Abstract: An electron-emitting electrode for discharge lamps etc. uses an electron-emitting material which contains a first metal component selected from Ba, Sr and Ca and a second metal component selected from Ta, Zr, Nb, Ti and Hf and also contains oxynitride perovskite. The electron-emitting material has restrained evaporation during electric discharge and a high resistance to ion sputtering.

Abstract: An electron-emitting material contains a first metal component selected from Ba, Sr and Ca and a second metal component selected from Ta, Zr, Nb, Ti and Hf and also contains oxynitride perovskite. The electron-emitting material has improved electron emission characteristics, restrained evaporation at elevated temperatures, and minimized consumption by ion sputtering. The electron-emitting material is prepared by firing a metal component-containing raw material disposed in proximity to carbon in a nitrogen gas-containing atmosphere to thereby create oxynitride perovskite.

Abstract: Materials, both glass and glass-ceramic, that exhibit UV-induced changes in light transmission and electrical conductivity behavior. The materials consist essentially, in mole %, of 20-40% SiO2, 10-20% AlO1.5, 35-55% SiO2+AlO1.5, at least 30% CdF2, 0-20% PbF2, and/or ZnF2, 0-15% rare earth metal fluoride, and 45-65% total metal fluorides.

Abstract: The invention encompasses epoxies, epoxy systems, and methods of forming conductive adhesive connections between electrical nodes. In one aspect, the invention includes a method comprising: a) providing a first node; b) providing a second node; c) providing a liquid conductive epoxy mixture between the first and second nodes, the liquid conductive epoxy mixture comprising a first liquid and a second liquid, the liquid conductive epoxy mixture having sufficient conductivity that a 15 mil length sample of the liquid conductive epoxy having cross-sectional dimensions of 50 mil by 2 mil would have a resistance of less than about 100 ohms along its length between about 10 minutes and about 20 minutes of combining the first and second liquids; and d) curing the liquid conductive epoxy to form a conductive adhesive connection between the first node and the second node.