Abstract: A method of manufacturing a liquid ejection head comprising: bonding together a diaphragm made of a stainless steel substrate containing iron, chromium and aluminum, and a pressure chamber formation substrate which has a space for a pressure chamber and is made of stainless steel containing chromium and aluminum, by diffusion bonding, in such a manner that a structural body including the diaphragm and the pressure chamber formation substrate is formed; carrying out a first heat treatment of the structural body so as to form an aluminum oxide film on a surface of the structural body and form a chromium oxide film between the aluminum oxide film and the structural body; forming a lower electrode on the aluminum oxide film; forming a piezoelectric body on a surface of the lower electrode reverse to a surface of the lower electrode on which the chromium oxide film and the aluminum oxide film are formed; forming an upper electrode on a surface of the piezoelectric body reverse to a surface of the piezoelectric bod

Abstract: Method for the production of indexable inserts, which exhibits the following: Deposition of a layer of cutting tip material forming the indexable inserts (40) by means of a PVD method on a dissolvable profiled substrate (10), and—dissolving of the substrate to produce the form of free-standing parts as indexable inserts.

Abstract: One embodiment of the present invention is a unique method for brazing an assembly. Another embodiment is a unique method of heat treating an object. Other embodiments include apparatuses, systems, devices, hardware, methods, and combinations for heat treating and/or brazing. Further embodiments, forms, features, aspects, benefits, and advantages of the present application will become apparent from the description and figures provided herewith.

Abstract: An exemplary multilayer printed circuit board includes a first circuit substrate, a third circuit substrate, a second circuit substrate between the first and third circuit substrates, a first anisotropically conductive adhesive layer between the first and second circuit substrates, and a second anisotropically conductive adhesive layer between the second and third circuit substrates. The first circuit substrate includes a first conductive terminal and a first through hole. The second circuit substrate includes a second conductive terminal and two through holes (i.e. second and third through holes). The third circuit substrate includes a third conductive terminal and a fourth through hole. The first anisotropically conductive adhesive layer fills the first and third through holes to electrically connect the first and second conductive terminals. The second anisotropically conductive adhesive layer fills the second and fourth through holes to electrically connect the second and third conductive terminals.

Abstract: In various embodiments, protective layers are bonded to a steel layer and connected by a layer of unmelted metal powder produced by cold spray.

Abstract: A method for preparing a surface of a YAG crystal for thermal bonding includes performing an ion implantation process to introduce nitrogen into a surface layer of the YAG crystal to replace depleted oxygen therein, to change surface energy of the surface layer of the YAG crystal and to provide desired bonding characteristics for the surface layer; and joining the ion implanted surface layer with a thermal management device configured to dissipate heat from the YAG crystal. Also, a micro-chip device having a YAG crystal whose surface is prepared with the above disclosed method is provided and a device for forming a metallization pattern on a surface of the YAG crystal is provided.

Abstract: An aluminum alloy brazing sheet having a core material of an aluminum alloy, and a filler material cladded on the core is disclosed. The core material is an aluminum alloy having about 0.05 to about 1.2 mass Si, about 0.05-about 1.0 mass % Fe, about 0.05-about 1.2 mass % Cu, and about 0.6-about 1.8 mass % Mn, balance Al and the inevitable impurities. The filler material includes an aluminum alloy having about 2.5-about 13.0 mass % Si. Also, there is provided a method of manufacturing such an aluminum alloy brazing sheet.

Abstract: A touch panel including: first electrode patterns provided on a transparent substrate and extending in a first direction; and second electrode patterns provided on the substrate and extending in a second direction that intersects the first direction, each of the first electrode patterns being constituted by transparent electrodes and conductive connecting sections via which the transparent electrodes are connected to each other, and each of the second electrode patterns being constituted by transparent electrodes and conductive connecting sections via which the transparent electrodes are connected to each other, each of the second electrode patterns intersecting the first electrode patterns via an insulation layer at the respective conductive connecting sections of said each of the second electrode patterns, and in at least one of the second electrode patterns, at least one of the conductive connecting sections of said at least one of the second electrode patterns being a metal wire.

Abstract: A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.

Abstract: A semiconductor substrate includes a substrate having plurality of electrical contact pads formed thereon, a first insulating protective layer formed on the substrate that exposes the electrical contact pads, a plurality of metal layers formed on the exposed electrical contact pads, a second insulating protective layer formed on the first insulating protective layer that exposes a portion of the metal layers, and a plurality of solder bumps formed on the exposed metal layers having copper. Through the second insulating protective layer covering a portion of the metal layers, the solder bumps are prevented from falling off or crack when the semiconductor substrate is under a temperature test.

Abstract: A sliding element 20, such as a bushing or bearing, includes a sintered powder metal base 24 deposited on a steel backing 22. The base 24 includes a tin, bismuth, first hard particles 40, such as Fe3P and MoSi2, and a balance of copper. In one embodiment, a tin overplate 26 is applied to the base 24. A nickel barrier layer 42 can be disposed between the base 24 and the tin overplate 26, and a tin-nickel intermediate layer 44 between the nickel bather layer 42 and the tin overplate 26. In another embodiment, the sliding element 20 includes either a sputter coating 30 of aluminum or a polymer coating 28 disposed directly on the base 24. The polymer coating 28 includes second hard particles 48, such as Fe2O3. The polymer coating 28 together with the base 24 provides exceptional wear resistance over time.

Abstract: Disclosed herein are a power module using sintering die attach and a manufacturing method of the same. The power module includes: a substrate having an insulating layer formed on a surface of a metal plate; a circuit layer formed on the substrate and including a wiring pattern and an electrode pattern; a device mounted on the wiring pattern; a sintering die attach layer applying a metal paste between the wiring pattern and the device and sintering the metal paste to bond the wiring pattern to the device; and a lead frame electrically connecting the device to the electrode pattern, whereby making it possible to to simplify and facilitate the process, increase electrical efficiency and improve radiation characteristics, and manufacture firm and reliable power module.

Abstract: A weldment includes metal materials that are welded to each other. At least one of the metal materials includes pure copper including an inevitable impurity, more than 2 mass ppm of oxygen, and an additive element selected from the group consisting of Mg, Zr, Nb, Fe, Si, Al, Ca, V, Ni, Mn, Ti and Cr. A method of manufacturing a weldment includes melting a dilute copper alloy material by SCR continuous casting and rolling at a molten copper temperature of not less than 1100° C. and not more than 1320° C. to make a molten metal, forming a cast bar from the molten metal, forming a dilute copper alloy member by hot-rolling the cast bar, and welding the dilute copper alloy member to a metal material.

Abstract: A method of brazing a top loading cutter into a cutter pocket is disclosed, wherein the method includes placing at least one braze disc between an inner wall of the cutter pocket and a portion of the top loading cutter and heating the at least one braze disc to a temperature above the melting temperature of the braze disc.

Abstract: Provided is a method for manufacturing an electronic component by using a solder joining method for bonding a first electronic component having a metal electrode with a second electronic component having a solder electrode, the method comprising; (i) forming a resin layer containing a thermosetting resin on at least one of the solder joint surfaces of said first electronic component and said second electronic component; (ii) positioning said metal electrode of said first electronic component and said solder electrode of said second electronic component to face each other, heating said positioned electrodes and applying pressure, and thereby bringing said metal electrode and said solder electrode into contact; (iii) heating electronic components while applying pressure thereby fusion bonding said solder to said metal electrode; and (iv) heating said resin layer.

Abstract: A method for producing tailor-made sheet metal strips, in particular steel strips, in which at least two sheet metal strips of different material quality and/or sheet metal thickness are welded to one another along the longitudinal edge in a continuous process. In order for the sheet metal strips produced by such a method to exhibit a relatively high level of weld seam strength, uncoated sheet metal strips are used in accordance with the invention as sheet metal strips to be welded. The tailor-made sheet metal strip formed of the uncoated sheet metal strips as a result of welding is then coated.

Abstract: An assembly of two objects integral with each other through at least one linking element provided between both objects, said linking element including at least a first material portion comprising intermetallic compounds of a phase formed with a first brazing metal and a second metal the melting point of which is higher than that of the first brazing metal, said linking element further including at least a second material portion composed of at least a third metal, said second material portion contacting both objects.

Abstract: The present invention relates to an electrochromic device having at least one active area (CDEF), having, on a carrier substrate (3), a multilayer stack comprising a layer forming a lower electrode (4), various functional layers (7) at least one of which is an electrochromic layer, at least one (6, 7a) of these layers being electrically insulating, and an upper electrode (9), in which device: at least one partition (5) separating the surface of the lower electrode (4) into two isolated regions, namely a free region (4a) and an active region (4b) containing the active area (CDEF); and at least one partition (12) separating the surface of the upper electrode (9) into two regions electrically isolated from each other, namely a free region (9a) and an active region (9b) containing the active area (CDEF).

Abstract: A saw band of steel for a band-sawing machine has a band back and a row of teeth having a number of teeth, at least the row of teeth being provided with a hard material coating. According to the invention, this coating comprises one or more metals of subgroups IV, V or VI of the periodic system or aluminum or silicon and/or their nitrites, oxides, carbides, carbonitrides or borides of the aforementioned metals or mixtures thereof. A method according to the invention is a vacuum coating method, for example as PVD or paCVD.

Abstract: An embodiment of the present invention is an interconnect technique. Carbon nanotubes (CNTs) are prepared. A CNT-solder composite paste is formed containing the CNTs and solder with a pre-defined volume fraction.

Abstract: An assembly, and an associated method, facilitates egress of gasses generated during a solder process, thereby reducing the occurrence of voids in the resultant solder connection. A channel is formed to extend part way through a solder pad. The channel defines a path by which to facilitate the egress of the gas generated during the solder operation.

Abstract: A system for delivering a treatment agent such as a radioactive source to a targeted treatment site within a patient's body is disclosed. Aspects of the device provided herein include a cable with contiguous sections having different flexibility characteristics made from a same material or material mixture throughout. For example, the material can mixture have first filaments made from a first material and second filaments made from a second material wherein the first material and second material having different annealing temperatures.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

Abstract: The invention relates to a centralizing tool, and to a method of forming a centralizing tool. A disclosed method of assembling a wellbore centralizer includes the step of providing a plurality of centralizing members, each centralizing member being of unitary construction and having a first circumferential part, a second circumferential part, and a longitudinal part disposed between the first and second circumferential parts. A first collar is formed by welding the first circumferential parts into a ring. A second collar is formed by welding the second circumferential parts into a ring.

Abstract: The invention relates to a method for producing a blade tip plating (20) on a blade (10) Tor a lurhomachine, in particular on a high-pressure rotating compressor blade lor a gas turbine, comprising the following steps:—producing a particle composite material (24) having embedded hard material particles (18);—placing the panicle composite material (24) on a solder (30) applied (o the blade tip (16): and—healing the solder (30).

Abstract: Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated compound layers. The methods described may operate to produce an intermetallic layer that bonds two substrates such as semiconductor wafers together in a relatively efficient and inexpensive manner.

Abstract: A method of joining pipes (3) to produce underwater pipelines (2), wherein the facing free ends (15) of two adjacent pipes (3), aligned along an axis (A), are welded to define a cutback (18); a protective sheet (22) of plastic material is extruded close to the cutback (18); and the protective sheet (22) is wound about the cutback (18).

Abstract: The disclosed embodiments provide a fuel cell plate. The fuel cell plate includes a substrate of electrically conductive material and a first outer layer of corrosion-resistant material bonded to a first portion of the substrate. To reduce the weight of the fuel cell plate, the electrically conductive material and the corrosion-resistant material are selected to be as light as practicable.

Abstract: The present subject matter relates to the field of fabricating microelectronic devices. In at least one embodiment, the present subject matter relates to forming an interconnect that has a portion thereof which becomes debonded from the microelectronic device during cooling after attachment to an external device. The debonded portion allows the interconnect to flex and absorb stress.

Abstract: Disclosed is an austenitic welding material which contains C: 0.01 wt % or less, Si: 0.5 wt % or less, Mn: 0.5 wt % or less, P: 0.005 wt % or less, S: 0.005 wt % or less, Ni: 15 to 40 wt %, Cr: 20 to 30 wt %, N: 0.01 wt % or less, 0: 0.01 wt % or less, and the balance of Fe and inevitable impurities, wherein the content of B contained as one of the inevitable impurities in the welding material is 3 wt ppm or less, and the total content of C, P, S, N and O in the welding material is 0.02 wt % or less.

Abstract: A welding alignment and spacing article is provided for forming a welding gap between two structures to be welded together. The article includes a body having first and second surfaces that are spaced from each other at a selected spacing distance to define a region of selected body thickness. The body is formed from a non-metallic degradable body material in the region that can be wholly or partially degraded by exposure to a degrading agent to reduce the body thickness. The degradable body material is sufficiently incompressible to be useable as a spacer that maintains a specified welding gap distance between the two structures to be welded.

Abstract: A cable assembly includes a housing including a main body and a piece of mushy insulation block on the housing, a plurality of contacts receiving in the main body of the housing, and a plurality of cable. Each of the cable includes at least an inner conductor and an outer insulation layer. The inner conductors are soldered to the contacts and the outer insulation layer each has a part fixed in the mushy insulation block of the housing.

Abstract: An apparatus and method for preventing debris from accessing and wrapping around the axles of a vehicle, such as a landfill compactor, are disclosed. The apparatus may include a wheel having a rim from which radially extend a plurality of cleats or tips. A subset of tips may be provided circumferentially around a laterally inner edge of the wheel. A wheel guard may be mounted between adjacent pairs of tips of the subset. Each wheel guard may be welded to the rim and to the adjacent pairs of tips. Each wheel guard may be a unitary piece of metal, or could be provided in two or more segment so as to be adjustable and thus facilitate use on wheels of differing diameters, or with different tip spacing. The wheel guards and adjacent tips form a continuous barrier around the circumference of the wheel to prevent debris from accessing and wrapping around the axles of the compactor.

Abstract: Provided is a method of manufacturing an electronic device comprising a first electronic component having a first terminal and a second electronic component having a second terminal, wherein said first electric component is electrically connected to said second electronic component by connecting said first terminal to said second terminal with solder, the method comprising, providing a resin layer having a flux action between said first terminal and said second terminal to obtain a laminate including said first electronic component, said second electronic component, and said resin layer, wherein a solder is provided on said first terminal or said second terminal; soldering said first terminal and said second terminal; and curing said resin layer while pressing said laminate with a pressurized fluid.

Abstract: There is provided a functional panel that can be joined and disassembled with ease by solving problems with a functional panel including electrical conductors integrally molded therewith, causing occurrence of cracking on the surface thereof, or cracking of a molded unit around the periphery of the electrical conductor, thereby rendering the electrical conductor susceptible to a break when a flexural load, an impact load, and so forth, acts on the functional panel. The functional panel comprises a main body of a panel member, an electrical conductor coated with a semi-cured resin having heat resistance and insulation properties, and a reinforcing fiber having a continuous filament, for fixing the electrical conductor to the main body of the panel member to thereby provide enhancement, and the functional panel is formed by exposing one end, and the other end of the electrical conductor from respective end faces of the panel member formed by integral molding.

Abstract: A thermoelectric device, an intermediate, a module, and a method for manufacturing the same are provided, wherein productivity is high, material costs are comparatively low, and there is a low environmental load. A thermoelectric device, wherein a block body has at least one P and N piece made of P-type and N-type materials, which are alternately sandwiched between insulation layers, wherein the adjacent P and N piece boundary portions are welded together, with the P and the N piece of the block body being electrically connected in a zigzag manner, and a plurality of block bodies are arranged in parallel, the block bodies adjacent to each other being bridged by an electrode to extend the electrical connection in the series; an intermediate using such a thermoelectric device; and a thermoelectric module using the intermediate are provided. In this case, as the P-type and N-type materials, any material preferably used for thermoelectric pairs can be used.

Abstract: The invention relates to a method for forming a highly electroconductive surface on an aluminum piece. A highly conductive layer of silver is formed on the piece by means of a eutectic join. The temperature of the aluminum piece is raised gradually and the oxide layer formed on the surface of the piece is removed. After the first heating stage, the silver piece that is to be attached is transferred to the cleaned surface. The contact point is heated to a temperature where a eutectic bond is generated between the aluminum and silver. During the second heating stage a slight momentary loading is applied to the contact point.

Abstract: A method of manufacturing a wheel balance assembly (500) from a clip and weight, the method comprising the following steps: 1. annealing at least a portion of the clip; 2. positioning the clip and weight adjacent one another; and 3. welding the clip and weight to one another.

Abstract: A cast metal part has a veneer made of cosmetic metal applied thereto so that the cast metal part has a cosmetic surface. A method for producing a cast metal part with a cosmetic surface comprises applying a veneer of cosmetic metal to a surface of the cast metal part. The cast metal part can be a die cast part, such as die cast aluminum or zinc. The veneer can be thin gauge highly cosmetic aluminum. The veneer of cosmetic metal can be applied to the surface of the cast metal part by placing the veneer into a casting mold used for forming the cast metal part, and casting molten metal onto the veneer in the casting mold. The veneer of cosmetic metal can also be applied to the surface of the cast metal part by solid-state welding, e.g., diffusion bonding, the veneer and the cast metal part together.

Abstract: A method of forming a solder dam on a lead of an electronic component includes forming the looped solder dam surrounding a target lead, to which the solder dam is to be formed, of a plurality of leads connected to the electronic component, by fitting a C-shaped fitted member to the target lead at a predetermined location.

Abstract: The present disclosure relates to forming a plurality of through silicon vias guard rings proximate the scribes streets of a microelectronic device wafer. The microelectronic device wafer includes a substrate wherein the through silicon via guard ring is fabricated by forming vias extending completely through the substrate. The through silicon via guard rings act as crack arresters, such that defects caused by cracks resulting from the dicing of the microelectronic wafer are substantially reduced or eliminated.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

Abstract: In a method of preparing an aluminum surface, flux is applied to the aluminum surface and the aluminum surface is brazed. Residual flux and metal oxides are removed from the aluminum surface using an aqueous fluid having a pH between about 5 and about 9.

Abstract: The present invention is directed to a process for joining tantalum clad steel structures. The process broadly comprises: a) providing a first tantalum clad section, said first tantalum clad section comprising a tantalum layer over a steel layer, with a bonding layer optionally therebetween, with a portion of said steel layer in an edge region not being covered by said tantalum layer or said bonding layer, b) providing a second tantalum clad section, said second tantalum clad section comprising a tantalum layer over a. steel layer, with a bonding layer optionally therebetween, with a portion of said steel layer in an edge region not being covered by said tantalum layer or said bonding layer, c) locating said steel edge regions adjacent each other, d) welding the steel edge regions together, e) cold spraying a tantalum powder onto the welded edge regions and over the tantalum layers adjacent said edge regions thereby joining the tantalum clad steel sections.

Abstract: A method for cleaning a thermode tip including applying an energy pulse to the thermode tip. The energy pulse involves raising the temperature of the thermode tip higher than the working temperature of the thermode tip. A method for cleaning a thermode tip may include periodically performing a predetermined number of soldering cycles at a working temperature; and applying an energy pulse to the thermode tip.

Abstract: The invention relates to a method for joining two components (10, 12) made of a metal material, which are connected on two mutually associated joining surfaces (14, 16) by means of a joined connection, wherein at least one of the components (10) is strengthened in at least a partial region of the joining surface (14) thereof prior to joining. The invention further relates to a joined connection of two components (10, 12) made of a metal material.

Abstract: The invention relates to a method for joining cathode metal sheets to form crude strips that can be coiled and rolled and for the production of metal strips of a constant thickness from crude strips that have been produced from cathode metal sheets of varying thicknesses. The aim of the invention is to produce metal strips of a high purity that are devoid of non-metallic inclusions. The method can be used whenever highly pure and/or inclusion-free metal in strip or foil form is required in large quantities. The application of said method is only limited by the fact that the metal is deposited electrolytically on cathodes, and if permanent cathodes are used, must be separated from said cathodes without fragmentation. This is possible with the following metals: lead, zinc, tin, copper, nickel, cobalt, cadmium, iron and gold.

Abstract: Methods of fabricating graphene using an alloy catalyst may include forming an alloy catalyst layer including nickel on a substrate and forming a graphene layer by supplying hydrocarbon gas onto the alloy catalyst layer. The alloy catalyst layer may include nickel and at least one selected from the group consisting of copper, platinum, iron and gold. When the graphene is fabricated, a catalyst metal that reduces solubility of carbon in Ni may be used together with Ni in the alloy catalyst layer. An amount of carbon that is dissolved may be adjusted and a uniform graphene monolayer may be fabricated.

Abstract: A shield for shielding structures, vehicles and personnel from a projectile and/or an explosive blast generally includes a substantially planar shield plate adapted for attachment to a structure to provide protection to the structure. The shield plate includes a chassis having an interior surface facing the structure and an opposite outer surface, and a ballistic liner disposed on the outer surface of the chassis such that the chassis is more proximal the structure than the ballistic liner. The ballistic liner has an exterior surface facing the exterior environment.

Abstract: The present invention provides a method for coating an article comprising applying a thermal spray coating to the article; applying a brazing material to the article; and heating the brazing material to at least a brazing temperature of the brazing material to form a resultant coating on the article, wherein the resultant coating is characterized by at least partial metallurgical bonding or at least partial alloying between the thermal spray coating and the brazing material.