Abstract: In an apparatus known as a wire bonder, a new type of one-piece joint element (20) is used as the articulated link (G) between a support unit (pivoting rocker 30) and a bonding unit (10) that carries a capillary (12). One or more such joint elements (20) define a virtual pivot axis (A2) for the unit (10), which lies outside the unit and thus provides a passage in the apparatus wide enough for relatively wide workpieces (chips 1 on substrate 2). A joint element (20a) is made in one piece and has at least two elastically flexible blades (22a) converging toward each other relative to a symmetry plane (S), and the blades are connected to each other by two rigid sections (23a, 24a). One of the rigid sections (23a) is attached to (and removable from) the support unit (30), the other (24a) is attached to (and removable from) the bonding unit (10), so that the joint element (20) is easy to fit or exchange.

Abstract: A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located therebetween. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components.

Abstract: A bonding tool used in a bonding apparatus for bonding, for example, pellet and leads of a lead frame including a tool attachment part to which a tool member is mounted. The tool member has four inclined surfaces, and the tool attachment part includes two fixed guide members and two detachable guide members fastened to the tool attachment part by bolts. Inclined surfaces that position two adjacent inclined surfaces of the tool member are formed on the fixed guide members, and inclined surfaces that position the other two inclined surfaces of the tool member are formed on the detachable guide members. The tool member is mounted on and dismounted from the tool attachment part by merely removing the detachable guide members.

Abstract: The present invention discloses a wire bonder that does not require bonding tool replacement to be performed by an experienced worker, is not bothersome and can be completed in an extremely short time, while also enabling time management of the degree of wear of the bonding tool and so forth to be performed reliably, so as to realize improved work efficiency and yield, as well as being able to demonstrate various other effects. In addition, the present invention also discloses a bonding arm and bonding tool that contribute to the achieving of these effects. The above effects are obtained by adding a tool replacement device that removes a used bonding tool (capillary) installed in a bonding arm and installs a new bonding tool. In addition, the above effects are obtained with respect to the bonding arm and bonding tool by forming a tapered surface that guides their mutual insertion.

Abstract: A thermocompression-bonding unit and a pressure-bonding head unit which are structurally simple and where reliability is high. The pressure-bonding head unit includes a pressure-bonding head; pressure-bonding head holding means for integrally fixing and holding the pressure-bonding head, the pressure-bonding head holding means being formed with a cutout from a first direction side in parallel with the pressure-bonding surface and also being formed with an opening perpendicular both to the first direction and the pressure-bonding surface; first deformation means for deforming the pressure-bonding head holding means so that a cutout inlet of the cutout opens or closes by a desired amount; and second deformation means for deforming the pressure-bonding head holding means so that one opening end or the other opening end of the opening is crushed in a direction parallel to the first direction by a desired amount.

Abstract: A soldering tip is disclosed which fits loosely over a ceramic heater rod. The rear skirt of the tip is slotted into segments the rear edges of which are tapered rearwardly inwardly to be engaged by a forwardly opening conical surface on the front of a metallic sheath covering and supporting the rear portion of the ceramic rod. When the soldering tip is urged rearwardly in its assembly to the remainder of the soldering tool the segmented portions of the skirt are then pressed radially inwardly over the ceramic rod. The slots dividing the skirt into segments extend well forwardly thereof whereby the bending of the segments is forwardly of the tip of the ceramic rod where a thermocouple type temperature sensor may be disposed. Thus the skirt portions make good thermal contact with the rear and central portions of the ceramic rod but not with the temperature sensor front tip portion.

Abstract: A process for bonding a flip chip (20), of the type having an active face provided with conductive bumps, to a substrate (22) so that its active face is oriented toward the substrate (22). The flip chip (20) is coupled through a vacuum to the distended end (32) of an ultrasonic horn (30) and then lowered onto the substrate (22) so that the bumps (20b) align with a bonding pattern on the substrate (22). A bias force is applied through the ultrasonic horn (30) to the backside of the flip chip (20), in a direction normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the bias force is applied such that the ultrasonic energy is isothermally transferred in a direction normal to and across the flip chip (20) to the substrate (22) for creating a diffusion bond therebetween.

Abstract: In one aspect, a device for attaching a component to a circuit board is provided, comprising a circuit board held in a holder and a contact heater that heats the component on the circuit board by contact and by conducting heat through the component. In a further aspect, the contact heater is in a wand which is manually moved onto the component. In another aspect, the invention provides a method for attaching a component to a circuit board, comprising the steps of gripping the component with a contact heater; placing the component on the circuit board; and heating the component on the circuit board by contact, wherein heat conducted through the component melts solder under the component and attaches the component to the circuit board.

Abstract: An apparatus for removing and/or replacing a surface-mounted integrated circuit that includes electrical heating elements disposed in a planar rectangular array and a handle positioning the element array in heat-conductive contact with the legs on the side edges of a surface-mounted integrated circuit. When electrical energy is applied to the heating elements, the elements and the integrated circuit legs are heated so as to liquify the solder joints between the legs and the circuit board pads. An air pad is positioned within the heating element array for grasping and holding the integrated circuit to facilitate lifting of the circuit from the circuit board, or for holding a replacement integrated circuit on the circuit board, when all of the solder joints have been liquified.

Abstract: A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

Abstract: A solder gun or soldering iron contains a pair of electrical terminals that hold a solder tip containing a pair of straight parallel leads. Each lead has a substantially U-shaped cross-section that creates a circular cavity filled which is filled with an insulative material. The soldering tip is made from either a low impedance material such as copper or high impedance material such as a multi-layer material of steel, copper and nickel that automatically maintains the soldering tip at a constant temperature. The soldering device also comprises a universal connector that receives both a solid solder tip and a hollow soldering tip. A rack extending around the soldering device allows quick and easy exchange of various solder tips into the universal connector. In another embodiment of the invention, the soldering device includes a multiple position trigger that both initiates heating of a solder tip and activates a suction mechanism.

Abstract: A method for producing a semiconductor modular structure includes placing semiconductor bodies, a ceramic substrate with metallizing, and a metal base plate, in an elastomer compression mold. A heatable pressure ram with a surface being concave relative to the base plate is placed on the base plate. At least the base plate and the ceramic substrate are convexely deformed and joined with pressure exerted by the pressure ram, at a temperature above room temperature.

Abstract: A capillary-retaining structure for an ultrasonic horn used in a wire bonding apparatus including a stress relief hole formed inside of a capillary attachment hole that is opened at an end portion of the ultrasonic horn. Thus, the capillary retention by the ultrasonic horn is stabilized, and the vibrational characteristics of the ultrasonic horn are also stabilized, thus improving overall bondability in wire bonding. The same effect can be obtained by setting the thickness of a portion between the end surface of the horn and the capillary attachment hole to be thin or by utilizing a bold and nut combination to hold the capillary.

Abstract: An in-jig assembly bond fixture for manufacturing a composite component having a plurality of parts includes at least one fixture for holding each of the plurality of parts in proper alignment relative to one another during a bonding operation. A mechanical mechanism is provided integral with the at least one fixture for applying a predetermined uniform compressive force to each bond line between each of the plurality of parts during the bonding operation. A plurality of heating elements is provided for applying heat directly to each bond joint and are each selectively located within the fixture for applying heat uniformly across each bond line during the bonding operation.

Abstract: Bond tool pressure distribution is optimized by a method and apparatus having a device having a first surface which permits inclination of the first surface in at least one direction, wherein the device is in a locked position. A first bonding arrangement is positioned on the first surface of the device. A second surface makes contact to the first bonding arrangement. This contact is detected and the device is unlocked to allow the first surface to incline while the second surface is in contact with the first bonding arrangement. The second surface is applied to the first bonding arrangement with a force, and the device is locked upon application of the force.

Abstract: Self-aligning tip elements are achieved in accordance with preferred embodiments of the invention by providing a edge surface of each tip element with key and notch formations which will interfit with each other in a prescribed orientation when the tip elements are inserted into the bobbins of the a tweezer handpiece and the tip elements are brought together by squeezing-together the legs of the tweezer handpiece. By utilizing a symmetric arrangement of key and notch formations on each tip element, a pair of like tip elements can be used together instead of requiring special left and right tip elements.

Abstract: Disclosed is a structure of soldering system with solder wire automatic feeding mechanism, which comprises a first cardan arm for holding a soldering iron and a second cardan arm for holding a solder wire feeding unit. The cardan arms are each comprised of three joints. A swivel knob is fastened in each cardan are to adjustably control the positioning of the soldering iron or the solder wire feeding unit. The solder wire feeding unit comprises a feeder head revolvably attached to a feeder holder so that the feeding angle of solder wire can be conveniently adjusted.

Abstract: The invention is related to an apparatus for re-using a copper wire having been used once for mash seam welding in a mash seam welder for mash seam welding a lap formed by overlapped opposite side edges of a metal sheet or like blank between upper and lower roller electrodes via copper wires. The apparatus is provided in a portion of or in relation to the mash seam welder for taking up the copper wire having been used once for welding and squeezed to have a substantially flat sectional profile as taken-up wire and feeding again the taken-up wire as rewound wire to the mash seam welder to be used again for welding between said upper and lower roller electrodes.

Abstract: A soldering tool comprises a handle (10) and a rod-shaped or tubular heating element fastened to the front end of the handle. A soldering tip (4) can be placed on the free end of the heating element. The soldering tip (4) has a borehole for receiving the free end of the heating element and can be fixed to the handle (10) or heating element by means of a fastening sleeve (1). The end of the fastening sleeve (1) nearer the soldering tip has first rotary catches (2, 3) which can be locked by second rotary catches (5) arranged at the rear end of the soldering tip (4) by turning the fastening sleeve (1) relative to the soldering tip (4).

Abstract: A tweezer-type heating device for installation and removal device of electronic components with respect to a substrate, such as for SMC installation and through hole installation or removal. More specifically, a handheld tweezer-type heating device is provided in which a wide variety of different sized (and shaped) tips can be used with a high degree of accuracy in terms of thermo/mechanical contact. Tolerances in the parts of the handpiece, the assembly, the heaters and the tips that may bring the bottom edges of the tips out of their alignment plane are very easily corrected with an adjustable hinge which, by loosening of a screw and sliding the parts with respect to each other, allows proper alignment to be achieved. Still further, a thumb screw is provided at the back of the handpiece to allow the gap between the tips to be slightly opened or closed. This is useful in accommodating tolerances in the components.

Abstract: A bonder that allows replacement of the bonding tool, corresponding to changes in the type of bonded component, to be performed both easily and rapidly, while also preventing the occurrence of operator-initiated errors accompanying the changes in bonded component type. As a result of allowing a bonding plate, which jointly applies compressive force to bonded components with a bonding tool, to float freely while being held by a diaphragm, the bonded components are adhered to the pressing surface of the bonding tool by the unrestricted bending of the diaphragm so as to follow its motion, thus eliminating the need for an operator to adjust the inclination of the bonding tool, as is necessary in conventional bonders.

Abstract: Latent heat of fusion is used to store and extract a relatively large quantity of temperature controlled heat from the small volume of a soldering iron tip. This is accomplished by fabricating the tip from a composite material comprised of a porous metal matrix, the interstices of which have been filled with an element or alloy having a melting temperature at or near a desired working point. The latent heat of fusion associated with the change of state of this working substance provides a constant temperature reservoir of heat immediately adjacent to a heat consuming operation such as solder joint formation. This proximity of heat source and sink allows the formation of a series of solder joints with only minor tool temperature variation from one to the next, thereby contributing to a uniformity among them that is considered desirable.

Abstract: Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates.

Abstract: A bonding head assembly including a retaining block having a vacuum suction hole or electromagnet on its concave surface formed on the undersurface, a central shaft loosely passing through the central hole of the retaining block and having a bonding tool at the lower end, an oscillating ball attached to the upper part of the central shaft. After the bonding tool is brought into in contact with a workpiece, vacuum suction or electromagnet is activated so that the oscillating ball is brought into a tight contact with the concave surface of the retaining block, thus securely retaining the oscillating ball in the retaining block and, as a result, setting the position of the central shaft and therefore the bonding tool.

Abstract: An ultrasonic transducer, bonding tool and method of bonding gold or gold plated leads to gold or gold plated bonding pads located on unheated substrates is disclosed. More particularly, the transducer of the present invention incorporates a modified transducer/tool interface which provides for increased durability as well as increased excursion control of any bonding tool placed therein. The bonding tool of the present invention includes a modified end having a raised pattern used to form an impression in the lead to be bonded to enhance gripping of the lead during bonding. The preferred methods include using the modified transducer and bonding tool to perform gold-to-gold bonding on unheated substrates while providing increased vertical clearance for bonding between structures.

Abstract: The invention is directed to a method wherein pressure is exerted onto a semiconductor surface by a chemically inert and non-solid medium. An opposite pressure is prevented from building up in an intermediate layer, for example, with the assistance of a seal. A connection between the semiconductor and the substrate occurs by pressure sintering or by diffusion welding. A contact between an active, inside region of the semiconductor and a plunger can be avoided since the plunger has a raised and annular outside region for sealing, and the actual pressing power is effected by the pressure medium via a bore situated in the plunger. This raised edge for sealing can also be situated on the semiconductor instead of being situated on the plunger. When a semiconductor component is extrusion-coated with a plastic melt, then this plastic melt itself can serve as a pressure medium.

Abstract: A press for welding magnetic yokes comprises first and second frames movable toward and away from each other, on which there are defined respective confronting and parallel pressure surfaces (12, 35), a motive means (50) acting between the frames (11, 30) to produce the aforesaid movements, and a presser (14, 36) associated with each of the pressure surfaces (12, 35) to define a saddle-piece for receiving the yoke (3). Between at least one of the pressers (14, 36) and its respective pressure surface (12, 35) there intervening an elastically deformable pillow (39) functioning as an adjuster of the deformation under load undergone by the corresponding pressure surface (12, 35). This pillow is composed of an elastic material which has a behavior under load, within a predetermined range of specific loads, that approaches a hydrostatic behavior, that is, such that for a given increase in the deformation there corresponds a proportionally low pressure increase.

Abstract: To effect disassembly of components relative to an integrated circuit board, the circuit board and its typical construction, including the soldering of the various components projected through the circuit board, is effected by an anvil, including a plurality of anvil bores, wherein the anvil is heated and each anvil bore is accordingly heated effecting the elimination of the associated soldering joints of each projecting tip of an associated electrical component directed through the circuit board. The apparatus further includes a metallic brush member arranged for securement to an associated heating member or gun to effect the cleaning and removal of solder residue remaining on the circuit board. Further, various anvil sizes are provided to accommodate various circuit board patterns and may be provided in a kit form in a single unitary container.

Abstract: A reflow solder head has its heater bar (30) mounted so as to cause the heater bar to contact a tilted reflow surface (50) and align itself with the tilted surface without tip skid. The heater bar is mounted to its movable drive ram (40) by two independent pivots (36,42), both nominally positioned on a line normal to and in the center of the heater bar itself. The first pivot (36) closer to the heater bar allows the heater bar to rotate about its first point of contact (54) with the tilted reflow surface. The second pivot (42) allows lateral movement of the first pivot (36) without tip skid during the rotation of the heater bar about its first point of contact. This double pivot mechanism eliminates the tendency of the heater bar to skid along the reflow surface.

Abstract: The present invention consists in the apparatus for use in welding a first component and a second component together by friction welding, comprising drive means operative to generate reciprocatory movement, a component holder operative to hold said first component, linking means operative to transmit reciprocatory movement from the drive means to the component holder so that in operation said first component performs reciprocatory heat-generating movement, pressure means operative to exert pressure on the component holder so that in operation said first component also performs welding movement, the linking means being such as to accommodate that welding movement during friction welding and the pressure means being such as to accommodate that heat-generating movement during friction welding.

Abstract: A tweezer-type heating device for installation and removal device of electronic components with respect to a substrate, such as for SMC installation and through hole installation or removal. More specifically, a handheld tweezer-type heating device is provided in which a wide variety of different sized (and shaped) tips can be used with a high degree of accuracy in terms of thermo/mechanical contact. Tolerances in the parts of the handpiece, the assembly, the heaters and the tips that may bring the bottom edges of the tips out of their alignment plane are very easily corrected with an adjustable hinge which, by loosening of a screw and sliding the parts with respect to each other, allows proper alignment to be achieved. Still further, a thumb screw is provided at the back of the handpiece to allow the gap between the tips to be slightly opened or closed. This is useful in accommodating tolerances in the components.

Abstract: An improveent in a Tape Automated Bonding (TAB) apparatus wherein a support for the device being bonded to a tape, or film carrier, is provided that will automatically adjust the position of the device supported thereon to conform to the bonding surface of the thermode. The support of the invention has a central member that provides for swivelling and a second member that prevents relative rotation.

Abstract: The method and apparatus of the present invention may be utilized to support a selected mounting point on a circuit board during the mounting an electronic component. An integrated circuit device is selected and positioned adjacent a first side of a circuit board at a desired mounting point utilizing a robotic manipulator and a placement head. A support fixture is then urged into temporary contact with a second side of the circuit board utilizing a flexible mounting system such that minor variations or misalignments between the plane of the support fixture, the circuit board and the placement head are eliminated. In one embodiment of the present invention a flexible fluid filled bag is utilized in conjunction with the support fixture so that the presence of components on the second side of the circuit board may be accommodated while supporting the circuit board during component mounting.

Abstract: A method and apparatus for fastening semiconductor components, such as power semiconductors, onto substrates is a diffusion welding method wherein the surfaces to be joined are provided with precious metal contact layers and are pressed together with at least 500 kp/cm.sup.2 at a moderate temperature of approximately 150 to 200 degrees C. Components which have a structured or shaped upper side can be joined to substrates when they are inserted in common with a member of elastically deformable material, such as silicone rubber, into a receptacle chamber that is closed by a movable die which transmits the pressing power. The deformable member completely fills out the remaining interior of the receptacle chamber when the pressing power is reached.

Abstract: A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes a nozzle head which has an interior bore for receiving an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the inteiror bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad. A source of bleed gas is supplied to the interior of the assembly to protect the component parts and excluse oxygen from the interior of the assembly. A cover gas is also supplied to the solder site to reduce oxidation of the moltent solder and reduce the amount of flux required.

Abstract: A pressure sintering method and apparatus provides that surfaces to be joined are pressed together with a pressure of at least 900 N/cm.sup.2 at a sintering temperature upon the interposition of a metal powder paste which serves to fasten electronic components, such as power semiconductors, to substrates. Components having a structural upper side can be pressure sintered when they are inserted into a receptacle chamber closed by a movable die together with a member of elastically deformable material, such as silicone rubber, which transmits the sintering pressure. The deformable member completely fills out the remaining space of the receptacle chamber when the sintering pressure reached.

Abstract: A tool for desoldering quadrilateral surface-mount components such as integrated circuits which have a row of leads on each of the four sides, the tool comprising a metallic hood with a depending skirt which contacts the rows of leads when the hood is snapped over the component. The hood is heated with a hot air gun or a heating element, and conducts the heat to the leads, melting the solder connecting the leads to the pads of the circuit board, permitting the component to be lifted off of the circuit board.

Abstract: A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes an upper nozzle mount and a removeable nozzle head which has an interior bore for receiving a portion of the nozzle mount and an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the interior bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad.

Abstract: An electric soldering iron includes a barrel and a head portion with a center hole being pivoted to a front end of the barrel. A piston and a piston rod are disposed in the front end of the barrel. A spring embraces the piston rod and bears against the piston. A solenoid is disposed in a rear end of the barrel. A button is disposed at a rear end of the barrel for controlling the solenoid. The piston is pushed forward by the spring when the solenoid is not actuated. A depression of the button actuates the solenoid to draw the piston rearward.

Abstract: A surface mount soldering/de-soldering tip holder includes a base having recesses or pockets formed therein that include at least one wall configured and sized to cooperate to a side surface of the tip. A cover plate having apertures formed therethrough is positioned on the base such that the apertures are aligned with the recesses in the base. Each aperture includes a convex portion for seating the shank of a soldering/de-soldering tip, while the portion of the cover plate adjacent to the convex portion extends over a portion of the respective recess to form a shelf. The shelf cooperates with the shoulder of a soldering/de-soldering tip once the tip is properly positioned in the recess. To remove a tip that is frictionally secured within a soldering iron adapter, the tip is inserted into one of the recesses formed in the base and positioned so that its shank is seated against the portion of the cover plate that forms the boundary for the convex portion of a respective aperture.

Abstract: The soldering apparatus using at least one resistance heated stirrup electrode that is place onto soldering locations on a printed circuit board includes a pivotable suspension of the stirrup electrode. The pivotable suspension is such that a dislocated rotational axis of pivotable suspension lies in a plane of the working surface and extends perpendicular to a long side of the rectangular working surface of electrode and at the center thereof. The working surface of the stirrup electrode thus achieves reliable contact with parts to be soldered. Embodiments having two or four soldering stirrups, each individually pivotly suspended, are also possible.

Abstract: In a soldering device comprising at least one stirrup electrode that is secured to a soldering stirrup holder and is heatable with electrical resistance heating and has two soldering webs lying opposite one another or four soldering webs lying opposite one another in pairs, the working surfaces at the underside of the soldering webs should be capable of being placed exactly parallel onto the soldering location that lies, for example, on a printed circuitboard. This is enabled by a flexible suspension of the soldering stirrup holder which provides a pivot compensation center lying centrally in the plane of the working surfaces. As a result thereof, a reliable contact of the parts to be soldered to one another and to the soldering stirrups is guaranteed.

Abstract: A technique is provided for desoldering circuit components employing a desoldering aid that fits like a cap on a standard size rectangular circuit component. The aid has a rectangular top of high thermal conductivity metal substantially the same size as the circuit component. At least a pair of integral sides along opposite edes of the top are bent normal to the top and are not further apart than the outside of the electrical leads on the opposite sides of the circuit component for good thermal contact therewith. The depth of the inside of the box is greater than the height of the top of the component so that there is no contact between the top of the box and the top of the component. The top of the box over the component is heated sufficiently to melt solder on the electrical leads. The box and component can then be lifted together from the printed circuit board.

Abstract: A device for retaining an attachment member having an engagement portion for engagement with an outer circumferential surface of a rod-like member, comprising: a receptacle for receiving a main part of the attachment member with some play; an elastic member for retaining the main part at its first position for keeping the rod-like member and the engagement portion from interfering with each other when the rod-like member is brought into a preliminary position for engagement with the engagement portion; and a pressure unit for bringing the attachment member to its second position for engaging the engagement portion with the rod-like member against a biasing force of the elastic member. When the attachment member is placed in the receptacle, it is held in its first position for not causing any interference between the engagement portion and the rod-like member by being supported by the elastic member. The rod-like member is then placed at a prescribed position.

Abstract: A soldering iron comprises a tube and a soldering tip slipped onto the front or outer end of the tube with a close sliding fit. The soldering tip is fastened axially by means of a spring element which is fastened to an inner end of the tube. In order to secure the soldering tip from rotating, the diameter of the front or outer section of the tube is made smaller than the diameter of the far or inner end section of the tube and the soldering tip is connected form-fittingly with the tube by a web formed in the inner tube which engages in a slot of the outer tube.

Abstract: A tape bonding method using an intermediate member provided between a bonding tool and a carrier tape having leads thereon. The intermediate member is made of a polyimide film, metal foil, glass material, elastic material, etc. and can be in a form of endless belt provided between a driving pulley and a driven pulley.

Abstract: Soldering apparatus of the kind having a replaceable tip element including a soldering face and having a frame portion and a tip retaining portion adapted to retain the tip element in heat conducting relationship with the frame portion. The soldering apparatus is characterized in that the frame portion incorporates a contact assisting formation adapted to embed itself at least partly into the tip element remote from the soldering face to thereby reduce electrical resistance between the tip element and frame.

Abstract: A machine for bonding leads from a chip to a substrate having top and bottom surfaces that are non-coplanar is comprised of a carrier for the substrate which includes a frame having a set of stops that terminate in a single plane and which are arranged in a pattern with a central opening. Also included in the carrier is a forcing mechanism which pushes on the bottom surface of the substrate such that the top surface of the substrate is pinned directly against all of the stops simultaneously and a portion of that top surface is exposed through the opening. This causes the exposed portion of the substrate's top surface to be aligned with the plane of the stops regardless of the degree of non-coplanarity that exists between the substrate's top and bottom surfaces.

Abstract: Apparatus for automatically adjusting the orientation of a first surface of a first body to be against a second surface of a second body when said first surface is pressed against said second surface. The apparatus includes a means for movably mounting the first body to a support which permits rotation of the first surface so that when the first surface is pressed against the second surface, the first surface rotates with respect to the support resulting in the first surface being against the second surface.

Abstract: The present invention consists in the apparatus for use in welding a first component and a second component together by friction welding, comprising drive means operative to generate reciprocatory movement, a component holder operative to hold said first component, linking means operative to transmit reciprocatory movement from the drive means to the component holder so that in operation said first component performs reciprocatory heat-generating movement, pressure means operative to exert pressure on the component holder so that in operation said first component also performs welding movement, the linking means being such as to accommodate that welding movement during friction welding, and the pressure means being such as to accommodate that heat-generating movement during friction welding.