Abstract: A vehicle assembly tool includes a base and a frame pivotably coupled to the base. The frame is configured for holding a plurality of vehicle parts to be welded together. A motor is coupled to the frame via a gear system to move the frame relative to the base. Per the present disclosure, the base can be juxtaposed with a plurality of robotic welders, each having an end effector with six degrees of freedom, and the frame then moved relative to the base to essentially provide a seventh degree of freedom for welding the parts together. Also, the frame can be programmed to return, after welding, to one of several user-defined load positions, each of which load positions can be tailored to a respective individual for facilitating ergonomic loading of parts into the frame by the particular individual.

Abstract: A vehicle assembly tool includes a base and a frame pivotably coupled to the base. The frame is configured for holding a plurality of vehicle parts to be welded together. A motor is coupled to the frame via a gear system to move the frame relative to the base. Per the present disclosure, the base can be juxtaposed with a plurality of robotic welders, each having an end effector with six degrees of freedom, and the frame then moved relative to the base to essentially provide a seventh degree of freedom for welding the parts together. Also, the frame can be programmed to return, after welding, to one of several user-defined load positions, each of which load positions can be tailored to a respective individual for facilitating ergonomic loading of parts into the frame by the particular individual.

Abstract: A method of transferring conductive balls via a suction head without picking up errors and mounting errors includes moving a suction head with pores towards the conductive balls located in a case and applying a vacuum pressure to the pores to suck and pick up the conductive balls. While the suction head is moved away from the case, the suction head is vibrated by oscillators at different frequencies changed within a predetermined frequency range, thereby dropping redundant conductive balls from the suction head. Further, the suction head is moved to a position above a work piece and moved towards the work piece. The pores are communicated with atmosphere to mount the conductive balls onto the work piece. While the suction head is away from the work piece, the suction head is vibrated by oscillators at different frequencies changed within a predetermined frequency range.

Abstract: The invention relates to a manufacturing process for brush-type seals having the following steps:Stacking of bristles in a bristle receiving shaft such that the bristles are partially situated next to the space for at least one brush cheek;adjusting the bristle receiving shaft in synchronization with the stacking of the bristles relative to a point of introduction of the bristles into the bristle receiving shaft so that the position of a bristle stack surface in the bristle receiving shaft remains at least essentially constant relative to the point of introduction;fastening the bristles on at least one brush cheek in the bristle receiving shaft; andremoving the at least one brush cheek with the bristles fastened thereto from the bristle receiving shaft.In addition, the invention provides an arrangement for manufacturing brush-type seals by means of which the above-mentioned process can be carried out correspondingly.

Abstract: An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate. The invention is also directed to a solder ball dispenser for dispensing solder balls to a plate having an upper surface with an array of holes formed therein. The solder ball dispenser includes a plate support to support the plate such that the upper surface is tilted at an angle from horizontal, a ball feed device to provide solder balls to the plate, and a solder ball retainer. The solder ball retainer is movable across the upper surface of the plate for controlling a speed at which the solder balls move across the plate.

Abstract: A method for continuous rolling includes flash-butt welding to form a continuous billet by joining a rear end of a preceding billet with a front end of a succeeding billet, removing burrs from a welded portion of the joined part, and continuously rolling the joined continuous billet in a rolling mill group. The flash-butt welding step includes the use of two travelling welders arranged in series and spaced at a distance along the direction of movement of the continuous billet corresponding to the length of the billet being welded. The travelling welders synchronously move with the continuous billet, and separately and simultaneously weld the continuous billet to another billet by flash-butt welding so as to extend the length of the continuous billet.

Abstract: Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.

Abstract: A dispenser for strand materials, such as solder, is provided. Also provided is a method for dispensing strand materials using the dispenser. The dispenser is hand-held, and includes a gear, which ratchetably rotates to selectively advance the strand material through the dispenser. The gear also creates indentations on the strand material, providing gauged lengths of strand material. The dispenser can be adapted to be refillable with standard size spools of solder, or can be adapted to feed solder from an external spool.

Abstract: An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

Abstract: A pressure head (10) for contacting a contact area of workpiece (230) through relative movement in the vertical Z-direction includes a frame (20), a horn (100) for contacting the workpiece (230) and a gimbal (40) connected to the frame (20). The gimbal (40) supports the horn (100) such that the horn (100) can rotate about horizontal X and Y rotation axes and can translate in the Z-direction relative to the frame (20). A pivot rod (140) includes a bearing surface (144) bearing against horn (100) such that the horn may rotate about the X-axis and Y-axis and for applying downward pressure to the horn. The shape and orientation of the bearing surface (144) corresponding to the shape and orientation of the contact area of horn (100).

Abstract: A pressure head (10) for contacting a workpiece (230) through relative movement in the vertical Z-direction includes a frame (20), a horn (100) for contacting the workpiece (230) and a gimbal (40) connected to the frame (20). The gimbal (40) supports the horn (100) such that the horn (100) can rotate about orthogonal X and Y rotation axes and can translate in the Z-direction relative to the frame (20). Three adjustment arms (170) movably connected to the frame (20) each apply a force on the horn (100) at points determining a plane for rotating the horn (100) about the X-axis or the Y-axis to a fixed position before contact with the workpiece (230). The adjustment arms (170) also provide electrical connection to electrical devices (136, 138) on the horn (100). A movable contact arm (190) connected to the frame (20) also contacts the horn (100) for providing an electrical connection.

Abstract: In a ball grid array (BGA) station (50) having a robotic arm (60) with a vacuum head (70) containing a predetermined quantity of vacuum apertures (90), a method and apparatus of loading an array of solder balls (14) for solder bumping a carrier (20). Solder balls (14) are supplied into a tub (500) having a head opening (510) for accommodating a vacuum head (70). After the vacuum head (70) is positioned by the robotic arm (60) towards the head opening (510) of the tub (500), suitable fluid pressure (570) is applied to the solder balls (14) within the tub (500) to force the solder balls (14) to float on the gas pressure towards the vacuum apertures (90). The vacuum apertures (90), which are appropriately sized and annularly shaped has at least a partial vacuum (34) applied through the apertures (90) to suck-up a desired quantity of solder balls for eventual placement on the BGA carrier (20).

Abstract: An apparatus and a method for transferring solder bumps from a solder mold to a solder-receiving substrate are disclosed. The apparatus includes a transfer fixture constructed by a base member, a lid member and a compressible member for holding a mold/substrate assembly therein. A plurality of compression pins are mounted through the lid member for supplying a uniform pressure on the mold/substrate assembly and for allowing lateral motion of the mold/substrate assembly relative to the transfer fixture due to a mismatch in the coefficients of thermal expansion. The compressible member is a cellulosic foam sheet which applies a uniform joining force across the entire surface of a wafer and assures abutting contact between the entire wafer and the mold surface. The foam sheet further assists in the lateral movement of the mold/substrate assembly relative to the base member of the transfer fixture.

Abstract: A method and apparatus are disclosed for placing solder balls 201 on electronic pads 1204 on a substrate 1202, such as for a ball grid array (BGA) applicator 10. The solder balls 201 are held to openings 102 in a foil 22 such as by vacuum force 1607 applied to the solder balls 201 through the openings 102 in a foil 22. After locating the solder balls 201 at electronic pads 1204 on a substrate 1202, by deactivating the vacuum force 1607 and optionally applying a release force 1703 the solder balls 201 are released and placed on the electronic pads 1204. Optionally, a release mechanism 2400 applies placing force 2600 to the solder balls 201 through the openings 2404 in the foil 2403.

Abstract: A first pattern of bumps and a second pattern of bumps are formed on a substrate (10) with bumps (14,15). During a transfer process, only the bumps (14) of the first pattern of bumps are transferred to pad extensions (20) of a device (17). The bumps (15) of the second pattern of bumps are not affected by this process and can be later transferred to a second device.

Abstract: An electronic element producing apparatus comprises a bonding tool 1 which has a first supply hole 2 for passing a bonding wire 3 used to bond a bonding pad 6 of a semiconductor device 5 and an external conductor which is to be connected electrically with the bonding pad 6, and contacts a leading end 3b of the bonding wire 3 protruded outside from the first supply hole 2 to the bonding pad 6, and which also has a second supply hole 12 to supply a bonding material to bond the bonding pad 6 and the leading end 3b of the bonding wire 3, the second supply hole 12 being formed to supply the conductive material to a contact point between the bonding wire 3 and the bonding pad 6. Therefore, the bonding pad 6 and the bonding wire 3 can be bonded without applying a dynamic or thermal load to the semiconductor device 5.

Abstract: Apparatus and method for setting welding run-off tabs in a coil end joiner which includes a support table having a U-channel therein, the U-channel having an opening through a base portion thereof, a left hold down clamp and a right hold down clamp positioned to either side of the U-channel over the support table, a first angled member having an actuator which provides horizontal movement of the first angled member, the first angled member extending upwardly through the opening in the base portion of the U-channel and contacting a corresponding second angled member such that horizontal movement of the first angled member results in vertical movement of the top surface of the second angled member which is parallel to the top surface of the support table. A rear welding run-off tab holder member having a U-channel therein is positioned over the second angled member and includes a rear welding run-off tab clamp which is positioned at a rear end thereof.

Abstract: A movement detector of the feeder of wire solder directly touches the wire solder, and the movement detector includes (a) a rotating body which revolves when the wire solder moves along a feeding direction and (b) a rotation detector which produces a rotation detecting signal by detecting a rotation of the rotating body. An abnormal halt detector of the feeder of the wire solder compares a rotation detecting signal from a rotation detector with a rotation instructing signal sent to a motor which feeds the wire solder, and calculates the comparison result, thereby judges an abnormal halt of the wire solder. When the abnormal halt is detected, a feeding roller for the wire solder is stopped, whereby the wire solder is prevented from being bent and deformed.

Abstract: A punching pin of a soldering apparatus cuts out a solder piece from a solder plate onto a feeder pin, and the feeder pin presses the solder piece against a predetermined junction of a conductive wiring pattern incorporated in a printed circuit board; then, an electric circuit component is mounted on the printed circuit board, and is strongly soldered to the conductive wiring pattern, because the punching pin and the feeder pin supply a fixed amount of solder to the predetermined junction.

Abstract: A method of depositing solder paste includes the steps of: superimposing a masking member having a plurality of through-holes and a supporting member on each other so that the supporting member covers the plurality of through-holes; filling cavity portions formed by the plurality of through-holes and the supporting member with solder paste; disposing an LSI chip and the masking member so that electrodes and the cavity portions are superimposed on each other respectively; and heating the solder paste so as to make the solder paste deposit on the electrodes.

Abstract: A method and apparatus allow securing of balls to ball grid array electronic components. A component having a surface with rows and columns of electrical contact solder pads is removed from a printed circuit board for rework. Excess solder is removed from the solder pads and the surface is pressed against a stencil having a pattern of holes corresponding to the component contact pad pattern. Each of the holes is filled with a solder ball. The assembly is heated to melt the at least the solder pads. Where lower melting solder balls are used, the pads and balls both melt. Where high melting temperature solder balls are used, only the solder pads melt. The assembly is cooled to solidify melted solder, the stencil is removed, the component is cleaned and is ready for reuse.

Abstract: The invention herein relates to a kind of integrated circuit solder ball implant machine that is mainly comprised of a machine base, a solder ball implant device, a solder ball loading device, an integrated circuit component positioning device and an integrated circuit mold ejection device, the innovations of which includes the utilization of the aforesaid integrated circuit component positioning device that reciprocates leftward and rightward at the lower extent of the solder ball implant device as well as the aforesaid solder ball loading device that is vibrated forward and backward to directly transport the solder balls through the feed holes of the solder ball implant device such that each of the solder balls are reliably, accurately, soundly and expeditiously carried and positioned onto integrated circuit component in the integrated circuit component positioning device.

Abstract: The array of recesses in a ball grid array carrier or (device) are populated with solder balls through a closely spaced tooling plate or stencil which has a like array of apertures. A solder bin is moved along side rails over the stencil allowing solder balls to fill the apertures in the stencil settling on the corresponding recesses and held there by adhesive. Excess solder balls are moved along by the movement of the bin. The bin is held in close contact with the stencil to avoid misplacement of the balls by bowing the stencil and by forcing it into a plane coplanar with the bottom of the bin. Alternative techniques are magnetic or vacuum areas of the bottom of the bin to ensure complete contact with the stencil.

Abstract: A soldering device for terminal components with multiple legs including a holder formed thereon with a cavity and a plurality of connecting wire guiding grooves for receiving a terminal component and connecting wires and adapted to be fitted into a positioning opening of a frame, soldering means having a soldering iron formed at the lower end with a plurality of notches for receiving the legs of the terminal component and controlled by a timer to melt the tin solder for soldering the legs of the terminal component with the connecting wires, and pushing soldering process thereby enabling the products to be collected, whereby the soldering device utilizes lesser holders than the conventional device and is especially fit for use with a small amount of soldering work for terminal components and connecting wires with various kinds and specifications.

Abstract: A welding station, for example for welding motor-vehicle bodies, receives only a part of the structure to be welded from a conveyor line, the remaining components of the structure being assembled with said part at the welding station itself, by using two locating gates which receive said components from manipulating robots, said robots also providing for carrying out the spot welding of the structure once the latter has been assembled and locked in a proper welding position by said locating gates. The locating gates are provided with self-propelled lower trolleys guided on rails, in order to be rapidly interchanged with another pair of locating gates adapted to a different type of body.

Abstract: An apparatus is provided for applying solder paste to the contact elements of ball grid array components, which is economical to manufacture and simple to handle, and which nonetheless offers the possibility of being able to apply a desired amount of solder precisely to the contact elements of a ball grid array component.

Abstract: In a method and a device for mounting an electronic component, a solder paste is printed on lands of a substrate with the use of a mask having a projecting part at a portion facing the substrate and positioned to between neighboring lands, and the projecting part prevents the solder paste on of the neighboring lands from flowing so as to come in contact with a other of the neighboring land to cause a shortcircuit between the neighboring lands.

Abstract: A conductive ball mounting apparatus and a mounting method for mounting a conductive ball for forming a bump without erroneously mounting an additional conductive ball in a workpiece, comprising a workpiece positioning section, a conductive ball feeding section, a mounting head provided with a plurality of suction holes each of which has a recess capable of storing one conductive ball on the bottom surface of the head, a moving device for moving the mounting head between the workpiece positioning section and the conductive ball feeding section, and a detecting device for detecting conductive balls erroneously additionally attached to the bottom surface of the mounting head without being stored in recesses arranged on the moving route of the mounting head.

Abstract: A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

Abstract: A new hand-held solder wire dispenser for conveniently dispensing lengths of solder during a soldering operation. The inventive device includes a rectangular housing with a spool of solder wire mounted in the housing, and a manual actuation apparatus for dispensing the solder wire through a wall of the housing. An electric version of the dispenser includes a reversible electric motor driving a pair of rubber drive wheels which frictionally engage the solder wire on opposite sides thereof, for causing dispensing movement of the wire.

Abstract: A solder ball placement and alignment apparatus for placing and aligning a plurality of solder balls onto solder pads on a multi-chip substrate includes a placement tray and a base seat. The placement tray includes a solder ball gate, means for controlling movement of the gate, a plurality of placement through holes that correspond to the solder pads on the substrate, and a plurality of alignment cavities disposed on the underside of the placement tray. The solder ball gate is slidably mounted to the placement tray and, when the gate is at a first position, an opening in the placement tray is uncovered thereby permitting solder balls to be removed when the placement and alignment apparatus is tilted toward the direction of the opening. When the gate is at a second position, the opening of the placement tray is covered. The movement of the gate is controlled by an electromagnet and associated control circuit means or a mechanical device.

Abstract: The invention provides an apparatus and a method for producing an electronic component provided with bumps, in which the operation of placing a solder ball serving as a material of a bump onto an electrode of a work is monitored, and if a solder ball placing failure is detected, a recovering operation is automatically performed. In the apparatus and method of the invention, a head is moved to a location above a solder ball supplying unit so as to pick up solder balls by means of suction. The head is then moved to a location above a flux reservoir so that the solder balls are coated with flux. The head is further moved to a location above a substrate and the solder balls are placed on electrodes of the substrate. The substrate is then observed using a camera to decide whether solder balls are correctly placed on the electrodes. If yes, the substrate is transferred into a heating furnace.

Abstract: A solder dispenser which includes a body portion having a sleeve thereon with a moveable shuttle extending through the sleeve. A solder holder bracket is retained on the moveable shuttle for retaining a spool of solder on the solder dispsenser. A solder gripper is carried on the body for gripping solder upon moving the shuttle to extend a length of solder from the solder spool. The solder gripper acts as a one-way cam which retains the solder as it is being extending from the spool but also allows solder to pass therethrough once it is extended from the spool. A trigger assembly is used to displace the shuttle and thereby extend a length of solder. The trigger assembly allows for dispensing a selected or desired length of solder from the spool.

Abstract: A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

Abstract: The method is directed to attaching spherical and/or non-spherical contacts to a substrate having mounting pads arranged in a predetermined array. The method includes the steps of positioning the substrate over a fixture, and positioning a stencil over the substrate. The stencil has openings arranged in the predetermined array, and is held and aligned by the fixture in such a position that the openings of the stencil are aligned with the mounting pads of the substrate. Soldering paste is applied onto the stencil so as to fill the openings of the stencil wherein a dab of paste is left in the openings of the stencil. Next, a contact loading plate is positioned over the substrate, the plate having openings arranged in the predetermined array. The plate is held and aligned by the fixture in such a position that the openings of the plate are aligned with the mounting pads of the substrate. The openings of the contact loading plate are then filled with contacts.

Abstract: A mounting head is composed of a box-shaped main body, a case contained inside the main body, and a suction tool in the lower part of the case. The main body and case are coupled by a spring member, and the weight of the suction tool is canceled by the force of the spring. A cylinder is provided in the main body, and a rod is coupled to the case and cylinder. Solder balls sucked in by a vacuum into suction holes of the suction tool are pressed onto the electrodes of a workpiece by the cylinder. The mounting head is moved up and down by elevating means comprising a ball screw, a nut, and a motor. The pressing force of the suction tool by the cylinder is set to a proper magnitude so that the solder balls are not squeezed or crushed into the electrodes or sink into the suction holes of the suction tool.

Abstract: A process of producing small metal bumps includes the steps of simultaneously holding small metal balls on an arrangement baseplate in the positions corresponding to those of electrodes of a semiconductor chip, a film carrier, or a substrate; aligning the small metal balls held on the arrangement baseplate with the electrodes; lightly pressing the small metal balls against the electrodes; to provisionally fix the balls to the electrodes; and pressing the provisionally fixed small metal balls to flatten the pressed surfaces of the small metal balls, and at the same time, to bond the small metal balls to the electrodes.

Abstract: A method of precisely positioning a quantity of conductive spacers (e.g., spherically shaped solder balls) on respective conductive pads (e.g., copper pads) of an underlying substrate (e.g., an FR4 printed circuit board or flexible circuit member) wherein the spacers are forcibly retained within a suitable holder and, when engaged with the respective pads, reflowed to effect a plurality of positive electrical connections between the spacers and pads. Such forcible retention allows for partial extension of the spacers from the invention's carrier, which is also disclosed.

Abstract: An apparatus for placing electrically-conductive balls on electrodes of workpieces so as to form projected electrodes includes a ball-placing head which picks up the conductive balls from a reservoir. Suction holes for respectively suction-holding the conductive balls are formed in a lower surface of a box member of the ball-placing head. Recesses are formed respectively in portions of this lower surface where the suction holes are not formed. The box member of the ball-placing head is caused to rest on an upper surface of layers of conductive balls stored in a container of the reservoir. In this condition gas is blown or injected into the container so as to fluidize the conductive balls. At this time the gas flows upward into the recesses in the lower surface of the box member, thereby sufficiently fluidizing the whole of the upper layer of conductive balls, so that all of the suction holes can effectively and securely pick up and hold the conductive balls.

Abstract: An absorber head picks up a plurality of soldering balls from a container, and is shifted horizontally toward a substrate. In the midway of this shift movement, the absorber head is stopped just above a flux storage and then lowered to soak the soldering ball in the flux stored in the flux storage, thereby applying each soldering ball with an adequate amount of flux. Thereafter, the absorber head is again shifted horizontally until it reaches the substrate. Then, the absorber head lowers the soldering ball applied with flux, so that each soldering ball is mounted on a corresponding electrode provided on the substrate. If any soldering balls are left in the flux storage due to failure of the pickup operation by the absorber head, such soldering balls are surely collected in a groove by wiping movement of a squeegee which is associated with the flux storage.

Abstract: A sucking failure detecting device built into an apparatus which transfers an object by sucking the object onto a sucking hole of a sucking head of the apparatus, the detecting device comprises: a light-emitting device emitting light and disposed on a movement path of the sucking head; and a light-receiving device disposed inside the sucking head which is made of light-shielding material, the light-receiving device receiving the light emitted by the light-emitting device and passing through the sucking hole.

Abstract: An automatic ball placing device can automatically attach the solder ball to the pad of BGA's (Ball Grid Array) substrate. It comprises mainly a BGA substrate fixing device, a stencil fixing seat at least, a horizontal driving device, a vertical driving device and a swinging device. The BGA substrate possesses multiple stencil. The horizontal driving device and the vertical driving device can drive the said BGA substrate fixing device to perform horizontal and vertical movement respectively so as to move the BGA substrate to the position below the stencil fixing seat and thereby, make the solder balls drop into the mesh of the stencil which facilitates the solder balls to attach to the pad of BGA's substrate.

Abstract: A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

Abstract: Methods for soldering a ball grid array (BGA) integrated circuit package to a printed circuit board. One method includes the steps of applying a solder flux to the conductive surface pads of a printed circuit board and capturing a plurality of solder balls with a separate fixture. The fixture is then placed onto the printed circuit board and the solder balls are released onto the conductive surface pads. The fixture is removed and an integrated circuit package is placed onto the solder balls. Solder flux may be applied to the bottom of the package to adhere the package to the balls. The solder balls are then reflowed to attach the package to the board. The flux provides a bonding agent which maintains the position of the solder balls and package while the solder is being reflowed. Another method includes the step of placing a fixture adjacent to the integrated circuit package so that a plurality of openings in the fixture are aligned with surface pads located on the bottom surface of the package.

Abstract: A suction head is introduced into a ball reservoir holding conductive balls, such as solder balls, and a plurality of suction holes formed in a suction surface of the suction head, hold the conductive balls by suction, respectively. Then, the suction head is moved into a position above a workpiece placed in position, and the suction is released from the conductive balls held on the suction head, thereby placing these conductive balls onto the workpiece. The suction head is vibrated or moved within the ball reservoir so that each of the suction holes can positively hold one conductive ball, thus preventing extra conductive balls from sticking to the suction head.

Abstract: A soldering ball mounting apparatus comprises a workpiece positioning mechanism "A" for positioning a workpiece 2 at a predetermined position. The workpiece 2 has an upper face formed with a plurality of electrodes 2a on which soldering balls 3 are mounted. A template 4, provided with a plurality of through holes 4a corresponding to the electrodes 2a in a one-to-one relationship, is supportable in such a manner that their through holes 4a are positioned just above the corresponding electrodes 2a of the workpiece 2. A soldering ball container 12 is provided on the template 4 for accommodating soldering balls 3 therein. The soldering ball container 12 has an open bottom allowing the soldering balls 3 to fall below the template 4 via the through holes 4a. A pair of X and Y motors shifts the soldering ball container 12 along the upper surface of the template 4 disposed in a horizontal direction.

Abstract: A process and apparatus is available for producing a bonded metal coating. older material constructed so as to form a solder material shaped body (18) is transported by means of an energy transfer device (13), which is guided in a capillary tube (12) and which acts in the manner of a stamp, towards a bonding surface (24) of a substrate (25). The solder material then is acted upon by energy by means of the energy transfer device (13) for shaping and connection to the bonding surface (24).

Abstract: A solder-ball mounting apparatus is provided with a ball feed jig having a ball tank that may receive a predetermined number of solder-balls for feeding the solder-balls to a ball suction jig through a guide mask mounted on an opening portion of the ball tank, and blowout holes formed in a bottom of the ball tank for a blow gas as a blow unit for agitating the solder-balls received in the ball tank in the ball feed jig. The solder-balls may be positively sucked to ball suction holes one by one without turning over the ball suction jig.

Abstract: In a soldering ball mounting apparatus, a pickup head is movable between a soldering ball feeder and a workpiece to be mounted with soldering balls. The pickup head has a bottom formed with a large number of absorber holes for vacuum-absorbing the soldering balls from the soldering ball feeder. On the way to the workpiece, light is irradiated onto the bottom of the pickup head from the exterior. When the light leaks into the pickup head, the leakage light is detected by a light detector provided in the pickup head so that presence of a soldering-ball pickup error is determined. On the other hand, on the way to the soldering ball feeder after mounting the soldering balls onto the workpiece, light is irradiated along the bottom of the pickup head from one side. Accordingly, when the light is not received at the opposite side, at least one soldering ball remains attached to the bottom of the pickup head so that presence of a soldering-ball mounting error is determined.

Abstract: An automatic soldering machine for soldering a rope chain comprises a pair of gears, each with a peripheral surface defining a trench which engages one of the strands of the rope chain and which is rotatable to precisely feed and place successive link junctions of the chain relative to hollow solder applying needles. The needles are reciprocally movable and serve to apply a premeasured amount of solder paste at the link junctions of the rope chain. A heater, for example, an induction heater, heats the chain, causing the solder to flow and then set and thereby secure the chain links together.