Abstract: A set of features for a product is identified. It is determined that preventing an electrical connection at a ball-grid-array location on a ball-grid-array assembly of the product would result in the set of features. The ball-grid-array location is established as a target BGA location based on that determination. Suction is applied to a via at the target BGA location during reflow of the ball-grid-array assembly. With that application of suction, a solder ball at the target BGA location is drawn into the via.

Abstract: Provided is a multi-beam laser debonding apparatus for debonding an electronic component from a substrate, the apparatus including: a first laser module to emit a first laser beam to a predetermined range of a first substrate area including attachment positions of a debonding target electronic component and a neighboring electronic component to thereby heat a solder of the electronic components to reach a predetermined pre-heat temperature; and a second laser module to emit a second laser beam overlapping the first laser beam to a second substrate area smaller than the first substrate area, the second substrate area including the attachment position of the debonding target electronic component to thereby heat the solder of the debonding target electronic component to reach a debonding temperature at which the solder commences melting.

Abstract: Apparatus and associated methods relate to removing an adhesively-attached component from a circuit board assembly. A complementary pair of high-permeability members are positioned on opposite sides of the circuit board assembly about the adhesively-attached component. Then, a magnetic field is induced within the complementary pair of high permeability members via a coil driver generating an AC current in an inductive coil circumscribing a central pedestal of the complementary pair of high-permeability members. The magnetic field induced is directed through the adhesively-attached component via a central pedestal located proximate the adhesively-attached component. A return path for the magnetic field is provided about a periphery of the adhesively-attached component via a peripheral pedestal.

Abstract: Provided is a system for removing an electronic component from a printed circuit board (PCB). The system may comprise a heating well configured to hold a rework liquid. The system may further comprise a head system configured to create a liquid-tight seal around an electronic component. The system may further comprise a nozzle and a mechanical capture device disposed within the head system. The mechanical capture device may be configured to attach to the electronic component. The system may further comprise a controller. The controller may be configured to release the rework liquid through the nozzle and onto the electronic component and lift the electronic component off the PCB.

Abstract: A light source system includes an excitation light source, a fluorescent plate that emits fluorescence when exposed to the excitation light from the excitation light source, and a compartment storing the fluorescent plate. The compartment has a heat-receiving section and a heat-dissipation section thermally connected to each other. The heat-receiving section is located opposite a fluorescence light output side of the fluorescent plate, in the compartment. The heat-dissipation section is outside the compartment.

Abstract: A shielding cover mounting and dismounting apparatus for mounting or dismounting a shielding cover connected with a circuit board. The circuit board has an upper surface and a lower surface, and the shielding cover is connected with the lower surface. The apparatus includes a base, a first supporting seat, a second supporting seat, a heater and a moving seat. The first supporting seat is disposed on the base and has a bearing cavity. The shielding cover and the circuit board are disposed in the bearing cavity, and the shielding cover is disposed between the circuit board and a bottom surface of the bearing cavity. The second supporting seat is disposed in an opening of the bearing cavity. The heater is disposed at one side of the upper surface of the circuit board. The moving seat drives the heater to move closer to or away from the circuit board.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: The proposed invention relates to an apparatus and a method of separating all the parts including but not limited to electronic components, mechanical components, and electromechanical components, modules etc either individually or in sections and modular parts from the main input PCB. The proposed invention is an apparatus and method for component removal during recycling of an electronic device comprising in combination an isothermal system; heating to achieve desired range of temperature within the said isothermal system; at least one system for mechanical handling of the object being recycled; at least one system for selective separation of components being removed.

Abstract: Disclosed is an aluminum alloy brazing sheet (1) for heat exchangers, the brazing sheet provided with a core material (2) and a filler material (3) that comprises an Al—Si—Zn alloy and is formed on at least one side of the core material (2). The core material (2) has a pitting potential of ?650 mV or more (vs. Ag/AgCl). The filler material (3) has a zinc concentration of from 1 to 10 percent by mass; a liquid fraction X, at the brazing temperature, satisfying the relation 0.3?X?0.88; and a clad ratio d (%) satisfying the relation 15<d?30. The filler material has a product (X×d) of the liquid fraction X and the clad ratio d (%) satisfying the relation 6?X×d)?23.

Abstract: Disclosed herein is an apparatus for manufacturing a camera module, the apparatus including: a base jig holding a PCB from below; a bonding head picking up an image sensor and attaching the image sensor onto the PCB; and a housing bonding tool picking up a housing assembly and attaching the housing assembly onto the PCB so that the image sensor attached onto the PCB is received in the housing assembly, wherein the base jig is constituted in a structure where the base jig is tension-movable in a vertical direction (Z-axial direction), so that an upper surface of the PCB is an identical reference plane for attaching the image sensor and the housing assembly when the image sensor is picked up by the bonding head and attached onto the PCB.

Abstract: A removal apparatus for a semiconductor chip may include a stage configured to support a board on which the semiconductor chip is mounted by bumps, a laser configured to irradiate a laser beam into the board over an area larger than the semiconductor chip, and a picker configured to cause the laser beam to penetrate the semiconductor chip locally and to separate the semiconductor chip from the board. A method of removing a semiconductor chip from a board may include loading the board, on which the semiconductor chip is mounted by bumps, on a stage; irradiating a laser beam into the semiconductor chip to melt the bumps and to separate the semiconductor chip from the board; continuously irradiating the laser beam into the board on which solder pillars, that are residues of the bumps, remain to melt the solder pillars; and removing the solder pillars.

Abstract: In a gas-turbine-stator-vane insert removing device with which welding metal that connects an insert collar, which protrudes outward from an outer circumferential surface of an insert, and a stator-vane-outer-shroud non-gas path surface, which surrounds the periphery of the insert collar, is removed by means of an arc discharge repeated at a short cycle between an electrode and a gas-turbine stator vane, a bottom surface of the electrode has the same plan-view shape as a plan-view shape of the welding metal.

Abstract: Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. The systems and methods described herein can be used to remove solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components from PWBs. In some such embodiments, the liquid heat medium may be at least partially separated from the solder and, in some cases, recycled back to a vessel in which the liquid heat medium is stored. The PWBs may be pre-heated, in some embodiments, prior to being immersed in a liquid heat transfer medium in which the solder is removed. In certain embodiments, an additional liquid heat medium may be used to remove underfill from PWBs. In certain embodiments, the electronic components separated from the PWBs may be at least partially separated according to size, density, and/or optical characteristics.

Abstract: Apparatuses and processes for recycling printed wire boards, wherein electronic components, precious metals and base metals may be collected for reuse and recycling. The apparatuses generally include a mechanical solder removal module and/or a thermal module, a chemical solder removal module, and a precious metal leaching module, wherein the modules are attached for continuous passage of the e-waste from module to module.

Abstract: A method is provided for transferring a graphene sheet to metal contact bumps of a substrate that is to be used in a semiconductor device package, i.e. a stack of substrates connected by said contact bumps, e.g., copper contact bumps for which graphene forms a protective layer. An imprinter device can be used comprising an imprinter substrate, said substrate being provided with cavities, whereof each cavity is provided with a rim portion. The imprinter substrate is aligned with the substrate comprising the bumps and lowered onto said substrate so that each bump becomes enclosed by a cavity, until the rim portion of the cavities cuts through the graphene sheet, leaving graphene layer portions on top of each of bumps when the imprinter is removed. The graphene sheet is preferably attached to the substrate by imprinting it into a passivation layer surrounding the bumps.

Abstract: A method of disassembling a combined steel sheet pile in which a steel sheet pile and an H-shaped steel are joined to each other, in which, when viewed in a cross-section perpendicular to a longitudinal direction, in a weld zone formed by a fillet weld, the weld zone is cut off to leave a portion on a side which is closer to the steel sheet pile than a throat depth surface, and thereby the combined steel sheet pile is disassembled into the steel sheet pile and the H-shaped steel.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and located at opposite sides of the base. The thermal expansion member is disposed in the casing and located over the base. The thermal expansion member is capable of expanding by heat so as to push the two clamping members to rotate with respect to each other.

Abstract: A method of recovering a bonding apparatus from a bonding failure to resume a normal operating state for semiconductor chip fabrication is disclosed. The bonding apparatus comprises: i) a bonding tool for bonding a wire between a semiconductor chip and a substrate; and ii) a position sensor. Specifically, the method comprises the steps of: a) the position sensor determining a position of the bonding tool when the bonding tool contacts a surface to bond the wire to the substrate; b) the bonding apparatus detecting a bonding failure caused by detachment of the semiconductor from the substrate based on the position of the bonding tool; and c) the bonding apparatus detaching the semiconductor chip from the wire.

Abstract: A cooling device for cooling electronic components includes a base plate, a power source, and a cooling module. The cooling module includes a cooling sheet and a thermal conductive base. The cooling sheet includes a hot surface and a cooling surface. The thermal conductive base is located above the cooling surface of the cooling sheet, and configured to support electronic components on a printed circuit board and transfer heat between the electronic components and the cooling surface. When the cooling sheet is powered on, the cooling surface is in a constant state of low temperature. Due to the heat transfer between the cooling surface and the thermal conductive base, heat from the electronic components can be transferred from the thermal conductive base to the cooling surface continuously.

Abstract: A repair apparatus includes a heating head device configured to heat a soldering member, which is soldered to a circuit board. The heating head device includes a heating head and a contact member heated by the heating head. The contact member is formed of a material having a spring characteristic and a thermal conductivity higher than a thermal conductivity of the heating head. The contact member is configured to be brought into contact with a soldered surface of the soldering member with an elastic force so as to melt a solder joining the soldering member to the circuit board.

Abstract: In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.

Abstract: The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: Polymer compositions containing a polymer matrix, a graphene that is covalently bonded to the polymer matrix and metal particles are described herein. A combined concentration of the metal particles and the graphene in the polymer matrix exceeds an electrical percolation threshold. In general, the graphene has a carbon:oxygen ratio of at least about 20:1 so as to impart a high electrical conductivity thereto. The polymer compositions can be used as a lead-free solder material, in which case they can allow multiple rework operations to take place at a connection. Methods for making and using such electrically conductive polymer compositions are also described.

Abstract: Methods for reworking a solder containing one or more joined members are described herein. Such methods can include applying a disintegrating agent to a solder containing a solder material, disintegrating the solder material to form a disintegrated solder material, and removing the disintegrated solder material from the solder. Such methods can also include applying a disintegrating agent containing bismuth to a solder containing a solder material, and heating the solder to liquefy the disintegrating agent. Such methods can also include applying a disintegrating agent containing a bismuth alloy to a solder having a solder material that contains metal nanoparticles, and heating the solder to liquefy the bismuth alloy.

Abstract: An assembly (10) that can be both joined and parted by temperature processing. A parting member (20) captured between two members of the assembly exhibits a state change as a function of temperature such that the two members can be joined with a meltable joining material (18) at a joining temperature, operated at an operating temperature lower than the joining temperature, and then separated at a parting temperature higher or lower than the operating and joining temperatures as a result of a parting force caused by the state change of the parting member. In one embodiment, the parting member has a coefficient of thermal expansion higher than a coefficient of thermal expansion of the assembly members such that differential thermal expansion causes the parting member to expand across the interface (16) between the members to generate the parting force.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: An apparatus for detaching a head slider bonded onto a mounting plate of a suspension includes a platform on which a head gimbal assembly is mounted; a heating device for heating a joint section between the head slider and the suspension to decrease the bonding force; a latching part for latching the mounting plate at a position on a center line of the mounting plate in the lengthwise direction and/or at positions symmetric about the center line; and a clamp device for moving the head slider in a direction along the center line with the heating to detach the head slider from the mounting plate.

Abstract: A heat conducting apparatus includes an air guide hood and a heat conducting device. The air guide hood is connected to a hot air supply source for delivering hot air, and includes an air outlet for exit of the hot air. The heat conducting device is disposed at the air outlet of the air guide hood, and includes a contact wall spaced apart from and disposed below the air outlet for contacting a soldered component, and a surrounding wall extending upwardly from the contact wall and connected to the air guide hood. The contact wall and the surrounding wall cooperatively define a space for guiding the hot air. The contact wall conducts the heat to the soldered component so as to melt tin solders between the soldered component and a circuit board, thereby reducing any adverse effect on other electronic components or good chips on the circuit board.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: Methods for reworking a solder containing one or more joined members are described herein. Such methods can include applying a disintegrating agent to a solder containing a solder material, disintegrating the solder material to form a disintegrated solder material, and removing the disintegrated solder material from the solder. Such methods can also include applying a disintegrating agent containing bismuth to a solder containing a solder material, and heating the solder to liquefy the disintegrating agent. Such methods can also include applying a disintegrating agent containing a bismuth alloy to a solder having a solder material that contains metal nanoparticles, and heating the solder to liquefy the bismuth alloy.

Abstract: In the initial state, a part having a bottom electrode such as a BGA is attached to a substrate. A heat transfer material such as low melting point solder is allowed to fill a gap between the substrate and the part having the bottom electrode, and the heat transfer material and the BGA serving as the bottom electrode are heated. The heat transfer material and the BGA are melted by the heating so that the part having the bottom electrode is removed from the substrate.

Abstract: A repair apparatus is provided which is configured to melt a solder section of an electronic component to remove the electronic component from a printed wiring board. The repair apparatus includes a light source configured to irradiate light, and a heat-transfer cap including a light-receiving section and a heat-transfer section. The heat-transfer section is configured to contact the electronic component, and transfer a heat generated from the light in the light-receiving section to the electronic component.

Abstract: A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

Abstract: A high speed ball shear machine is adapted for removing a metal bump fixed on a substrate. The high speed ball shear machine includes a fixing base, a shear tool, and a metal bump catcher. The substrate is fixed on the top surface of the fixing base. The shear tool is disposed above the top surface. The fixing base is adapted for being translated along a translation path relative to the shear tool, wherein the translation path is a straight path. When the fixing base translates along the path, the metal bump is driven to strike the shear tool so as to separate itself from the substrate. The metal bump catcher, which is adapted for catching the drop bump after the striking, is disposed on the side wall of the fixing base. The bump catcher has a fillister with a configuration depicted in the figures of this invention.

Abstract: A heat conducting apparatus includes an air guide hood and a heat conducting device. The air guide hood is connected to a hot air supply source for delivering hot air, and includes an air outlet for exit of the hot air. The heat conducting device is disposed at the air outlet of the air guide hood, and includes a contact wall spaced apart from and disposed below the air outlet for contacting a soldered component, and a surrounding wall extending upwardly from the contact wall and connected to the air guide hood. The contact wall and the surrounding wall cooperatively define a space for guiding the hot air. The contact wall conducts the heat to the soldered component so as to melt tin solders between the soldered component and a circuit board, thereby reducing any adverse effect on other electronic components or good chips on the circuit board.

Abstract: A process including local heating of a brazing point in order to remove an integrally brazed component from a structural part is provided. The brazing point joins a metal sheet in the interior of a cavity to a structural part. The process makes the removal of the metal sheet from the cavity much easier compared to the existing mechanical removal. A plasma source or an induction source may be used for heating the filler metal.

Abstract: In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.

Abstract: A method is provided for reclaiming a suspension from a disk drive head gimbal assembly (HGA). An ultrasonic probe is applied to the HGA's read/write head slider on a side opposite that of its solder balls. Ultrasonic oscillations are transmitted through the ceramic slider to the side with the solder balls. The oscillations break the brittle intermetallic compound of the slider balls and free the slider. The ultrasonic energy also weakens the epoxy adhesive between the slider and suspension. The method can be used with heat to further weaken the solder balls and adhesive.

Abstract: A vapor phase rework station and methods for reworking a circuit board to remove and replace components soldered thereto. A nozzle is disposed over the target component and vapor is communicated from a vapor source to the interior volume of the nozzle. As the vapor heats the solder holding the target component to the circuit board, the vapor condenses within the interior volume. The condensed vapor is suctioned from the interior volume of the nozzle. A component gripping tool grips the target component and withdraws it from the circuit board. The reverse operation is performed to reflow the solder to attach a new component to the circuit board in the area from which the target component was previously removed.

Abstract: The present invention provides a system and method for providing a improved device for dismounting integrated circuits for rework tools in the fabrication and manufacture of hard disk drives. Embodiments of the present invention include a vacuum cap with suction capabilities for dismounting the integrated circuits. The vacuum cap includes a cylindrical portion with a vacuum path for holding a rod-like vacuum cylinder which when pressurized causes the integrated circuit to dismount. Embodiments of the present invention further include a light weight aluminum heat-shield that is disposed around the vacuum cap to protect the vacuum cap from excessive heat and to preserve the suction capabilities of the vacuum cap. In one embodiment the heat shield acts as a stopper to prevent the vacuum cap from moving upwards and helps the vacuum cap from absorbing multiple mechanical stress in order to protect the vacuum cylinder from being damaged.

Abstract: In a basic variant of a soldering device whereby a laser device is used for melting solder material (3), a protective device is provided which protects the laser lens system (22) from suctioned liquid solder material. Protection of the laser lens system can be achieved by a transverse flow from an inlet channel (23) into an outlet channel (24) and/or by a diaphragm (39) arranged in front of the laser lens system.

Abstract: A method and structure is disclosed for detaching a chip from a substrate that delays the delivery of shear force to the chip until the connectors attaching the chip to the substrate are soft enough that the delivery of shear force will not damage the chip's connectors. More particularly, the shear force is created by a bimetallic disk that, when heat is applied, is transformed into shearing force. The shearing force is delayed by a delaying device until the connectors connecting the chip to the substrate are soft enough that the application of shear force will separate the chip from the substrate without damaging the chip's connectors. The delaying device includes a physical gap that may be adjusted to control when the shear force is applied to the chip.

Abstract: A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

Abstract: The present invention relates to a method and to a device for separating solder material deposits (12) from a substrate (10), in which a receiving sleeve (19) having a receiving opening (22) is positioned to overlap with a solder material deposit arranged on the substrate in such a manner that an opening edge (21) of the receiving opening is brought into abutment against the substrate in an essentially sealing manner, the solder material deposit is subjected to thermal energy and a sleeve lumen (23) that is defined by the receiving sleeve and that is disposed transverse to a longitudinal axis (30) of the receiving sleeve is subjected to an air flow (28) that is directed to an output device (29) of the receiving sleeve.

Abstract: A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).

Abstract: A solder repairing apparatus includes a stage designed to place the surface of at least a specific part of an object along a reference plane within a specific spot defined on the stage. A heating unit applies a thermal energy to the specific spot. A dividing plate is designed to move into the specific spot in a vertical attitude perpendicular to the reference plane. The dividing plate exhibits a low solder wettability. The solder melts in response to the application of the thermal energy. When the dividing plate in the vertical attitude enters the specific spot, the dividing plate gets into the solder. Since the dividing plate exhibits a low solder wettability, the dividing plate repels the solder. The solder is divided into two parts. The division of the solder reliably eliminates a short circuit in the electronic circuit.

Abstract: Methods and articles for receiving times and temperatures for stages of a profile including solder heating stages to rework a populated printed circuit board (PCB), the rework including removing a first integrated circuit (IC) from the PCB, focusing heat on the first integrated circuit using an oven element during rework of the PCB, collecting actual temperature information from a plurality of temperature sensing elements to detect actual temperature information associated with the first integrated circuit, and generating a suggested modification for an operator to modify the time and/or the temperature of at least one of the stages in the profile in response to a fail status indicating that the collected actual temperature information did not meet temperatures for a variable.

Abstract: Apparatus and methods for removing components from a circuit board. A conveyor transports circuit boards having components attached with solder through a heating section. When the solder has been melted by application of electromagnetic radiation, the circuit board is subjected to mechanical forces that dislodge the components to be removed from the circuit board. In one embodiment, the electromagnetic radiation is supplied by heaters operating at color temperatures in the vicinity of 973 Kelvin. The components are recovered in a form that allows their reuse.