Abstract: A Pd—Ru alloy catalyst for hydrogen production and its preparation methods are provided. The catalyst can include a plurality of particles comprising an alloy of at least palladium (Pd) and ruthenium (Ru). Moreover, the catalyst can further include a support material such as carbon support having external or internal surfaces on which the plurality of particles is dispersed. The alloy catalyst can have a molar ratio of Pd:Ru in a range of about 0.5:1 to about 9:1. For hydrogen evolution reaction (HER), the Pd—Ru alloy catalyst exhibits increased catalytic activities comparing to some well-known catalysts.

Abstract: A manufacturing method of a TiAl joined body includes: an arranging step and a heating step. The arranging step is a step of arranging a plurality of members which contains a TiAl intermetallic compound and insert materials which contain Ti as a major element, Cu and Ni such that each of the insert materials is inserted between two adjacent members of the plurality of members. The heating step is a step of heating the plurality of members and the insert materials in a non-oxidizing atmosphere at a temperature above melting points of the insert materials and below melting points of the plurality of members.

Abstract: An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.

Abstract: Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an enclosure for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a tube in fluid communication with an inerting gas source wherein the tube comprises one or more openings for the flow of the inerting gas therethrough, a base wherein the tube resides in therein and comprises an interior volume, a neck comprising an opening and an interior volume in fluid communication with the interior volume of the base, and a cap proximal to the opening wherein the inerting gas source travels through the tube into the interior volume and into the atmosphere through the opening defined by the neck and cap.

Abstract: A method for manufacturing a rotor by welding a plurality of elements together is described. The elements have a body with cavities and surfaces to be welded to surfaces of adjacent elements. According to the method, the elements are vertically stacked one above the other to form a pile with facing surfaces to be welded together defining slots. The cavities of adjacent elements define bores that extend within the pile. Then, adjacent elements are welded together within the slots. The bore is purged with an inert gas or mixture during welding. The slots are welded at an upper part of the bore before the slots at a lower part of the bore, and a slot at the upper part of the bore is welded last.

Abstract: A method of processing a brazed article includes forming a braze joint with an aluminum component comprising a nano-grained aluminum alloy.

Abstract: A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.

Abstract: Apparatus and method for purging atmospheric air from a chamber with a gas including means for generating a substantially non-turbulent, laminar flow front of the gas into the chamber with minimal turbulence to displace the atmospheric air in the chamber, the chamber having exhaust means associated therewith to permit the displaced atmospheric air to exit the chamber. The chamber is preferably a welding chamber and the gas is preferably argon.

Abstract: Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes a slot having a generally vertical orientation positioned to receive a microfeature workpiece. In several embodiments, the system can further include a conductive material at least partially filling the slot.

Abstract: The invention provides a process for soldering in the vapor phase in which after the solder has melted onto the item to be soldered a vacuum is generated around the item to be soldered in the vapor phase. Also provided is a device for soldering in the vapor phase comprising a first chamber containing the vapor phase and, inside the first chamber within the vapor phase, a second chamber in which a vacuum can be generated and into which the item to be soldered can be introduced. A third chamber communicates with the first chamber to allow the item to be soldered to be transferred into the first chamber by means of a transporting system. The process and device according to the invention are advantageous in that they ensure soldered joints having a higher quality than those of the prior art.

Abstract: A welding system includes a resistance type or other type welder with a support member and a tool for holding a work piece supported on the supported member. The support member and tool are configured to provide a substantially gaseous fluid bearing between the support member and the tooling to allow the tooling to be moved relative to the support member. When the bearing is not provided, the tooling is supported on the support member so that an electrical current pathway is provided between the tooling and the support member.

Abstract: The invention relates to a coiled composite sheet material far brazing, the composite sheet material having a structure comprising a substrate, the substrate including an aluminium substrate and/or an aluminium alloy substrate, on at least one side coupled to a carrier layer having a thickness of at most 150 ?m and additionally a polymer being homopolymers of olefin, or a copolymer of an olefin and a non-olefinic comonomer copolymerizable with the olefin being vinyl monomer, acrylic acid, methacrylic acid and/or acetic acid as a carder filled with a brazing flux material.

Abstract: A fusion welding method is provided for fusion welding at juxtaposed interface surfaces a first member, for example made of a first metal based on at least one of Ru, Rh, Pd, and Pt, with a second member made of a second metal, for example a high temperature alloy based on at least one of Fe, Co, and Ni, including at least one identified element, for example Al, that can form a continuous layer of a brittle intermetallic compound with the first metal that is free of such element. With the interface surfaces disposed in contact, energy is generated at the interface surfaces in a combination of an amount and for a first time selected to be sufficient to heat the interface surfaces to a fusion welding temperature. However, the first time is less than a second time that enables formation at the fusion welding temperature of the continuous layer of the brittle intermetallic compound at the interface surfaces.

Abstract: The invention relates to a brazing sheet product including a core sheet, on at least one side of the core sheet a clad layer of an aluminum alloy including silicon in an amount in the range of 4 to 14% by weight, and further including on at least one outersurface of the clad layer a plated layer of nickel-tin alloy, such that the clad layer and all layers exterior thereto form a metal filler for a brazing operation and have a composition with the proviso that the mol-ratio of Ni:Sn is in the range of 10:(0.5 to 9).

Abstract: A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

Abstract: A method of brazing an aluminum or aluminum alloy material, containing brazing an aluminum alloy brazing sheet that has an aluminum or aluminum alloy core material and, being clad on one or both surfaces, a filler alloy layer comprised of an Al—Si-based alloy and contains Mg incorporated at least in a constituent layer except the filler alloy layer, thereby to form a hollow structure whose one surface clad with the filler alloy is the inner surface, wherein the brazing is carried out in an inert gas atmosphere without applying any flux; and an aluminum alloy brazing sheet which satisfies the relationship: (X+Y)?a/60+0.5 and X>Y, wherein a (?m) represents the thickness of the filler alloy layer clad on the core material of the inner side of the hollow structure, and X and Y (mass %) represent the Mg contents of the core material and the brazing material, respectively.

Abstract: The present invention solves a problem with a wire bonding device, that during a wire bonding process, a cover at the periphery of a working hole warps upward to cause inadvertent sparking to occur across the cover that has warped upwards and a torch electrode. This invention's bonding device 21 provided with recognition device is characterized in that insulation treatment is applied to a part 231 of a cover 23 positioned at the periphery of a working hole 24. The interior of a working region is kept, for example, at 230° C. by a heater 30 inside a setting base 22, and by being placed under high temperature constantly, a part 471 of cover 23 warps upwards. However, since insulation treatment is applied to part 231 of cover 23, a bonding device can be realized with which inadvertent sparking between a torch electrode 28 will not occur.

Abstract: Stainless steels are welded using a shielding gas including 88 to 98.9 mole % Ar, 1 to 10 mole % H2, and 0.1 to 2.0 mole % CO2. The shielding gas permits low sulfur, high chromium, austenitic stainless steel pipes to be joined with welds having sufficient penetration, strength, corrosion resistance and durability for practical use.

Abstract: A vacuum chamber-forming method for forming a vacuum chamber in a power element of a control valve for a variable capacity compressor through a reduced number of steps. A power element is assembled in the atmospheric air by arranging a disk, a diaphragm, a disk, a spring and an upper housing on a lower housing, caulking the periphery of the lower housing to the periphery of the upper housing, and then soldering the junction of the upper and lower housings. The assembled power element is placed in a vacuum container, and a small hole formed in the upper housing is subjected to spot welding in the vacuum atmosphere, whereby the small hole is sealed by a weld metal.

Abstract: A heating furnace tube, a method of using the same and a method of manufacturing the same which have been developed with a view to eliminating inconveniences occurring when a carbon-containing fluid is made to flow in the heating furnace tube. The heating furnace tube which comprises a rare earth oxide particle distributed iron alloy containing 17-26 wt. % of Cr and 2-6 wt. % of Al. The method of manufacturing this heating furnace tube which comprises the steps of forming or inserting an insert metal on or into at least one of a joint end portion of one heating furnace tube element and that of the other heating furnace tube element, bringing these two joint end portions into pressure contact with each other directly or via an intermediate member, and diffusion welding the two heating furnace tube elements to each other by heating the insert metal.

Abstract: Organic solderability protectant (OSP) is applied to copper bond pads. The copper bond pads include flip chip bond pads and SMD bond pads on a dielectric upper surface and BGA bond pads on a dielectric lower surface. Solder paste is applied to the flip chip bond pads. This solder paste is reflowed in an inert atmosphere to form solder-on-pads (SOPs) on the flip chip bond pads. Flux residue from the solder paste is then removed with water. By reflowing the solder paste in an inert atmosphere and removing the flux residue with water, degradation of the OSP and oxidation of the SMD and BGA bond pads is inhibited.

Abstract: Handheld and stationary hot air solder reflow apparatus for repairing, reworking or producing electronic components and circuit boards of the type having a means for supplying a flow of hot air to an outlet tube are provided with a nozzle adaptor which has an internal adapter body which is resiliently carries a support collar which is held in an axial direction relative to the internal body by a spring. A bezel ring having a plurality of receiving tabs is mounted in the support collar, the tabs on the bezel ring in the support collar engage tabs on a mounting plate of each nozzle assembly, causing compression of the spring and resulting in a clamping of the mounting plate between a bottom surface of the internal body and the bezel ring.

Abstract: Nonmetallic high-temperature material, such as graphite, CFC or SiC, or components produced from these materials, are joined using the two-stage process. First the structural components are canned and the canning foil is tightly pressed onto the surface contour of the structural components. Then the components are joined to a composite component by forming a material-to-material bond between the metal canning foils. This widens the hitherto highly restricted field of technical application for materials of this type.

Abstract: A brazing method for joining to or more pieces of metal together includes running a molten brazing solder into a space between the pieces, heating at least the adjacent surfaces of the pieces to be joined to brazing temperature in a reducing atmosphere and preheating at least the adjacent surfaces to about 600° C. in an oxidizing atmosphere prior to said heating to the brazing temperature.

Abstract: A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

Abstract: An apparatus for attaching an electronic device to and removing an electronic device from a substrate. An electronic device pick-up and vacuum head applies a vacuum source to the electronic device for engaging, picking up and retaining the electronic device. The heat is transmitted by conduction through the structure of the device pick-up and vacuum head to the electronic device and solder for securing the electronic device on the substrate to heat the solder to its reflow temperature. The pick-up and vacuum head includes an electronic device engaging portion, a vacuum port, and a heat source engaging portion.

Abstract: There is provided a rolled plate joining apparatus equipped with a truck that can travel reversibly in the rolling direction, tailing end pinch rolls that are mounted on the truck and can be moved vertically with the tailing end of a preceding rolled plate pinched horizontally, leading end pinch rolls that are mounted on the truck and can pinch horizontally the leading end of a succeeding rolled plate, machining apparatuses for cutting one surface of the tailing end of the preceding rolled plate and the other surface of the leading end of the succeeding rolled plate, and a pressure welding apparatus for compressing the preceding rolled plate and the succeeding rolled plate with the machined surfaces of the preceding rolled plate and the succeeding rolled plate overlapped to reduce them approximately to the thickness of the rolled plates, including a tailing end centering apparatus placed between the tailing end pinch rolls and the pressure welding apparatus for pressing the opposite width ends of the tailing

Abstract: The invention relates to a method for drying fluxing of a metallic surface before soldering or tinning using an alloy, according to which the surface to be fluxed is treated, at a pressure close to atmospheric pressure, with a gaseous treatment atmosphere comprising excited or unstable species and being substantially free of electrically charged species, which is obtained from a primary gas mixture and, optionally, an adjacent gas mixture, the primary gas mixture being obtained at the gas outlet of at least one apparatus for forming excited or unstable gas species, in which an initial gas mixture comprising an inert gas and/or a reducing gas and/or an oxidizing gas has been converted, the adjacent gas mixture not having passed through the apparatus.

Abstract: Apparatus for connecting a first area array component to a substrate with a joining material. The apparatus has a nozzle directing heat toward both the first area array component and the portion of the substrate beneath the first area array component to melt the joining material. An elastic seal contacts the substrate and prevents the heat from affecting other components adjacent the first area array component. The nozzle is pressed against the substrate to restrain warping of the substrate, which might be caused by the heating of the first area array component, and to prevent damage to the substrate. The nozzle can tilt so that it conforms to the surface of the substrate. The first area array component is allowed to move freely in the direction of a plane of the substrate under the surface tension of the molten joining material during heating to center the first area array component.

Abstract: The invention relates to a method for dry cleaning or dry fluxing metallic surfaces before, during, or after a reflow soldering operation. The metallic surfaces that are dry cleaned or dry fluxed include (1) the metallic substrate on which an at least partially metallic, electronic component is to be mounted, (2) the solder paste, and (3) the metallic portions of the electronic component. The method comprises treating the metallic surface with a gaseous treatment atmosphere comprising unstable or excited gaseous species, and is substantially free of electrically charged species.

Abstract: A novel composition of matter is disclosed comprising perfluorinated, ethyldimethyl cyclohexane. The compound has unique utilities in vapor phase heating and soldering, oxygen transport for biological fluids and other requirements for an inert, stable fluid.

Abstract: A carbide shank boring bar having a coolant/lubricant bore running axially therethrough fitted with a steel head, said head being machinable to produce a pocket to receive a metal cutter insert wherein said boring bar shank and said steel head have a diameter less than one-half inch and said head is brazed without flux to said boring bar and no flux residue remains in said coolant/lubricant bore upon completion of said brazing. The method of achieving the fusion includes using an atmospheric vacuum chamber to conduct the fusion.

Abstract: A method for brazing aluminum components with a flux, wherein the flux and the aluminum components are heated together in a brazing furnace filled with a nonoxidizing gaseous medium, thereby fluxing and brazing the aluminum components at one time, or wherein the flux is previously pulverized and electrostatically deposited on the aluminum components, and the fluxed aluminum components is heated to a brazeable temperature in the furnace, thereby melting the braze metal and effecting the braze joints between the aluminum components.

Abstract: Articles of aluminum, or of an aluminum alloy, can be brazed satisfactorily, employing an aluminum alloy as the brazing material, by removing any surface oxide layers from bodies comprising the articles, and preforms of the brazing material, simultaneously with providing initial films of zinc, or tin, thereon. Then coatings of silver and/or of gold, or a suitable alloy containing silver or gold, are provided on the articles, and on the preforms of the brazing material, to protect the surfaces of these aluminum containing bodies from reoxidizing. The required brazing operation then is performed in a high vacuum, or in an inert atmosphere. Any oxygen produced inadvertently, for example, by the decomposition of any silver oxide present, is removed before it can contact any aluminum. The zinc or tin, the materials of the coatings, and the aluminum of the bodies, interdiffuse, and this interdiffusion proceeds rapidly when the brazing alloy melts.

Abstract: Disclosed is a novel fluorocarbon comprising carbon atoms and fluorine atoms and having no double bond, the atomic ratio of fluorine to carbon atoms being 1.50 to 1.93, which exhibits a liquid state at room temperature. The liquid fluorocarbon has excellent water- and oil-repellent properties and can advantageously be used, for example, not only as a water- and oil-repellent but also as an inert liquid, a heat transfer agent and a vapor phase soldering liquid in various fields, especially in the electronic industry. The liquid fluorocarbon can be obtained directly from a pitch or from a pitch fluoride which can be obtained by direct fluorination of a pitch.

Abstract: An ultrasonic transducer and its method of fabrication wherein bonding between an impedance matching layer on one side of a piezoelectric layer and a support layer on the other side of the piezoelectric material is made by providing onto each material a smooth, thin gold film on the smooth surfaces of the layers which are to be in contact with one another in the assembled transducer. The layers are bonded to each other by the gold films under moderate temperature and pressure to form the transducer. Sawing of the impedance matching and piezoelectric layers into a plurality of parallel transducers attached to the support layer forms an array.

Abstract: A fully-fluorinated and fully saturated fluorocarbon, containing at least two condensed or non-condensed six-membered rings, seventeen carbon atoms and from 28 to 32 (inclusive) fluorine atoms in its molecule, and having a boiling point from 250.degree. to 265.degree. C.; provided that where the rings are non-condensed they are separated by not more than 4 carbon atoms. Such multi-ring C.sub.17 saturated-perfluorocarbons are produced by the saturation fluorination of the corresponding multi-ring hydrocarbons and are suitable for use as high-temperature vapour-soldering fluids, especially for use with solders melting above 200.degree. C.

Abstract: An aluminum or aluminum alloy shape for manufacture of heat exchangers is coated with a metallic layer of a zinc-base alloy constituting a fluxless soldering or low temperature brazing material when heated. A process for direct coating of formed aluminum shapes in nascent state includes the steps of providing a non-reactive atmosphere around the shape, providing a coating material of zinc-base alloy and bringing the aluminum shape and the coating material into contact and maintaining the contact at an elevated temperature for a predetermined period of time for forming a coherent coating on the aluminum shape.

Abstract: The disclosure relates to the use of metastable state of mixed gases which, when appropriately mixed, provide better control of current and voltage conditions and subsequent arc formation properties in making balls of aluminum, copper and gold with an electronic flame-off method. The specific mixtures involve inert argon mixed with small amounts of hydrogen and neon. Exceptionally well controlled balls of uniform size result.

Abstract: Novel compositions include compounds of the formula: ##STR1## wherein the carbon rings are fully fluorinated.

Abstract: Novel compositions include compounds of the formula: ##STR1## wherein the carbon rings are fully fluorinated and R is selected from the group consisting of fluorine, --CF.sub.3 or --CF(CF.sub.3).sub.2.

Abstract: Novel compositions of matter are disclosed; perfluoro-1,1-di(orthoxylyl) methane, perfluoro-1,1-di(orthoxylyl) ethane and perfluoro-1,1-di(orthoxylyl) propane. The compositions are made by cobalt trifluoride fluorination of 1,1-di(orthoxylyl) methane, 1,1-di(orthoxylyl) ethane and 1,1-di(orthoxylyl) propane. The compositions have utility as vapor phase soldering fluids.

Abstract: In a method and apparatus for the automatic joining of pins to the surfaces of articles, especially of ear pins to associated pieces of jewelry, the joining step utilizes flame soldering in the automatic joining process in order to reduce costs for small lot manufacturing and firm joining of the pin to the article. The apparatus has an article receptacle movably disposed on a base plate which also carries a solder supply gun, a pin supply and support structure and a soldering flame nozzle, all being movable between a remote rest position and an operating position in which they are properly located for performing the pin soldering task.

Abstract: An improved vapor phase soldering process and apparatus are disclosed having particular application to electronic circuitry designed for operation at frequencies higher than 1 MHz. A printed circuit board having a defined circuit pattern on both sides is clamped between two parallel clamping fixtures, one having circuit matching characteristics for the specified PC board, and the fixture further having vents allowing vapor phase gas access to the PC board and soldering process waste gasses egress from the soldering area. This process and apparatus allows shortened soldering time, and improves performance characteristics of the PC board by improving the conduction characteristics of the defined circuit pattern.

Abstract: Gases entrapped in a metal assembly are exhausted through a vent closed off by a metal or metal alloy which has a melting point below the temperature at which said assembly is hot rolled. The metal assembly is designed to bond dissimilar metals on hot rolling.

Abstract: In the manufacture of glazing panels comprising sheets marginally bonded together, in order to simplify and speed up production, a method of effecting bonding between at least one such sheet and one or more members assembled in marginal contact therewith, comprising bringing the assembly within the sphere of treatment means which is carried by a frame and causing the treatment means to act simultaneously on each side margin of the assembly to bond it together. In an apparatus for performing the method, in order to accommodate assemblies of different sizes carried by a support, each beam of the frame is coupled at one end relative to a movable coupling, whereby the end of each beam is movable along another beam in the direction of whose length its end coupling is movable, so that the size of the frame can be adjusted.

Abstract: First and second underwater tubular members are assembled together so that the outer surface of the first tubular member and the inner surface of the second tubular member are spaced apart to form an annular cavity. The cavity is sealed, cleaned and dried and filled with a gas at a pressure greater than the surrounding water pressure. The pressure in the cavity is reduced prior to detonating an explosive charge within the first tubular member to weld the members together. The cavity may be subdivided into a plurality of zones by further seals, the pressure in the zones being separably adjustable so as to be able to control the pressure difference across each seal.

Abstract: A method and apparatus for dip-soldering semiconductor components is disclosed as including a temperature-controlled solder bath and a gas supply line disposed along one edge of the upper surface of the bath. Hydrogen and nitrogen gases are selectively supplied and discharged from nozzles of the supply line by means of a two-way control valve, and the supply line is vertically, horizontally, and rotatably adjustable with respect to the bath container and the bath surface so as to precisely locate the position of the gas nozzles with respect thereto.

Abstract: Underwater welding apparatus including a welding chamber and at least one source of gas under pressure connected to the welding chamber through a demand valve, in which the demand valve allows the flow of gas to the chamber to increase as the increase in the hydrostatic head causes the pressure of the gas in the chamber to increase, and to decrease as the hydrostatic head decreases.

Abstract: A method of brazing aluminum parts where the brazing occurs between one aluminum part and a second part formed of either aluminum or another metal, wherein the aluminum or aluminum alloy has a braze cladding which is plated with a bond-promoting alloy prior to the brazing operation. If an aluminum brazing foil is utilized between the parts, the bond-promoting metal is plated onto the brazing foil. The bond-promoting alloy includes nickel or cobalt with a small amount of lead added thereto, such that the nickel-lead or cobalt-lead may be used individually or in combination.