Abstract: A device for stably maintaining the shape of a fragile object in a liquid includes a container for accommodating the fragile object, a lid member for sealing the container, and a protecting member. The device is configured to form a liquid-tight space by covering a liquid surface in the container which accommodates the fragile object and the liquid with the protecting member and further covering the protecting member and an open portion of the container with the lid member.

Abstract: A method for closing a hole penetrating a hole height from a first surface of a metal article through a second surface of the metal article is disclosed including removing a portion of the metal article surrounding the hole from the metal article. The portion includes a depth extending from the first surface into the metal article and terminating prior to the second surface. Removing the portion forms a support surface within the hole adjacent and opposite to the second surface. A metal support structure is disposed within the hole on the support surface, and a metal composition is applied into the hole and onto the metal support structure. The metal support structure, the metal composition, and the metal article are fused together.

Abstract: Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.

Abstract: A planetary carrier subassembly for a transmission is provided that is sintered using braze preforms. The carrier subassembly may include a powder metal carrier member having a plurality of carrier legs extending a distance therefrom, and a powder metal cover member having a plurality of cover legs extending a distance therefrom. The carrier member and cover member are positioned such that respective ends of the carrier legs and ends of the cover legs are aligned with one another. The subassembly is provided with at least one braze preform including a braze material and a sacrificial binder, such as a wax. The braze preform is placed between a respective pair of the aligned carrier legs and the cover legs. The braze preform is provided with a geometry configured to direct a flow of braze material during a subsequent sintering process.

Abstract: The invention relates to a method for joining a semiconductor (20) to a substrate (10), comprising the following steps: •applying a first paste layer (1) of a sintering paste to the substrate; •heating and compressing the first paste layer to form a first sintered layer; •applying a second paste layer (2) of a sintering paste to the first sintered layer and arranging a semiconductor (20) on the second paste layer; •heating and compressing the second paste layer (2) to form a second sintered layer. The invention further relates to a semiconductor component produced by means of the method.

Abstract: In accordance with one or more aspects, a method of reducing void formation in a solder joint may comprise applying a solder paste deposit to a substrate, placing a solder preform in the solder paste deposit, disposing a device on the solder preform and the solder paste deposit, and processing the solder paste deposit and the solder preform to form the solder joint between the device and the substrate. In some aspects, the substrate is a printed circuit board and the device is an integrated circuit package.

Abstract: Thermally stable polycrystalline constructions comprise a body having a polycrystalline ultra-hard phase and a plurality of empty voids. A population of the voids can be filled with a reaction product. The body is substantially free of a catalyst material. The construction comprises a first support member attached to the body by a first braze material. A second support member is attached to the body and the first support member by a second braze material. The construction may include a third support member attached to the body that is integral or separate from one of the other support members. The braze materials used to attached the support members can be the same or different, as can be the materials used to form the different support members.

Abstract: A method of manufacturing a semiconductor chip is disclosed. A die having a plurality of die-pads is attached to a substrate in a semiconductor package which includes a plurality of substrate-pads. The method involves forming conductive column bumps of differing volumes extending from the die-pads; attaching each of the column bumps to a corresponding substrate-pad to form a subassembly; and reflowing the subassembly so that the column bumps form robust electrical and mechanical connections between the die pads and the substrate pads.

Abstract: A method for welding superalloy components at ambient temperature conditions while reducing the propensity of the superalloy material to crack as a result of the weld. A root pass region of the weld is formed using a filler material that exhibits ductility that is higher than that of the base superalloy material. The ductile material mitigates stress in the root region, thereby preventing the formation of cracks. A remaining portion of the weld is formed using a filler material that essentially matches the base superalloy material. The method may utilize a pre-weld heat treatment to grow a gamma prime precipitate phase in the superalloy material, a chill fixture to remove heat during welding, a relief cut to reduce stress in the root region, and a conventional post-weld heat treatment.

Abstract: A method of manufacturing an electronic apparatus including a first and a second components, includes: forming a first solder bump on one of the first component and the second component; forming a second solder bump on the other one of the first component and the second component; bringing the first solder bump into contact with the second solder bump at a temperature higher than the liquidus temperature of any of the first and the second solder bumps such that the first and the second solder bumps are fused together to form a solder joint of an alloy having a lower liquidus temperature than any of the first and the second solder bumps; and solidifying the solder joint between the first and the second component.

Abstract: A method of butt welding a first and second tubular to join them together, the tubulars being suitable for use in an underwater environment and normally being made from carbon steel and having a corrosion resistant alloy (CRA) provided on an internal face thereof, the method comprising: depositing from an external side of the first and second tubulars, a weld-filler material onto a butt joint between the first and second tubulars. Preferably the weld filler on the external side is a carbon steel weld filler and for the internal side is a CRA weld filler. In this manner sufficiently strong circumferential welds may be provided especially for CRA clad tubulars. A method of deploying the tubulars underwater and an apparatus comprising tubulars welded together is also disclosed.

Abstract: Disclosed is an austenitic welding material which contains C: 0.01 wt % or less, Si: 0.5 wt % or less, Mn: 0.5 wt % or less, P: 0.005 wt % or less, S: 0.005 wt % or less, Ni: 15 to 40 wt %, Cr: 20 to 30 wt %, N: 0.01 wt % or less, O: 0.01 wt % or less, and the balance of Fe and inevitable impurities, wherein the content of B contained as one of the inevitable impurities in the welding material is 3 wt ppm or less, and the total content of C, P, S, N and O in the welding material is 0.02 wt % or less.

Abstract: Electronic assemblies with solder containment brackets are provided. A solder containment bracket may have a planar base and a vertically extending wall. The wall may protrude upwards from the base to form an enclosed region. The base may have a hole that corresponds to the shape of the enclosed region. The wall may have an opening. A wire may be inserted into the opening. The wire may be soldered to the solder containment bracket to form a solder joint that electrically connects the wire to the bracket. The solder joint formed within the enclosed region may have a size that is defined by the bracket wall. The solder containment bracket may be soldered to a solder pad on a printed circuit board by reflowing a layer of solder paste.

Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps.

Abstract: A connection structure for elements includes a first plate having an electrode layer formed on one surface of the first plate, an element connected to the electrode layer at one surface of the element and a second plate connected to the other surface of the element. A connection method for the above elements comprises the steps of: disposing the element on upper surface of the electrode layer of the first plate through solder and the second plate on upper surface of the element through conductive paste and heating the solder and the conductive paste simultaneously for melting the solder and calcining the conductive paste.

Abstract: A weld joint includes low and high alloy steel components. A weld bead between the low and high alloy steel components includes a first weld wire in contact with the low alloy steel component, a second weld wire in contact with the high alloy steel component, and a third weld wire between the first and second weld wires. The third weld wire has a higher percentage of chromium than the first weld wire and a lower percentage of chromium than the second weld wire. A method for welding includes applying a first weld wire to a low alloy steel component, applying a second weld wire to a high alloy steel component, and applying a third weld wire between the first and second weld wires. The third weld wire has a higher percentage of chromium than the first weld wire and a lower percentage of chromium than the second weld wire.

Abstract: A component brazed to another, constraining component such as sleeve assembly brazed in a bore of a bit body. The braze joint includes particulate material in the gap between the components.

Abstract: Thermally stable polycrystalline constructions comprise a body having a polycrystalline ultra-hard phase and a plurality of empty voids. A population of the voids can be filled with a reaction product. The body is substantially free of a catalyst material. The construction comprises a first support member attached to the body by a first braze material. A second support member is attached to the body and the first support member by a second braze material. The construction may include a third support member attached to the body that is integral or separate from one of the other support members. The braze materials used to attached the support members can be the same or different, as can be the materials used to form the different support members.

Abstract: Improved solder and soldering methods are disclosed. In accordance with one technique, a solder having a plurality of individual wire strands braided together is used. In accordance with another technique, the braided solder comprises both the same solder composition and wire gauge in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different solder compositions used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least two different wire gauges used in the individual solder wire strands. In accordance with another technique, the braided solder comprises at least one wire strand where the primary surface is coated with a thin layer of a noble metal. In accordance with another technique, the braided solder comprises at least one wire strand where flux material is present.

Abstract: A joining method between Fe-based steel and Ti/Ti-based alloys having a joint strength higher than those of base metals by using interlayers. The production of intermetallic compounds at a joint portion between Fe-based steel and Ti/Ti-based alloys can be prevented using interlayers, and strong interface diffusion bonding can be formed at interfaces between interlayers, thereby producing a high-strength joint. Accordingly, the present disclosure can be used to develop high-strength, high-functional advanced composite materials.

Abstract: A micromechanical component and a corresponding production method. The micromechanical component includes a first component and a second component, with which the first component is connected by an alloy region; the first and second components enclosing a vacuum region or residual gas region, which is sealed by the alloy region.

Abstract: A magnetic based welding tool having an adjustment knob, a pivot arm, and a copper alloy pad, designed to assist with welding holes, for example, in sheet metal, that are to be welded closed with a MIG or TIG welder, by providing a backup to the hole, to keep the welding material from coming through the hole in excess amounts, and a magnetic base to hold the tool onto a ferrous metal panel, such as steel, with an adjustable arm to keep the copper alloy pad away from the magnetic base and in firm contact with the surface to be welded.

Abstract: A welded component includes at least one high temperature segment of a high alloy Cr steel with high creep strength and a low temperature segment of a low alloy steel with high toughness and/or a high yield strength which are connected materially to one another via a weld joint. In one such component a gradual transition of chemical, physical and mechanical properties in the joining area is achieved in that between the weld joint and the high temperature segment there are at least two successive clad layers of at least two lower alloy weld metals with a total content of elements which increase the creep strength, such as for example Cr, Mo, W and V, which total content decreases toward the weld joint, and/or an increasing total content of elements which increase the toughness and/or yield strength, such as for example Ni and Mn, which total content increases toward the weld joint.

Abstract: In one embodiment, the present invention provides a method for welding together two metal pieces, comprising buttering a surface of a first metal piece with a first nickel-based filler metal at a thickness sufficient to isolate a heat-affected zone in the first metal piece from subsequent welding; heat-treating at least the heat-affected zone in the first metal piece; buttering a surface of a second metal piece with a second nickel-based filler metal having the same composition as the first nickel-based filler metal and at a thickness sufficient to isolate a heat-affected zone in the second metal piece from subsequent welding; heat-treating at least the heat-affected zone in the second metal piece; and welding the heat-treated first buttered surface to the heat-treated second buttered surface with a third nickel-based filler metal having the same composition as the first and second nickel-based filler metals.

Abstract: A braze material and method of brazing titanium metals. The material may consist of Ti, Ni, Cu Zr, PM and M where PM is a precious metal and M may be Fe, V, Cr, Co, Mo, Nb, Mn, Si, Sn, Al, B, Gd, Ge or combinations thereof, with the (Cu+PM)/Ni ratio around 0.9. Optionally, a second brazing may be performed to rebraze any braze joint that did not braze successfully. The second brazing material has a lower braze temperature than the first and may consist of a mixture of Ti, Ni, Cu, Zr PM and M with from 1-20 wt % more Zr, PM, M or combinations thereof than the first braze. The braze material may be placed on a base material, in a vacuum furnace, and heated to form a braze joint between the braze and base material. The heating step may occur from about 800-975° C. and over 3 to 15 minutes.

Abstract: The camera module structure (10) of the present invention, is a board electrode (2) formed on a printed board (1) and a mounting electrode (4) formed on a camera module (3) mounted on the printed board (1) being joined through a solder joint section (5), and the board electrode (2) and the mounting electrode (4) are aligned by self-alignment. The solder joint section (5) is composed of a first solder (6) and a second solder (7) having different characteristics. Thus, a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment is provided.

Abstract: A weld process cuitable for repairing precipitation-strengthened superalloys, and particularly gamma prime-strengthened nickel-based superalloys. The process entails forming a weldment in a cavity present in a surface of an article formed of a precipitation-strengthened superalloy. The cavity has a root region and a cap region between the root region and the surface of the article. A solid body formed of a superalloy composition is placed in the root region of the cavity so as to occupy a first portion but not a second portion of the root region. A first filler material formed of a solid solution-strengthened superalloy is then weld-deposited in the second portion of the root region. Subsequently, a second filler material formed of a precipitation-strengthened superalloy is weld-deposited in the cap region of the cavity.

Abstract: A method (80) of reducing stress between substrates of differing materials includes the steps of applying (82) solder (16) on a first substrate (14), reflowing (84) the solder on the first substrate to form a cladded substrate (30), applying (85) a medium such as flux or solder on a second substrate (42) having a substantially different coefficient of thermal expansion than the first substrate, placing (86) the cladded substrate on the second substrate, and reflowing (88) the cladded substrate and the second substrate such that thermal stress caused by the substantially different coefficient of thermal expansion between the first and second substrates is limited to when a temperature approximately reaches below a solidus temperature of the solder on the first substrate.

Abstract: A method of welding superalloy components comprising: pre-heat one or more components to be welded to a temperature of at least 1500° F. in a substantially enclosed inert gas atmosphere; supplying multiple fillers to the weld zone, at least two of said fillers having different compositions; and welding the one or more preheated components utilizing a laser beam, while maintaining said pre-heat temperature.

Abstract: Novel materials and methods for repairing/reclassifying superalloy components are described herein. These materials are non-traditional blends of materials having a much higher base material content than traditional repair/reclassification materials. In embodiments used to repair/reclassify nickel-based components, these materials may comprise about 5-18.9 weight percent of a low melting point alloy and about 81.1-95 weight percent of a base material. In embodiments used to repair/reclassify cobalt-based components, these materials may comprise about 15-30 weight percent of a low melting point alloy and about 70-85 weight percent of a base material. These materials can be used to repair surface defects and/or build up worn or eroded areas of a component to meet precise dimensional and metallurgical requirements. These materials create robust repaired components having a dense, isothermally solidified structure having minimal borides and a high re-melt temperature.

Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.

Abstract: The invention is a method of bonding a ceramic part (6) to a metal part (4) by heating a component assembly (2) comprised of the metal part (4), the ceramic part (6), and a thin laminated interlayer material (8) placed between the two parts and heated at a temperature that is greater than the temperature of the eutectic formed within the laminated interlayer material (8) or between the metal part (4) and the laminated interlayer material (8), but that is less than the melting point of the ceramic part (6) or of the metal part (4). The component assembly (2) is held in intimate contact at temperature in a non-reactive atmosphere for a sufficient time to develop a strong bond between the ceramic part (6) and the metal part (4). The compact interlayer material (8?) may be further comprised of two or more sets of metal alloy spheres (16, 16?) each having distinct compositions.

Abstract: Reactive foils and their uses are provided as localized heat sources useful, for example, in ignition, joining and propulsion. An improved reactive foil is preferably a freestanding multilayered foil structure made up of alternating layers selected from materials that will react with one another in an exothermic and self-propagating reaction. Upon reacting, this foil supplies highly localized heat energy that may be applied, for example, to joining layers, or directly to bulk materials that are to be joined. This foil heat-source allows rapid bonding to occur at room temperature in virtually any environment (e.g., air, vacuum, water, etc.). If a joining material is used, the foil reaction will supply enough heat to melt or soften the joining material, which upon cooling will form a strong bond, joining two or more bulk materials.

Abstract: A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided.

Abstract: A method of modifying the tin to lead ratio of a tin-lead bump forms a patterned solder mask over a substrate that comprises a first tin-lead bump formed thereon, the patterned solder mask having an opening that exposes the tin-lead bump. A solder material including tin and lead is filled in the opening of the solder mask over the first tin-lead bump. The solder material has a tin to lead ratio that differs from that of the first tin-lead bump. The solder material is reflowed to fuse with the first tin-lead bump, which forms a second tin-lead bump. The tin to lead ratio of the second tin-lead bump is thereby different from that of the first tin-lead bump.

Abstract: The method forms a sputter target assembly by attaching a sputter target to an insert and applying a bond metal layer between the insert and a backing plate. Then pressing the insert and backing plate together forms a solid state bond with the bond metal layer, attaches the insert to the backing plate and forms at least one cooling channel between the insert and the backing plate. A filler metal secures the outer perimeter of the insert to the backing plate in order to eliminate leakage from the cooling channel during sputtering of the sputter target.

Abstract: A metal foil connection of first and second metal foils having a thickness of less than 0.05 mm includes a connecting point in which the metal foils are brazed to one another. The connecting point forms a wedge which is filled with brazing medium. A mass of the brazing medium, and a mass of sections of the metal foils which the brazing medium contacts in the wedge, have a given ratio. A honeycomb body, a brazing medium particle fraction and a method for manufacturing metal foil connections with a thickness of less than 50 micrometers, are also provided.

Abstract: A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.

Abstract: A vacuum chamber-forming method for forming a vacuum chamber in a power element of a control valve for a variable capacity compressor through a reduced number of steps. A power element is assembled in the atmospheric air by arranging a disk, a diaphragm, a disk, a spring and an upper housing on a lower housing, caulking the periphery of the lower housing to the periphery of the upper housing, and then soldering the junction of the upper and lower housings. The assembled power element is placed in a vacuum container, and a small hole formed in the upper housing is subjected to spot welding in the vacuum atmosphere, whereby the small hole is sealed by a weld metal.

Abstract: Sn—Zn alloy is plated on at least one of a first metallic member and a second metallic member, Sn—Ag alloy is used as a solder, the first metallic member and the second metallic member are connected by the solder, and a connection structure of metallic members is therefore produced. Heat degradation of plating and the contact corrosion between solder and plating can thereby be prevented, solderability can be improved, and qualities such as corrosion resistance and connecting strength at the connection structure can be improved.

Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.

Abstract: A method is provided for making, from a plurality of members brazed together, an article including an environmental resistant surface coating and a wear resistant surface portion. Prior to brazing, the members are assembled with at least one preform including the wear resistant material in a matrix including a first brazing alloy having a brazing temperature in a brazing temperature range. The assembly of members includes a second brazing alloy having a brazing temperature in the brazing temperature range. The assembly of members and wear resistant preform is heated in the brazing temperature range to provide a brazed article preform. Then the article preform is machined to a selected geometry and can be coated with the environmental coating.

Abstract: There is disclosed a heat exchanger made of an aluminum alloy having a radiator part (10) and an oil cooler part (11) in combination and manufactured integrally by the brazing method, wherein a refrigerant tank (13) for covering and sealing the oil cooler part is made of an aluminum alloy, an aluminum alloy containing Si in an amount from more than 7.0 wt % to 12.0 wt %, Fe in an amount from more than 0.05 wt % to 0.5 wt %, Cu in an amount from more than 0.4 wt % to 8.0 wt %, Zn in an amount from more than 0.5 wt % to 10.0 wt %, and the balance of aluminum and inevitable impurities is used as a filler material of brazing sheets that are used for the oil cooler part and are brazed in the tank, and the refrigerant tank is assembled integrally with the radiator part and the oil cooler part by brazing with the brazing material.

Abstract: A device integration method involves attaching two components together using a first material having a first melting point, then creating a unit by attaching the two components to a third component, using a second material having a second melting point lower than the first melting point, and then attaching the unit to another component, using a third material, having a third melting point lower than the second melting point. A device having multiple components attached together using a process described herein.

Abstract: A brazing product, e.g. a brazing sheet product, having an aluminium layer made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18 weight %, and a layer comprising nickel on the outer surface of the aluminium layer such that taken together the aluminium layer and all layers exterior thereto form the filler metal for a brazing operation. The filler metal has a composition containing at least one element: (i) with a smaller exchange current density for the Hydrogen Evolution Reaction (“HER”) than nickel and/or (ii) such that the electro-chemical potential difference between particles of Ni-aluminide(s) of the filler and the aluminium alloy matrix of the filler is reduced. The filler metal's mol-ratio of Ni to such element(s) is in the range of 10:(O.3-30). The invention also relates to a method of manufacturing a brazed assembly using the brazing product, and to a brazed assembly comprising at least one component made of the brazing product.

Abstract: Nonmetallic high-temperature material, such as graphite, CFC or SiC, or components produced from these materials, are joined using the two-stage process. First the structural components are canned and the canning foil is tightly pressed onto the surface contour of the structural components. Then the components are joined to a composite component by forming a material-to-material bond between the metal canning foils. This widens the hitherto highly restricted field of technical application for materials of this type.

Abstract: Disclosed is a method to provide a transient liquid phase solder joint by annealing and quenching. The invention allows the attainment of a single phase solder joint at room temperature which will not reflow in subsequent thermal processing above the initial reflow temperature and thus obviates the need for a solder material hierarchy.

Abstract: A first substrate is attached to a second substrate by providing solder structures that include a first portion adjacent the second substrate that has a first melting point, and a second portion adjacent the first substrate that has a second melting point that is lower than the first melting point. The solder structures then are heated to a first temperature that is at or above the second melting point but below the first melting point, to melt the second portions. Simultaneous with the heating of the solder structures to the first temperature, the first substrate is attached to the second substrate while the second portions are melted. Finally, the solder structures are heated to a second temperature that is above the first temperature, to alloy at least some of the first portions and the second portions.

Abstract: The invention relates to a method for forming a welded joint between abutting pieces of steel. The welded joint is produced by first forming a strength weld and then depositing additional weld metal on the toe of the strength weld to form a toughness weld. The fusion interface of the toughness weld forms a minimum angle with the direction of the maximum tensile load across the welded joint. The toughness weld toe is separated from the heat-affected zone of the strength weld to effectively prevent propagation of a crack initiated at the toughness weld toe into the heat-affected zone of the strength weld. The welded joint so produced is substantially resistant to failure by brittle fracture.

Abstract: A tip cap hole is loaded with a first composition comprising particles of a first alloy having a solidus temperature above the brazing temperature. The first composition is covered with a second composition comprising particles of a second alloy having a liquidus temperature below the brazing temperature. The second composition is heated to the brazing temperature to cause particles of the second alloy to melt to form a liquid of the second alloy which is carried into spaces between the particles of the first alloy by capillarity. The liquid of the second alloy is cooled to form a solid securely bonding the particles of the first alloy. By weight, the second alloy has no more than 1% B and from 3% to 11% Si. The first alloy has Cr and at least about 5% Al, at least about 0.5% Hf, no more than 0.5% Ti.