Abstract: Methods of and apparatuses for electronic board assembly are provided. The apparatus can comprises one or more thermal heads controlled by a programmable logic controller. A user is able to enter the controlling parameters into the programmable logic controller through an human operator interface. The thermal heads are able to be connected with one or more pneumatic solenoid to make the thermal heads moving vertically until the thermal head in contact with the heat sink. The thermal head is able to provide a temperature, at or above the operating temperature of the thermal pad, capable of making the phase change thermal interface material to bond the heat sink and the electronic boards.

Abstract: An organic solderability preservative solution includes pyrazine derivatives which inhibit corrosion of metal. The solution is applied to metal surfaces of components for electronic apparatus to improve solderability of electrical connections between the components in the electronic apparatus.

Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.

Abstract: A method for preparing a surface of a YAG crystal for thermal bonding includes performing an ion implantation process to introduce nitrogen into a surface layer of the YAG crystal to replace depleted oxygen therein, to change surface energy of the surface layer of the YAG crystal and to provide desired bonding characteristics for the surface layer; and joining the ion implanted surface layer with a thermal management device configured to dissipate heat from the YAG crystal. Also, a micro-chip device having a YAG crystal whose surface is prepared with the above disclosed method is provided and a device for forming a metallization pattern on a surface of the YAG crystal is provided.

Abstract: Provided is a semiconductor device manufacturing system according to the present disclosure which manufactures a semiconductor device using a chip stack. The system includes a chip reducing apparatus and a chip bonding apparatus, the chip reducing apparatus includes a reduction chamber, an oxide film of the surface of the terminal of each chip is reduced in the reduction chamber, the chip bonding apparatus includes a reflow chamber isolated from the reduction chamber, a solder ball is bonded to the terminal of each chip in the reflow chamber, and the chip bonding apparatus is installed separately from the chip reducing apparatus.

Abstract: There is provided a method of manufacturing a board module which includes attaching a metal particle to a surface of a solder bump, which includes at least a tin component and is mounted on an electrode provided on a first surface of an electric part or a printed circuit board, the metal particle having a higher specific gravity and a higher melting point than the solder bump, making the first surface face up, heating the solder bump to a temperature equal to or higher than the melting point of the solder bump so that the metal particle precipitates in the solder bump, and forming an inter-metal compound layer, which has a higher melting point than a melting point of the solder bump, at an interface between the solder bump and the electrode by using the metal particle, which has precipitated, and the tin component of the solder bump.

Abstract: Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

Abstract: A method of converting a land grid array (LGA) module to a ball grid array (BGA) module by removing and oxidizing portions of the LGA conductive pad features on the upper surface of the LGA module. A BGA solder ball is deposited on the remaining portion of the conductive feature of the LGA module, with subsequent reflowing of the BGA solder ball. By modifying the LGA module to support a BGA structure, excessive heat generated by components placed on the modified LGA pad can be conducted through the BGA structure and into the element on which the LGA module is attached, such as a PCB.

Abstract: An assembly of two objects integral with each other through at least one linking element provided between both objects, said linking element including at least a first material portion comprising intermetallic compounds of a phase formed with a first brazing metal and a second metal the melting point of which is higher than that of the first brazing metal, said linking element further including at least a second material portion composed of at least a third metal, said second material portion contacting both objects.

Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Abstract: In a method for manufacturing an Al clad product, first, cladding material is fused and coated on base material having Al. Then, slurry material is coated on the cladding material coated on the base material, the slurry material including mixture of a flux powder, a resin binder powder and a diluent. Thereafter, the slurry material is hardened to thereby provide a hardened product including the base material, the cladding material and hardened slurry material. In a subsequent step, the hardened product is brazed to thereby provide an Al clad product, wherein the diluent included in the slurry material is gasified in the hardening process of the slurry material and the cladding material is fused by employing an arc discharge technique.

Abstract: The superplastically formed structural assembly includes first and second structural members having facing surfaces. The first and second structural members can include a first outer structural member, a second outer structural member or at least one intermediate structural member. In one embodiment, the first and second structural members include first and second outer structural members. In another embodiment, the first and second structural members include first and second intermediate structural members. The structural assembly includes at least one friction stir weld joint joining the first and second structural members. In one embodiment, the facing surface of the first structural member is at least partially covered with oxide to prevent thermo-compression welding of the first and second structural members adjacent the at least one friction stir weld joint. In another embodiment, the facing surface of the second structural member is at least partially covered with oxide.

Abstract: A method of fusing a component to a sterilized storage or delivery device formed of a cyclic olefin polymer which includes forming the storage or delivery device from a cyclic olefin polymer, forming a second member or component having at least a surface layer formed of the second polymer, wherein the Hansen relative energy distance Ra/Ro of the second polymer relative to the cyclic olefin polymer is equal to or less than 0.7, applying the second member to the storage or delivery device, and heating the assembly to the sterilization temperature, thereby causing the second polymer to chemically interact with the cyclic olefin polymer, fusing the second component to the storage or delivery device. The preferred embodiment of the invention is a medical container, such as a vial, wherein the vial is formed of a cyclic olefin polymer and the cap, closure or collar is formed of a second polymer heat fused to the vial or container.

Abstract: An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined discharge gas at approximately atmospheric pressure and generating an excited active species of the discharge gas as a result of the gas discharge. Then, at least one of a connecting surface of an electrode formed of a piezoelectric piece on a piezoelectric resonator and a connecting portion of a lead terminal are exposed to the excited active species, whereby the exposed connecting portions are surface treated. Finally, the electrode and the lead terminal are connected together, and at least the electrode and the lead terminal are sealed in a case. The improved piezoelectric element is formed by this process and uses less solder and is more stable than prior art piezoelectric elements.

Abstract: The invention is related to a method of fabricating an attachment bump of a component (11). In accordance with the invention, a flexible preform (13a) is fabricated, which is plated with materials (13b) appropriate for metallurgical bonding. The invention is also related to a method of attaching a component (11) to the surface of a circuit card (15) using bumps. In accordance with the invention, bumps are formed from preforms (13a) made from a flexible material, which preforms (13a) are metallized (13b) over their entire surface. The bump (13a, 13b) is attached to the attachment pads (12a, 16a) of the component (11) and the circuit card (15) by means of metallizations (12b, 13b, 16b) between the attachment pads and the bump. The bond is formed metallurgically by transfusion. The surface of the bonding side of the component (11) is coated with an insulating material (14) before the mentioned bonding elsewhere than at the attachment pads (12).

Abstract: A method of forming hydrogen fluoride (HF), to allow fluxless soldering, from a solid source such as potassium hydrogen fluoride (KF.HF) using a specialized apparatus, including a cartridge which is heated in a controlled atmosphere apparatus. The gaseous reaction product, HF, may be extracted from the apparatus either by itself or in a carrier gas (such as argon or nitrogen). The solid reaction product, potassium fluoride (KF), is an inert material which remains in the cartridge. The combination of the cartridge and KF may be safely disposed of as a unit or refilled with KF.HF under controlled conditions.

Abstract: A method for soldering components to opposite sides of a receptive element includes the steps of applying a solder formulation to both sides of the receptive element (201) and placing components on a first side of the receptive element (204). The solder formulation is hardened on the first side of the receptive element (205). Components are placed on a second side of the receptive element and the solder formulation on the second side of the receptive element is hardened. The components are fixed to the receptive element by performing a single reflow operation (208).

Abstract: A process for improving the fillet-forming capability of brazeable aluminum articles includes providing a brazeable aluminum article, having at least one surface; and contacting the surface with a dilute, aqueous solution of fluoridic compounds, for at least 5 seconds at a temperature ranging from about 150.degree. to 212.degree. F. to produce an oxide-free surface which can be readily brazed with a minimal drip loss.

Abstract: A method for flip-chip bonding of two electronic components (27,28) does not use a flux material. A substrate (13) of one electronic component (28) is roughened during processing to provide an improved adhesive surface for a solder ball (12). The roughened pattern is replicated by additional conductive layers formed over the substrate or in an alternate embodiment may be formed on one of the intermediary or top conductive layers. Tacking pressure is applied to the two components so the solder ball (12) will be affixed to the roughened surface and provide a temporary bond. This bond ensures the surfaces of the two electrical components remain in contact with each other during reflow of the solder ball (12) to form a permanent bond.

Abstract: High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. The components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by directing the reactive gas flow containing the active species at the component surfaces. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove organic substances or oxide film surfaces.

Abstract: A fluxless soldering method utilizing a strongly internally bonded fluorine containing gas such as hydrogen fluoride (HF). The solder surface is exposed to the gas in place of a flux treatment, resulting in a modified surface layer which allows reflow or joining for an extended period.

Abstract: NiAl is preheated to a temperature between 1530.degree. C. and 1638.degree. C. causing some of the aluminum to evaporate along the faying surfaces thereby forming a glazed layer of nickel rich self-generated filler metal. The glazed faying surfaces are placed in contact, heated to 1530.degree. C. to 1570.degree. C., and pressed together to form a fusion weld.

Abstract: A preflux composition suitable for use as a preflux for protecting the solderability of copper during a heating cycle comprising rosin, antioxidant, and a solvent system comprised of glycol ether and terpene and further including a dibasic acid, process for protecting the solderability of copper which is to be subjected to a heating cycle prior to soldering comprising using said preflux composition, and articles comprising printed circuits or wiring boards which have copper areas coated with said preflux composition.

Abstract: A method of bonding a sheet of metal such as copper on a substrate of aluminum nitride, the method comprising the following steps known per se: i) growing a layer of alumina on the aluminum nitride substrate by means of heat treatment; and ii) placing the sheet of metal on the alumina layer and then bonding them together; the method being wherein alumina-growing step i) is performed under a controlled oxidizing atmosphere which is free from moisture.

Abstract: A method and resulting structure is disclosed in which a metal-to-metal bond is formed by heating the surfaces to be bonded in an oxidizing ambient atmosphere until the desired bond is achieved. Heating takes place at 700.degree. C.-1200.degree. C. and bonding may be enhanced by applying pressure between the surfaces while heating.

Abstract: A method for producing a metallic interface suitable for overlaying consists of exposing the area of an alloy combination to be overlayed to a temperature above its lower critical until an element reduced zone arises. This element reduced zone more easily accepts element diffusion that takes place during overlaying. Accordingly, an improved interface, one that is more ductile and less prone to cracking, is produced.

Abstract: A heat exchanger core having a tube of aluminum material and heat transfer fins of aluminum material joined to each other with a brazing filler, which has at least part of the surface thereof coated with an inorganic sintered layer incorporating therein a pigment-containing phase of the two complexes of potassium hexafluoroaluminate and potassium tetrafluoroaluminate.

Abstract: Aluminum, magnesium, or their alloys are soldered by means of a tin-lead system following initial application of a thin coating of nickel-copper alloy.

Abstract: A permanently solderable palladium-nickel electroplated coating is formed on electrically conductive surfaces. The coating has a first alloy layer of 46 to 82 atomic percent palladium and 18 to 54 atomic percent nickel. This first layer is covered by a continuous second layer of 96 to 100 atomic percent metallic palladium and 0-4 atomic percent nickel. The second layer has a thickness of up to twenty angstroms. The second layer is formed by dipping the first layer in a solution of sulfuric or hydrochloric acid.

Abstract: A method of treating a solution comprising ions of gold and cyanide is disclosed. The method comprises treating the solution with metallic gold to precipitate therefrom metallic silver.

Abstract: Brazing alloy on detailed aluminum parts is formed in an exact pattern of the joints to be brazed. An aluminum sheet having brazing alloy coated on one or both sides (e.g., a brazing sheet) is plated with electroless nickel and electrolytic copper which are etched by use of a photoresist mask into a mask which outlines the pattern. The brazing alloy coating is then chemically milled to form the exact pattern of the joints. Parts are then assembled and dip brazed to form the completed brazed unit.

Abstract: An improved method for treating surfaces of aluminum sheets, and in particular, boron reinforced aluminum sheets, to render such sheets more amenable to diffusion bonding which consists in contacting the sheets prior to such diffusion bonding with an aqueous solution containing chloride ions to thereby cause etch pitting on the surfaces.