Abstract: Apparatus for performing an operation with molten solder, such as soldering or desoldering a component mounted on a substrate such as a PCB including an enclosed reservoir, the reservoir including a contained space above the molten solder; a hollow nozzle for receiving solder from the reservoir; an element for conveying the molten solder in the reservoir to the nozzle; and a source connected to the contained space for introducing a pressurized gas into the space to raise the solder through the conveying means to a predetermined level within the nozzle and maintaining said solder at said predetermined level to thus effect the operation with the molten solder and then removing the gas to return the solder to the reservoir. The gas is pulsed at least during the time the solder approaches and reaches the predetermined level. The apparatus includes a plurality of different size hollow nozzles for receiving solder from the reservoir where the nozzles are removably attachable with respect to the reservoir.

Abstract: A soldering iron which is developed specifically to address a wide variety of miniaturized integrated circuit soldered pin configurations has a handle with a heating block which mounts one of a set of wide, chisel-shaped blades that are engaged in a deep channel in the heating block and which taper gradually to a knife edge which is the operative edge of the soldering head. The wide, thin, extensively tapered and knife-edged blade usually addresses a row of integrated circuit pins or surface mounted leads to act brush-like to solder them substantially at the same time, or to heat them substantially simultaneously when desoldering the row to remove the component.

Abstract: A desoldering method and apparatus for removal of molten solder from joined parts including a desoldering tool; a vacuum pump connected to the desoldering tool for applying vacuum thereto for removing the solder; a motor for energizing the pump; and circuitry for providing an initial, relatively high, voltage to the motor and for thereafter providing a relatively lower voltage to the motor so that, during the application of the high voltage to the motor, a relatively large pulse of the vacuum is applied to the joined parts to (a) effect removal of substantially all of the molten solder into the desoldering tool and (b) initiate cooldown of the parts and, during the application of the lower voltage to the motor, a relatively lower vacuum is continuously applied to maintain the cooldown of the parts.

Abstract: A X-Y table is disclosed having a table rotatably mounted on a base for movement in the X-Y and .theta. directions. The device includes fine adjustments in both X and Y directions and a quick shear mechanism with means for automatically returning the table to its original position after the quick shear procedure. The table may be used as a stand above unit or particularly for use in installing and removing components from printed circuit boards.

Abstract: A device for removing a component from a substrate to which it is secured by solder. The device has a moveable member which defines a space to which suction can be applied. The space has an opening which can be positioned against the component so as to hold the latter to the moveable member by suction. Provision is made for applying heat to the solder to soften it. The moveable member is arranged such that the suction causes it to pull the component so as to remove it from the substrate when the solder is molten.

Abstract: A repair terminal is disclosed for reworking defective components on printed circuit boards. The terminal has a heater arm which lowers itself over the component, and directs hot gas thereon. A vacuum shroud surrounds the heat zone around the component and removes excess heat so as to minimize damage to surrounding components. The heater arm has inner and outer tubes, the inner tube delivering hot gas the outer tube removing it. Thus the outer tube prevents an operator from being burned by the dangerously hot temperature of the inner tube. A workholder is also disclosed for holding and aligning the circuit board with the heater arm. The workholder is capable of adjustment along the X- and Y-axes as well as in the theta orientation.

Abstract: The present invention proposes an apparatus or jig for the controlled spot heating of a substrate having soldered components therein and a designated locus to be heated for removal and/or replacement of a component. The apparatus comprises a frame and support means on the frame for holding and positioning the substrate with the locus to be heated along a designated axis of the frame. A rail at one end of the frame parallel to the designated axis holds a heating arm. The heating arm extends along an axis perpendicular to the designated axis and can be positioned along the rail. The heating arm ends in a directing means that is positioned over the designated axis and directs a heating medium, e.g. infra red radiation or a heated gas, onto a locus to be heated. The directing means limits the area of the application of the heating medium to only that area necessary for removal of the component.

Abstract: An apparatus for reflowing solder terminals that join an electronic element to a support substrate, which apparatus includes (1) a stage for supporting the substrate, (2) a quantity of liquid capable of being heated to a temperature in excess of the melting point of the solder of the solder terminals, (3) a means to contact a surface of the substrate with the liquid, including a reservoir for maintaining the liquid, and a pumping means to move the liquid from the reservoir into contact with the surface of the substrate, and (4) a means to control the temperature of the liquid when in contact with the substrate to initially increase the temperature of the liquid, and subsequently reduce the temperature of the liquid.

Abstract: A method is provided of temporary assembling by soldering of peel off plates through soldering material and a flexible junction element for a mechanical release device to release two parts temporarily fixed edgewise by peeling off the flexible element and the soldering material. There is provided on the plates and flexible junction element reserve areas without any adherence to the soldering material, and preferably at the limits of said reserved areas a recess for removing any excess of soldering material, and the melting solder material is put under load for distributing it between the plates and the flexible junction element. A so obtained assembly can be applied particularly to obtain automatic opening of containers in particular in space for spreading out solar panels.

Abstract: An apparatus is disclosed for removing or installing at least one through-hole mounted component from a printed circuit board or the like, the apparatus including a compliant mask for contacting and supporting the printed circuit board with the mask having at least one hole extending therethrough and the hole being aligned with the component. A conduit is provided for directing liquid solder into the hole in the mask to contact leads of the component and thus facilitate installation or removal thereof from the board.

Abstract: An apparatus for removing a mask which extends beyond the outer edges of a semiconductor wafer bonded thereto. The apparatus includes a base having a vacuum chamber opening onto the upper surface of the base, a vacuum valve separating the vacuum chamber from a vacuum source, an actuating lever and a mask discharge facilitator. The discharge facilitator comprising a horizontal plate having a plurality of vertical pins around the periphery thereof. When the lever is actuated, it opens the vacuum valve and lifts the discharge facilitator forcing the vertical pins into contact with the mask. The simultaneous application of the vacuum holding force, and vertical force applied by the pins causes the separation of the mask from the upper surface of the wafer.

Abstract: A solder/desolder tool has a heater block supporting a handle at its upper end and a heating plate at its lower end. The heating plate is thermally engaged by heating elements housed in the heater block. An array of pin relief apertures are formed in the heating plate. Retractable clamps are pivoted to the heater block for clamping a leadless chip against the heating plate. The leadless chip has an array of input/output sockets corresponding to the array of pin relief apertures. A method is disclosed for soldering the chip sockets to a corresponding array of pins supported by a PC board. According to the method, solder balls are loaded in the chip sockets, and the chip is then secured in the tool to reflow the solder balls to form solder plugs. The solder plugs are then set upon the upper ends of the pins and melted by the heating plate so that solder joints are formed between the pins and sockets. The chip is released from the tool to allow the solder joints to cool.

Abstract: The disclosure is directed to process and apparatus for the removal, site preparation, and replacement of any single connector pin contained within a sizeable array of closely spaced very small connector pins on an electronic packaging structure (substrate or module) without causing deleterious metallurgical effects either to the remaining pins or the ceramic substrate.

Abstract: The invention is a device for attaching or removing electronic components from a substrate and includes a nozzle for delivering heat to the terminal areas of the substrate. The nozzle includes a first plate, spaced from the component, having openings corresponding to the terminals of the component. The nozzle further includes a second portion below the plate for directing heated fluid to the component. Further, at least one opening in the plate is enlarged to delivery more heat to certain terminals connected to a ground plate, for example.

Abstract: Apparatus for the selective removal of the solder and a connector soldered in the through hole of a circuit panel including means for heating the solder and a pair of aligned tubes placed against opposite surfaces of the panel surrounding the connecting through hole with the tubes being supplied with fluid under pressure so as to produce a pressure differential across the solder column in the through hole and effective to urge the connector and solder from the through hole into the low pressure tube when the solder is melted.

Abstract: Apparatus for and method of desoldering and removing a soldered together integrated circuit from a mounting member and for cleaning the same in which the integrated circuit and the mounting member are placed in tension in preparation of separating the same so that when the securing solder is melted the integrated circuit and mounting member separate from each other. The integrated circuit and mounting member are subjected to a pressurized flow of fluid which bathes the integrated circuit in an enclosure that is completed by the mounting member so that the mounting member and the integrated circuit are cleaned of solder and are also cooled.

Abstract: A method is disclosed for removing an integrated circuit package that has multiple leads which are soldered into respective metal plated holes in a printed circuit board. The board is of the type that has internal metal lines which make joints with the metal plating, and the method is adapted to remove the package from the board without overstressing the joints. The method includes the steps of: flowing a liquid on the leads at a temperature higher than the melting temperature of the solder without pulling on the package for a time period .DELTA.t.sub.1 ; and pulling on the package immediately after the end of the .DELTA.t.sub.1 period with a force F.sub.1 =F.sub.3 +(25 to 75)% F.sub.2. Force F.sub.2 is the minimum force that will extract a single soldered lead from the board under the condition the solder is below but within 5.degree. C. of melting; F.sub.3 is the minimum force that will lift the package from a pool of the liquid; and .DELTA.t.sub.

Abstract: An apparatus for removing lap soldered circuit packages from the module to which they are soldered is presented. The module is placed over the apparatus with the circuit package on the underneath side. A nozzle of the apparatus is raised so as to be centered below the circuit package, and a heated gas is directed over the lap soldered leads for a predetermined time. When the solder melts, gravity causes the circuit package to fall away from the module. The falling package is caught and held by the nozzle. The nozzle is then lowered away from the module, and as it is lowered, push rods protrude upwardly through the nozzle to support the circuit package and lift it out of the nozzle, thereby positioning the nozzle for easy and safe handling.

Abstract: A method and apparatus is disclosed for soldering leadless semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal pads on a printed wiring board. The device includes a housing having a bore in which is slidably mounted a suction head. The suction head is used to raise and lower the module relative to the leaded terminals. The suction head has a passageway connected to a source of vacuum for both holding the module relative to the head as well as exhausting heated air from a source which is directed against the leaded terminals to melt same.

Abstract: A device for dismounting an integrated circuit package soldered on a printed electric circuit board by melting the solder, including an electric heater which heats a heating shank disposed so as to contact upper portions of soldered portions of a plurality of leads soldered to circuit ends on an electric circuit board wherein the leads extending from side walls of an IC package mounted on the board. A suction cup member is disposed in a center portion of the heating shank so as to face an upper surface of the IC package and dismount the IC package sucked thereby from the board after melting the solder.

Abstract: A tip assembly for a desoldering instrument, which features a replacable tip. The tip assembly itself includes a tip housing which houses the replaceable tip and a spacer bushing. Screwed into the tip housing is an end cap against which the spacer bushing bears. The replaceable tip preferably consists of Teflon; that is, polytetrafluoroethylene resin. The Teflon may be substantially pure Teflon which has the advantage that it releases solder readily, or it may consist of a conductive Teflon, filled or mixed, for example, with carbon, which makes it conductive and provides an anti-static feature. The tip housing extends very closely to the outer end of the tip, to provide a heat sink and to provide electrical conduction. Alternatively, the tip may be relatively long and extend substantially through the bore of the tip housing. It is surrounded by a spacer bushing of pure Teflon.

Abstract: A tool for removing soldered IC packages comprises a block of heat-conducting material having a plurality of cylinder-shaped holes with parallel axes; a plurality of heat-conducting rods, each of which has one end that slides in a respective one of said holes; an insulator containing the block having a lid with another plurality of holes which are aligned with at least some of the rods in the block; and means for moving the rods that align with the holes in the lid partway through such holes by distances of unequal length so they can conduct heat from the block to respective I/O pins on the package that lie in multiple planes.

Abstract: A reworking tool for ceramic substrate hybrid circuits has a metal base for sitting on a heated surface, a support member support above the base and a pillar of heat conductive material attached to the base and extending up through an aperture in the support member. The top surfaces of pillar and support member are in a common plane. By this means a "hot spot" is produced at the top of the pillar and a hybrid circuit positioned on the support member can be so positioned that a particular component position is resting on the top of the pillar. Solder at this component position will melt and a component can be removed, or a component added or a component removed and another placed in position. Lateral sliding of the hybrid circuit laterally on the support member enables the solder to solidify.

Abstract: A desoldering tip, adapted to be attached to a standard pencil soldering iron, is formed with a recess adapted to closely fit over a leadless component soldered and adhered with an adhesive to a printed circuit board. Solder present in the recess attaches the component to the tool by molecular attraction. Once the solder and adhesive are melted, the component is readily lifted from the board with the tool. The component is then ejected from the tool.

Abstract: A portable electric hot air rework tool for directing a stream of turbulent hot air through removable and replaceable nozzles with a selectably sized orifice to predetermined size localized areas of a printed circuit assembly until a temperature sufficient to melt solder is achieved, thereby facilitating the soldering/desoldering of circuit components or parts of components mounted thereon. The apparatus essentially comprises a portable work station having upper and lower heat tubes, or plenums, through which a blower-forced stream of air made turbulent by turbulators with contra-pitched blades is directed, an adjustable support grid for supporting the pc assembly, within the directed air stream and a three-position switch for controlling the temperature and flow of the air in the heat tubes. An alignment positional indicator aids in precise location of the printed circuit assembly.

Abstract: A solder removing device is disclosed for absorbing solder which has been rendered molten by the application of heat, including an open-mesh structure comprising a strand and formed by knitting, as a primary example, at least the surface of the strand being metallic and receptive to solder flux (and indeed being coated with solder flux rendering it more capable of wetting with molten solder). The open-mesh structure enables the device to absorb solder more freely and in greater quantities than can prior braided devices in which the multiple strands are contiguous.

Abstract: Stacked leaded hybrid substrates and associated carrier plates are exited from a reflow solder operation into a vibrating table. Vibration of the table sequentially advances each stacked carrier and substrate until components on the latter contact an arm that is spaced above the table. Detection of the presence of a substrate and carrier adjacent the arm causes a plunger to move transversely across the table and into contact with an edge of the substrate. Further movement of the plunger pushes an edge of the carrier into contact with spring loaded pins in the table top. The shear force created on contiguous surfaces of the substrate and carrier by the plunger and pins causes the substrate to slide off of the carrier and over the pins. If this shear force exceeds a prescribed value, the pins rotate into the table top for passing a carrier and/or substrate without damaging the latter.

Abstract: Stacked leaded hybrid substrates and associated carrier plates are exited from a reflow solder operation onto a vibrating table. Vibration of the table sequentially advances each stacked carrier and substrate until components on the latter contact an arm that is spaced above the table. Detection of the presence of a substrate and carrier adjacent the arm causes a plunger to move transversely across the table and into contact with an edge of the substrate. Further movement of the plunger pushes an edge of the carrier into contact with spring loaded pins in the table top. The shear force created on contiguous surfaces of the substrate and carrier by the plunger and pins causes the substrate to slide off the carrier and over the pins. If this shear force exceeds a prescribed value, the pins rotate into the table top for passing a carrier and/or substrate without damaging the latter.

Abstract: A chip carrier (5) having a plurality of first ends (21--21) is aligned with and bonded to mating lands (34--34) on a PCB substrate (31) by positioning the carrier in a recess of a nozzle (66) on the tool and directing individual streams of hot gas horizontally onto the terminals and lands to cause previously deposited solder thereon to reflow to bond the articles together. Alternatively, articles bonded with reflowable material may be de-bonded in a like manner.

Abstract: A semiconductor chip mounted on a substrate by solder columns connecting one side of the chip to the substrate, is removed from the substrate by cooling the unconnected side of the chip to embrittle the solder columns and then twisting the chip with small angle rotational motion to shear the columns at their midpoints. A mechanism for cooling and rotating the chip makes use of the cooling substance to minimize the contact of the substrate with the cooling substance.

Abstract: A device for removing a solder alloy from a solid soldered joint comprising a multiplicity of metallic strands formed into an elongated wick operable to effect the solder removal through the application of an end portion thereof to the joint in heat exchange relation to a heat source so that when the solder alloy is rendered molten by the heat source it will flow by capillary action from the joint into the applied end portion of the wick, the improved step of each metallic strand of the wick having its exterior surface coated with solidified solder alloy having a melting point substantially below the melting point of tin prior to being formed into the wick so that when the end portion thereof is applied to the joint in heat exchange relation with the heat source as aforesaid the solid solder alloy of the coating on the strands of the applied end portion when rendered molten by the heat source mixes with the molten solder alloy from the joint flowing by capillary action into the applied end portion of the wick

Abstract: The present invention relates to a desoldering tool or device especially intended for desoldering electrical connections of the type used for supporting components in printed circuit boards. The device includes a heating element for melting the solder connection by contact therewith and a vibrating mechanism which relatively moves the two conductive elements defining the connection during the course of cooling of the melted joint whereby, upon completion of cooling, the component is essentially free of mechanical connection to its former receptacle. The invention further relates to the method of desoldering which involves melting a soldered connection and relatively vibrating the theretofore connected components during cooling of the solder, especially by pressure exerted on one of the connectors by a vibratable heating member.

Abstract: A spindle for a machine for sealing electric vacuum devices, comprising a housing, a hollow sleeve rotating in the housing, a central arbor accommodated within the hollow sleeve and movable relative thereto, the arbor carrying a candle-like plug adapted to receive therein a foot or stem of an electric vacuum device, e.g. lamp or tube. A crosspiece rotates together with the central arbor and has mounted thereon uprights supporting a holder adapted to retain therein the bulb or envelope of an electric vacuum device, the spindle also incorporating a mechanism for removing automatically a stem that has been welded to the candle-like plug.

Abstract: The present invention relates to portable, semiautomatic apparatus for aligning and removing solid state multicontact electrical circuit devices, e.g. DIP (dual-in-line package) chips from printed circuit panels or boards so as to prepare the board for new or replacement chip insertion and soldering.

Abstract: A desoldering wick formed of tin-coated copper strands braided together. The wick is coated with a flux solution which includes a coloring agent such as a dye. In use, the extent to which molten solder has traveled along the wick is visually indicated by a color demarcation line between the portion of the wick still having colored flux thereon and the portion of the wick from which the colored flux has been discharged. The latter portion can then be cut off and discarded.

Abstract: In desoldering soldered joints, an electrically conductive wick or braid, used to absorb molten solder from the joint, is connected to a ground conductor of the circuit of which the joint forms a part, thus preventing possible damage to voltage-sensitive circuit components, for example FET's. A solder-absorbent conductive wick is provided with connecting means for connection either directly or through an intermediate conductor with a ground conductor of a circuit in which a joint is to be desoldered by the aid of the wick. Connection to the circuit conductor may be by way of a first electrical connector portion mating with a second connector portion on a circuit board carrying the circuit. The first connector portion may be mounted on a jig or locating fixture arranged to receive the circuit board.

Abstract: A method and device for unsoldering semiconductor modules which are soldered onto terminal surfaces of a carrier by terminals pads composed of soft solder is disclosed herein. A suction cup is placed onto a semiconductor module to be unsoldered and the terminal pads are melted. The suction cup is raised together with the semiconductor module, and, with a burst of compressed air, the semiconductor module is removed. The suction cup is then lowered onto the terminal surfaces and soft solder residues are melted and sucked away.

Abstract: The removal of connector pins from a panel, such as a printed circuit board, in which the pin extends from the panel and is soldered to a circuit member on one or both sides of the panel, is achieved by a tool positioned over the pin and having a main body member which is held in contact with the panel surface and with an axially sliding gripping member having a split gripping portion. The gripping member is moved by a tubular member surrounding the gripping member and which, on axial movement, forces the split gripping portion of the gripping member into firm frictional contact with the pin, further axial movement of the tubular member moving the gripping member and pin axially shearing the solder joint. The tubular member is moved by a pivotally mounted handle, the reaction from the pivoting of the handle and pulling on the pin holding the tool firmly against the panel. The pin is removed without damage to the panel and a new pin can be inserted and resoldered using the remaining solder at the joint.

Abstract: An extraction tool is disclosed for removing integrated-circuit blocks (IC's) from soldered placement in a circuit board. Support members of the tool position it with reference to the circuit board for proper operation. Heating elements melt the solder; and a force mechanism, including a pair of grippers, is then actuated. In a two-step motion pattern, the grippers grasp the block then withdraw it from the circuit board. An ejector then forces the block from the tool.

Abstract: A solder removing device is disclosed for absorbing solder which has been rendered molten by the application of heat, including an open-mesh structure comprising a strand and formed by knitting, as a primary example, at least the surface of the strand being metallic and receptive to solder flux (and indeed being coated with solder flux rendering it more capable of wetting with molten solder). The open-mesh structure enables the device to absorb solder more freely and in greater quantities than can prior braided devices in which the multiple strands are contiguous.

Abstract: A tool for isolating a printed circuit wiring trace from a component pin, said tool having a rotatable shank with an internal cavity and external cutting flutes formed on an end thereof. The end of the tool is pushed over the exposed end of the pin such that the cutting flutes bear against the solder material which bridges the gap between the printed wiring trace and the component pin. The tool is then rotated to remove the solder bridge and any underlying wiring trace material to isolate the wiring trace and pin from each other.