Applying Porous Or Capillary Feed Material Patents (Class 228/204)
  • Publication number: 20100102107
    Abstract: This method of coating the area of hybridization of a component constituted by two elements associated with one another by means of a soldering material, comprises depositing in proximity to said component a coating substance capable of filling by capillarity the volume defined between the hybridized elements of said component. On the periphery of the hybridization area on the lower element of said component is defined an area (10) of non-wettability as regards said substance, by deposition of a covering anti-wetting as regards said substance, applied by PECVD, and defining on said first element, in line with the hybridization, a wetting surface for the coating substance.
    Type: Application
    Filed: January 6, 2010
    Publication date: April 29, 2010
    Applicants: Commissariat A L'Energie Atomique, Photonera France
    Inventors: Christophe Kopp, Jacqueline Bablet, Jacques Raby, Cyrille Rossat
  • Patent number: 7635078
    Abstract: This invention relates to a method of brazing while the thickness of the opening between materials being brazed can not be maintained constant or can not be adjusted in the appropriate range. In order to solve this issue the porous material of metals or metal alloys consisting of Ni, Cu, Ti, Al, Ag or W should be utilized. The metallic porous material is inserted into the brazing opening mentioned above by using the softness of it, and is made to hold the brazing solder and to reinforce the bonding part after brazing.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: December 22, 2009
    Assignee: Kanto Yakin Kogyo Kabushiki Kaisha
    Inventors: Tadashi Ariga, Kiichi Kanda
  • Patent number: 6776329
    Abstract: A method for producing a heat-conducting connection between two work pieces (1, 2) includes the steps of first producing a porous sintered layer (3), interposed between the two work pieces (1, 2) and sintered onto every work piece (1, 2) across a certain area, and subsequently compacting the porous sintered layer (3) sintered onto the two work pieces (1, 2) by pressing the two work pieces (1, 2) against each other.
    Type: Grant
    Filed: September 30, 2002
    Date of Patent: August 17, 2004
    Assignee: Siemens Aktiengesellschaft
    Inventor: Herbert Schwarzbauer
  • Publication number: 20040016793
    Abstract: A method is disclosed for direct application of a brazing flux material to a brazing surface. The method includes the step of applying a brazing filler material to a substrate utilizing a kinetic spray process to form a brazing surface. Following application of the brazing filler material to the substrate brazing flux material can be directly applied to the brazing surface as either a dry powder or a wet slurry. The nature of the brazing surface allows the applied flux material to adhere to the surface without the utilization of additional binders or resin materials.
    Type: Application
    Filed: July 24, 2002
    Publication date: January 29, 2004
    Inventors: Zhibo Zhao, Bryan A. Gillispie, John R. Smith, Thomas Hubert Van Steenkiste, Yang Luo
  • Patent number: 6065668
    Abstract: The object of the invention consists of a process through which containing metal structures are built and shaped, in one case using steel sheets pre-protected by paints, and made to be electrically conductive by adding aluminium powder, or other equivalent conductive metals having a fusion temperature which is equivalent to the one fusing the sheets to be welded, and whose boiling temperature is higher than their fusion one; in a second case using sheets pre-protected by a thin layer of zinc plating followed by an external film of acrylic resin; it also consists in resorting to the aid of anthropomorphic welding robots, at the end of whose mobile arm is placed the laser beam out put unit connected to the laser source by an optical fibre cable, and also in the fact that the welding is carried out on the internal not visible sides of the containing structures that are being built.
    Type: Grant
    Filed: April 7, 1998
    Date of Patent: May 23, 2000
    Inventor: Gianfranco Natali
  • Patent number: 5460319
    Abstract: A lead for achieving solder joining with great vibration strength includes an upper lead portion having a clip and a lower lead portion having a thin tip for insertion into an electrode in a lower substrate and an oblong through hole in the body of the lower lead portion for inducing capillarity of soldering flux.
    Type: Grant
    Filed: June 22, 1993
    Date of Patent: October 24, 1995
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Hazime Kato
  • Patent number: 5153704
    Abstract: A resin encapsulated semiconductor device comprises a semiconductor element, a conductive base, a wire of aluminum connecting the element and the base, and a thermosetting resin encapsulating hermetically the component to protect the device from a mechanical stress and ambient atmosphere.
    Type: Grant
    Filed: January 3, 1992
    Date of Patent: October 6, 1992
    Assignee: Hitachi, Ltd.
    Inventors: Jin Onuki, Masateru Suwa, Masahiro Koizumi, Tomio Iizuka, Takeo Tamamura
  • Patent number: 4510659
    Abstract: A vane compressor is provided which has a rotor formed therein with a plurality of axial slits opening in its outer peripheral surface in a circumferentially spaced arrangement, and in each of which a vane is received, and a plurality of cavities located between adjacent ones of the axial slits. The rotor is formed of at least two rotor elements integrally joined in an axial alignment, each rotor element being formed of a sintered alloy compact. The rotor elements are brazed along their end faces abutting against each other.
    Type: Grant
    Filed: March 25, 1983
    Date of Patent: April 16, 1985
    Assignee: Diesel Kiki Co., Ltd.
    Inventor: Michio Okazaki