Abstract: An apparatus and method for filling a ball grid array template is disclosed. The apparatus comprises a normally horizontal base plate with the ball grid array template being mounted onto the base plate at one end. A solder ball supply bin is slidably mounted over the surface of the base plate. The bin is enclosed on three vertical sides, while the fourth vertical side proximate the ball grid array template is a pivotable ball gate. At rest, the bin is located at an end of the base plate opposite to the template. When the base is tilted, the bin slides from its rest location to the other end of the base plate, so that it is positioned over the template, thereby allowing the solder balls to fill the locating holes of the template. The base is then rotated so that it tilts the opposite way, allowing the bin to return to its rest position. As the bin returns to its rest position, the ball gate sweeps any excess balls on the surface of the template back into the bin.

Abstract: A filling device for and a method of filling balls in an array of apertures in a ball-receiving element, the filling device comprising: a housing including an opening at a lower surface thereof and defining in part a chamber for containing a supply of balls, the housing being in use movably disposed over a ball-receiving element including an array of apertures; and distribution means disposed within the housing for distributing balls contained in the chamber such as to maintain a limited number of layers of the balls over at least a region of the opening in the housing.

Abstract: In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.

Abstract: In a first aspect, a programmable transfer device is provided for transferring conductive pieces to electrode pads of a target substrate. The programmable transfer device includes (1) a transfer substrate; and (2) a plurality of individually addressable electrodes formed on the transfer substrate. Each electrode is adapted to selectively attract and hold a conductive piece during transfer of the conductive piece to an electrode pad of a target substrate. Numerous other aspects are provided.

Abstract: A semiconductor device manufacturing apparatus includes a substrate holding section that holds a semiconductor wafer substrate, a discharge mechanism that discharges liquid drops of metal paste from a discharge nozzle toward a surface of the semiconductor wafer substrate, and a driving mechanism that moves at least one of the substrate holding section and the discharge nozzle. A control section is provided to control the discharge and driving mechanisms so as to adhere the metal paste to the surface. The semiconductor wafer substrate includes a terminal unit formed from two or more electrically separated terminals connected to a device circuit and an insulation layer having an opening in a formation position of the terminal unit. Further, the control section controls the discharge and driving mechanisms to selectively coat the opening of the semiconductor wafer substrate with the metal paste overlying the terminal unit to be electrically connected.

Abstract: An automated ball mounting system is disclosed In which solder balls are tested by heating the solder balls to a temperature between the eutectic temperature of lead-tin and the melting temperature of a lead free solder ball. If the heated solder balls melt they are standard solder balls. If they do not melt they are lead free solder balls. Solder balls that are input into the automated ball mounting process are automatically tested to determine solder ball type. When the test indicates that the wrong type of solder ball is being used an error message is indicated and the solder ball mounting process stops.

Abstract: Provided is a pail-pack for welding wire, including: an outer cylinder for accommodating a welding wire winding layer; a lower pressure plate having a bottom surface contacting a top portion of the welding wire winding layer to apply pressure to the welding wire winding layer; and an upper pressure plate having a hollow circular shape provided on the lower pressure plate to apply pressure to the lower pressure plate and the welding wire winding layer.

Abstract: After introducing a solder ball from a hopper into a receiving hole of a ball separator, the ball separator is slid between blocks, and the solder ball is sent out to a portion outside of the blocks. By suctioning the solder ball from within a projected region on a lower block which is situated inside of the receiving hole at a time when the solder ball is taken into the receiving hole and surrounds a rolling trajectory of the solder ball that has been taken into the receiving hole, the solder ball is forcibly introduced into the receiving hole.

Abstract: The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander formed on an elongated rod slidably mounted within a vertical tubular housing. An SMD chip may be safely fetched by pressing the rod on the top of the SMD with a continuous depressing motion until the fingers clasp the SMD chip safely therebetween. A soldering unit with a bifurcate soldering head located juxtaposed to the fingers is operative to solder the SMD chip to the printed circuit board while the SMD chip is safely held in place.

Abstract: Apparatus for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Abstract: A ball mounting apparatus and method for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, a force generating device for urging the head upward, a clamping device for clamping the head in a condition in which this force generating device stores the force, and a moving mechanism for moving the head. The force of the force generating device is able to lift the head above a lower stop which is a component of the clamping device.

Abstract: In order to apply solder material (20) to a workpiece (1), compressed gas is guided through a bore hole (5) of a capillary (3). A pressure sensor (13) situated in the bore hole (5) measures the dynamic pressure of the compressed gas. As soon as the tip (12) of the capillary approaches the workpiece (1), the dynamic pressure increases and is used as a measure for the distance between the tip (12) of the capillary (3) and the workpiece (1), enabling the feed motion of the capillary to be controlled.

Abstract: Methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.

Abstract: A system (10) and method (30) for precisely depositing a solder compound onto a substrate (18). The system (10) generally includes a receiving member (20) having a rotatable portion (21) adapted to receive a planar substrate (18), a horizontal member (12) for depositing solder balls (11) on the substrate (18), and a contact member (14), located between the receiving member (20) and horizontal member (12). The contact member comprises an aligner plate (14) having a pair of stoppers (15) protruding therefrom. Advantageously, pivotable portion (21) of the system (10) establishes the planarity of the substrate (18), with respect to the horizontal mount (12) allowing for the solder balls (11) to be mounted thereon, preventing the substrate (18) from being slightly misaligned, warped, and/or tilted.

Abstract: A ball mounting apparatus for mounting a plurality of balls sucked up and held by a head onto a workpiece. The apparatus includes a positioning mechanism for the workpiece, a ball supply device for supplying the balls, the head for sucking up the balls, an force generating device for urging the head upward, a clamping device for clamping the head in a condition in which this force generating device stores the force, and a moving mechanism for moving the head. The force of the force generating device is able to lift the head above a lower stop which is a component of the clamping device.

Abstract: The present invention relates to improvements in forming and transferring solder bumps for use in mounting integrated circuit substrates on chip carrier packages. A mold having cavities for the solder bumps is held in contact with a substrate and a compressible device. As the temperature is increased to melt the solder in the cavities, at an appropriate time and temperature, the compressible device is caused to decompress resulting in the mold separating from the substrate and leaving formed solder bumps on the contacts on the substrate. Various mechanisms are described to cause the force holding the mold and substrate together to decrease.

Abstract: A ball mounting method for mounting a plurality of balls held by a head onto a workpiece. The head is clamped such that a clamping surface mounted to the head is engaged with a rigid lower positioning stop, and then moved above a ball supply section. The balls are held on the head, and the head is moved above the workpiece. The clamping force is then released so that the clamping surface does not engage the lower stop, and the head is counterbalanced between the lower positioning stop and an upper positioning stop. While the head is unclamped and counterbalanced, the balls are mounted on the workpiece. The head is then clamped and moved above the ball supply section again.

Abstract: The invention relates to a device for applying pieces of material to a workpiece. Said device comprises a plurality of capillaries which respectively bring a piece of material (6) to a work station (3) in one working cycle. The piece of material is placed on the work station. A filling station fills a circular conveyer with a number of pieces of material (6) corresponding to the number of capillaries (4). An extracting station (19) is arranged in the transport path from the filling station (18) to the machining station (4?), said extracting station (19) extracting individual fragments of material (6) in a selective manner.

Abstract: The present invention provides a bump forming apparatus which can prevent charge appearance semiconductor substrates from pyroelectric breakdown and physical failures, a method carried out by the bump forming apparatus for removing charge of charge appearance semiconductor substrates, a charge removing unit for charge appearance semiconductor substrates, and a charge appearance semiconductor substrate. At least when the wafer is cooled after the bump bonding is connected on the wafer, electric charge accumulated on the wafer because of the cooling is removed through direct contact with a post-forming bumps heating device, or the charge is removed by a decrease in temperature control so that charge can be removed in a noncontact state. Therefore, an amount of charge of the wafer can be reduced in comparison with the conventional art, so that the wafer is prevented from pyroelectric breakdown and damage such as a break or the like to the wafer itself.

Abstract: A stencil used for printing solder paste on a contact pad of a printed wiring board has one or more reverse-tapered apertures passing there through, wherein the apertures have a variable cross-section that is larger at the fill side of the stencil (i.e., where solder paste enters the apertures) than at the board side of the stencil (i.e., where the stencil contacts the contact pad of the printed wiring board).

Abstract: A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

Abstract: An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate includes a plurality of longitudinal guide grooves. A transparent cover is secured on the alignment plate and shaped to cover part of the guide grooves. A parts feeder is operatively associated with the alignment plate to feed solder columns over the upstream end of the alignment plate. The solder columns are received in the guide grooves and fed toward the downstream end of the alignment plate while the alignment plate is vibrated by the vibrator. The solder columns are arranged in an array within the guide grooves so that a vacuum pickup tool may readily capture the cylindrical body of the solder columns.

Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

Abstract: An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposite the soldering point, a means for supplying heat to the solder ball to remelt it, and a pressing apparatus for holding down the substrate to prevent the substrate from being resilient when placing and remelting the solder ball.

Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).

Abstract: A conductive powder is stored at a predetermined position in a tank. At least one substrate is placed at a predetermined position opposite the conductive powder in the tank. The tank is rotated so as to immerse the substrate into the conductive powder. Thereby, the conductive powder is applied to the substrate.

Abstract: A planting device for planting solder balls onto a chip includes a main board with a plurality of apertures for accommodating solder balls, and a fixture for fixing the chip under the main board. The chip is coated with a layer of adhesive for adhering the solder balls accommodated inside the apertures onto the chip.

Abstract: A welding tab assembly has a weld tab and a metal rod. The weld tab has an inverted L-shaped recess defined in one side of the weld tab and an inclined hole defined in a top face of the recess. The metal rod is inverted L-shaped and is received in the inverted L-shaped recess. An inclined section obliquely extends from one end of the metal rod and is received in the inclined hole in the weld tab. A fastener detachably holds the metal rod in the recess. In such an arrangement, the welding slag can be cleaned or exhausted during the welding process by means of detaching the weld tab from the welded parts, such that the welding quality is improved.

Abstract: A flux is supplied from a flux transfer head having a flux transfer pin to a predetermined position on a substrate, and then a solder ball is mounted on the predetermined position by a solder ball mounting head having a suction nozzle. The solder ball mounting head and the flux transfer head are provided alternately on a head supporter. When the rotation of the head supporter is stopped, sucking a solder ball suction by the suction nozzle, depositing the flux on a free end of the flux transfer pin, transferring the flux to the substrate by the flux transfer pin, and mounting the solder ball on the predetermined position by the ball mounting head, and examining whether the solder ball exists on the suction nozzle by which the ball mounting operation has just carried out are executed.

Abstract: A solder ball dispenser (100) has feeder unit, head unit chambers (200, 300) and a pneumatic singulator (370). Solder balls (101) are mobilized in the chambers by moving air. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack (340). The singulator ejects the balls one at a time to a target device such as a Ball Grid Array. The dispenser has a plurality of conduits (331-338) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum. The trajectory of each solder ball is stopped before moving to a next position in the pneumatic singulator. No solid object causes solder balls to move within the dispenser or to be ejected from the dispenser.

Abstract: An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path.

Abstract: A solder ball attracting mask which is mounted on a suction apparatus for sucking a plurality of solder balls under vacuum so as to place the solder balls on electrodes of an electronic component and formed with a plurality of through-holes for attracting the solder balls thereto, with the solder ball attracting mask having a principal face engageable with the solder balls and a rear face engageable with the suction apparatus such that the through-holes extend through the solder ball attracting mask from the principal face to the rear face, the through-holes each including a funnellike attraction area for attracting the solder ball thereto, which reduces its diameter gradually from the principal face towards the rear face up to a suction port and a suction hole which has a diameter larger than that of the suction port and extends from the suction port to the rear face to define a suction space.

Abstract: A laser diode bar, solder preform and heat sink are assembled prior to reflowing the solder in a manner to prevent molten solder from being drawn by capillary action over the light emitting end of the diode bar. A recessed pin 30 locates the ends of the laser bar and solder preform with respect to an edge of the heat sink so that the laser bar and solder preform overhang the heat sink edge by respective amounts. When molten, the solder will not be drawn by capillary action to obscure the light emitting end of the laser diode bar.

Abstract: A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station to apply flux onto a substrate and a solder ball placement station to place solder balls onto the flux on the substrate. The solder ball attachment system further includes a conveyor assembly to move the substrate between the flux station and the solder ball placement station.

Abstract: A device and a method, as well as use thereof, in the feeding of welding wire, said device and method designed to prevent deformities from forming in the welding wire (2) during the feeding of welding wire. A first end of the welding wire (2) in one container (3) is connectable to a wire guide (1).

Abstract: A solder ball dispenser (100) has feeder unit and head unit chambers (200, 300) and a pneumatic singulator (370). Solder balls (101) are put into motion in the chambers by moving air. The pneumatic singulator and a channel for solder balls are formed, machined or molded in a head plate (142) of a dispenser and enclosed by a front plate (141) and a back plate (143) secured adjacent to the head plate. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack (340). The pneumatic singulator ejects the balls one at a time to a target device such as a Ball Grid Array (BGA). The dispenser has a plurality of conduits (331-338) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum.

Abstract: A method and apparatus for reworking a Ball Grid Array (BGA) package is provided. The apparatus includes a housing with a solder ball compartment that includes solder balls; a sliding base plate positioned to slide under the solder ball compartment; and a BGA nest for supporting the BGA package and a stencil with a hole. The sliding base plate has a BGA nest holder adapted to receive the BGA nest with the BGA package and the stencil. The sliding base plate with the BGA nest, BGA package and the stencil moves underneath the solder ball compartment such that solder balls are placed on the BGA package through the stencil hole pattern. After the solder balls are placed on the BGA package, the sliding plate with the BGA package and the solder balls move in a second direction away from the solder ball compartment.

Abstract: The invention provides an apparatus and method for positioning solder balls in a desired array on a substrate. A positioning means is provided for positioning the solder balls in positions corresponding to the array of positions the solder balls are to take up on the substrate. A container for receiving a plurality of solder balls and which is movable between a first position remote from the positioning means and a second position directly thereover supplies solder balls to the positioning means. Means are provided to bias the solder balls in the direction of movement of the container from the first to the second position whereby to reduce or obviate damage to the solder balls during such movement.

Abstract: The device for positioning a tool (1) in relation to a workpiece (6) controls drives (2, 3, 4) in relation to three spatial axes (x, y, z) through two cameras (10, 11), the first (1) of which takes an image essentially along a spatial axis (y), the other (11) being oriented essentially vertically with respect to a surface (8) of the workpiece.

Abstract: A wafer transfer apparatus adapted to a wafer ball placement apparatus including at least one wafer cassette, a flux dispenser unit, a ball placement unit, a reflow oven unit, and an unloader. The apparatus is also adapted to a wafer bump printing apparatus including at least one wafer cassette, a bump printing unit, a reflow oven unit, and an unloader. The apparatus includes a robot arm for picking up a wafer from the at least one wafer cassette and transferring the wafer to/from one of the wafer cassette, the flux dispenser unit, the ball placement unit or bump printing unit, and the reflow oven unit. The apparatus may also include a stage for carrying and moving the robot arm. With the apparatus, it is possible to reduce process time, simplify steps of transferring the wafer and lower risks of breaking wafer. The invention can achieve the effects of improving the production efficiency, saving the space and simplifying the apparatus.

Abstract: An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate includes a plurality of longitudinal guide grooves. A transparent cover is secured on the alignment plate and shaped to cover part of the guide grooves. A parts feeder is operatively associated with the alignment plate to feed solder columns over the upstream end of the alignment plate. The solder columns are received in the guide grooves and fed toward the downstream end of the alignment plate while the alignment plate is vibrated by the vibrator. The solder columns are arranged in an array within the guide grooves so that a vacuum pickup tool may readily capture the cylindrical body of the solder columns.

Abstract: A fluxer applies powdered flux to an object. The fluxer includes an enclosure that defines a chamber where the object is fluxed. The enclosure includes an inlet for receiving the object into the chamber prior to application of the flux and an outlet for discharging the object from the chamber after the flux has been applied. A conveyor extends through the enclosure for traversing the object into and out of the chamber. The fluxer also includes a hopper for storing the flux and an applicator in fluid communication with the hopper for applying the flux to the object. A flux recovery system is in fluid communication with the chamber to introduce and maintain a negative pressure within the chamber. As a result, excess flux is retained within the enclosure. This excess flux can then be recovered and recycled to the hopper.

Abstract: A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.

Abstract: When solder paste passes through a first gap (34) located between a pressurizing member (28) and a printing mask (3) during solder paste printing, a pressure directed toward the printing mask is applied from the pressurizing member to the solder paste.

Abstract: An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

Abstract: An apparatus for applying solder balls to a substrate (7, 9) and for remelting the solder balls on soldering points (6) of the substrate (7, 9) has a capillary (3) for supplying a solder ball (5) to the soldering points (6) and for placing the solder ball (5) at the free end (4) of the capillary (3) opposite the soldering point, a means for supplying heat to the solder ball (5) to remelt it, and a pressing apparatus (10) for holding down the substrate (7, 9) to prevent the substrate (7, 9) from being resilient when placing and remelting the solder ball (5).

Abstract: The bump ball crimping apparatus of the present invention is characterized in comprising an alignment plate 31 for aligning bump balls; a crimping table 32 on which the wafer to which bump balls are to be crimped is mounted; a crimping plate 42 that crimps the bump balls onto the bonding pads of the wafer; a Y-axis moving mechanism 35 that can move the alignment plate 31 in the Y direction and can fasten it at a predetermined position; an X-axis moving mechanism that can move the alignment plate 31 in the X direction and can fasten it at a predetermined position; and a second Y-axis moving mechanism 37 that can move the crimping table 32 in the Y direction and can fasten it at a predetermined position.

Abstract: A method for reworking a ball grid array (BGA) of solder balls including one or more defective solder balls on an electronic component workpiece using a single-ball extractor/placer apparatus having a heatable capillary tube pickup head optionally augmented with vacuum suction. A defective solder ball is identified, extracted by the pickup head and disposed of. A nondefective solder ball is picked up by the pickup head, positioned on the vacated attachment site, and thermally softened for attachment to the workpiece. Flux may be first applied to the replacement solder ball or to the vacated attachment site. The extractor/placer apparatus may be automated to locate, extract and replace defective balls for completion of a fully operable BGA.

Abstract: A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate having holes to which solder paste is supplied corresponding to the through holes is disposed. A printing roller is swept by forcibly rotating it to fill with solder paste, then a printing squeegee follows the printing roller to further fill through holes. Parts are loaded on the through holes and reflowing is carried out on the printed circuit board and paste receiving plate, so that the parts are soldered to the printed circuit board.