Abstract: In one form of the invention, a laser beam propagates directly through bulk material of a TAB tape or base, to heat and form a bond between electrical leads formed on the base and aligned contact bumps. In another form, a chromium seed-metal layer is formed on a TAB tape or base, and leads are in turn formed on the chromium; the chromium absorbs a laser beam to heat the leads. In both forms, an optical fiber preferably presses copper leads and gold bumps together with over 300 g force, without aid by a gas stream—and then also conducts the beam to the bond site, forming a bond of shear strength over 200 g. Also preferably gold contacts are plated on the leads; and the method makes an inkjet printhead—with the bumps formed on a die or other printhead component, and nozzles formed through the base.

Abstract: More complete bonding of wafers may be achieved out to the edge regions of the wafer by constrained bond strengthening of the wafers in a pressure bonding apparatus after direct wafer bonding. The pressure bonding process may be accompanied by the application of not above room temperature.

Abstract: A process and apparatus for manufacturing Solid Solder Deposit-Printed Circuit Board (SSD-PCB) by melting dry solder powder previously deposited on a pocketed-PCB 20. The process and apparatus utilize as heat source an electrically heated conveyor wire mesh 76 instead of a reflow oven. This invention, unlike the prior art for producing SSD-PCB, can readily utilize dry solder powder in conjunction with flux layers 116 separately deposited on top of the conveyor wire mesh 76 thereby excluding the use of solder paste and associated paste printing equipment. Specifically the invention reduces the manufacturing cost because: shortens manufacturing time, reduces manufacturing energy consumption and requires less manufacturing equipment than prior art.

Abstract: Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.

Abstract: A method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process is disclosed. The method comprises applying solder paste to the substrate and placing electronic components to the substrate to form a substrate assembly. The method further includes locating the substrate assembly on a pallet having a heat conductive layer for heat sinking means from the substrate. The method further includes rapid localized heating to a melting temperature sufficient to melt the solder paste using a supplemental heat source. While exposing the deposited solder paste to further rapid localized heating, the method further comprises cooling the pallet at the second surface to diffuse the heat from the substrate defining a temperature gradient across the substrate.

Abstract: Methods are provided for interconnecting two electronic components having surface mount technology interconnects. In one embodiment, a reflowable electrically conductive first interconnect material is reflowed onto the land pads of a microelectronic die. A reflowable electrically conductive second interconnect material is reflowed between the first interconnect material and corresponding bond pads of a carrier substrate at a temperature below the melting temperature of the first interconnect material. The gap between the microelectronic device and the carrier substrate is provided with underfill material. The first and second interconnect materials are reflowed at or above the reflow temperature of the first interconnect material creating a hybrid material having a melting temperature higher than the second interconnect material.

Abstract: A method of sealing an opening in a cast member that employs a green seal cap formed from the consolidation of a mixture of powdered metal and a binder under sufficient pressure to impart enough strength to the cap to maintain its shape during the blade manufacturing process. The green seal plate cap is inserted into the opening in the cast member and the cast member is subjected to iso-static pressing, which bonds the seal plate cap to the cast member and sinters the cap to form a solid seal.

Abstract: The present invention discloses a method of manufacturing a multi-chip stacking package. The characteristic of the invention is that after the alignment of the bumps of at least two chips, welded bumps will be generated in a high temperature welding to form a welded bump. Furthermore, one of the at least two chips may only provide bonding pad similar to the Under Bump Metallurgy and may not provide bumps, and using the bonding pad to be welded with the bump on another chip.

Abstract: More complete bonding of wafers may be achieved out to the edge regions of the wafer by constrained bond strengthening of the wafers in a pressure bonding apparatus after direct wafer bonding. The pressure bonding process may be accompanied by the application of not above room temperature.

Abstract: A method of manufacturing a fiber reinforced metal disc comprises forming an annular groove in an axial face of a first metallic ring. A plurality of metal coated fibers are arranged in spiral preforms and a plurality of metallic wires are arranged in spiral preforms. The metal coated fiber preforms and the metallic wire preforms are arranged in the groove. An annular projection is formed on an axial face of a second metallic ring. The annular projection on the second metallic ring is aligned with the annular groove in the first metallic ring. Heat and pressure is applied to axially consolidate the metal coated fiber preforms and metallic wire preforms and to bond the first metal ring, the second metal ring, and the preforms to form a unitary composite disc. The use of metal coated fibers and metallic wires allows the mechanical properties to be tailored.

Abstract: A method of laminating a plurality of metal plates one to another, comprising steps of (a) arranging at least first and second generally planar metal plates having exposed surfaces into a spaced apart parallel relationship with one another, (b) anchoring the spaced apart plates to a fixed location, and (c) propelling a projectile against the exposed surface of the first plate with sufficient velocity to create a spot impact between the first and second plates of sufficient energy to create a metallurgical weld between the plates at the point of projectile impact.

Abstract: A reflow soldering apparatus and method are provided for reflow soldering electrical and electronic components to circuit boards. The reflow soldering apparatus and method use selective infrared (IR) heating alone or in combination with convection heating to achieve reflow soldering. Selective IR heating provided by the apparatus and method according to the invention helps to eliminate or helps to at least substantially reduce a risk overheating and thermal damage to non-targeted electrical and electronic components and areas of circuit boards during reflow.

Abstract: A plurality of parts are brazed using an iron/chromium brazing filler metal. The parts are preferably composed of stainless steel and the brazed assembly forms a heat exchanger characterized by good corrosion resistance and low rates of leaching of Ni into fluids passing therethrough. The heat exchanger is especially suited for use in processing items intended to be ingested by humans or animals. Leaching rates and corrosion resistance are further enhanced by a post-brazing conditioning step wherein the assembly is heated in an oxygen-containing atmosphere to a temperature ranging from about 150° to 600° C.

Abstract: The invention relates to a process for soldering electrical components to soldering positions, which are provided with soldering material, on a plastic sheet provided with applied conductor tracks. The plastic sheet is heated, from the side which is remote from the components, to a below its damage temperature and after heating its side which is remote from the components is thermally insulated. Then, the side which faces the components is acted on by a heating-gas stream which is concentrated onto the locations which are to be soldered by a template which has windows.

Abstract: An adhesive-free multilayered metal laminate having a given thickness which is obtained by bonding a metal sheet having a thin metal film on a surface thereof to a metal foil without using an adhesive; and a process for continuously producing the laminate. The process comprises the steps of; setting a metal sheet on a reel for metal sheet unwinding; setting a metal foil on a reel for metal foil unwinding; unwinding the metal sheet from the metal sheet-unwinding reel and activating a surface of the metal sheet to thereby form a first thin metal film on the metal sheet surface; unwinding the metal foil from the metal foil-unwinding reel and activating a surface of the metal foil to thereby form a second thin metal film on the metal foil surface; and press-bonding the activated surface of the first thin metal film to that of the second thin metal film so that the first thin metal film formed on the metal sheet is in contact with the second thin metal film formed on the metal foil.

Abstract: A method of joining coiled sucker rod in the field. In its most basic form, the method includes a first step of placing abutting ends of sucker rod in face to face relation. A second step involves positioning a gas burner in proximity to the abutting ends of sucker rod and heating the abutting ends with a hydrocarbon gas flame while applying axial pressure to force the abutting ends together. A third step involves continuing heating and applying pressure until a weld is formed with a bulge formed above the weld which is at least one third of the diameter of the welded rod. A fourth step involves keeping the pressure constant until the weld cools.

Abstract: A film which has a multilayered metal and is obtained by bonding a polymer film having a thin metal film formed on a surface thereof to a metal foil having a given thickness without using an adhesive. It has a given thickness and is adhesive-free. The film having a multilayered metal is obtained by preparing a polymer film having a thin metal film superposed on a surface thereof, activating both the surface of the thin metal film and a surface of a metal foil, and press-bonding the activated thin-metal film surface to the activated metal foil surface.

Abstract: The invention provides a convection type brazing apparatus for metal workpieces such as aluminum, copper, iron and so forth that enables uniform heating of the metal workpieces to prevent deformation of the workpieces and can shorten a heating time to achieve a higher operation efficiency. A heating medium gas heated by a tube heater 36 in a thermal medium gas heating chamber 45 is forwarded by a fan 37 to manifolds 41A and 41B located on both left and right sides, to be blown through a multitude of nozzles 43 toward workpieces W to which a brazing material and flux have been applied in advance. Once the workpieces temperature has reached a predetermined temperature for brazing, a switching valve located in an upper duct 48 is activated so that the heating medium gas is intermittently blown to the workpieces. As a result, a temperature slope of the workpieces is minimized and uniform brazing can be performed.

Abstract: A method of manufacturing a high-quality metal foil/ceramics joining material (19) and a metal foil laminated ceramic substrate (20) which can prevent a damage to a ceramic material and enhance the productivity of the metal foil/ceramics joining material and the metal foil etched, are pressure-joined to ensure an easy and positive subsequent pressure-joining and the ceramic material (13) can be prevented from being broken because the ceramics material (13) is heated while being placed on a holder (14) and is pressure-joined under a pressure of 1 kg/mm2 or lower.

Abstract: A solder reflow system is disclosed that includes a substrate, a solder pad disposed upon the substrate, an optical component disposed upon the solder pad, and a laser positioned above the substrate with laser output focused sufficiently close to the solder pad to reflow the solder when the laser is powered. Also disclosed is a method for reflowing a solder joint, including: providing an optical component assembly including a substrate, a solder pad disposed upon the substrate, solder disposed upon the solder pad, and an optical component disposed upon the solder pad; providing a laser; positioning the laser above the substrate with laser output focused sufficiently close to the solder pad, instead of directly over the solder pad; and powering the laser, thereby transferring energy through the substrate into the solder pad, and reflowing the solder.

Abstract: A second substrate is positioned relative to a first substrate having phase-changeable bumps, such as solder bumps, between them, wherein the second substrate has a first face adjacent the first substrate, a second face remote from the first substrate, and at least one edge wall between the first and second faces. The phase-changeable bumps are liquefied to establish an equilibrium position of the first and second substrates relative to one another. At least a portion of the second face is pushed away from the equilibrium position towards the first substrate, to a new position, without applying external force to the first face other than spring forces of the phase-changeable bumps that are liquefied, and without applying external force to any edge wall. Thus, only spring forces of the phase-changeable bumps that are liquefied oppose the pushing. The phase-changeable bumps that are liquefied then are solidified, to maintain the new position.

Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.

Abstract: In a shield terminal joining structure for joining a shield terminal to a prescribed grounding position along a shielded cable that is formed by an inner core wire made of a conductor, an inner insulation covering that covers the inner core wire, a braid that is provided around the outside periphery of the inner insulation covering, an outer insulation covering that covers the braid, resistive welding is performed while crimping parts of the shield terminal to the outer covering of the shielded cable at the grounding position, so as to melt away part of the outer insulation covering, enabling a weld to be made between the crimping parts and the braid of the shielded cable.

Abstract: Fluxless soldering processes use pressure variations and vented cavities within large-area solder joints to reduce void volumes and improve the properties of the large-area solder joints. The vents can be sealed after soldering if closed cavities are desired. A cavity can also improve hermeticity of a solder joint by providing an additional solder fillet around the cavity in addition to the solder fillet around the perimeter of the solder joint.

Abstract: The instant invention is directed to a bonded product, such as a manifold, for gas or liquid chromatographs, and a method for making the same. The bonded product is made using the following steps: (i) contacting two or more steel sheets; (ii) heating the contacted sheets to a temperature substantially below the melting temperature of the sheets; (iii) applying pressure to the contacted sheets; and (iv) cooling the contacted sheets. No intermediate foreign material is used to bond the steel sheets, e.g., no welding material or TLP diffusion bonding plate is utilized. Nonetheless, a strong, leak free bond is generated at temperatures as low as 1700° F. (926.6° C.). The bond is molecular in nature, as evidenced by grains that grow from one sheet to another across the interface between the two sheets.

Abstract: A solder reflow system is disclosed that includes a substrate, a solder pad disposed upon the substrate, an optical component disposed upon the solder pad, and a laser positioned above the substrate with laser output focused sufficiently close to the solder pad to reflow the solder when the laser is powered. Also disclosed is a method for reflowing a solder joint, including: providing an optical component assembly including a substrate, a solder pad disposed upon the substrate, solder disposed upon the solder pad, and an optical component disposed upon the solder pad; providing a laser; positioning the laser above the substrate with laser output focused sufficiently close to the solder pad, instead of directly over the solder pad; and powering the laser, thereby transferring energy through the substrate into the solder pad, and reflowing the solder.

Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.

Abstract: A method of repairing a part, such as a rotating disk/drum rotor of a gas turbine engine. The method includes: heating a contact area of a wrought material and a contact area of a wrought part; and pressing the contact area of the material against the contact area of the part to bond the parts. A method of making a rotating part of a gas turbine engine, comprising: heating a contact area of a wrought material and a contact area of a wrought part; and pressing the contact area of the material against the contact area of the part to bond the parts. The methods may include a subsequent heat treatment to provide the desired strength properties to the joint between the material and the part.

Abstract: To form a micromachine package, bond pads on a front surface of a controller chip are aligned with corresponding traces on a front surface of a micromachine chip. The bond pads are physically connected to the traces thus mounting the controller chip as a flip chip to the micromachine chip. A bead is formed around a periphery of the controller chip. The bead and the controller chip form an enclosure around a micromachine area in the front surface of the micromachine chip. This enclosure protects the micromachine area from the ambient environment.

Abstract: Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Abstract: An electronic unit manufacturing apparatus includes: a cream solder printer for printing cream solder on one side of a printed-circuit board; a chip placement machine for placing a plane-mounted part on the printed-circuit board on which the cream solder is printed; a first reflow furnace for fixedly securing the plane-mounted part to the printed-circuit board; a solder application machine for applying a larger amount of cream solder than that printed by the cream solder printer in the vicinity of holes made in the one side of the printed-circuit board; and a second reflow furnace for inserting pins of a deformed part into the holes made in the printed-circuit board from an opposite side thereof and fixedly securing the pins of the deformed part to the printed-circuit board, wherein in the second reflow furnace. In the second reflow furnace, temperature on the opposite side of the printed-circuit board is set lower than temperature on the one side thereof.

Abstract: The methods comprises the bonding of defined metals between them by assistance of mechanical pressure and direct electric current so that the local temperature allow the bonding of different metals or alloys without any of them to lose their specific characteristics and to react like one piece of metal with extremely resistance to the electrochemical oxidation. Due to the generating of high oxidants as H2, Cl2, ClO3, O3, O2, H2O2, [OH], [CLOH], [O], through electrolysis, this anode is effective enough to eliminate liquid wastes.

Abstract: Handheld and stationary hot air solder reflow apparatus for repairing, reworking or producing electronic components and circuit boards of the type having a means for supplying a flow of hot air to an outlet tube are provided with a nozzle adaptor which has an internal adapter body which is resiliently carries a support collar which is held in an axial direction relative to the internal body by a spring. A bezel ring having a plurality of receiving tabs is mounted in the support collar, the tabs on the bezel ring in the support collar engage tabs on a mounting plate of each nozzle assembly, causing compression of the spring and resulting in a clamping of the mounting plate between a bottom surface of the internal body and the bezel ring.

Abstract: A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Abstract: A method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally converted into thermal energy and bad connections due to underheating or destruction of the contacts due to overheating does not occur. The method and apparatus provides rapid, reproducible bonding even for the smallest of contact geometries. For example, the method of the invention results in solderless gold to gold compression bonding of conductive leads contained in a polymer flex circuit tape, such as a polyimide, without damaging the tape. A strong solderless gold to gold bond can be formed between the gold plated copper lead on the flex circuit tape and a gold plated pad on a semiconductor chip without the need for a window in the flex circuit and without any damage to the tape.

Abstract: A heat sink made of aluminum having both high strength and heat dissipation performance together is manufactured. In a method of manufacturing a heat sink made of aluminum by brazing a plurality of fins 13 on a heat dissipating substrate 11, the fin 13 comprises an Al—Mg—Si series alloy containing from 0.3 to 0.7% by weight of Mg, from 0.3 to 0.7% by weight of Si and the balance of Al and inevitable impurities, and is put to cooling at a rate of 50° C./min or more in a range from 450-500° C. to 300° C. in the cooling process after heating for brazing and, subsequently, artificial aging is applied at 100 to 250° C.

Abstract: Carbon steel pipes are joined to each other in a non-oxidizing atmosphere by using an insert constituted by a Ni-base alloy or a Fe-base alloy having a melting point which is lower than 1200° C. and a thickness of 80 mm or smaller under conditions that the surface roughness Rmax of the joined surfaces of the carbon steel pipes is 20 &mgr;m or smaller, the joining temperature is not lower than 1250° C. nor higher than 1330° C., duration at the joining temperature is 30 seconds or longer and the pressure is not lower than 2 MPa nor higher than 4 MPa. The expanding operation is performed such that the maximum difference in level of the joined portion is not larger than 25% of the carbon steel pipe and the expansion ratio is 25% or lower.

Abstract: A printed circuit board which has been soldered in a molten solder bath is cooled immediately thereafter with a cooling liquid at a rate of at least 10° C./second. Thermal effects of high-temperature solder during soldering are suppressed, and the metal matrix of the solder is refined, resulting in soldered connection of increased strength.

Abstract: A method of semiconductor eutectic alloy metal (SEAM) technology for integration of heterogeneous materials and fabrication of compliant composite substrates takes advantage of eutectic properties of alloys. Sub1 and Sub2 are used to represent the two heterogeneous materials to be bonded or composed into a compliant composite substrate. For the purpose of fabricating compliant composite substrate, the first substrate material (Sub1) combines with the second substrate material (Sub2) to form a composite substrate that controls the stress in the epitaxial layers during cooling. The second substrate material (Sub2) controls the stress in the epitaxial layer grown thereon so that it is compressive during annealing. A joint metal (JM) with a melting point of Tm is chosen to offer variable joint stiffness at different temperatures. JM and Sub1 form a first eutectic alloy at a first eutectic temperature Teu1 while JM and Sub2 form a second eutectic alloy at a second eutectic temperature Teu2.

Abstract: Its basic means is a monolithically bonded construct prepared by monolithically bonding together a rare-earth magnet 2 and a an alloy material that is a high melting point metal or a high specific-tenacity material through the solid phase diffusion bonding by the hot isostatic pressing treatment, and a monolithically bonded construct with an interposal of a thin layer of the high melting point metal between a rare-earth magnet 2 and an alloy material 3, 4 that is a high specific-tenacity material.

Abstract: There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations thereon; a dielectric substrate 14 having a first surface 16 on a first side thereof, a second surface on a second side thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations of the electronic component 10; and a diode laser 50; (b) depositing solder paste atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side of the substrate 14 for a predetermined time, such that the solder paste atop the at least one of the mounting pads 24 is melted.

Abstract: Rotary tools 340A and 340B are disposed to weld along two joining lines. For this purpose spaced welding lines the two rotary tools are inserted and into respective welding joints moved at the same time along their respective welding lines. At a position P1 of a portion of a window 210, the rotary tool 340A is retreated from the welding joint so that the tool 340 A continues to move friction stir welding on that welding joint is stopped although the welding. At a position P3, the rotary tools 340B are gradually withdrawn from their respective welding joints while they continue to move along the welding line. At a position P4, the moves of the rotary tools 340A and 340B is stopped, the rotary tool 340B is made to retreat and the joining is made to stop. Next, the rotary tools 340A and 340B are inserted and the move are started again. An insertion amount of the rotary tool 340B is larger than an insertion amount during the stop of the move of the rotary tool.

Abstract: An apparatus and method for joining two or more vehicle components together to form a joint in a vehicle body and frame assembly is disclosed. The frame assembly can include a pair of longitudinally extending side rails having a plurality of transverse cross members extending therebetween. At least one of the side rails includes a portion that is deformed inwardly to define a mounting projection that is sized to receive an end of one of the cross members therein. The mounting projection is preferably formed having a first relatively large diameter portion that is somewhat larger in diameter than the outer diameter of the end of the cross member and a second relatively small diameter portion that is only slightly larger in diameter than the outer diameter of the end of the cross member. An internal magnetic pulse welding inductor assembly is inserted within the cross member to generate an intense electromagnetic field.

Abstract: A flow control nozzle for hot gases includes an input end to receive a hot gas. An output end of the flow control nozzle delivers the hot gas to a surface mount device attached with solder to a printed circuit board. A gas distribution mechanism is positioned between the input end and the output end. A gas flow control mechanism is positioned in the gas distribution mechanism to selectively alter the flow of the hot gas through the gas distribution mechanism such that the gas distribution mechanism and the gas flow control mechanism operate to deliver the hot gas to the output end in a substantially uniform manner that facilitates substantially uniform melting of the solder.

Abstract: A method of assembling a pressed joint between an integrated circuit module and a temperature regulating unit includes the steps of: 1) providing the integrated circuit module with a contact surface of a first material and providing the temperature regulating unit with a contact surface of a second material; 2) coating the contact surface of the temperature regulating unit with a metal alloy which adheres in a solid state to the second material but not the first material; 3) heating the metal alloy to a slurry/liquid state; and 4) squeezing the slurry/liquid alloy between the contact surfaces on the integrated circuit module and the temperature regulating unit.

Abstract: A method and apparatus for selectively heating a structure capable of absorbing heat radiations in the 0.5 to 2 micron range relative to an adjacent structure wherein a first structure capable of absorbing heat radiations in the 0.5 to 2 micron range is disposed adjacent a second structure much less capable of absorbing heat radiations in the 0.5 to 2 micron range. An unfocused heat source which provides a major portion of its heat energy in the range of from about 0.5&mgr; to about 2&mgr; relative to heat energy above 2&mgr; and below 0.5 micron directs heat concurrently to the first and second structures to heat the first structure to a temperature sufficiently high and much higher then the second structure to permit a predetermined function to be performed in conjunction with the first structure while maintaining the second structure below a predetermined temperature. The function is then performed. The heat source preferably comprises an unfocused tungsten halogen lamp.

Abstract: A first member and a second member have end portions overlapped and welded by irradiating a laser beam on an outer surface of a lap portion. A front end surface of a fused portion slants at an obtuse angle larger than 90° with respect to a naked outer surface of the second member. A dilution rate S=B/(A+B) is equal to or less than 45%, where “A” represents a cross-sectional area of the fused portion merging into the first member and “B” represents a cross-sectional area of the fused portion merging into the second member.

Abstract: A method for determining the condition of a reflow furnace so as to prevent the semiconductor element from tilting due to different collapsed amounts of solder bumps in the single semiconductor element of multiple chip modules mounted on the semiconductor element on the substrate. For the carrying direction in the reflow furnace using a carrying belt, temperature analysis for time duration is performed for the solder bumps at both the front and rear, and then the condition of the reflow furnace is determined so as to close at both the times for reaching the solder melting temperature and the times for maintaining the solder melting temperature.

Abstract: A method of semiconductor eutectic alloy metal (SEAM) technology for integration of heterogeneous materials and fabrication of compliant composite substrates takes advantage of eutectic properties of alloys. Sub1 and Sub2 are used to represent the two heterogeneous materials to be bonded or composed into a compliant composite substrate. For the purpose of fabricating compliant composite substrate, the first substrate material (Sub1) combines with the second substrate material (Sub2) to form a composite substrate that controls the stress in the epitaxial layers during cooling. The second substrate material (Sub2) controls the stress in the epitaxial layer grown thereon so that it is compressive during annealing. A joint metal (JM) with a melting point of Tm is chosen to offer variable joint stiffness at different temperatures. JM and Sub1 form a first eutectic alloy at a first eutectic temperature Teu1 while JM and Sub2 form a second eutectic alloy at a second eutectic temperature Teu2.