Abstract: A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire bonding machine. The body portion includes a inlet port for receiving a fluid from a gas supply source. The body portion defines a fluid path from the inlet port to the at least one device aperture.

Abstract: A mechanical weldable fitting for use in tapping a pipe includes a first and second metal collar, each formed of attachable upper and lower semi-toroidal portions that when assembled on the pipe providing spaced-apart external cylindrical surfaces. Each collar having at least one internal circumferential sealing groove therein that receives a gasket formed about the pipe. A lower semi-tubular metal containment member is positioned on the external cylindrical surfaces of the collars. An upper semi-tubular metal containment member is positioned on the external cylindrical surfaces of the collars. The upper containment member having an integral upwardly extending tubular access portion affording passage for tapping the pipe. The upper and lower containment members are welded to each other and to the collars to fully encompass a portion of the pipe.

Abstract: On production of a component, two primary pieces must often be fixed together to give one piece. In order to achieve the above, it is important that the two primary pieces are oriented in a particular manner during the fixing process, which provides some difficulties. According to the invention, a plug body is fixed to the component by a mounting, whereby the position of the plug body relative to the component remains unchanged during a fixing process.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: A system and method are disclosed for the manufacture of a hard disk drive arm and the bonding of magnetic head to suspension on the drive arm.

Abstract: A sensor pre-load and welding apparatus and method are disclosed. A weld fixture apparatus includes a fixture base upon which a sensor package having a sensor base and a sensor cover is located, and a load bar associated with a spring, wherein the load bar provides a specific weight to the fixture base in order to assist in maintaining the sensor cover and the sensor base parallel to one another upon the fixture base. An adjustable load foot is generally located above the fixture base, such that the adjustable load foot applies a pre-determined load with a specific weight to the sensor base in order to maintain the sensor cover and the sensor base securely in place as the sensor base and the sensor cover are welded to one another in order to configure the sensor package.

Abstract: A pre-load weld fixture apparatus and method are disclosed, which include a stationary pivot block attached to a base, wherein the stationary pivot block is located adjacent to a nest for maintaining an object to be welded. Additionally a pivot arm is associated with a pivot arm insert, wherein the pivot arm rotates about a pivot point provided by a pin press component associated with the stationary pivot block, such that the pivot point is fixed to the stationary pivot block in relation to the object to be welded and wherein the pivot arm is positioned parallel to the nest. A spring block can be connected to the stationary pivot block, wherein the spring block provides tension to the pivot arm in order to permit a user to maintain the object upon the base with a desired tension for welding thereof. Finally, a torsion spring can be maintained by the spring block, wherein the torsion spring allows the spring block to provide tension to the pivot arm.

Abstract: A method utilizing a stabilizing jig structure for positioning and supporting the assembly of an elongate structural beam and a beam-end mounting component during weld attachment of that mounting component to an end of the beam. This method includes the steps of (a) applying, through a positionally shiftable first biasing element, a first yieldable biasing force which urges the beam-end mounting component relatively toward the associated beam end, and (b) applying, through a positionally shiftable second biasing element, a second yieldable biasing force which urges the beam-end mounting component relatively toward the first biasing element.

Abstract: Adaptable spring force clamping apparatus and methods are disclosed. In one embodiment, an apparatus includes at least one elongated member adapted to be positioned proximate to a surface of a work piece. The elongated member includes first and second end portions adapted to be secured to substantially prevent movement of the elongated member relative to the surface. A plurality of pressure applying devices are operatively attached to the elongated member, each pressure applying device including a contact member moveable relative to the elongated member and adapted to engage the surface of the work piece, and a resilient member operatively coupled to the contact member and to the elongated member.

Abstract: While fabricating a packaged semiconductor chip, a wire is bonded on a chip contact pad using a wire bonding machine. A bond head of the wire bonding machine is moved relative to the chip contact pad, thereby pulling a first length of the wire out of the wire bonding machine. Part of the wire passes through a space between a first outer edge of a first bearing race and a second outer edge of a second bearing race during the pulling of the first length. The wire is bonded on a lead. A first piezoelectric element is energized in the bond head, thereby causing it to expand and press against the first bearing race, which brakes the first bearing race and brakes the wire between the first and second races. The bond head is moved relative to the lead during the braking and severs the wire proximate to the lead.

Abstract: A recess formed in close contact with a thin-walled portion 3a of a workpiece to store molten metal at a surfaced portion, a jig 4 manufactured from a material with a higher heat-resisting temperature than that of the molten metal and a satisfactorily large heat capacity, a step (A) wherein the jig is installed on the workpiece, a preheating step (B) in which the workpiece and the jig are preheated to a predetermined temperature under the condition that jig 4 is installed, a build up welding step (C) for build up welding the thin-walled portion of the workpiece and forming weld beads at surfaced portion, and a jig-removing step (D) for removing the jig after weld beads solidify completely.

Abstract: A lead frame such as a normal or inverted lead frame includes an unsymmetrical part such as a gate. A clamp, for clamping the lead frame during wire bonding, includes an observation hole. The unsymmetrical part of the lead frame is visible through the observation hole. A lead eye box and a lead eye point are set on the unsymmetrical part through the observation hole. The picture inside the lead eye box is captured and compared to a control picture. Setting the lead eye box and the lead eye point on the unsymmetrical part through the observation hole allows detection of when the lead frame is inadvertently rotated at prescribed angles or when a normal lead frame and an inverted lead frame are inadvertently mixed.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: A line-up clamp unit is powered by a diesel engine which drives a hydraulic pump for operating hydraulic equipment in the unit. The unit includes a line-up clamp which has front shoes, rear shoes and expanding copper back-up tiles. Drive wheels are deployed by a hydraulic cylinder and operated by a hydraulic drive motor. A group of aligning assemblies are electrically operated and fiction to extend L-shaped members to beyond the diameter of the pipe being welded so that the unit can be automatically positioned at the end of a pipe section. A control box includes a radio receiver for receiving control signals and producing corresponding electric control commands for operating the line-tip unit. A remote control radio transmitter has operating, mechanisms, including push buttons and toggle switches, for operating the line-up unit, including the engine, drive motor, brakes, line-up clamp and aligners.

Abstract: More complete bonding of wafers may be achieved out to the edge regions of the wafer by constrained bond strengthening of the wafers in a pressure bonding apparatus after direct wafer bonding. The pressure bonding process may be accompanied by the application of not above room temperature.

Abstract: In a method for assembling a plurality of component individual parts in stages to form a complex composite component, in order to achieve as high an accuracy as possible of the finished component, the individual parts are positioned relative to one another and fixed during the staged assembly process, such that there may be no need for any reclamping of the intermediate component between the individual assembly stages. For this purpose, a clamping frame is used, which is first equipped with some clamping elements, into which is introduced a first set of component individual elements which are assembled together with one another to form an intermediate component. In the second step, the clamping frame is equipped with further clamping elements, into which the component individual elements corresponding to them are introduced, and, in a further assembly step, these further component individual elements are assembled together with the intermediate component to form the finished component.

Abstract: Method for welding piped (2, 3) to each other, in which the outer side of the one pipe is engaged tightly with the help of first clamping means and the outer side of the other pipe is engaged tightly with the help of second clamping means in which the first and second clamping means are kept in the line and with their ends close to or against each other by means of a rigid frame on which both clamping means are arranged, after which welding means are operated in order to make a welding seam from the outside for connecting both pipes, after which the frame with the first and the second clamping means and with the welding means is moved along and over the other pipe to the other end of the other pipe for repeating the aforementioned steps for welding the other pipe and a next pipe.

Abstract: A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.

Abstract: A method of assembling a vehicular body includes the following operations: positioning a floor main and making a relative positioning between the floor main and a body side's lower section, by using a three-dimension general locator device standing on a floor, and positioning each of a right body side, a left body side and a roof rail and making the relative positioning between the body side's upper section and the roof rail, by using a front body side upper section locator jig and a rear body side upper section locator jig which are disposed on a ceiling and independent of each other in a forward-and-rearward direction of the vehicular body, and each of which is replaceable in accordance with a type of vehicle.

Abstract: A method and system for rapid heat-sink soldering, having a workpiece gripper, an intense heat source, and an optional air-jet cooling system, is provided for soldering workpieces to substrates of dissimilar material composition. The workpiece gripper selectively positions the workpiece closely adjacent the substrate and continually removes excess heat from the workpiece, both during and after the application of heat to the workpiece. Upon termination of the heat application, air-jet cooling can be provided to the workpiece to quickly cool the terminal and the molten layer of solderable material.

Abstract: A pipe aligning tool is provided for providing proper alignment and spacing between two piping components to be welded together in an end to end abutted relationship. The tool includes a spacer lying in a single plane for positioning between the ends of the piping components to provide the proper spacing. A pipe locator in the form of two projections, projects perpendicularly outwardly from each side of the spacer for concentric alignment of piping components on opposing sides of the spacer when abutted with the respective pipe locators. The simple construction of the tool permits two piping components to be both concentrically aligned and properly spaced for welding in a simple task which can be manually performed without depending upon visual alignment by the user.

Abstract: A clamping device is provided for clamping an object, such as bonding wire for a wire bonding machine. The device comprises a pair of clamping arms arranged in pivotal relationship with each other about a pivot point, the clamping arms having clamping ends movable between an open position and a closed position. An attraction device is operative to provide an attraction force between the clamping arms about the pivot point. The device includes biasing means that is operative to provide a biasing force in opposition to the attraction force about the pivot point, such that the biasing force is operative to bias the clamping ends towards the closed position. In a preferred embodiment, the biasing means comprises a flexure bearing.

Abstract: A method of securing articles to each other and an alignment and holding apparatus comprising a platform having an alignment member for positioning and holding a first article, such as a substrate, in a first position and a further alignment member for aligning extensions of a second article, such as a lead frame, in an assembleable position with respect to the first article while a spacer maintains the extensions in proper lateral position and a clamp that secures the extensions proximate the first article while an electrical connection is formed between the first article and the extensions of the second article.

Abstract: An auto-feed terminal wire clamping machine and its terminal structure comprises a terminal wire clamper having a feeding groove, and the feeding groove at its rear end having a feeding push rod and at its front end having a terminal mold plate module that further comprising an upper mold plate and a lower mold plate; an aligning conveyer comprising an aligning groove with an opening at one end coupled to the side of the feeding groove; an auto aligning feeder having a vibratory disc on a machine table, and such vibratory disc having a spiral track that includes a positive and inverse alignment area, an angle alignment area, and an open position alignment area; wherein the spiral track is coupled to an opening at another end of the aligning groove; by the foregoing structure, this invention can automatically sieve and randomly arrange the disordered terminal inner molds and feed them in an ordered direction to the feeding groove of such terminal wire clamper and automatically complete the terminal wire clampi

Abstract: A circuit board pallet with an improved securement pin and component positioning arms is disclosed. The improved pin of the present invention is cylindrical pin with an enlarged head. A countersunk hole is drilled in the bottom of the pallet to accommodate the pin. The pin is inserted into the countersunk hole and secured with a high-temperature epoxy resin. The epoxy holds the pin securely in place and keeps the pin from moving up or down. The present invention also comprises at least one arm affixed at one end to a swivel joint. The swivel joint allows the arm to rotate about a vertical axis. The upper portion of the swivel joint is hinged such that the arm can rotate about a horizontal axis. The combination of movement about the horizontal and vertical axis allows the arm to be positioned at any point over the pallet.

Abstract: A flash discharge tube includes a pin-shaped cathode. The pin-shaped cathode has an electrode core of tungsten having a first end portion. A lead of nickel has a second end portion connected with the first end portion. In the electrode producing method, the electrode core and the lead are retained by use of respectively first and second chuck mechanisms with the first and second end portions opposed to one another. The first and second end portions are pushed on one another by moving at least one of the first and second chuck mechanisms. While the first and second end portions are pushed on one another, the first and second chuck mechanisms are supplied with electric current, so as to weld the electrode core and the lead together therewith by resistance welding.

Abstract: A wire-bonding machine includes a heat block for supporting a lead frame during wire-bonding. A clamp mechanism in the machine clamps leads of the lead frame during wire-bonding by fixedly holding sets of the leads against the heat block one set at a time. A wire-bonding tool wire-bonds leads clamped by the clamp mechanism to bond pads on an integrated circuit die. By clamping leads of the lead frame in separate sets, the machine provides improved clamping for lead frames with leads requiring clamping in different planes.

Abstract: An apparatus and method for joining structural members to form preforms and structural assemblies are provided. The structural members are positioned so that joining surfaces thereof define an angled aperture, such a slot or frustoconical bore, that receives a corresponding joining member. The joining member is urged into the aperture against the joining surfaces and moved, for example, by oscillating or rotating the joining member, to friction weld the joining member to the structural members. Each structural member can include a clamping portion that is received by a clamping device that prevents the aperture from opening as the joining member is urged into the aperture. A gripping portion of the joining member and the clamping portions of the structural members can be trimmed from the resulting preform to form a finished structural assembly.

Abstract: A method of securing articles to each other and an alignment and holding apparatus comprising a platform having an alignment member for positioning and holding a first article, such as a substrate, in a first position and a further alignment member for aligning extensions of a second article, such as a lead frame, in an assembleable position with respect to the first article while a spacer maintains the extensions in proper lateral position and a clamp that secures the extensions proximate the first article while an electrical connection is formed between the first article and the extensions of the second article.

Abstract: A line-up clamp unit is powered by a diesel engine which drives a hydraulic pump for operating hydraulic equipment in the unit. The unit includes a line-up clamp which has front shoes, rear shoes and expanding copper back-up tiles. Drive wheels are deployed by a hydraulic cylinder and operated by a hydraulic drive motor. Brakes are also operated hydraulically. A group of aligning assemblies are electrically operated and function to extend L-shaped members to beyond the diameter of the pipe being welded so that the unit can be retracted and automatically positioned at the end of a pipe section. A control box is mounted to the line-up unit and includes a radio receiver for receiving control signals and producing corresponding electric control commands for operating the hydraulic and electric components of the line-up unit.

Abstract: The invention provides an apparatus and method for clamping an object. The apparatus comprises a clamping mechanism and an actuation system to actuate clamping and de-clamping of the clamping mechanism, wherein the actuation system comprises two actuator devices which are operatively coupled whereby to provide an actuation force to the clamping mechanism. Preferably, the actuator devices comprises a variable reluctance actuator and a linear induction actuator coupled together and adapted to cooperate to provide the actuation force to the clamping mechanism.

Abstract: The present invention relates to a method for mounting electrical components on leadframes. A conveyor belt is used, having a holder which is attached to the conveyor belt. A leadframe is placed on the conveyor belt and is adjusted and held in position relative to the holder. The leadframe thus maintains its position relative to the endless conveyor belt throughout the entire period for which it remains on the endless conveyor belt.

Abstract: A system for providing cutting and orbitally welding thin-walled tubing. The system includes a plurality of clamping blocks that hold the tubing while the tubing is trimmed and orbitally welded. The system further includes at least one tooling plate to which the clamping blocks can be mounted such that the tubing is attached to the tooling plate and properly aligned for net length trimming. The system further includes a welding cassette for retaining the clamping blocks and properly aligning the tubing during orbital welding.

Abstract: A system and method of joining together first and second electric terminals includes providing the second terminal with an aperture extending therethrough and a notch therein. The first and second terminals are positioned in overlapping relationship with one another so the aperture overlaps the first terminal to provide access to the first terminal through the second terminal, and so the notch overlaps the first terminal. Heat is applied to the first terminal through the aperture in the second terminal to heat the first and second terminals. The end of a solder wire is positioned in engagement with the notch of the heated second terminal to locate the solder wire with respect to the terminals and to melt the solder wire to form a solder pool that contacts the first and second terminals.

Abstract: A method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The method includes the use of an individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding. If desired, the method also provides for the use of a conventional fixed clamp for the lead fingers during the wire bonding process in addition to the individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding and also provides for the replacement of the fixed clamp with another, or second, independent clamp.

Abstract: The invention provides an apparatus and a method for preventing oxidation of an electronic device, such as a semiconductor leadframe, when it is heated. The apparatus comprises an area in which said device is to be heated and inlet means adapted to supply a relatively inert gas to the said area. In particular, the apparatus includes a porous distribution element through which the inert gas is passed from the inlet means to said area, whereby to protect the electronic device in the area from oxidation.

Abstract: The invention relates to a method of welding together for example two pie pieces (1,3) having an advance opening. First of all, the first pipe (1) piece is magnetised by contacting the first pipe piece with a magnetic (1,2) element. Then a second pipe (B) piece is positioned with respect to the first pipe piece, such that the surfaces of the pipe pieces to be welded are facing each other. Said surfaces of the pipe pieces are then welded at least partially, whereafter the magnetic element is removed. According to the invention, the magnetic element is positioned between said surfaces of the first (A) and second pipe pieces which are interconnected by welding. The magnetic element covers only a part of said surfaces.

Abstract: An alignment weight is provided. The alignment weight includes a body of material having first and second opposing surfaces. A number of depressions are formed in the first surface. The depressions receive pins of a floating pin field when placed on a floating pin field during connection of the floating pin field to a printed circuit board.

Abstract: An apparatus and method for controlling movement of packaged devices. Specifically, embodiments of the present invention discloses an apparatus a method of providing a controlling mechanism for effecting physical control over a device that is disposed on a structure. An exothermically reactive structure is disposed on the controlling mechanism, such that, when activated, an exothermic alloying reaction between alloys in the exothermically reactive structure operates the controlling mechanism. The controlling mechanism is adapted to release the device, position the device, or tune the device.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: In a method for assembling a plurality of component individual parts in stages to form a complex composite component, in order to achieve as high an accuracy as possible of the finished component, the individual parts are positioned relative to one another and fixed during the staged assembly process, such that there may be no need for any reclamping of the intermediate component between the individual assembly stages. For this purpose, a clamping frame is used, which is first equipped with some clamping elements, into which is introduced a first set of component individual elements which are assembled together with one another to form an intermediate component. In the second step, the clamping frame is equipped with further clamping elements, into which the component individual elements corresponding to them are introduced, and, in a further assembly step, these further component individual elements are assembled together with the intermediate component to form the finished component.

Abstract: An exit side pusher mechanism (10) for a flash butt welder (14) applies a pushing force which opposes the tendency of an leading strip (16) of steel to back away from a spacer bar (40) prior to welding. The pusher mechanism includes a rotating drive wheel (82) which frictionally engages the strip. The drive wheel is lowered into an engagement position by a pneumatically driven actuator (100). A pneumatically driven drive motor (84) rotates the drive wheel a preselected distance to advance the strip back towards the spacer bar.

Abstract: The present invention provides a sealing system for implementing an optimum temperature profile for solder melting and improving productivity, and a sealing method therefor. The present invention comprises a sealing machine for superimposing a pre-soldered cap onto a package on which an electronic device element is mounted, a multi-clip for receiving and holding a plurality of sets of the packages and caps superimposed by the sealing machine in batch, and a sealing furnace for heating the plurality of sets held in batch by the multi-clip, and generating a plurality of electronic devices in batch by melting the previously applied solder and sealing the plurality of sets of packages and caps. According to the present invention, the plurality of sets of the packages and caps held in batch by the multi-clip are heated and sealed, therefore the sealing efficiency of the packages and caps can be improved.

Abstract: A method of connecting a generally flat battery lead to at least one flat current collector of a polymer battery, comprising the steps of: bending a generally planar lead about at least one generally planar current collector tab to form a layered area, wherein at least one planar tab is disposed between planar portions of the lead with the lead wrapped around one edge of at least one tab; clamping the layered area between two weld fixtures of an ultrasonic welder; and vibrating the weld fixtures to ultrasonically weld together the battery lead and at least one current collector tab.

Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.

Abstract: An apparatus and method for randomly interchanging up to four pairs of side framing gates at a framing station of a vehicle assembly line while maintaining a predetermined build cycle time interval of the assembly line. The system employs first and second carousels positioned on opposite sides of the assembly line upstream of the framing station and third and fourth carousels positioned on opposite sides of the production line downstream of the framing station.

Abstract: Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force to hold a substrate, a plurality of vacuum holes in the plate around the electro-static chucks for receiving a vacuum force, and adsorbing and holding the substrate, and a plurality of alignment mark confirming holes in a periphery of the plate for confirming the marks for aligning the adsorbed substrate, thereby separating substrate from the stage more easily by applying a DC power with polarities opposite to a regular DC power.

Abstract: The welding apparatus has a positioner (1) provided with workpiece supporting means (11) which is rotatable about a first central axis (Ca) and is pivotable up and down about a second central axis (Cb) crossing the first central axis (Ca). A welding robot (2) includes a robot body (20) mounted on the workpiece supporting means (11). Therefore, even when the workpiece supporting means (11) operates, it is possible to prevent a torch (3) carried by the robot body (20) from positionally deviating relative to a workpiece (W) supported on the work supporting means (11).

Abstract: Provided is a construction including a stage having a suction hole for sucking an electronic component and fixing the same in position and position regulating suction hole for sucking an electronic component when the electronic component is regulated in position, a position regulating pawl for positioning the electronic component on the stage and a position regulating suction force control section capable of controlling a position regulating suction force when the electronic component is regulated in position on the stage.