Abstract: An object of the present invention is to provide a Schottky barrier diode less apt to cause dielectric breakdown due to concentration of an electric field. A Schottky barrier diode includes a semiconductor substrate 20 made of gallium oxide, a drift layer 30 made of gallium oxide and provided on the semiconductor substrate 20, an anode electrode 40 brought into Schottky contact with the drift layer 30, and a cathode electrode 50 brought into ohmic contact with the semiconductor substrate 20. The drift layer 30 has an outer peripheral trench 10 that surrounds the anode electrode 40 in a plan view, and the outer peripheral trench 10 is filled with a semiconductor material 11 having a conductivity type opposite to that of the drift layer 30. An electric field is dispersed by the presence of the thus configured outer peripheral trench 10. This alleviates electric field concentration on the corner of the anode electrode 40, making it less apt to cause dielectric breakdown.

Abstract: A semiconductor device includes first and second electrodes, a semiconductor part therebetween, and first and second control electrodes in a trench of the semiconductor part. The first and second control electrodes are arranged along a front surface of the semiconductor part. The semiconductor part includes first and third layers of a first-conductivity-type, and the second and fourth layer of a second-conductivity-type. The second layer is provided between the first layer and the second electrode. Between the second layer and the second electrode, the third and fourth layers are provided apart from the first layer with first and second portions of the second layer interposed, respectively. The first portion of the second layer has a first thickness in a second direction from the first electrode toward the second electrode. The second portion of the second layer has a second thickness in the second direction larger than the first thickness.

Abstract: A thin film resistor includes a high-resistance region and low-resistance regions which are formed at both ends of the high-resistance region. The high-resistance region includes first high-resistance regions and a second high-resistance region, and the first high-resistance regions are arranged at both side surfaces in a first direction in the second high-resistance region. The second high-resistance region has a higher sheet resistance than that of the first high-resistance regions.

Abstract: A transistor includes a semiconductor layer structure, a source electrode and a drain electrode on the semiconductor layer structure, a gate on a surface of the semiconductor layer structure between the source electrode and the drain electrode, and a field plate. The field plate includes a first portion adjacent the gate and a second portion adjacent the source or drain electrode. The second portion of the field plate is farther from the surface of the semiconductor layer structure than the first portion of the field plate, and is closer to the surface of the semiconductor layer structure than an extended portion of the gate. Related devices and fabrication methods are also discussed.

Abstract: An embodiment relates to a device having a SiC substrate, a well region, a source region, and a first sinker region, wherein the first sinker region has a depth that is equal to or greater than a depth of the well region, the source region is within the well region, the first sinker region is within the source region, and the first sinker region is located between a source interconnect metallization region and the SiC substrate. Another embodiment relates to a device having a SiC substrate, a drift layer on the SiC substrate, a well region on the drift layer, a source region within the well region, and a plug within the well region.

Abstract: A Schottky diode includes a cathode terminal in a high voltage region of a semiconductor die, an anode terminal in a low voltage region of the semiconductor die, where the anode terminal and the cathode terminal are separated by a junction isolation termination situated between the high voltage region and the low voltage region. The Schottky diode includes a junction barrier Schottky diode or a trench metal-oxide-semiconductor (MOS) Schottky diode. The junction isolation termination includes pzener rings. The semiconductor die includes a substrate of a first conductivity type, an epitaxial layer of a second conductivity type situated on the substrate, a well region of the second conductivity type situated in the epitaxial layer in the high voltage region, and coupled to the cathode terminal, a Schottky barrier situated on the epitaxial layer in the low voltage region, and coupled to the anode terminal.

Abstract: An integrated electronic device forming a power device and including: a semiconductor body; a first conductive region and a second conductive region, which extend over the semiconductor body, the second conductive region surrounding the first conductive region at a distance; and an edge termination structure, which is arranged between the first and second conductive regions and includes a dielectric region, which delimits an active area of the power device, and a semiconductive structure, which extends over the dielectric region and includes a plurality of diode chains, each diode chain including a plurality of first semiconductive regions of a first conductivity type and a plurality of second semiconductive regions of a second conductivity type, the first and second semiconductive regions being arranged in alternating fashion so as to form a series circuit including a plurality of first and second diodes, which are spaced apart from one another and have opposite orientations.

Abstract: This disclosure relates to a semiconductor device structure and method of manufacturing a semiconductor device. The semiconductor device structure comprises a semiconductor substrate having an edge region laterally separated from a device region; an edge termination structure arranged on the semiconductor substrate; wherein the edge termination structure comprises: a first oxide layer arranged on the substrate to extend from the active region to the edge region; an isolation layer arranged on top of the first oxide layer; and a metal layer arranged to at least partially cover the isolation layer and wherein the metal layer is further arranged to extend from the isolation layer to contact the edge region.

Abstract: High voltage semiconductor devices are described herein. An exemplary semiconductor device includes a first doped region and a second doped region disposed in a substrate. The first doped region and the second doped region are oppositely doped and adjacently disposed in the substrate. A first isolation structure and a second isolation structure are disposed over the substrate, such that each are disposed at least partially over the first doped region. The first isolation structure is spaced apart from the second isolation structure. A resistor is disposed over a portion of the first isolation structure and electrically coupled to the first doped region. A field plate disposed over a portion of the second doped region and electrically coupled to the second doped region.

Abstract: Edge termination for super-junction MOSFETs. In accordance with an embodiment of the present invention, a super-junction metal oxide semiconductor field effect transistor (MOSFET) includes a core super-junction region including a plurality of parallel core plates coupled to a source terminal of the super-junction MOSFET. The super-junction MOSFET also includes a termination region surrounding the core super-junction region comprising a plurality of separated floating termination segments configured to force breakdown into the core super-junction region and not in the termination region. Each termination segment has a length dimension less than a length dimension of the core plates.

Abstract: A device includes a semiconductor substrate, a buried doped isolation layer disposed in the semiconductor substrate to isolate the device, a drain region disposed in the semiconductor substrate and to which a voltage is applied during operation, and a depletion region disposed in the semiconductor substrate and having a conductivity type in common with the buried doped isolation barrier and the drain region. The depletion region reaches a depth in the semiconductor substrate to be in contact with the buried doped isolation layer. The depletion region establishes an electrical link between the buried doped isolation layer and the drain region such that the buried doped isolation layer is biased at a voltage level lower than the voltage applied to the drain region.

Abstract: Described herein is a semiconductor device including a semiconductor substrate in which an element region and a termination region surrounding the element region are provided. The element region includes: a gate trench; a gate insulating film; and a gate electrode. The termination region includes: a plurality of termination trenches provided around the element region; an inner trench insulating layer located inside of each of the plurality of termination trenches; and an upper surface insulating layer located at an upper surface of the semiconductor substrate in the termination region. The upper surface insulating layer includes a first portion and a second portion having a thinner thickness than the first portion and located at a location separated from the element region than the first portion, and a gate wiring is located at an upper surface of the first portion and is not located at an upper surface of the second portion.

Abstract: A semiconductor device is provided with: a first conductivity type contact region; a second conductivity type body region; a first conductivity type drift region of; a trench formed through the contact region and body region from a front surface of the semiconductor substrate, wherein a bottom of the trench is positioned in the drift region; an insulating film covering an inner surface of the trench; a gate electrode accommodated in the trench in a state covered with the insulating film; and a second conductivity type floating region formed at a position deeper than the bottom of the trench, and adjacent to the bottom of the trench. The floating region includes a first layer adjacent to the bottom of the trench and a second layer formed at a position deeper than the first layer, wherein a width of the first layer is broader than a width of the second layer.

Abstract: A semiconductor device is disclosed. In one embodiment a semiconductor device includes a semiconductor chip including a substrate, a ground terminal configured to be provided with a reference potential and a supply terminal electrically coupled to the substrate, the supply terminal configured to be provided with a load current and configured to be provided with a supply voltage between the substrate and the ground terminal. The semiconductor device further comprises an overvoltage protection circuit disposed in the semiconductor chip and coupled between the supply terminal and the ground terminal, the overvoltage protection circuit including a first transistor having a load current path coupled between the supply terminal and an internal ground node and a second transistor having a load current path coupled between the internal ground node and the ground terminal.

Abstract: Among other things, one or more semiconductor devices and techniques for forming such semiconductor devices are provided. The semiconductor device comprises a strip-ground field plate. The strip-ground field plate is connected to a source region of the semiconductor device and/or a ground plane. The strip-ground field plate provides a release path for a gate edge electric field. The release path directs an electrical field away from a gate region of the semiconductor device. In this way, breakdown voltage and gate charge are improved.

Abstract: A semiconductor device is disclosed. The semiconductor device is capable of obtaining a high reverse recovery resistant amount by allowing sheet resistance of a peripheral portion in a p type diffusion region that is in contact with a metal electrode through an insulating film on a surface to be as high as possible and reducing an increase in cost if possible. The semiconductor device includes: a p type diffusion region that is disposed in a surface layer of the one main surface of an n type semiconductor substrate; and a voltage-resistant region that surrounds the p type diffusion region.

Abstract: A high-voltage LDMOS device with voltage linearizing field plates and methods of manufacture are disclosed. The method includes forming a continuous gate structure over a deep well region and a body of a substrate. The method further includes forming oppositely doped, alternating segments in the continuous gate structure. The method further includes forming a contact in electrical connection with a tip of the continuous gate structure and a drain region formed in the substrate. The method further includes forming metal regions in direct electrical contact with segments of at least one species of the oppositely doped, alternating segments.

Abstract: A semiconductor device includes: a drift layer having a first conductivity type; a body layer having a second conductivity type; a first semiconductor region having the first conductivity type; a gate insulation film; a trench gate electrode; a first main electrode; a second semiconductor region having the second conductivity type; and a conductor region. The first main electrode is electrically connected with the body layer and the first semiconductor region. The second semiconductor region is disposed on a bottom part of the gate trench, and is surrounded by the drift layer. The conductor region is configured to electrically connect the first main electrode with the second semiconductor region and is configured to equalize, when the semiconductor device is in an off-state, a potential of the second semiconductor region and a potential of the first main electrode.

Abstract: Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing and conventional blanket deposition and photolithography, and methods of forming circuits by printing electronic inks onto structures having print-compatible shapes. The layouts include features having (i) a print-compatible shape and (ii) an orientation that is either orthogonal or parallel to the orientation of every other feature in the layout.

Abstract: The semiconductor device includes a first semiconductor layer of the first conductive type, a second semiconductor layer having the cubic crystalline structure formed on the first semiconductor layer, an electrode formed on the second semiconductor layer, and a reactive region formed between the second semiconductor layer and the electrode. The second semiconductor layer includes an upper surface that is tilted from the (100) plane. The reactive region includes at least one element constituting the second semiconductor layer, at least one element constituting the electrode, and forming a protuberance extending toward the second semiconductor layer.

Abstract: Provided is a semiconductor device which increases a concentration around an emitter by arranging a lightly doped region (HNMLDD). When the semiconductor device is operated in a forward bias, a maximum common-emitter current gain is obtained in a forward-active region, such that signals are amplified and an unnecessary noise is decreased at the same time. Further, the semiconductor device of the invention further includes a field plate disposed on a substrate between the emitter and a base or/and the collector and the base, and configured to change a potential distribution of junctions between each of doped regions and raise a breakdown voltage of the junctions.

Abstract: A semiconductor device according to the present invention includes, in a termination region, a p? type breakdown voltage holding region that is an impurity region formed in a predetermined depth direction from a substrate surface of an n? type substrate, a first insulating film formed on the n? type substrate so as to cover at least the p? type breakdown voltage holding region, a first field plate formed on the first insulating film, a second insulating film formed so as to cover the first field plate and the first insulating film, and a second field plate formed on the second insulating film. The first insulating film is thicker in a corner portion than in an X-direction straight portion and a Y-direction straight portion.

Abstract: A downsized semiconductor device having an excellent reverse characteristic, and a method of manufacturing the semiconductor device is sought to improve. The semiconductor device comprises a semiconductor body having a polygonal contour. An active area is formed in the semiconductor body. An EQR electrode is formed so as to surround the active area and to have curved portions of the EQR electrode along the corners of the semiconductor body. An interlayer insulating film is formed to cover the active area and the EQR electrode. The EQR electrode is embedded in the interlayer insulating film around the active area. EQR contacts are in contact with the curved portions of the EQR electrode and the semiconductor body outside the curved portions, and have at least side walls covered with the interlayer insulating film.

Abstract: A field limiting regions are arranged in the upper surface of a semiconductor region in the peripheral region and connected to upper portions of at least some of columnar regions. An insulating film is provided on the semiconductor region in the peripheral region and covering a field limiting region. A coupling plate electrode is provided above a pair of the field limiting regions adjacent to each other in a direction from a boundary between the element region and the peripheral region to an outer edge of the peripheral region. The joint field regions are in contact with one of the pair of field limiting regions on a boundary side in an opening formed in the insulating film, and reaching the other one of the pair of the field limiting regions on an outer edge side with the insulating film interposed therebetween.

Abstract: A semiconductor includes an N-type impurity region provided in a substrate. A P-type RESURF layer is provided at a top face of the substrate in the N-type impurity region. A P-well has an impurity concentration higher than that of the P-type RESURF layer, and makes contact with the P-type RESURF layer at the top face of the substrate in the N-type impurity region. A first high-voltage-side plate is electrically connected to the N-type impurity region, and a low-voltage-side plate is electrically connected to a P-type impurity region. A lower field plate is capable of generating a lower capacitive coupling with the substrate. An upper field plate is located at a position farther from the substrate than the lower field plate, and is capable of generating an upper capacitive coupling with the lower field plate whose capacitance is greater than the capacitance of the lower capacitive coupling.

Abstract: In an exemplary implementation, a III-nitride semiconductor device includes a III-nitride heterojunction including a first III-nitride body situated over a second III-nitride body to form a two-dimensional electron gas. The III-nitride semiconductor device further includes a dielectric body situated over the III-nitride heterojunction and including a first dielectric layer of a first dielectric material and a second dielectric layer of a second dielectric material different than the first dielectric material. A gate well of a first width is defined by the first dielectric layer, and is of a second width defined by the second dielectric layer, where the second width is greater than the first width. The III-nitride semiconductor device further includes a gate arrangement situated in the gate well and including a gate electrode integrated with a field plate.

Abstract: Transistors having a dielectric over a semiconductor, a control gate over the dielectric at a particular level, and one or more conductive structures over the dielectric at the particular level facilitate control of device characteristics of the transistor. The one or more conductive structures are between the control gate and at least one source/drain region of the transistor. The one or more conductive structures are electrically isolated from the control gate.

Abstract: A semiconductor device includes a semiconductor body and an edge termination structure. The edge termination structure comprises a first oxide layer, a second oxide layer, a semiconductor mesa region between the first oxide layer and the second oxide layer, and a doped field region comprising a first section in the semiconductor mesa region, and a second section in a region below the semiconductor mesa region. The second section overlaps the first and the second oxide layers in the region below the semiconductor mesa region.

Abstract: In an exemplary implementation, a III-nitride semiconductor device includes a III-nitride heterojunction including a first III-nitride body situated over a second III-nitride body to form a two-dimensional electron gas. The III-nitride semiconductor device further includes a gate well formed in a dielectric body, the dielectric body situated over the III-nitride heterojunction. A gate arrangement is situated in the gate well and includes a gate electrode, a source-side field plate, and a drain-side field plate. The source-side field plate and the drain-side field plate each include one or more steps, where the drain-side field plate has a different number of the one or more steps than the source-side field plate.

Abstract: A compound semiconductor device includes a substrate having an opening formed from the rear side thereof; a compound semiconductor layer disposed over the surface of the substrate; a local p-type region in the compound semiconductor layer, partially exposed at the end of the substrate opening; and a rear electrode made of a conductive material, disposed in the substrate opening so as to be connected to the local p-type region.

Abstract: A semiconductor device which can suppress the influence of the external electric charge and can be efficiently manufactured is provided. The semiconductor device is provided with an active region in which a semiconductor element is disposed and a termination region between the active region and an edge surface of the semiconductor substrate. An insulating layer is disposed on at least a part of an upper surface of the termination region. A plurality of floating electrodes is disposed at an interval in the insulating layer in a direction from the active region toward the edge surface of the semiconductor substrate, and a width of the plurality of floating electrodes in a thickness direction of the semiconductor substrate is greater than a width of the plurality of floating electrodes in the direction from the active region toward the edge surface of the semiconductor substrate.

Abstract: A semiconductor device includes a drift region of a first doping type, a junction between the drift region and a device region, and a field electrode structure in the drift region. The field electrode structure includes a field electrode, a field electrode dielectric adjoining the field electrode, arranged between the field electrode and the drift region, and having an opening, and at least one of a field stop region and a generation region. The semiconductor device further includes a coupling region of a second doping type complementary to the first doping type. The coupling region is electrically coupled to the device region and coupled to the field electrode.

Abstract: An electric device, comprising a conductive guard ring formed on a substrate along an outer periphery of the substrate, an electrode formed inside the guard ring on the substrate, and a connecting portion formed above the electrode, for connecting an external apparatus and the electrode, wherein the connecting portion includes a conductive member for electrically connecting the external apparatus and the electrode, and an insulating member formed on a lower surface of the conductive member, and the insulating member exposes a portion of the conductive member, which is positioned immediately above the electrode, and an end of the insulating member is positioned inside the guard ring in planar view such that the conductive member and the guard ring do not contact each other.

Abstract: A field device and method of operating high voltage semiconductor device applied with the same are provided. The field device includes a first well having a second conductive type and second well having a first conductive type both formed in the substrate (having the first conductive type) and extending down from a surface of the substrate, the second well adjacent to one side of the first well and the substrate is at the other side of the first well; a first doping region having the first conductive type and formed in the second well, the first doping region spaced apart from the first well; a conductive line electrically connected to the first doping region and across the first well region; and a conductive body insulatively positioned between the conductive line and the first well, and the conductive body correspondingly across the first well region.

Abstract: Disclosed is a power device, such as power MOSFET, and method for fabricating same. The device includes an upper trench situated over a lower trench, where the upper trench is wider than the lower trench. The device further includes a trench dielectric inside the lower trench and on sidewalls of the upper trench. The device also includes an electrode situated within the trench dielectric. The trench dielectric of the device has a bottom thickness that is greater than a sidewall thickness.

Abstract: Disclosed is a power device, such as a power MOSFET device and a method for fabricating same. The device includes a field plate trench. The field plate trench has a predetermined width and a predetermined sidewall angle. The device further includes a single trench dielectric on sidewalls of the field plate trench and at a bottom of the field plate trench. The single trench dielectric has a bottom thickness that is greater than a sidewall thickness. The device also includes a field plate situated within the single trench dielectric.

Abstract: A semiconductor device is formed with a stepped field plate over at least three sequential regions in which a total dielectric thickness under the stepped field plate is at least 10 percent thicker in each region compared to the preceding region. The total dielectric thickness in each region is uniform. The stepped field plate is formed over at least two dielectric layers, of which at least all but one dielectric layer is patterned so that at least a portion of a patterned dielectric layer is removed in one or more regions of the stepped field plate.

Abstract: Disclosed is a power device, such as a power MOSFET, and methods for fabricating same. The device includes a field plate trench. The device further includes first and second trench dielectrics inside the field plate trench. The device also includes a field plate situated over the first trench dielectric and within the second trench dielectric. A combined thickness of the first and second trench dielectrics at a bottom of the field plate trench is greater than a sidewall thickness of the second trench dielectric.

Abstract: The present invention relates to a semiconductor device. The device comprises a semiconductor substrate. A semiconductor drift region is on the semiconductor substrate. The semiconductor drift region comprises a semiconductor region of a first conduction type and a semiconductor region of a second conduction type. The semiconductor region of the first conduction type and the semiconductor region of the second conduction type form a superjunction structure. A high-K dielectric is on the semiconductor substrate. The high-K dielectric is adjacent to the semiconductor region of the second conduction type. An active region is on the semiconductor drift region. A trench gate structure is on the high-K dielectric, the trench gate structure being adjacent to the active region. The semiconductor region of the second conduction type is formed by shallow angle ion implantation, thus its width is narrow and its concentration is high.

Abstract: A guard ring for a through via, and a method of manufacture thereof, is provided. The guard ring comprises one or more rings around a through via, wherein the rings may be, for example, circular, rectangular, octagon, elliptical, square, or the like. The guard ring may be formed from a contact through an inter-layer dielectric layer and interconnect structures (e.g., vias and lines) extending through the inter-metal dielectric layers. The guard ring may contact a well formed in the substrate.

Abstract: An integrated circuit containing a voltage divider having an upper resistor of unsilicided gate material over field oxide around a central opening and a drift layer under the upper resistor, an input terminal coupled to an input node of the upper resistor adjacent to the central opening in the field oxide and coupled to the drift layer through the central opening, a sense terminal coupled to a sense node on the upper resistor opposite from the input node, a lower resistor with a sense node coupled to the sense terminal and a reference node, and a reference terminal coupled to the reference node. A process of forming the integrated circuit containing the voltage divider.

Abstract: A semiconductor structure and manufacturing method for the same, and an ESD circuit are provided. The semiconductor structure comprises a first doped region, a second doped region, a third doped region and a resistor. The first doped region has a first type conductivity. The second doped region has a second type conductivity opposite to the first type conductivity. The third doped region has the first type conductivity. The first doped region and the third doped region are separated by the second doped region. The resistor is coupled between the second doped region and the third doped region. An anode is coupled to the first doped region. A cathode is coupled to the third doped region.

Abstract: The semiconductor device includes a first semiconductor layer of the first conductive type, a second semiconductor layer having the cubic crystalline structure formed on the first semiconductor layer, an electrode formed on the second semiconductor layer, and a reactive region formed between the second semiconductor layer and the electrode. The second semiconductor layer includes an upper surface that is tilted from the (100) plane. The reactive region includes at least one element constituting the second semiconductor layer, at least one element constituting the electrode, and forming a protuberance extending toward the second semiconductor layer.

Abstract: A semiconductor device includes a superjunction structure. The influence of external charge on device performance is suppressed using a shield electrode, field plate electrodes, and cover electrodes in various configurations. Optional embodiments include placing an interconnection film between certain electrodes and the upper surface of the superjunction structure. Cover electrodes may also be connected to various potentials to limit the effects of external charge on device performance.

Abstract: The semiconductor device has insulating films 40, 42 formed over a substrate 10; an interconnection 58 buried in at least a surface side of the insulating films 40, 42; insulating films 60, 62 formed on the insulating film 42 and including a hole-shaped via-hole 60 and a groove-shaped via-hole 66a having a pattern bent at a right angle; and buried conductors 70, 72a buried in the hole-shaped via-hole 60 and the groove-shaped via-hole 66a. A groove-shaped via-hole 66a is formed to have a width which is smaller than a width of the hole-shaped via-hole 66. Defective filling of the buried conductor and the cracking of the inter-layer insulating film can be prevented. Steps on the conductor plug can be reduced. Accordingly, defective contact with the upper interconnection layer and the problems taking place in forming films can be prevented.

Abstract: A photodetector having a ridge-in-slit geometry is provided, where a semiconductor ridge is laterally sandwiched in a metallic slit. This assembly is disposed on a layer of semiconducting material, which in turn is disposed on an insulating substrate. These structures can provide efficient resonant detectors having the wavelength of peak response set by the ridge width. Thus a lateral feature defines the wavelength of peak responsivity, as opposed to a vertical feature.

Abstract: A III-nitride semiconductor device includes an active region for supporting current flow during forward-biased operation of the III-nitride semiconductor device. The active region includes a first III-nitride epitaxial material having a first conductivity type, and a second III-nitride epitaxial material having a second conductivity type. The III-nitride semiconductor device further includes an edge-termination region physically adjacent to the active region and including an implanted region comprising a portion of the first III-nitride epitaxial material. The implanted region of the first III-nitride epitaxial material has a reduced electrical conductivity in relation to portions of the first III-nitride epitaxial material adjacent to the implanted region.

Abstract: An overvoltage protection devices operable to provide protection against overvoltage events of positive and negative polarity, comprising: an N P N semiconductor structure defining: a first N-type region; a first P-type region; and a second N-type region; wherein one of the first or second N-type regions is connected to a terminal, conductor or node that is to be protected against an overvoltage event, and the other one of the first or second N-type regions is connected to a reference, and wherein a field plate is in electrical contact with the first P-type region, and the field plate overlaps with but is isolated from portions of the first and second N type regions.

Abstract: A semiconductor device includes: an electron transit layer formed on a substrate and of a group III nitride-based compound semiconductor; an electron supply layer formed on the electron transit layer and of a group III nitride-based compound semiconductor having a higher band gap energy than the transit layer; a field plate layer formed on the supply layer, formed of a non-p-type group III nitride-based compound semiconductor, and having a lower band gap energy than the supply layer; a first electrode forming an ohmic contact with a two-dimensional electron gas layer in the transit layer at an interface thereof with the supply layer; and a second electrode forming a Schottky contact with the electron gas layer. The second electrode forms an ohmic contact, at a side wall of the field plate layer, with two-dimensional hole gas in the field plate layer at an interface thereof with the supply layer.

Abstract: In one general aspect, a semiconductor processing method can include forming an N-type silicon region disposed within a P-type silicon substrate. The method can also include forming a field oxide (FOX) layer in the P-type silicon substrate where the FOX layer includes an opening exposing at least a portion of the N-type silicon region. The method can further include forming a reduced surface field (RESURF) oxide (ROX) layer having a first portion disposed on the exposed N-type silicon region and a second portion disposed on the FOX layer where the ROX layer includes a first dielectric layer in contact with the exposed N-type silicon region and a second dielectric layer disposed on the first dielectric layer. The method can further include forming a doped polysilicon layer having a first portion disposed on the first portion of the ROX layer and a second portion disposed on the second portion of the ROX layer.