Joint Interposed Patents (Class 228/249)
  • Patent number: 6534194
    Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: March 18, 2003
    Assignee: Johns Hopkins University
    Inventors: Timothy P. Weihs, Michael Reiss
  • Publication number: 20020175205
    Abstract: A brazing product, e.g. a brazing sheet product, having an aluminium layer made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18 weight %, and a layer comprising nickel on the outer surface of the aluminium layer such that taken together the aluminium layer and all layers exterior thereto form the filler metal for a brazing operation. The filler metal has a composition containing at least one element: (i) with a smaller exchange current density for the Hydrogen Evolution Reaction (“HER”) than nickel and/or (ii) such that the electro-chemical potential difference between particles of Ni-aluminide(s) of the filler and the aluminium alloy matrix of the filler is reduced. The filler metal's mol-ratio of Ni to such element(s) is in the range of 10:(O.3-30). The invention also relates to a method of manufacturing a brazed assembly using the brazing product, and to a brazed assembly comprising at least one component made of the brazing product.
    Type: Application
    Filed: January 31, 2002
    Publication date: November 28, 2002
    Inventors: Adrianus Jacobus Wittebrood, Jacques Hubert Olga Joseph Wijenberg, Joop Nicolaas Mooij
  • Patent number: 6440583
    Abstract: Disclosed is an Al alloy for a welded construction having excellent welding characteristics, which Al alloy comprises 1.5 to 5 wt % of Si (hereinafter, wt % is referred to as %), 0.2 to 1.5% of Mg, 0.2 to 1.5% of Zn, 0.2 to 2% of Cu, 0.1 to 1.5% of Fe, and at least one member selected from the group consisting of 0.01 to 1.0% of Mn, 0.01 to 0.2% of Cr, 0.01 to 0.2% of Ti, 0.01 to 0.2% of Zr, and 0.01 to 0.2% of V, with the balance being Al and inevitable impurities. Also disclosed is a welded joint having this Al alloy base metal welded with an Al—Mg- or Al—Si-series filler metal.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: August 27, 2002
    Assignees: The Furukawa Electric Co., Ltd., Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Seizo Ueno, Yoichiro Bekki, Noboru Hayashi
  • Patent number: 6434946
    Abstract: An article assembly comprising a plurality of members includes a multi-layered brazed joint provided in the assembly between a first member that can be affected adversely by thermal exposure at a limiting and a second member requiring exposure, such as for brazing, at least at the limiting temperature. The assembly is provided with a multi-layered brazed joint directly or indirectly between such members by brazing to the second member a second brazing alloy that can be brazed at a temperature required to braze the second member, providing a preform. The assembly is brazed to include the first member by brazing members of the assembly together with a first brazing alloy, brazing at a temperature less than the limiting temperature, brazed at the second brazing alloy.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: August 20, 2002
    Assignee: General Electric Company
    Inventors: Mark Richard Shaw, David Edwin Budinger, Ronald Daniel Regan
  • Patent number: 6326088
    Abstract: A diffusion-soldered joint and a method for making diffusion-soldered joints includes a particularly actively diffusing, low-melting-point intermediate layer, applied in the molten state, introduced in the form of a solder carrier between at least two joint components. The solder carrier includes a metal foil that is equipped on both sides with solder layers, wherein the solder layers may include multiple layers.
    Type: Grant
    Filed: August 7, 1997
    Date of Patent: December 4, 2001
    Inventors: Rolf Mayer, Rolf Engelhart, Wilfried Reschnar, Godehard Schmitz
  • Patent number: 6135345
    Abstract: In a metal material bonding method, an insertion material, which has a lower melting point than that of metal materials to be bonded, is interposed between bonding end surfaces of the metal materials to be bonded. The metal materials to be bonded is heated and held to a temperature not lower than the melting point of the insertion material and not higher than the melting point of the metal materials to be bonded while applying pressure to bonding surfaces of the metal materials to be bonded. The insertion material is formed to have a size which is smaller than each of the bonding surfaces of the metal materials to be bonded.
    Type: Grant
    Filed: February 9, 1999
    Date of Patent: October 24, 2000
    Assignee: Daido Tokushuko Kabushiki Kaisha
    Inventors: Takao Shimizu, Noboru Yamamoto, Shigeyuki Inagaki, Hiroaki Suzuki
  • Patent number: 6098871
    Abstract: The present invention relates to a process for joining two metal members together. The process comprises the steps of providing two parent metal members to be joined and a prealloyed interlayer foil having a melting point depressant; creating a joint interface by positioning the foil between two spaced apart surfaces of the two parent metal members to be joined together; applying a load substantially transverse to the joint interface which does not cause deformation of the surfaces; and applying localized rapid heating in the area of the joint interface at a temperature sufficient to effect bonding of the two metallic members while causing little or no degradation of microstructural or mechanical properties of the parent metal and a coarsening of grain size in rim portions of the metal members.
    Type: Grant
    Filed: July 22, 1997
    Date of Patent: August 8, 2000
    Assignee: United Technologies Corporation
    Inventors: Ronald R. Cairo, John M. Robertson, J. Carter Barone, Dennis C. Stewart
  • Patent number: 6010059
    Abstract: A method of mechanically joining electrically conductive parts to form an electrically conductive joint by providing first and second electrically conductive parts that are to be joined to establish electric conductivity between them wherein the first part comprises non-alloying material and the second part comprises non-ferrous material. Brazing material is disposed between the parts at a location where they are to be joined. Ultrasonic energy is then applied. The brazing material is selected to comprise at least two materials, one of the two materials being elemental copper, and the elemental copper being the largest single constituent of the brazing material. The invention also provides a novel construction for parts that form a portion of an interruptable current path through a circuit protection device such as an electric circuit breaker.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: January 4, 2000
    Assignee: Siemens Energy & Automation, Inc.
    Inventor: Charles A. Newland
  • Patent number: 5890748
    Abstract: A composite male hose coupler comprising a metallic tail piece; an externally threaded male fitting; and means for affixing the tail piece to the male fitting; and a method of manufacture thereof, are disclosed. The metallic tail piece is formed of annealed brass tube stack and includes a first cylindrical portion and a second cylindrical portion joined together by a radially outwardly extending flange generally perpendicular to the longitudinal axes of the first and second cylindrical portions. The externally threaded male fitting is formed of machined brass stock and includes external threads on the outer surface and an annular lip for receiving the flange of the tail piece. A solder material is employed to produce a fluid-tight seal between the tail piece and the male fitting.
    Type: Grant
    Filed: October 14, 1997
    Date of Patent: April 6, 1999
    Assignee: Winzeler Stamping Company
    Inventors: Daniel L. Phillips, Steven D. Champion, Michael E. Allman
  • Patent number: 5702050
    Abstract: A method of brazing a honeycomb for air sealing onto a braze surface of the front end of the stationary blade of an axial-flow compressor in accordance with the invention includes the steps of: placing a filler sheet between the honeycomb and the braze surface; constraining the honeycomb in the seal width direction so that the seal width direction of the honeycomb corresponds to the seal width direction of the braze surface while keeping the figure of the honeycomb at the same curvature with that of the braze surface; and heating the assembly to braze the honeycomb and the braze surface.
    Type: Grant
    Filed: April 18, 1996
    Date of Patent: December 30, 1997
    Assignee: Mitsubishi Jukogyo Kabushiki Kaisha
    Inventor: Kiyoo Oono
  • Patent number: 5358169
    Abstract: A method of soldering leads to electrical elements, such as resistors, in which a ribbon of solder, having a coating of flux, is sandwiched between a plurality of electrical elements and a plurality of leads. Hydrogen flames then cut the ribbon at points between the electrical elements and also between the leads. The hydrogen flames are then directed at the leads to melt the solder and cause extending portions of the ribbons to be drawn towards the leads.
    Type: Grant
    Filed: January 14, 1994
    Date of Patent: October 25, 1994
    Assignee: Caddock Electronics, Inc.
    Inventors: Richard E. Caddock, Robert C. Bowen
  • Patent number: 5271549
    Abstract: A multiple-lead element soldering method of this invention contains a step of beforehand mounting a band-shaped sheet solder on a wiring board so as to be bridged over land portions of a wiring pattern on which lead terminals of the multiple-lead element are to be soldered, and a step of heating the band-shaped sheet solder by a heat press method to melt the band-shaped sheet solder, whereby the land portions of the wiring pattern and the lead terminals of the multiple-lead element are accurately soldered through the melted band-shaped sheet solder with sufficient amount of solder.
    Type: Grant
    Filed: February 24, 1993
    Date of Patent: December 21, 1993
    Assignee: Sony Corporation
    Inventor: Toshio Tohyama
  • Patent number: 5222651
    Abstract: A process for producing a vacuum interrupter chamber includes placing spacers in bodily contact with a soldering foil and joining the spacers to the soldering foil or fixing them in a displacement-proof fashion on specially made dents in the foil, so that they can be fixed for the purpose of a reliable and simple assembly. Degassing gaps are left between soldering spacers, on which a cover of the interrupter chamber rests. The vacuum interrupter chamber is evacuated in a single furnace cycle and soldered.
    Type: Grant
    Filed: September 24, 1990
    Date of Patent: June 29, 1993
    Assignees: Calor-Emag Elektrizitaets-Aktiengesellschaft, Degussa AG
    Inventors: Gunter Pilsinger, Joseph Lipperts, Wolfgang Diem
  • Patent number: 4844322
    Abstract: A method for replacing a damaged or defective section of a length of original piping or tubing located within a structrue such as the turbine of a jet engine wherein access to the tubing is limited, and replacing such damaged section with a new section of tubing comprises inserting a cutter mounted at one end of a flexible shaft into the interior of the original tubing and rotating the shaft to cut out and remove the damaged section of tubing leaving at least one stub section of original tubing. The stub sections of original tubing are then prepared for welding or brazing to a section of replacement tubing with a series of tools each mounted to an elongated shaft. These tools include a chamfering tool, a deburring tool, and a polishing tool.
    Type: Grant
    Filed: October 15, 1987
    Date of Patent: July 4, 1989
    Assignee: General Electric Company
    Inventors: Gilbert E. Flowers, Earl L. Kelly, Jr., Henry E. Lynch
  • Patent number: 4816621
    Abstract: A ceramic-metal lead assembly, of the type suitable for use in nerve or heart pacemakers, has a disk of high-purity ceramic with at least one lead extending therethrough, the disk being soldered vacuum-tight to a flange ring via a solder gap. The flange ring consists of a metal which is resistant to body electrolytes, and the coefficients of thermal expansion of the joined materials are matched to each other, but are not identical. For avoiding cracks in the ceramic disk in the region of the solder connection, the solder gap has a width such that the diffusion path of the metal of the flange ring into the solder connection cannot exceed a selected distance in the solder bridge which forms at the soldering temperature. A solder zone which is free of the metal of the flange ring, and thus has a dutility which is not degraded by the flange ring metal, is formed around the ceramic disk.
    Type: Grant
    Filed: November 25, 1987
    Date of Patent: March 28, 1989
    Assignee: Siemens Aktiengesellschaft
    Inventors: Rosa M. Huebner, Ursula Huebner, Klaus G. Huebner
  • Patent number: 4785989
    Abstract: Alumina is bonded to a metal by means of an active brazing filler alloy. When the metal to which the alumina is bonded is a high blushing metal, that is, a metal on which the active brazing filler alloy readily flows on the surface, a thin layer of a low blushing metal is disposed therebetween.
    Type: Grant
    Filed: November 16, 1987
    Date of Patent: November 22, 1988
    Assignee: GTE Products Corporation
    Inventors: Howard Mizuhara, Eugene Huebel
  • Patent number: 4710235
    Abstract: A process for bonding together two or more pieces of material, at least one of which is an amorphous material, wherein an intermediate interlayer is placed between the two pieces and the assembly is hot pressed at a temperature above the melting point of the interlayer but below the crystallization temperature of the amorphous piece. The composition of the interlayer is chosen so that the elements diffusing into the pieces being bonded are compatible with retention of the amorphous structure. When the bonding operation is carried to completion, no evidence of the interlayer as a separate phase remains. Alternatively, the bonding operation may be halted before completion and the interlayer will remain as a separate, observable phase. For bonding hard metal amorphous materials, alloys of aluminum with silver, gold, silicon and germanium, and alloys of gold with silicon, with the addition of fluxing elements such as phosphorus and boron, have been found to provide particularly satisfactory results.
    Type: Grant
    Filed: March 5, 1984
    Date of Patent: December 1, 1987
    Assignee: Dresser Industries, Inc.
    Inventor: David M. Scruggs
  • Patent number: 4676069
    Abstract: A vapor phase processing apparatus of the type wherein an article is heated to a preselected temperature for vapor phase processing, comprises a vessel containing a liquid having a boiling point at least equal to the preselected temperature, into and out of which the article is transported, and a heating device for boiling the liquid in the vessel to produce vapor. The heating device is provided, as the sole source of heat, at a base wall of the vessel in such a manner that the heating device is not exposed to the liquid in the vessel.
    Type: Grant
    Filed: April 1, 1986
    Date of Patent: June 30, 1987
    Inventor: Eiichi Miyake
  • Patent number: 4664309
    Abstract: A chip mounting device which is hereinafter also referred to as an "interconnection preform placement device", includes a retaining member having a predefined pattern of holes in which are positioned preforms of joint-forming material such as solder. Each preform is of a predefined configuration and has a height or length greater than is cross-sectional dimension. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. A method of forming resilient interconnections comprises placing the interconnection preform placement device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms.
    Type: Grant
    Filed: June 30, 1983
    Date of Patent: May 12, 1987
    Assignee: Raychem Corporation
    Inventors: Leslie J. Allen, Gabe Cherian, Stephen H. Diaz
  • Patent number: 4650107
    Abstract: A large-area semiconductor component (1) is joined without bubbles by means of soldering to a substrate (2) by placing a perforated metallic intermediate layer (5) between the solder (3) before the soldering and the substrate (2) and the assembly is brought to soldering temperature under pressure and perpendicular to the soldering plane. During this process, the solder (4) completely fills the cavities between the components (1, 2) and (5) after the soldering and drives gas bubbles and any impurities to the periphery of the assembly, a constant distance being maintained between the semiconductor component (1) and the substrate (2). The intermediate layer (5) is preferably constructed as structured foil or as metallic fabric.
    Type: Grant
    Filed: November 15, 1985
    Date of Patent: March 17, 1987
    Assignee: BBC Brown, Boveri & Company, Limited
    Inventor: Helmut Keser
  • Patent number: 4499778
    Abstract: A flexure mount particularly adapted for use in a dynamically tuned gyroscope provides a universal coupling between a rotor element and a drive shaft. The mount features a substantially planar "spider" member oriented transversely to the spin axis of the rotor. The spider has four webs that each extend radially from an inner gimbal ring to a segmented outer ring having four independent sectors each associated with and centered on one of the webs. Two mutually perpendicular "vertical" or cross flexure members each have key portions that extend through radial slots in the webs of the spider. The inner gimbal ring and the spider have central apertures coaxial with the spin axis. An alignment member is seated in the aligned apertures. The vertical flexure members are seated in a set of mutually perpendicular and axially extending slots formed in the alignment member. The spider and the cross members are preferably etched or stamped from precision rolled sheet material.
    Type: Grant
    Filed: February 3, 1981
    Date of Patent: February 19, 1985
    Assignee: Northrop Corporation
    Inventors: Robert O. Westhaver, Gary Walker, Menno G. Koning
  • Patent number: 4491265
    Abstract: A continuous strip of brazing foil is partially folded about transverse parallel fold lines in a repetitive pattern. When this strip is positioned between the nodes of honeycomb cells the fold lines will index the cells into proper alignment for assembly. The brazing strip also serves its normal function of providing brazing material for attaching the assembly to other components.
    Type: Grant
    Filed: June 6, 1983
    Date of Patent: January 1, 1985
    Inventors: Nelson C. Ittner, Gary N. Ittner
  • Patent number: 4436240
    Abstract: A method is described for plating the inner and outer circumferences of a cylindrical dielectric element used in an isolator, and for then assembling the dielectric element with other components to complete the isolator. The dielectric element is first sensitized and activated so that a subsequently applied plating will adhere thereto. The end faces of the dielectric element are then covered with a plating resist, and the element is immersed in a metal plating bath to plate the inner and outer circumferences of the dielectric element. Having been plated, the dielectric element and other components of the isolator are assembled within a hollow connector and joined thereto using a solder sheath.
    Type: Grant
    Filed: April 5, 1982
    Date of Patent: March 13, 1984
    Assignee: Zenith Radio Corporation
    Inventors: Jay H. Feinberg, Terrance Knowles
  • Patent number: 4413406
    Abstract: A method for forming cores for an electrical transformer is disclosed. Also disclosed are the cores made from such a method. In one embodiment an amorphous metal core has relatively thick superimposed laminations comprised of relatively thin amorphous metal sheets. The amorphous metal sheets are heated and bonded together by a metallic bonding agent to form relatively thick amorphous metal packets for the superimposed laminations of the core. The heating and bonding of the amorphous metal sheets reduce the mechanical stresses normally induced into the amorphous metal during the fabrication process. In another embodiment a hybrid core has superimposed laminations certain of which comprise sheets of non-crystalline amorphous metal and one or more sheets of crystalline silicon steel metal.
    Type: Grant
    Filed: March 19, 1981
    Date of Patent: November 8, 1983
    Assignee: General Electric Company
    Inventors: Moreland P. Bennett, Donald E. Ballard
  • Patent number: 4295672
    Abstract: A flexible tube terminating means comprising a fitting connected around the end portion of a flexible tube and having a shoulder for engagement by an annular threaded coupling member located around the tube. The fitting is formed by one member which engages the end of the tube and holds a second member in place while both members are brazed together and to the tube by solder located in an annular cavity formed between the two members and around the tube.
    Type: Grant
    Filed: May 14, 1979
    Date of Patent: October 20, 1981
    Inventor: Robert A. Williams
  • Patent number: 4146165
    Abstract: A procedure for joining parts by brazing-diffusion byEffecting a primary machining on the parts to be assembled in order to prde reservoirs for filling metal,Arranging a strip between the parts or deposit a coating on one of the parts,Filling the filling metal reservoir with a metal powder,Holding the parts together and providing pressure on the surfaces to be joined by means of screws or the equivalent,Placing the assembly within an enclosure containing a controlled atmosphere which is heated to cause, first, the filling metal to flow and, second, diffusion to take place, thenPerforming a secondary machining to eliminate the retaining screws and if possible the reservoirs.
    Type: Grant
    Filed: November 7, 1977
    Date of Patent: March 27, 1979
    Assignee: Societe Nationale d'Etude et de Construction de Moteurs d'Aviation
    Inventors: Jacques Lesgourgues, Bernard A. Blanchet
  • Patent number: 4110592
    Abstract: Metallic tape is butt spliced, i.e. without overlapping the tape, by measuring a fine strip of silver solder into a gap between the cut edges of the lengths of tape being spliced in such a manner that the strip of solder extends over one of the lengths and under the other. The area being spliced is pressed between carbon electrodes and the silver solder is fused by the passage of resistance current.
    Type: Grant
    Filed: June 3, 1976
    Date of Patent: August 29, 1978
    Assignee: Kloften & Kloften A/S
    Inventor: Sigmund Ege
  • Patent number: 4077467
    Abstract: An apparatus for soldering an article which is placed within a first confined region in hot saturated vapors of a primary high temperature liquid. The vapors condense on the article to heat the article for such purpose. A second body of hot saturated vapors of a secondary liquid having a lower boiling point and density than the primary liquid provides a secondary vapor blanket in a second confined region of the apparatus which causes the primary vapors to condense and return to a primary liquid reservoir so that their escape from the apparatus is prevented. The temperature of the secondary liquid is controlled independently of the primary liquid.
    Type: Grant
    Filed: January 28, 1976
    Date of Patent: March 7, 1978
    Inventor: Donald J. Spigarelli
  • Patent number: 4066203
    Abstract: A method of electrically and hydraulically connecting a conductor bar having a plurality of hollow water-cooled conductors involves compressing the conductor bar and shims of brazing material in a connector clip formed of a pair of mating clip members. Brazing shims (strips and bands) are placed in desired positions, and then the components are heated and hydraulically compressed. The conductor bar and brazing material assembly is sized for a tight fit in one dimension, but oversized in another dimension so that compression results in a desired distribution of the molten brazing material. During compression, the clip members are secured from relative motion, other than displacement toward one another, and air is passed through the hollow conductors to prevent the accumulation of brazing material in the open ends thereof. In addition to the clip members, the connector device includes a water inlet member with a stem that is inserted between and brazed to the clip members after the compression step.
    Type: Grant
    Filed: January 21, 1977
    Date of Patent: January 3, 1978
    Assignee: McGraw-Edison Company
    Inventor: David Peter Davies
  • Patent number: 3936277
    Abstract: Fiber reinforced metal sheets coated with an alloying material for use in forming fiber reinforced metal matrix composite structures by means of eutectic bonding processes and the structures formed by said sheets.
    Type: Grant
    Filed: April 9, 1970
    Date of Patent: February 3, 1976
    Assignee: McDonnell Douglas Corporation
    Inventors: William M. Jakway, Ronald B. Kollmansberger