Abstract: A nanostructured material system for efficient collection of photo-excited carriers is provided. They system comprises a plurality of plasmonic metal nitride core material elements coupled to a plurality of semiconductor material elements. The plasmonic nanostructured elements form ohmic junctions at the surface of the semiconductor material or at close proximity with the semiconductor material elements. A nanostructured material system for efficient collection of photo-excited carriers is also provided, comprising a plurality of plasmonic transparent conducting oxide core material elements coupled to a plurality of semiconductor material elements. The field enhancement, local temperature increase and energized hot carriers produced by nanostructures of these plasmonic material systems play enabling roles in various chemical processes. They induce, enhance, or mediate catalytic activities in the neighborhood when excited near the resonance frequencies.

Abstract: An electron emission source is provided. The electron emission source includes a first electrode, an insulating layer, and a second electrode. The first electrode, the insulating layer, and the second electrode are successively stacked with each other. the second electrode is a graphene layer, and the graphene layer is an electron emission end to emit electron. A thickness of the graphene layer ranges from about 0.1 nanometers to about 50 nanometers.

Abstract: A fan-out wafer level package includes a semiconductor die with a redistribution layer on a sidewall of the semiconductor die. A redistribution layer positioned over the die includes an extended portion that extends along the sidewall. The semiconductor die is encapsulated in a molding compound layer. The molding compound layer is positioned between the extended portion of the redistribution layer and the sidewall of the semiconductor die. Solder contacts, for electrically connecting the semiconductor device to an electronic circuit board, are positioned on the redistribution layer. The solder contacts and the sidewall of the redistribution layer can provide electrical contact on two different locations. Accordingly, the package can be used to improve interconnectivity by providing vertical and horizontal connections.

Abstract: The present application discloses a semiconductor device with a protection structure for suppressing electromagnetic interference and air gaps reducing parasitic capacitance and a method for fabricating the semiconductor device. The semiconductor device includes a connection structure including a connecting dielectric layer, a first protection structure positioned in the connecting dielectric layer and positioned adjacent to a perimeter of the connecting dielectric layer, and a plurality of air gaps positioned on sides of the first protection structure. The first protection structure is formed of copper, aluminum, titanium, tungsten, cobalt, the like, or a combination thereof.

Abstract: A high-resolution x-ray imaging system encodes spatial information into x-ray energy by an encoding filter which changes the x-ray energy sensitivity of each detector at different portions of the detector. Acquiring successive images at different energies allows the fluence at different portions of a single detector to be isolated providing effective sub detector resolution.

Abstract: An organic light-emitting display apparatus includes a transistor on a substrate. The transistor includes a gate electrode, a first electrode, and a second electrode. The apparatus also includes a protective layer over the first electrode and including a first portion that contacts the second electrode, and an organic light-emitting device having a pixel electrode electrically connected to the second electrode.

Abstract: The object is to provide a technique for enabling determination of an appropriate test condition. A test condition determining apparatus includes a map generating unit, a withstand voltage estimating unit, and a test condition determining unit. The map generating unit generates a wafer map relevant to a plurality of chips, based on measurement values of thicknesses and carrier concentrations of an epitaxial growth layer, and measurement results of crystal defects in the epitaxial growth layer and a substrate. The withstand voltage estimating unit estimates a withstand voltage of each of the chips based on the wafer map. The test condition determining unit determines a test condition of a test to be conducted on the chips, based on a result of the estimation made by the withstand voltage estimating unit.

Abstract: An electron emission source is provided. The electron emission source comprises a first electrode, an insulating layer, a semiconductor layer, and a second electrode. The first electrode, the insulating layer, the semiconductor layer, and the second electrode are successively stacked with each other. The second electrode is a graphene layer, and the graphene layer is an electron emission end to emit electrons.

Abstract: An organic light emitting device including a blue subpixel that is larger than a red subpixel and a green subpixel. The red subpixel and the green subpixel have the same layered structure such that the red subpixel and the green subpixel are formed by using the same shadow mask.

Abstract: A semiconductor device includes n semiconductor chips stacked via electrical contacting means in the silicon substrate thickness direction, n being an integer larger than 2, a side face of the stacked semiconductor device in the substrate thickness direction being covered by a non-conductive layer. The shape of the side face with respect to a plan view of the stacked semiconductor device may be one of curved, convex, concave or circular.

Abstract: Described herein are integrated circuit structures having a package substrate with microstrip transmission lines as the top metallization layer, and a ground plane external to the package substrate that is electrically connected to a ground plane internal to the package substrate, as well as related devices and methods. In one aspect of the present disclosure, an integrated circuit structure may include a package substrate having an internal ground plane and a microstrip signal layer as the top metallization layer, and an external ground plane on the surface of the package substrate that is electrically connected to the internal ground plane in the package substrate. In another aspect of the present disclosure, an integrated circuit structure may further include changes to microstrip transmission line geometry to match impedance values of areas covered by the external ground plane with impedance values of areas not covered by the external ground plane.

Abstract: A conductive thin film, a touch panel and a manufacturing method for the same, and a display device are provided. Material for forming the conductive thin film comprise topological insulator, the conductive thin film has a two-dimensional nanostructure, which solves the technical problem that the resistance of electrodes of the touch panel is relatively harge.

Abstract: Methods and apparatus for use in quantum cryptographic applications are disclosed. An optical signal having a first wavelength is encoded for quantum cryptography at a stage where the optical signal is on at least two signal paths. The wavelength of the encoded optical signal on the at least two signal paths is converted to a second wavelength before the optical signal is encoded for transmission. Encoding for transmission is applied to the optical signal on the second wavelength.

Abstract: A translucent cover for an LED light bulb is disclosed. The translucent cover includes a cover body made from a light-transmissive material, light-scattering particles in the light-transmissive material, and a series of micro-structure features on and inner surface of the cover body. The micro-structure features are configured to refract and reflect light emitted from the LED light bulb to increase the emission angle of the light emitted from the cover.

Abstract: Exemplary metamaterial photocathodes enable detection of light from visible through long wave infrared wavelengths. Metamaterial stacks, comprising gold, silicon, and cesium-oxide, coupled to a semiconductor allow hot electrons to efficiently enter a vacuum. The hot electrons are multiplied in a multichannel plate and directly through another vacuum towards a phosphorus screen.

Abstract: Integrated capacitor structures and methods for fabricating same are provided. In an embodiment, the integrated capacitor structures exploit the capacitance that can be formed in a plane that is perpendicular to that of the substrate, resulting in three-dimensional capacitor structures. This allows for integrated capacitor structures with higher capacitance to be formed over relatively small substrate areas. Embodiments are suitable for use by charge pumps and can be fabricated to have more or less capacitance as desired by the application.

Abstract: Exemplary metamaterial photocathodes enable detection of light from visible through long wave infrared wavelengths. Metamaterial stacks, comprising gold, silicon, and cesium-oxide, coupled to a semiconductor allow hot electrons to efficiently enter a vacuum. The hot electrons are multiplied in a multichannel plate and directly through another vacuum towards a phosphorus screen.

Abstract: Methods are described for the economical manufacture of Scanning Probe and Electron Microscope (SPEM) probe tips. In this method, multiple wires are mounted on a stage and ion milled simultaneously while the stage and mounted probes are tilted at a selected angle relative to the ion source and rotated. The resulting probes are also described. The method provides sets of highly uniform probe tips having controllable properties for stable and accurate scanning probe and electron microscope (EM) measurements.

Abstract: A high efficiency incandescent light bulb includes a filament both electrically and optically heated to visibly incandesce. The filament is enclosed in a visibly transmissive, IR reflective filter, with a high view factor, as to maximize recycling of IR wavelengths. The filter is formed on two clamshell segments.

Abstract: A new ultra-thin high-efficiency photoelectron source utilizing a metallic photonic resonant cavity having a photonic resonant cavity with a top metallic layer with a plurality of openings, each having an average dimension less than the wavelength of the excitation photons in vacuum, a bottom metallic layer and a photoelectron emission layer of semiconductor positioned between the top metallic layer and the bottom metallic.

Abstract: The invention relates to a semi-transparent photocathode (1) for a photon detector having an increased absorption rate for a preserved transport rate. According to the invention, the photocathode (1) includes a transmission diffraction grating (30) able to diffract said photons and provided in the support layer (10) on which the photoemissive layer (20) is deposited.

Abstract: A conductive structure includes a substrate including a first dielectric layer formed thereon, a first trench formed in the first dielectric layer, a first barrier layer formed in the first trench, a first nucleation layer formed on the first barrier layer, a first metal layer formed on the first nucleation layer, and a first high resistive layer sandwiched in between the first barrier layer and the first metal layer.

Abstract: A photodetector including a substrate, a light absorption layer arranged over the substrate, the light absorption layer including a stack including a semiconductor layer that absorbs light of a wavelength having an electric field vector parallel to a normal direction of a substrate surface, a lower contact layer arranged on a first side of the light absorption layer, a lower electrode contacting with the lower contact layer, an upper contact layer arranged on a second side of the light absorption layer, and an upper electrode contacting with the upper contact layer. An uneven structure including polarization-selective shapes of projections or depressions on the second side of the upper contact layer is provided, the shapes of projections or depressions each having a size of a wavelength or less of incident light in the semiconductor layer and half the wavelength or greater and being periodically arranged in at least one direction.

Abstract: An integrated vacuum microelectronic structure is described as having a highly doped semiconductor substrate, a first insulating layer placed above said doped semiconductor substrate, a first conductive layer placed above said first insulating layer, a second insulating layer placed above said first conductive layer, a vacuum trench formed within said first and second insulating layers and extending to the highly doped semiconductor substrate, a second conductive layer placed above said vacuum trench and acting as a cathode, a third metal layer placed under said highly doped semiconductor substrate and acting as an anode, said second conductive layer is placed adjacent to the upper edge of said vacuum trench, the first conductive layer is separated from said vacuum trench by portions of said second insulating layer and is in electrical contact with said second conductive layer.

Abstract: An optoelectronic modulation stack includes a substrate, a plurality of touch sensing units, at least a first anti-interference spot and a nano-structural layer. The touch sensing units are coplanarly disposed on the substrate, and a first interval region is formed between the adjacent touch sensing units. The first anti-interference spot is disposed within the first interval region, and the width of the first anti-interference spot is substantially less than that of the substrate or touch sensing unit. The nano-structural layer is disposed below the first anti-interference spot and includes a plurality of nano structures. When the light passes through the nano structures and the first anti-interference spot, the optical characteristic of the light is changed.

Abstract: The present disclosure provides a test element group, an array substrate, a test device and a test method. The test element group includes an array of Thin Film Transistors (TFTs), in which first electrodes of the TFTs in each row are connected to a first connection end, second electrodes of the TFTs in each column are connected to a second connection end, and third electrodes of all of the TFTs in the array are connected to an identical third connection end. The first electrode, the second electrode and the third electrode correspond to the source electrode, the drain source and the gate source of the TFT.

Abstract: A photocathode designs that leverage the grazing incidence geometry yield improvements through the introduction of recessed structures, such as cones, pyramids, pillars or cavities to the photocathode substrate surface. Improvements in yield of up to 20 times have been shown to occur in grazing incidence geometry disclosed herein due to a larger path length of the X-ray photons which better matches the secondary electron escape depth within the photocathode material. A photocathode includes a substrate having a first side and a second side, the first side configured to receive x-ray energy and the second side opposing the first side. A structured surface is associated with the second side of the substrate such that the structured surface includes a plurality of recesses from the second side of the substrate into the substrate.

Abstract: A semiconductor light emitting device includes a substrate; a base layer made of a first conductivity-type semiconductor and disposed on the substrate; a plurality of nanoscale light emitting units disposed in a region of an upper surface of the base layer and including a first conductivity-type nano-semiconductor layer protruding from the upper surface of the base layer, a nano-active layer disposed on the first conductivity-type nano-semiconductor layer, and a second conductivity-type nano-semiconductor layer disposed on the nano-active layer; and a light emitting laminate disposed in a different region of the upper surface of the base layer and having a laminated active layer.

Abstract: The present disclosure relates to a method and apparatus for mitigating printable native defects in an extreme ultra violet (EUV) mask substrate. In some embodiments, the method is performed by identifying a printable native defect within an EUV mask substrate that violates one or more sizing thresholds. A first section of the EUV mask substrate including the printable native defect is removed to form a concavity within the EUV mask substrate. A multi-layer replacement section that is devoid of a printable native defect is inserted into the concavity.

Abstract: A microparticle can include a central region and a peripheral region. The peripheral region can include a nanoparticle, such as a metal nanoparticle, a metal oxide nanoparticle, or a semiconductor nanocrystal. The microparticle can be a member of a monodisperse population of particles.

Abstract: Light-emitting devices, and related components, systems and methods are disclosed.

Abstract: A method for manufacturing a light emitting device has: forming a first phosphor layer including a first phosphor that is based on KSF or quantum dots on a light emitting element by a method other than spraying, and forming a second phosphor layer including a second phosphor that is different from the first phosphor on the first phosphor layer by spraying.

Abstract: A radio frequency transmitter includes a digital power amplifier and a bias control circuit. The digital power amplifier is arranged for receiving at least a radio frequency input signal, a digital amplitude control word signal and at least one bias voltage to generate a radio frequency output signal. The bias control circuit is coupled to the digital power amplifier, and is arranged for adjusting the at least one bias voltage according to a power control signal.

Abstract: The invention relates to novel block copolymers that enable a good dispersion of nanofillers in water and also to a dispersion of nanofillers obtained owing to these block copolymers. This dispersion may be used as a transparent electrode in organic solar cells or other photoemitter or photoreceptor devices.

Abstract: A photo-emitter x-ray source is provided that includes a photocathode electron source, a laser light source, where the laser light source illuminates the photocathode electron source to emit electrons, and an X-ray target, where the emitted electrons are focused on the X-ray target, where the X-ray target emits X-rays. The photocathode electron source can include alkali halides (such as CsBr and CsI), semiconductors (such as GaAs, InP), and theses materials modified with rare Earth element (such as Eu) doping, electron beam bombardment, and X-ray irradiation, and has a form factor that includes planar, patterned, or optically patterned. The X-ray target includes a material such as tungsten, copper, rhodium or molybdenum.

Abstract: The present disclosure provides an electrode and an feedthrough for an implantable medical device. In one embodiment, the implantable electrode and the implantable feedthrough both comprise electrically insulating diamond material and electrically conductive diamond material that form an interface. Further, the present disclosure provides method for fabricating the implantable electrode and the feedthrough.

Abstract: A display panel and a display device, such as an organic light emitting panel that includes a spacer. The display panel and the display device include a semiconductor element including a first electrode; a passivation layer arranged on the semiconductor element and including a via hole exposing the first electrode; a second electrode arranged on the passivation layer and connected to the first electrode through the via hole; and a spacer arranged on the second electrode and adjacent to the via hole, wherein the spacer exposes at least a portion of a region where the via hole is formed.

Abstract: A semiconductor light-emitting element according to the present invention includes: an n-type nitride semiconductor layer 21; a p-type nitride semiconductor layer 23; an active layer region 22 which includes an m plane nitride semiconductor layer and which is interposed between the n-type nitride semiconductor layer and the p-type nitride semiconductor layer; an n-type electrode 30 which is electrically connected to the n-type nitride semiconductor layer; a p-type electrode 40 which is electrically connected to the p-type nitride semiconductor layer; a light-emitting face, through which polarized light that has been produced in the active layer region is extracted out of this element; and a striped structure 50 which is provided for the light-emitting face and which has a plurality of projections that run substantially parallel to the a-axis direction of the m plane nitride semiconductor layer.

Abstract: Systems and methods for EMC, EMI and ESD testing are described. A probe comprises a center conductor extending along an axis of the probe, a probe tip, and a shield coaxially aligned with the center conductor and configured to provide electromagnetic screening for the probe tip. One or more actuators may change the relative positions of the probe tip and shield with respect to a device under test, thereby enabling control of sensitivity and resolution of the probe.

Abstract: A memory cell and method for operating a memory cell including a bidirectional access device and memory element electrically coupled in series. The bidirectional access device includes a tunneling capacitance. The memory element programmable to a first and second state by application of a first and second write voltage opposite in polarity to one another. The memory element has a lower capacitance in the first state than the second state. A read unit senses a transient read current due to a voltage drop upon application of a read voltage. Determining if the memory element is the first or second state is based on whether the read current is greater or less than a sense threshold. The sense threshold is based on a capacitance ratio between the first and second state.

Abstract: A field emission device is configured as a heat engine. Different embodiments of the heat engine may have different configurations that may include a cathode, gate, suppressor, and anode arranged in different ways according to a particular embodiment. Different embodiments of the heat engine may also incorporate different materials in and/or proximate to the cathode, gate, suppressor, and anode.

Abstract: A semiconductor photocathode includes an AlXGa1-XN layer (0?X<1) bonded to a glass substrate via an SiO2 layer and an alkali-metal-containing layer formed on the AlXGa1-XN layer. The AlXGa1-XN layer includes a first region, a second region, an intermediate region between the first and second regions. The second region has a semiconductor superlattice structure formed by laminating a barrier layer and a well layer alternately, the intermediate region has a semiconductor superlattice structure formed by laminating a barrier layer and a well layer alternately. When a pair of adjacent barrier and well layers is defined as a unit section, an average value of a composition ratio X of Al in a unit section decreases monotonously with distance from an interface position between the second region and the SiO2 layer at least in the intermediate region.

Abstract: A field emission device may comprise: an emitter comprising a cathode electrode and an electron emission source supported by the cathode electrode; an insulating spacer around the emitter, the insulating spacer forming an opening that is a path of electrons emitted from the electron emission source; and/or a gate electrode comprising a graphene sheet covering the opening. A method of manufacturing a gate electrode may comprise: forming a graphene thin film on one surface of a conductive film; forming a mask layer having an etching opening on another surface of the conductive film, wherein the etching opening exposes a portion of the conductive film; partially removing the conductive film through the etching opening to partially expose the graphene thin film; and/or removing the mask layer.

Abstract: A field emission device may comprise: an emitter comprising a cathode electrode and an electron emission source supported by the cathode electrode; an insulating spacer around the emitter, the insulating spacer forming an opening that is a path of electrons emitted from the electron emission source; and/or a gate electrode around the opening. The electron emission source may comprise a plurality of graphene thin films vertically supported in the cathode electrode toward the opening.

Abstract: A field emission device is configured as a heat engine. Different embodiments of the heat engine may have different configurations that may include a cathode, gate, suppressor, and anode arranged in different ways according to a particular embodiment. Different embodiments of the heat engine may also incorporate different materials in and/or proximate to the cathode, gate, suppressor, and anode.

Abstract: A light emitting die package and a method of manufacturing the die package are disclosed. The die package includes a leadframe, at least one light emitting device (LED), a molded body, and a lens. The leadframe includes a plurality of leads and has a top side and a bottom side. A portion of the leadframe defines a mounting pad. The LED device is mounted on the mounting pad. The molded body is integrated with portions of the leadframe and defines an opening on the top side of the leadframe, the opening surrounding the mounting pad. The molded body further includes latches on the bottom side of the leadframe. The lens is coupled to the molded body. A composite lens is used as both reflector and imaging tool to collect and direct light emitted by LED(s) for desired spectral and luminous performance.

Abstract: An electron multiplier for a system for detecting electromagnetic radiation or an ion flow is disclosed. The multiplier includes at least one active structure intended to receive a flow of incident electrons, and to emit in response a flow of electrons called secondary electrons. The active structure includes a substrate on which is positioned a thin nanodiamond layer formed from diamond particles the average size of which is less than or equal to about 100 nm.

Abstract: A field emission device is configured as a heat engine.

Abstract: Plasmonic nanoscale devices with increased emissions are disclosed. Highly concentrated fields of plasmonic nanocavities are integrated with a core to alter the excited-state optical processes. A plasmonic device (e.g., a nanowire) is created using a direct or indirect bandgap material core, an interlayer and a metallic shell.

Abstract: An integrated vacuum microelectronic device comprises: a highly doped semiconductor substrate, at least one insulating layer) placed above said doped semiconductor substrate, a vacuum aperture formed within said at least one insulating layer and extending to the highly doped semiconductor substrate, a first metal layer acting as a cathode, a second metal layer placed under said highly doped semiconductor substrate and acting as an anode. The first metal layer is placed adjacent to the upper edge of the vacuum aperture and the vacuum aperture has a width dimension such as the first metal layer remains suspended over the vacuum aperture.