Abstract: In various embodiments, apparatuses for receiving and supporting one or more components during processing thereof at process temperatures greater than approximately 1000° C. feature refractory metal shelves separated by refractory metal support posts.

Abstract: In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.

Abstract: The present concept is a method of cladding and fusion welding of superalloys and includes the steps of firstly application of a composite filler powder that consists of 5-50% by weight brazing powder which includes melting point depressants, and 50-95% by weight high temperature welding powder, to a superalloy base material. Secondly there is simultaneous heating of the base material and the composite filler powder by a welding heat source that is movable relative to the base material. There is heating to a temperature that will fully melt the brazing powder and at least partially melt the high temperature welding powder and also melt a surface layer of the base material, thereby forming a weld pool. Thirdly upon solidification and cooling of the weld pool, there is coalescence between the weld bead and the base material.

Abstract: The invention concerns a method for manufacturing a steel component (6, 11) comprising a first steel part (7) and a second steel part (8), the first (7) and second (8) steel part having a carbon content up to 1.5 weight percent, The method is comprising: Heating (1), at least partly, the first steel part (7), and at least partly, the second steel part (8), to above the alpha/gamma transformation temperature, and joining (2) the first steel part (7) and the second steel part (8) by welding, the welding taking place at a temperature above the alpha/gamma transformation temperature, and cooling (3) such that hardening effects are avoided. The invention further concerns weld seams (9), welded steel components (6, 11), and bearing components (11, 15, 20, 22, 26, 27, 31).

Abstract: The invention relates to a method for manufacturing finned tubes made of metal, in particular heat exchanger tubes, where at least one continuous strip forming the fins is fed tangentially to a tubular body set into rotational motion, and wound onto it, the side of the strip facing the tubular body is connected to the tube surface by means of a welding device and using a filler material, and the strip to be wound is guided between guide discs just behind the welding area, said discs reaching close up to the tube surface and the welding point. To increase the service life of the guide discs, the guide discs are cooled, specifically with cooling water to which roughly 10% by volume of a welding release agent are added.

Abstract: A reflow method for solder includes heating the solder to a first temperature that is above a liquidus temperature of the solder; cooling the solder to a second temperature that is below a solidification temperature of the solder; reheating the solder to a third temperature that is above a solidus temperature of the solder and below the liquidus temperature of the solder; cooling the solder to a fourth temperature that is below the solidification temperature of the solder.

Abstract: This disclosure describes a method and apparatus for controlling the temperature of a welding zone for welding together pipe sections. The temperature is controlled by a flow of inert gas through the pipes. The inert gas flow is cooled and acts as a heat sink to remove heat from the weld zone thereby controlling the weld zone temperature.

Abstract: A method for repairing a component of a gas turbine and a solder alloy are disclosed. In an embodiment, the method includes applying the solder alloy to the component in an area of the component having a punctiform damage or a linear imperfection, where the solder alloy is a mixture of a NiCoCrAlY alloy and a Ni-based solder. A molded repair part made of the solder alloy is applied to the component in an area of the component having a planar defect. The component is heat treated to solder the molded repair part on the component and to solder the solder alloy applied to the component in the area of the component having the punctiform damage or the linear imperfection. The component is cooled after the heat treating and, following the cooling, the component is further heat treated.

Abstract: A process for manufacturing a honeycomb seal is disclosed. The process includes the following steps: a) the honeycomb structure is brought to the desired three-dimensional form and is fixed in this form; b) then the honeycomb structure is filled with a filler material; c) then the honeycomb structure filled with the filler material is machined on a side on which a carrier element is arranged, such that this side has the desired contour and that the end edges of the honeycomb structure are sealed flushly with the filler compound; d) then the side contoured in this way is coated with a coating; e) next the carrier element is applied to the coating, preferably by laser powder build-up welding.

Abstract: A welding apparatus for welding workpieces of high-temperature superalloys is provided. The welding apparatus includes a heat source for producing a heat input zone on the workpiece surface, a supplying device for supplying welding filler into the heat input zone and a transporting device for producing a relative movement between the heat source and the supplying device on the one hand and the workpiece surface on the other hand. The welding apparatus further includes a control unit with a control program, which carries out the relative movement in such a way that the welding power and the diameter of the heat input zone are set such that the cooling rate during the solidifying of the material is at least 8000 Kelvins per second.

Abstract: A welding jig for ensuring concentricity of an interior surface of a pipe with a circular outer periphery of a bolting flange thereon, comprising (i) a frame member; (ii) two spaced-apart rollers positioned at one end of said frame member, each adapted to remain in contacting engagement during welding with said circular outer periphery of said bolting flange; and (iii) a chill block, having a convexly-curved outer surface of a curvature corresponding to a desired inner diameter of said pipe, adapted to be positioned proximate said interior surface of said pipe. The rollers permit translational movement of the chill block about a center point of said pipe flange when the welding jig is placed on the pipe flange, to permit uniform diametrical deposition of weld material on said inner diameter of said pipe flange. A method of making a pipe is further disclosed and claimed.

Abstract: Two thin-walled jackets a joined by preparing end faces of the jackets by plastically deforming and upsetting microprojections thereon and thereby forming the metal of the upset microprojections into annular beads on inner surfaces of the respective jackets. Then the end faces are abutted while centering the jackets on each other relative to their external diameters. The end faces are then spot welded together in a plane where the end faces abut and then joined with a continuous main weld having a width equal to between four and six times the thickness of the wall of the jackets. Heat is then extracted from the welded jackets starting at a distance not exceeding times the wall thickness from a joint center line where the end faces abut.

Abstract: The present invention relates to a method for producing a multi-part piston (10, 110) for an internal combustion engine, comprising the following method steps: producing an upper piston part (11) and a lower piston part (12), each having an inner support element (22, 26; 122, 126) having joining surfaces (24, 28; 124, 128) and an outer support element (23, 27; 123, 127) having joining surfaces (25, 29; 125, 129), applying a high-temperature solder material in the area of at least one joining surface (24, 28 or 25, 29; 124, 128 or 125, 129), assembling the upper piston part (11) and the lower piston part (12) to form a piston body by establishing a contact between the joining surfaces (24, 28 or 25, 29; 124, 128 or 125, 129), placing the piston body in a vacuum furnace and evacuating the vacuum furnace; heating the piston body at a pressure of at most 10?2 mbar to a soldering temperature of at most 1300° C.

Abstract: Provided are a heat releasing material for an electronic device being manufactured by the junction of a metal impregnated carbon composite material on a copper or aluminum substrate with reduced warpage; and a method for manufacturing the heat releasing material. A metal substrate/metal impregnated carbon composite material structure, characterized in that it comprises a metal substrate comprising a metal sheet, plate or block and, being joined on the metal substrate via a brazing material, a metal impregnated carbon composite material having a thickness of 0.1 mm to 2 mm; and a method for manufacturing the metal substrate/metal impregnated carbon composite material structure, characterized in that it comprises a step wherein a brazing material is caused to be present between the metal substrate and the metal impregnated carbon composite material, and they are kept at a temperature of 500° C. or higher and under a pressure of 0.2 MPa or more and then cooled.

Abstract: A welding jig for ensuring concentricity of an interior surface of a pipe with a circular outer periphery of a bolting flange thereon, comprising (i) a frame member; (ii) two spaced-apart rollers positioned at one end of said frame member, each adapted to remain in contacting engagement during welding with said circular outer periphery of said bolting flange; and (iii) a chill block, having a convexly-curved outer surface of a curvature corresponding to a desired inner diameter of said pipe, adapted to be positioned proximate said interior surface of said pipe. The rollers permit translational movement of the chill block about a center point of said pipe flange when the welding jig is placed on the pipe flange, to permit uniform diametrical deposition of weld material on said inner diameter of said pipe flange. A method of making a pipe is further disclosed and claimed.

Abstract: To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.

Abstract: A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate.

Abstract: This relates to a process for controlled atmosphere brazing including, brazing an aluminium alloy without flux in a controlled atmosphere, while using brazing sheet including an aluminium alloy core upon which on at least one side a layer of filler alloy is clad. The filler clad layer has an inner-surface and an outer-surface, the inner-surface is facing the core and the outer-surface is devoid of any further metallic based layers. The filler alloy has a composition which is Na-free, Li-free, K-free, and Ca-free, and includes, in wt. %: Si 3% to 15%, Mg 0.05% to 0.5%, one or more elements selected from the group of: (Bi 0.03% to 0.2%, Pb 0.03% to 0.2%, Sb 0.03% to 0.2%, and the sum of these elements being 0.2% or less), Fe 0 to 0.6%, Mn 0 to 1.5%, the balance aluminium and incidental impurities.

Abstract: A method is provided for brazing porous metal parts. By heating a filler metal such as a brazing alloy containing composition to a temperature between the solidus and liquidus temperature, the brazing alloy can be caused to partially infiltrate the pores of a porous metal part. After being infiltrated, the brazing alloy containing composition may be cooled and thereby able to form a strong adhesion between the porous metal parts and another material. The other material may, for example, be a solid material or another porous metal part.

Abstract: A highly reliable semiconductor chip electrode structure allowing control of interface reaction of bonding sections even in the case of using two- or three-element solder used conventionally is disclosed. A solder alloy making layer for preventing dissolving and diffusion of tin into tin-based lead free solder is thinly formed on a UBM layer. The tin-based solder is supplied in solder paste or solder ball form. A combined solder alloy layer composed of a combination of intermetallic compounds, one of tin and the solder alloy making layer, and one of tin and the UBM layer, is formed by heating and melting.

Abstract: A repair method of propagating epitaxial crystalline structures is provided. The repair method broadly comprises the steps of providing a substrate to be repaired, placing an additive material as a preformed shape onto an area of the substrate to be repaired, utilizing a heat source to heat an entire volume of the additive material and an area adjacent to the additive material to within 0-100° F. of their solidus temperatures, holding at the fusion temperature for a time sufficient to allow grain growth and orientation to occur, and ramping down the heat source at a predetermined controlled rate until solidification is complete.

Abstract: A diffuser plate for a reflow oven includes an upper surface and a plurality of nozzle openings therein. Each of the plurality of nozzle openings has a raised surrounding portion for restricting condensed flux on the upper surface of the diffuser plate from flowing through the nozzles. A drain hole permits condensed flux on the upper surface to flow downward through the plate.

Abstract: Residual tensile stresses can be mitigated through methods and systems provided by the present invention. Such a method can include securing a metal member (10) to a substrate and at least partially surrounding a portion of the metal member (10) with a cooling fluid (18). As a result, the cooled portion of the metal member (10) contracts a predetermined amount. Once cooled, the metal member may be fixed, preferably welded, to another metal member in a constrained relationship. As the portion of the metal member is returned to its original temperature, expansion of the metal member acts to mitigate residual tensile stresses in the metal assembly. Tensile stress in restrained members, cambering, and structural deformation can be readily controlled in an assembled structure.

Abstract: Method for preventing solder from rising to a portion of an electric contact when the electric contact is being soldered to a copper foil so as to extend therefrom. The portion is plated with a noble metal and adapted to contact a mating object. Cooling means is brought into contact with at least the portion of the electric contact adapted to contact the mating object, and connection portion between the electric contact and the copper foil is heated by heating means. The rising of solder can be prevented and the electric contacts thus obtained are superior in mechanical property (sufficient bonding strength), electrical property (conductive property and low contact resistance), resistance to environmental conditions (impediment to oxidization), and physical property (limitation of rise of solder due to capillary action).

Abstract: To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.

Abstract: A soldering method for soldering an electronic component onto a circuit board is provided. The soldering method uses a cooling circuit board as the circuit board. The cooling circuit board includes an insulation substrate and a metal heat sink. The insulation substrate has a front surface with a metal circuit and a rear surface to which the heat sink is fixed. The heat sink has a refrigerant passage. The electronic component is arranged on the metal circuit with solder in between. A heated heating medium is supplied to the refrigerant passage when heating and melting the solder.

Abstract: The present invention relates to a method and device (10) for the temperature treatment of workpieces (19) or components, in particular for producing a solder connection between a solder material and at least one component or workpiece used as a solder material carrier by means of melting the solder material arranged on the solder material carrier, where a heating and, in a subsequent method step, a cooling of at least one component is carried out in a process chamber (13, 14) which is sealed from the surrounding area, wherein the heating and the cooling of the component (19) are carried out in two chamber regions (13, 14) of the process chamber (12), which can be separated from one another by means of a condensation device (15).

Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.

Abstract: A system and method are provided for injection molding conductive bonding material into a plurality of cavities in a mold within a vacuum chamber. A mold and a fill head are located within a vacuum chamber, wherein the mold includes a plurality of cavities. A vacuum is created within the vacuum chamber, thereby removing air from the chamber and from the cavities. Optionally, rotational motion is provided to at least one of the mold and the fill head while the fill head is in substantial contact with the mold. Conductive bonding material is forced out of the fill head toward the mold, and into at least one of the cavities, while a vacuum is maintained in the vacuum chamber.

Abstract: A method of brazing stainless steel components to form a complex shape such as an impeller. The method includes the steps of providing the stainless steel components shaped and formed from a selected stainless steel alloy; providing a brazing alloy having a selected composition and compatibility with stainless steel; heating the stainless steel components and brazing alloy for a controlled time to a liquidus temperature to effect brazing; cooling the stainless steel components and brazing alloy to a quench temperature substantially lower than the liquidus temperature of the brazing alloy to provide a tensile strength of greater than about 20 Ksi in the brazing alloy; and quenching the assembly from the quench temperature to a temperature of less than about 400° F. in a given time to provide a brazed assembly free of distortion and cracks with desired mechanical properties in the stainless steel components by virtue of the thermal treatment.

Abstract: A solder bump reflow process includes raising the temperature of an aligned die-substrate assembly to a temperature and for a time sufficient to cause a first reflow; allowing the temperature of the assembly to fall to a first cooling temperature and for a time sufficient to re-solidify the solder; raising the temperature of the die-substrate assembly a second time to a temperature and for a time sufficient to cause a second reflow; allowing the temperature of the assembly to fall a second time to a second cooling temperature and eventually to an ambient room temperature; in which at least the first and second melts and the first re-solidification are conducted without exposing the assembly to oxidizing atmosphere. Also, apparatus for carrying out the method includes a multi-zone oven.

Abstract: The present invention provides seam-welded, air hardenable steel tubes, methods of manufacturing seam-welded air hardenable steel tubes, tube mills for practicing such methods and applications for using seam-welded, air hardenable steel tubing of the present invention.

Abstract: A system and method for reflowing solder to interconnect a plurality of electronic components (24) to a substrate (12) is disclosed. The system includes an oven for preheating the substrate (12) and the plurality of electronic components (24) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (72), a pallet (14 ) for supporting the substrate (12), wherein the pallet (14) has at least one internal cavity (40), and a phase-transition material (42) disposed within the cavity (40) for absorbing heat from the pallet (14).

Abstract: An apparatus and method for making a seam-welded steel pipe free of untempered martensite without seam anneal. The method includes selecting a steel containing a carbon concentration below a predetermined level, for example, 0.14% or 0.12% by weight. The method also includes flooding both outside and inside of the strip with a coolant while the weld seam is being formed, and continuing to immerse the welded strip for a sufficient time after the weld seam is formed to prevent the formation of untempered martensite. The apparatus includes a heater capable of heating the strip to a temperature sufficient to form a welded seam, a cooling module configured to supply a coolant to the welded seam both inside and outside of the strip as the weld seam is being formed, and another cooling module configured to immerse the welded strip in a coolant after the weld seam is formed for a sufficient length of time to prevent the formation of untempered martensite.

Abstract: The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer because of the cooling is removed through direct contact with a post-forming bumps heating device, or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.

Abstract: A method of brazing stainless steel components to form a complex shape such as an impeller. The method includes the steps of providing the stainless steel components shaped and formed from a selected stainless steel alloy; providing a brazing alloy having a selected composition and compatibility with stainless steel; heating the stainless steel components and brazing alloy for a controlled time to a liquidus temperature to effect brazing; cooling the stainless steel components and brazing alloy to a quench temperature substantially lower than the liquidus temperature of the brazing alloy to provide a tensile strength of greater than about 20 Ksi in the brazing alloy; and quenching the assembly from the quench temperature to a temperature of less than about 400° F. in a given time to provide a brazed assembly free of distortion and cracks with desired mechanical properties in the stainless steel components by virtue of the thermal treatment.

Abstract: A method for manufacturing an air compressor assembly including, between a tank welding step and a final assembling step, a step of submerging a welded tank into a dip tank that contains cooling liquid treated with a corrosion inhibitor. In a preferred embodiment, in the submerging step, all air access ports of the welded tank are open to allow the cooling liquid to coat both the inside and outside surfaces of the air tank to maximize corrosion inhibitor protection and increase tank cooling rate. The method for manufacturing an air compressor assembly according to the present invention may be used in manufacturing air compressor assemblies in various styles.

Abstract: A method of manufacturing a mount structure according to the present invention which forcedly cools down a melted solder paste on a printed circuit board at a cooling speed of 1.5° C./second or higher to solidify the solder paste when an electronic part is mounted on the printed circuit board by reflow processing.

Abstract: A temperature-controlled rework system comprises a manifold assembly adapted to direct a cooling gas flow toward an area of a printed circuit board adjacent a rework zone to reduce a temperature of the adjacent area to below a temperature of the rework zone. The system also comprises a temperature control system adapted to monitor the temperature of the adjacent area.

Abstract: When a diamond is brazed to a metal substrate, while obtaining a stable joining strength, a joined interface of the diamond is not eroded to provide a good joint with a beautiful view. A brazing-filler material containing at least one selected from a group consisting of gold and silver, and copper as principal components, and further containing 0.001 to 5 mass % of vanadium is used. Preferably, a vanadium content is not more than 2.0 mass %, and more preferably not more than 0.5 mass %. Using this brazing-filler material, unidirectional solidification is performed from a side of diamond to form vanadium carbide in a joined interface in a shape of islands, and thereby an interface having a beautiful view with stable joining strength can be obtained. In addition, strong joining is possible also by a usual solidification method.

Abstract: A method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process is disclosed. The method comprises applying solder paste to the substrate and placing electronic components to the substrate to form a substrate assembly. The method further includes locating the substrate assembly on a pallet having a heat conductive layer for heat sinking means from the substrate. The method further includes rapid localized heating to a melting temperature sufficient to melt the solder paste using a supplemental heat source. While exposing the deposited solder paste to further rapid localized heating, the method further comprises cooling the pallet at the second surface to diffuse the heat from the substrate defining a temperature gradient across the substrate.

Abstract: A method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process is disclosed. The method comprises applying solder paste to the substrate and placing electronic components to the substrate to form a substrate assembly. The method further includes locating the substrate assembly on a pallet having a heat conductive layer for heat sinking means from the substrate. The method further includes rapid localized heating to a melting temperature sufficient to melt the solder paste using a supplemental heat source. While exposing the deposited solder paste to further rapid localized heating, the method further comprises cooling the pallet at the second surface to diffuse the heat from the substrate defining a temperature gradient across the substrate.

Abstract: A method for treating alloy before and after friction stir welding, the method comprising the following steps. First solution heat treating a multiplicity of aluminum-zinc alloy engineered components for a first time period at a first temperature. First air cooling the components in ambient air at room temperature until the components are cooled to room temperature. Friction stir welding the components to form an assembly. Second solution heat treating the assembly for a second time period at a second temperature. Additional steps and embodiments are considered.

Abstract: A method and device is provided for thermal treatment of workpieces or components, in particular for producing a soldered joint between a solder material and at least one component or workpiece which is used as a carrier for said solder material, by melting of the solder material arranged on the solder material carrier. At least one component is heated in a melt chamber (12) in a process atmosphere which is sealed off from the environment. In a subsequent step the component is cooled in a cooling chamber (13) in a process atmosphere which is sealed off from the environment. The component is heated and cooled in process chamber (12, 13) which are independent of each other.

Abstract: An electrical connector is soldered or affixed to a conductive element of a glass sheet of a vehicular window via radiation heating of a layer of solder with an infrared radiative heating device. The heating device may include an infrared lamp and a reflector, which functions to direct the radiant energy from the lamp to a target region generally corresponding with the location of the solder layer between the electrical connector and the conductive element. The heating device is operable to rapidly and substantially heat the solder layer to a desired temperature to melt the solder layer, while substantially limiting directing of heat to the glass sheet. The electrical connector may be affixed at a vehicular or modular window assembly plant, such that the glass sheet may be transported from a glass manufacturing plant to the vehicular or modular window assembly plant without the electrical connector.

Abstract: A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment surface enters the fused material. The material is allowed to cool to permit re-solidification, after which the treatment surface is withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material that is not wettable by the solder.

Abstract: A method for friction stir welding using liquid cooling. The method includes the steps of moving a pin tool across a welding location, spraying a cooling liquid in a localized manner from a cooling ring moving with the pin tool onto a trailing region and onto lateral regions of the welding location adjacent to the pin tool, and blowing cooling gas from a gas jet moving with the pin tool from a front of the pin tool against the pin tool and against the cooling liquid emerging from the cooling ring. In addition, a friction stir welding and cooling device includes a pin tool configured to move across a welding location and a cooling ring at least partially encircling the pin tool. The cooling ring is configured to move simultaneously with the pin tool across the welding location and includes a plurality of nozzles configured to spray a cooling liquid.

Abstract: A device for producing a soldered joint between two joining partners which can be joined via a common contact surface (7), using a solder material which can be introduced between the two joining partners. At least one joining partner (1), in the region of the contact surface (7), provides at least one recess, known as a solder reservoir (3), which faces the contact surface and into which the solder material can be introduced, and the solder reservoir (3) is completely delimited and surrounded by the contact surface (7).

Abstract: There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.

Abstract: A rod material made of Ti alloy has a larger diameter portion at the end, which is joined with the end of material made of Ti—Al intermetallic compound, by friction welding, to form a poppet valve for an internal combustion engine. Instead of providing such larger diameter portion, the end of the material made of Ti—Al intermetallic compound may be heated to facilitate joining.