and sensing assembly, etc., at least a transmission line to be connected with the conductive region of electronic component. Method of producing a cloth electronic product includes sewing the electronic component on packaging cloth or heat melt adhesive film after being connected with the transmission line, or connecting electronic component with the transmission line during the process of jointing of transmission or sewing of packaging cloth or heat melt adhesive film, and then sewing the packaging cloth on the clothing cloth or integrating the heat melt adhesive film into the packaging cloth or clothing cloth. Original structure of the heat melt adhesive film cannot be viewed and miniaturization effects can be produced.

Abstract: An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.

Abstract: In a composite component having a laminate body, a conductive layer and a connector can be joined to one another using an intermediate flexible circuit. Among other things, this flexible circuit places the conductive layer and the connector in electrical communication with one another. Furthermore, during the forming process and because of its thinness, the flexible circuit integrates well with the layers of the laminate body and can accommodates some spatial displacement of the connector and conductive material relative to one another.

Abstract: The invention relates to a target arrangement comprising a tubular-shaped carrier element and a hollow-cylindrical target having at least one target material, said target comprising at least one one-piece tube segment which at least partially surrounds the carrier element. Said carrier element and the tube segment are partially interconnected in a material fit by at least two plastically deformable compensating means. The invention also relates to a method for producing said type of target arrangement and a tubular segment.

Abstract: A composite panel comprises an outer skins and an inner core. The inner core includes a frame, an elastomeric material disposed between at least a portion of the frame and the outer skin, and a foamed polymer filler. Also disclosed is a method of manufacturing the same.

Abstract: A method for attaching a roof panel to a roof rail of a vehicle bodyside frame, wherein the roof rail prohibiting access to an underside of an area at which the roof panel attaches to the roof panel, can include applying a single-component adhesive to a roof rail or to a portion of a roof panel that rests on the roof rail, placing the roof panel onto the roof rail, attaching the roof panel to the roof rail using single-sided spot welds, and heating the roof panel and vehicle bodyside frame to a temperature that cures the single-component adhesive.

Abstract: The present disclosure relates to cutting tools incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to a thermally stable polycrystalline diamond body joined to a substrate to form a cutting element. The thermally stable polycrystalline diamond body may be binderless polycrystalline diamond or a non-metal catalyst polycrystalline diamond. A polycrystalline cubic boron nitride layer is also provided, bonded on one side to the polycrystalline diamond body and on the other side to the substrate.

Abstract: An electronic device comprises: a printed wiring board that comprises a substrate, pads formed on the substrate, and an insulating film layer covering a surface of the substrate on which the pads are formed; and an electronic element that comprises external terminals electrically connected to the pads and that is mounted on the printed wiring board. The insulating film layer comprises at least one connecting opening section each exposing at least part of one of the pads. At least part of an inner wall of the connecting opening section comprises at least one step section.

Abstract: A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer.

Abstract: According to one embodiment described herein, a method for assembling a multi-emitter laser pump package, includes providing a base substrate comprising a laser riser block. A chip-on-hybrid laser assembly is bonded to the laser riser block with a solder preform. A scalar module is bonded to the base substrate with an adhesive such that an output of the chip-on-hybrid laser assembly is optically coupled into an input of the scalar module. A sidewall ring is adhesively bonded to the base substrate with a non-hermetic adhesive, the sidewall ring comprising a fiber interconnect fitting and at least one electrical connector. A first end of a fiber interconnect is optically coupled to an output of the scalar module and a second end of the fiber interconnect is positioned in the fiber interconnect fitting of the sidewall ring.

Abstract: An airfoil includes, among other possible things, a main body extending between a leading edge and a trailing edge. Channels are formed into the main body, with a plurality of ribs extending intermediate the channels. A cover skin is attached to the main body. The cover skin is welded to the main body at outer edges. An adhesive is placed between inner surfaces of the cover skin and the main body. The adhesive is deposited inwardly of the outer edges of the cover skin.

Abstract: Provided is an adhesive composition containing an organoaluminum complex (A), a silane coupling agent (B), and a curable component (C).

Abstract: A method for bonding a first surface provided with at least one copper area surrounded by a silicon oxide area to a second surface includes an operation of treatment of the first surface by a plasma, before placing the first surface in contact with the second surface. The plasma is formed from a gas source containing a silicon oxide nitriding agent and a copper oxide reducing agent containing hydrogen. The gas source may include an N2 and NH3 and/or H2 gas mixture or a N2O and H2 gas mixture, or ammonia, which is then used both as a nitriding agent and as a reducing agent. The plasma obtained from this gas source then necessarily contains nitrogen and hydrogen, which enables, in a single operation, to provide a high-performance bonding between the first and second surfaces.

Abstract: A method of centering a disk of a hard disk drive includes arranging a disk on an upper end portion of a hub on which a plurality of disks are rotatably assembled, and assembling the disk on the hub by vibrating the hub. Accordingly, the disks and/or spacers may be easily assembled on the hub, a time of centering may be relatively much reduced, and a superior centering quality may be obtained.

Abstract: A method for fabricating an optical device including: a first step of preparing a carrier having a first area and a second area, both edges of the second area having a wall of a step, one edge of the second area being adjacent to the first area, the first area having a first thickness, the second area having a second thickness larger than the first thickness, a second step of mounting the carrier on a temperature control device after the first step, and a third step of mounting a first optical component on the first area of the carrier after the second step.

Abstract: Components may be interconnected using liquid materials such as liquid adhesive and solder. To prevent undesired movement between the components during the assembly process and to prevent the liquid material from flowing into undesired areas, an attachment and dam structure may be provided. The structure may be formed from a substrate such as a flexible polymer film coated with adhesive. When interposed between first and second components, the structure attaches the first and second components and prevents movement between the first and second components. The structure may have one or more edges adjacent to the liquid material to block the liquid material from flowing while the liquid material is in its liquid state. Once the components have been connected, the liquid material can be solidified.

Abstract: Provided is an integral thermal compression bonded board technology which is high in reliability and low in cost. In a process of bonding printed boards to each other, electrodes are connected with each other by solder connection using a Cu core solder plated ball and the boards are bonded by a three-layer bonding material constituted by a bonding material layer, a ball maintaining core layer, and the bonding layer, and solder of the Cu core solder plated ball inserted into holes of three layers is formed by integral thermal compression. They are connected with each other by flux or welcoming solder.

Abstract: A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

Abstract: To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, a. providing a frame including a tensioned wire, b. providing a holding jig including at least one seat in which the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode.

Abstract: An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces.