Abstract: Flowable brazing compositions and methods of brazing metal articles together using the same are provided herein. In an embodiment, a flowable brazing composition includes a non-polymeric carrier medium and flux-coated particles. The carrier medium includes at least one polar organic solvent and is liquid at ambient temperature. The flux-coated particles include a braze material core and a flux coating disposed on the core. The braze material core includes different material from the flux coating. The flowable brazing composition has less than or equal to about 1.5 weight % of polymeric binder components, based upon a total weight of the flowable brazing composition.

Abstract: A process for manufacturing a honeycomb seal is disclosed. The process includes the following steps: a) the honeycomb structure is brought to the desired three-dimensional form and is fixed in this form; b) then the honeycomb structure is filled with a filler material; c) then the honeycomb structure filled with the filler material is machined on a side on which a carrier element is arranged, such that this side has the desired contour and that the end edges of the honeycomb structure are sealed flushly with the filler compound; d) then the side contoured in this way is coated with a coating; e) next the carrier element is applied to the coating, preferably by laser powder build-up welding.

Abstract: A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 ?m or less.

Abstract: Braze and electrode wire assemblies, e.g., used with an implantable microstimulator, include a wire welded in the through-hole of an electrode, which electrode is brazed to a ceramic case that is brazed to a metal ring that is welded to a metal can. The braze joints are step or similar joints that self-center the case, provide lateral support during braze assembly, and provide increased surface area that prevents braze material from exuding from the joints. The end of the ceramic case that is brazed to the metal ring need not be specially machined. The shell has a reference electrode on one end and an active electrode on the other, and is externally coated on selected areas with conductive and non-conductive materials.

Abstract: A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.

Abstract: To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser chip having a p-side electrode and a n-side electrode in a crystalline substrate and a mounting plate having a first solder film and a second solder film in a supporting body. The laser chip has a level difference A such that the p-side electrode is projected beyond the n-side electrode. The mounting plate has a level difference B such that the first solder film is projected beyond the second solder film. The level difference B of the mounting plate is determined as higher than the level difference A of the laser chip. Therefor, when the mounting plate is overlaid to the laser chip, first, the n-side electrode contacts with the second solder film, and then, the p-side electrode contacts the first solder film.

Abstract: A composite material is produced by a method where an adhesive composition which comprises a particulate material that reduces thermal stress and a brazing material containing a noble metal element as a base, wherein the adhesive composition can bond two or more kinds of different members to form a composite member with sufficient bond strength to avoid causing damages, such as cracks that occur on the side of the member that is weak against thermal stress, and also by a method to produce a composite member comprised of two or more kinds of different members, in which either the adhesive composition is used or the bonding portion of the different members is filled with the particulate material that reduces thermal stress, and then a molten brazing material is poured there into, and cooled to bond the members.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract: Interconnection elements for electronic components, exhibiting desirable mechanical characteristics (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart a desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element.

Abstract: A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract: Lead connection in a structure is provided by leads disposed against electrodes of wiring board through resin, which resin is then stiffened by the application of light. Accordingly, an electrical and a mechanical connection of the leads and the electrodes is accomplished.

Abstract: Two materials having different coefficients of thermal expansion are brazed together by use of an interlayer of expanded metal therebetween. The expanded metal makes point-type contact with the two materials and accommodates stresses resulting from the expansion difference.

Abstract: Lead connection in a structure is provided by leads disposed against electrodes of wiring board through resin, which resin is then stiffened by the application of light. Accordingly, an electrical and a mechanical connection of the leads and the electrondes is accomplished.

Abstract: Disclosed is a method for bonding one of the principal planes of a lead formed on a film or the like and an electrode formed on the face side of a semiconductor element, by way of metal bumps, wherein the electrode, metal bumps and lead are pressurized between a support for supporting the semiconductor element and a jig placed at the other principal plane side of the lead, and the semiconductor element is heated so that the temperature at the back side of the semiconductor element may be higher than that at the face side of the semiconductor element. According to this method, it is enough to heat the support at the semiconductor element side, and it is not necessary, as required in the prior art, to heat temperature, and the conventional problems such as fusion of lead to the boding tool are solved.

Abstract: A relatively large scale low cost method of fabricating optical devices with associated coupling lenses comprises the following steps:(a) producing in one surface of a substrate (1) of suitable material(s) a predetermined array of planar diffused lenses (4);(b) forming or otherwise producing on the opposite surface of the substrate (1) remote from the planar lenses (4) but in predetermined positional relationship to the lenses in the general planar direction of the substrate an array or pattern of metallic bonding pads or other registration means co-operable with corresponding pads or other means provided on a multiplicity of optical devices (10) for the accurate registration of such devices relative to the optical lenses; and,(c) dividing the substrate (1) into a multiplicity of parts each of which comprises an optical device (10) having an associated planar lens (4).

Abstract: Disclosed is a method of realizing high-density and inexpensive semiconductor apparatus by joining the electrodes of two semiconductor devices. A metal bump formed on a substrate is transferred and joined onto the electrode of first semiconductor device, and electrode of second semiconductor device and the metal bump transferred and joined on the first semiconductor device are positioned, pressed and heated, thereby joining the two semiconductor devices together.

Abstract: A method of assembly of at least two ceramic components each having at least one flat surface, as applicable in particular to microwave equipment and encapsulation modules for microwave semiconductors. The starting components are made of ceramic material which has been pre-fired, or in other words heated to about 1500.degree. C., and are therefore rigid. The components are no longer joined together by means of a glass paste or a brazed joint between metallized parts but are heated to over 1700.degree. C. The impurities which are present in the ceramic material in a proportion of 1 to 10% serve as a flux and produce an autogenous weld between the two components. Prior to assembly, the ceramic components can be provided with metallizations such as electric tracks on condition that these metallizations are refractory.

Abstract: A method for bonding Si.sub.3 N.sub.4 or SiC ceramics with metals which comprises the steps of depositing, on the ceramic material, an insert material consisting of a mixture of at least one metal selected from the group consisting of Ni and Cu and at least one member selected from the group consisting of metal oxides, nitrides and carbides by ion plating or spary coating, subjecting the deposited insert material to thermal reaction treatment to permit metallurgical bond between the insert material and the ceramic material, and bonding a metal member to the surface of the insert material by brazing with a brazing material whose melting point is lower than the insert material or by diffusion welding at a temperature lower than a melting point of the insert material.

Abstract: This invention relates to devices and methods of manufacturing cut glass panels which comprise a plurality of glass panes arranged in a predetermined pattern with novel came flanges that span the adjacent edges of the glass panes on both sides of the panel. In this manufacturing method, a pair of complementary came-flange gridworks that correspond to mirror images of the predetermined pattern are first constructed. The cut glass panes are then positioned between the inner surfaces of the complementary gridworks so that the edges of each pane are separated from the edges of adjacent panes by spaces that form a network of continuous interconnected channels, and so that those channels are completely spanned by and sandwiched between the inner surfaces of the complementary came-flange gridworks. In a preferred embodiment, the outer surface of one of the gridworks is then sealed to all adjacent glass surfaces with a releasable cement. The cemented came-pane assemblage so formed is detached from the other gridwork.

Abstract: A collector for electric machines, including a rotationally symmetrical sintered ceramic body and a plurality of radially disposed metallic segments which are separated from each other by one interspace each and which are bonded to the ceramic body via a eutectic intermediate layer. The segments are bonded to the ceramic body in accordance with the eutectic method by being surface-oxidized on their inside narrow side and radially pressed against the ceramic body with the totality being brought to the melting temperature corresponding to the metal/metal-oxide eutectic and subsequently being cooled down again. A preferred embodiment includes: copper segments on an Al.sub.2 O.sub.3 ceramic body.

Abstract: In directly bonding a metal to ceramics, in accordance with the invention, that surface of a metal component which is to be bonded by heating to a ceramic substrate is provided with parallel-running grooves before the preoxidation. The grooves make it possible to optimize the quantity of oxygen available at the bonding location and provide good flow behavior of the melt. As a result, a bond with good adhesion is obtained. Moreover, there is no formation of a thicker oxide layer on the free smooth surface of the metal component.

Abstract: A method for matching the bonding pad surfaces of a device and heatsinks to be bonded, which method maximizes the uniformity of pressure applied during thermocompression bonding, is disclosed. The method comprises using the collet of a die bonding machine to burnish the bonding pad on a heatsink. The collet is then traversed to a second workstage where the collet is used to pick up a device and burnish the device bonding pad against a suitable burnishing medium. The collet, with the device, is then traversed back to the main workstage where thermocompression bonding of the device to the heatsink is carried out. The alignment of the collet is locked and maintained throughout all of the steps to insure that all burnished surfaces are parallel and that the pressure during bonding is perfectly perpendicular to those parallel surfaces.

Abstract: A method suitable for connecting a plurality of metal leads at the same time with electrodes of a semiconductor device. Metal leads are provided each of which has a metal bump bonded thereto. The metal of the metal bump is softer than that of the lead. Those metal leads are located above the semiconductor device so that the bumps are contacted with the electrodes and then the bumps are bonded to the electrodes by heating, whereby the metal leads are connected with the electrodes.

Abstract: A method for positioning and fixing optical components relative to one another which comprises the steps of providing a carrier plate having an optical component, securing an optical component on a retainer plate having at least one solderable area, positioning the retainer plate above the carrier plate with a reference mark on said plates being aligned and the solderable area on each of the two plates being disposed in aligned pairs of solderable areas, applying at least one solder piece to each pair of solderable areas as the plates are held in the position, melting the solder pieces, allowing the molten metal to solidify to secure the aligned plates together and then releasing the secured aligned plates.

Abstract: A method of forming circuit packages including bonding an electronic component, (10) such as a chip carrier, to a supporting substrate (22). Solid solder preforms (13) are applied to contact members (12) on the component or substrate or both. The preforms are bonded to the contact members by heating to a temperature below the melting point of the solder while applying force to the preforms. The preforms are therefore bonded without melting, and fluxing and cleaning operations may be eliminated. The component can then be bonded to the substrate by the same solid phase technique.

Abstract: In the manufacture of glazing panels comprising sheets marginally bonded together, in order to simplify and speed up production, a method of effecting bonding between at least one such sheet and one or more members assembled in marginal contact therewith, comprising bringing the assembly within the sphere of treatment means which is carried by a frame and causing the treatment means to act simultaneously on each side margin of the assembly to bond it together. In an apparatus for performing the method, in order to accommodate assemblies of different sizes carried by a support, each beam of the frame is coupled at one end relative to a movable coupling, whereby the end of each beam is movable along another beam in the direction of whose length its end coupling is movable, so that the size of the frame can be adjusted.

Abstract: A method is provided for thermo-compression diffusion bonding respective structured copper strain buffers directly to each of the two major opposed surfaces of a substrateless semiconductor device wafer having a beveled outer edge surface. A selected portion of each strain buffer axially aligned with a like portion of the other strain buffer is diffusion bonded to the wafer while subjecting the wafer only to substantially compressive force so as to avoid wafer fracture. The lateral extent of each strain buffer is less than that of the respective wafer surface in contact therewith, allowing the beveled surface to be cleaned and passivated prior to attachment of the strain buffers to the wafer via diffusion bonding.

Abstract: A method of soldering a first, vitreous component for example a sheet to at least one second component which is vitreous or metallic, in which the or each vitreous component is metallized in the joint region(s), the components are assembled together in the required relationship where they may be held by a clamp and the joint region(s) of the assembly is or are dipped in a bath of molten solder to bond it together as a unit. Such a unit may be constituted as an envelope containing one or more electrical circuit components, as a fluid flow directing unit or as a pane for incorporation into a leaded window.

Abstract: A method is provided for thermo-compression diffusion bonding first and second structured copper strain buffers, respectively, directly to the two opposed surfaces of a substrateless semiconductor device wafer. The expensive tungsten or molybdenum support plate conventionally used to provide structural integrity to the relatively fragile semiconductor device wafer is thus eliminated. The method includes sandwiching the semiconductor device wafer between copper strand type strain buffers each having a lateral extent greater than the lateral extent of the wafer, diffusion bonding the strain buffers to the semiconductor device via first and second metallic coating layers, and removing most of the overhanging portions of the buffer which are not bonded to the wafer. A step of etching and passivating the edges of the wafer is also disclosed.

Abstract: A curved section is provided for connecting in a conduit through which passes a fluid stream having solid material entrained therein. A plurality of wear strips are attached to the inside wall of the curved section. They are positioned for the solid material to impinge thereon as the fluid stream changes its direction of flow as it passes through the curved section. The wear strips are elongated members of wear resistant material positioned side-by-side along the inside wall against which the solid material impinges. The abutting sides of adjacent wear strips are beveled so that the outer edges of one adjacent strip extends over the inner edge of the other adjacent strip to provide a continuous surface of wear resistant material in the path of the entrained solid material.

Abstract: An improved metallization system for semiconductor substrates comprising successive layers of at least one barrier metal and tin is disclosed. A semiconductor package comprising a housing of impervious material, a semiconductor device having the metallization system of this invention disposed in the housing and conductor means bonded to the tin on the semiconductor device is also disclosed. The system is of particular usefulness in double stud diode packages.

Abstract: The capacitive fluid pressure transducers described herein comprise quartz bodies and diaphragms having suitable electrodes deposited thereon to form both sensing and reference capacitors in appropriate configurations for high fidelity measurement of relative blood pressure, said transducers being substantially unaffected by temperature and other environment factors.

Abstract: Disclosed is a double side cooled, pressure mounted semiconductor package and a method for the manufacture thereof. The package is formed by directly bonding upper and lower metal contact assemblies to an annular ceramic housing. Assembly is simplified if at least one contact assembly comprises two parts applied sequentially. An annular flange having a central opening approximately the size of the central opening in the annular housing and having an outside diameter larger than the outside diameter of the ceramic housing is direct bonded to one end of the housing simultaneously with a lower semiconductor contact. After a conventional semiconductor pellet is positioned in the housing, the second part, a metal contact disc with an outside diameter approximately equaling the outside diameter of the flange, is positioned thereover. Finally, the flange and the disc are welded around their peripheries.

Abstract: A beam-lead integrated circuit chip structure which comprises a semiconductor chip substrate having a passivated planar surface from which active and passive devices in the circuit extend into the substrate. A plurality of peripheral beam-leads interconnected with the chip devices extend beyond the periphery of the chip and a plurality of solder mounds having a lower melting point than said beam-leads extends from the surface of the chip to a point beyond the plane of the beam-leads.This chip structure permits a method of automatic alignment of said plurality of beam-leads with a corresponding plurality of beam-leads on a dielectric substrate which involves placing the chip on the substrate so that said plurality of solder mounds are respectively in registration with a plurality of corresponding solder-wettable land pads on said non-wettable dielectric substrate.

Abstract: A process for making an interconnect system for a multilayer circuit pattern. The interconnect system is formed having minimized through-hole space consumption so as to be suitable for high density, closely meshed circuit patterns.

Abstract: Providing a high strength, hermetic ceramic to metal seal by essentially heating a wire-like metal gasket and a ceramic member, which have been chemically cleaned, while simultaneously deforming from about 50 to 95 percent the metal gasket against the ceramic member at a temperature of about 30 to 75 percent of the melting temperature of the metal gasket.

Abstract: A curved section is provided for connecting in a conduit through which passes a fluid stream having solid material entrained therein. A plurality of wear strips are attached to the inside wall of the curved section. They are positioned for the solid material to impinge thereon as the fluid stream changes its direction of flow as it passes through the curved section. The wear strips are elongated members of wear resistant material positioned side-by-side along the inside wall against which the solid material impinges. The abutting sides of adjacent wear strips are beveled so that the outer edges of one adjacent strip extends over the inner edge of the other adjacent strip to provide a continuous surface of wear resistant material in the path of the entrained solid material.