Abstract: A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

Abstract: An integrated circuit device includes a gate region extending above a semiconductor substrate and extending in a first longitudinal direction. A first fin has a first sidewall that extends in a second longitudinal direction above the semiconductor substrate such that the first fin intersects the gate region. A second fin has a second sidewall extending in the second direction above the semiconductor substrate such that the second fin intersects the gate region. A shallow trench isolation (STI) region is formed in the semiconductor substrate between the first and second sidewalls of the first and second fins. A conductive layer disposed over the first insulating layer and over top surfaces of the first and second fins. A first insulating layer is disposed between an upper surface of the STI region and a lower surface of the conductive layer to separate the STI region from the conductive layer.

Abstract: The present invention provides an electronic device, comprising: a circuit board having at least one first heat-generating element and at least one second heat-generating element mounted thereon; a heat sink connected to said at least one first heat-generating element; a fan facing said heat sink; and an airflow guiding member placed between said fan and said heat sink for guiding the cooling air from said fan to said heat sink and said at least one second heat-generating element respectively.

Abstract: A semiconductor device includes a semiconductor module that has a joint surface, a first fitting portion and a second fitting portion provided on the joint surface of the semiconductor module, the second fitting portion having a shape different from the first fitting portion; and a radiating fin that has a joint surface, a third fitting portion and a fourth fitting portion provided on the joint surface of the radiating fin, the fourth fitting portion having a shape different from the third fitting portion. The semiconductor module is bonded to the radiating fin so that the first fitting portion is fitted into the third fitting portion or the third fitting portion is fitted into the first fitting portion, and the second fitting portion is fitted into the fourth fitting portion or the fourth fitting portion is fitted into the second fitting portion.

Abstract: A cooling system includes a moving rotor system which in turn includes: a rotating disk on which a plurality of heat conducting structures are distributed, the heat conducting structures including an inner arrangement of spiral blades; an air flow generating fan element; and an outer arrangement of heat transfer pins distributed along a perimeter of the rotating disk, the heat transfer pins having a high aspect ratio that maximizes a surface area to footprint area; wherein the spiral blades generate a mass fluid flow of ambient fluid toward the heat transfer pins such that the heat transfer pins are persistently cooled.

Abstract: A frequency converter for driving a motor, includes a circuit board, having at least one first heat-generating element mounted thereon; a heat sink, connected to the at least one first heat-generating element; a fan, facing the heat sink; and a bracket, for positioning the at least one heat-generating element relative to the heat sink and the circuit board. The frequency converter includes a separating member for separating at least one portion of at least one second heat-generating element from the circuit board to prevent the cooling air guided to the at least one second heat-generating element from flowing to the circuit board. The frequency converter includes an airflow guiding member for guiding the cooling air from the fan to the heat sink and the at least one second heat-generating element and a flow guiding gate dispensing more airflow to the region corresponding to the at least one first heat-generating element.

Abstract: A computer system includes an enclosure having an air intake, a heat sink and an electronic element. The heat sink includes a first heat dissipating portion, a second heat dissipating portion, and a third heat dissipating portion interconnecting the first and second heat dissipating portions. Each of the first heat dissipating portion, second heat dissipating portion, and third heat dissipating portion includes a number of fins and passages formed between each two adjacent fins. The passages of the first heat dissipating portion face toward the air intake. A space is maintained between the first heat dissipating portion and the second heat dissipating portion, and the electronic element is mounted in the space.

Abstract: A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.

Abstract: A computer system includes a chassis, a motherboard, a heat sink, a duct and a fan. The chassis includes a chassis bottom wall. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The duct includes a guiding portion and a latch portion located on the guiding portion. The latch portion is secured to the chassis bottom wall. The guiding portion is adjacent to the heat sink to direct airflow to the heat sink. The fan is secured on the latch portion of the duct. The guiding portion of the duct is positioned between the heat sink and the fan.

Abstract: Provided is an electronic apparatus capable of also supplying sufficient air flow to a heat generating device other than the heat sink. An electronic apparatus includes: a cooling unit (10) including a heat sink (13), and a cooling fan (15) for generating air flow for receiving heat of the heat sink (13); an upper wall member (40) connected to the cooling unit (10) so as to form an outer wall defining an air passage continuous with the cooling unit (10); and a power circuit (17) arranged in the air passage and serving as an object to be cooled.

Abstract: An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width larger than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuit package.

Abstract: A structure of a heat dissipation substrate of power LEDs and a device made by using the same overcomes drawbacks such as complex structure of power LEDs, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of the heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other. The through hole is smaller than the blind hole, and both of them share the same direction of axis. The heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit.

Abstract: According to one embodiment, a cooling structure includes a first heat radiating member receiving heat generated by a first heat generating body, and including a plurality of first heat radiating fins projecting toward a second housing, a first flow-in portion provided to the first housing to be open in one of first directions, a second heat radiating member receiving heat generated by a second heat generating body, and including a plurality of second heat radiating fins projecting toward a first housing, and a first flow-out portion provided to the second housing to be open in one of second directions crossing the first directions. The cooling structure includes a cooling fan unit configured to supply the air that has flown from outside to the first heat radiating fins, thereafter supply the air to the second heat radiating fins and cause the air to flow to the outside.

Abstract: A heat dissipating system includes an enclosure, a first fan module, a second fan module of a computer power source. The enclosure has a front panel, a rear panel parallel to the front panel, a side panel, and a top panel. The rear panel defines an output vent therein. A disk drive module is disposed on the front panel and near the top panel. A motherboard with a CPU is disposed on the side panel. The first fan module is configured to dissipate heat generated by the CPU. The second fan module is placed on the rear panel and is aligned with the output vent of the rear panel. The top panel defines a plurality of airflow holes corresponding to the disk drive module. The plurality of the airflow holes is capable of allowing air to flow to the disk drive module for heat dissipating.

Abstract: A packaged heat dissipating assembly for an intermediate bus converter (IBC) has a frame being mounted on and around the IBC and a heat sink being mounted on the frame. The packaged heat dissipating assembly is easily detached from the IBC. Therefore, a broken bus converter module (BCM) or heat sink is easily replaced separately. Consequently, heat dissipating designs and maintenance of a server or communication equipment is facilitated and maintenance costs of the IBC and the server or communication equipment are lowered.

Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.

Abstract: There is provided an LED package having high heat dissipation efficiency. An LED package according to an aspect of the invention may include: a package body including a first groove portion being recessed into the package body and provided as a mounting area on the top of the package body; first and second lead frames arranged on a lower surface of the first groove portion while parts of the first and second lead frames are exposed; an LED chip mounted onto the lower surface of the first groove portion and electrically connected to the first and second lead frames; and a plurality of heat dissipation patterns provided on the bottom of the package body and formed of carbon nanotubes.

Abstract: A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting semiconductor chips thereon, is disposed. The radiation fins, such as sheet-shaped fins having different lengths are arranged such that the surface area density of the fins becomes higher in the coolant flow direction, whereby the surface area density is the total surface area of radiation fins on a unit surface area of the metal base. As a result, the temperatures of semiconductor chips arranged along the coolant flow direction are closer to each other.

Abstract: The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces.

Abstract: A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member is fixed to a bottom of the base of the cooling member via fixing means.

Abstract: Some embodiments discussed herein include a semiconductor having a source region, a drain region and an array of fins operatively coupled to a gate region controlling current flow through the fins between the source region and the drain region. The semiconductor also has at least one cooling element formed at least in part of a material having a heat capacity equal to or larger than the heat capacity of the material of the source region, drain region and array of fins, the cooling elements being in close vicinity to fins of the array of fins electrically isolated from the fins of the array, the source region and the drain region.

Abstract: A semiconductor device includes a module board mounting thereon an electric component and including a plug at an edge of the module board, and a mount board including thereon a socket adapted to said plug on a surface portion of the mount board for mounting thereon the module board via said plug, wherein the mount board includes therein a heat radiation layer in contact with a bottom surface of the socket, wherein the socket comprises a heat radiation guide plate in contact with a side surface of the socket.

Abstract: An LED lamp includes a plurality of LED light units juxtaposed together and a connecting member engaging with the LED light units. Each LED light unit includes a heat sink and an LED module engaged on the heat sink. The heat sink defines a groove group at each lateral portion thereof. The connecting member includes a plurality of inserts received in grooves of the groove groups of the heat sinks of neighboring LED light units and clasping the neighboring LED light units together thereby to secure the LED light units into the LED lamp.

Abstract: A thermal module includes a fin assembly, a heat spreader, a heat pipe connected between the fin assembly and the heat spreader, and a securing plate. The securing plate has at least three resilient members secured on a bottom surface thereof. Each of the resilient members has a capability to deform resiliently along a direction perpendicular to the bottom surface of the securing plate to resiliently press the heat spreader to an electronic component.

Abstract: The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.

Abstract: This invention includes a heat sink structure for use in a semiconductor package that includes a ring structure with down sets and a heat sink connected to the ring structure. The down sets can be slanted or V-shaped. The invention also includes a method of manufacturing a semiconductor package that includes inserting a substrate with an attached semiconductor chip in a first mold portion, placing a heat sink structure on top of a portion of the substrate, placing a mold release film onto a second mold portion, clamping a second mold portion onto a portion of the heat sink structure, injecting an encapsulant into a mold cavity, wherein the encapsulant surrounds portions of the substrate, semiconductor chip and heat sink structure, curing the encapsulant, whereby the heat sink structure adheres to the encapsulant and singulating the encapsulated assembly to form a semiconductor package.

Abstract: The present invention provides a heat dissipation module and a fan thereof. The heat dissipation module includes a heatsink and a frameless fan. The fan is disposed in the heatsink. The fan includes a motor base, an impeller, a motor and at least one engaging member. The impeller and the motor are disposed on the motor base. The motor drives the impeller to rotate, and the engaging member is extended radially from the motor base. The fan is directly assembled to the heatsink via the engaging member.

Abstract: A system for supporting integrated circuit packages to prevent mechanical failure of the packages at their connection to a printed circuit board or card involves bracing the packages to the board or card, The packages may also be braced against one another. The structure is particularly well adapted to supporting vertical surface mount packages at a point spaced from the point where they connect to a printed circuit board or card.

Abstract: An electric assembly includes a heat sink defining a through hole and a notch communicating with the through hole; a circuit board defining a fixing hole; and a fastening assembly. The fastening assembly includes a fastener comprising a stem, a head connected one end of the stem, and a clamp connected to an opposite end of the stem; a limiting member comprising a main body slideably disposed on the stem and a limiting portion extending from the main body, the main body received into the through hole, and the limiting portion engageably inserted into the notch; and an elastic member disposed around the stem and between the head and the main body. Wherein the limiting portion is capable of sliding out of the notch and against the heat sink to compress the elastic member.

Abstract: A heat dissipation device includes a fin unit, a fan and a fan duct. The fin unit includes a plurality of fins stacked together. An airflow channel is defined between each two neighboring fins. The fan includes an air inlet and an opposite air outlet. The fan duct communicates the airflow channels of the fin unit and the fan. The fan duct includes a first flue connected to the air inlet of the fan and a second flue connected to the fin unit. The second flue includes a first side plate and a second side plate covering on two neighboring sides of the fin unit, respectively.

Abstract: Included are a semiconductor package, a first bus bar, a second bus bar and a soldering control unit. The semiconductor package includes a power semiconductor element, a first electrode plate and a second electrode plate. The first bus bar is a conductive member which is soldered onto the main surface of the first electrode plate through a first solder member. The second bus bar is a conductive member which is soldered onto the main surface of the second electrode plate through a second solder member. The soldering control unit is provided on each of the main surface of the first bus bar to which the first electrode plate is soldered and the main surface of the second bus bar to which the second electrode plate is soldered, and controls the solder joint thickness.

Abstract: The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In a proposed embodiment, at least one heat pipe is used to transfer heat from the condensation portion of a vapor chamber to cool a bottom portion of a finned heat dissipation space and transfer the heat to a colder location on the heat fins. In another proposed embodiment, the water vapor chamber is placed in a heat sink and is adapted to thermally connect to at least one heat pipe.

Abstract: A heat dissipation device includes a heat sink having a plurality of fins defining a plurality of passageways therebetween. The passageways have an inlet and an outlet at front and rear sides of the heat sink. Two adjusting members are mounted at two lateral sides of the heat sink. A fan is located at the inlet of the passageways of the heat sink for providing airflow to the heat sink. A guiding member is positioned at the outlet of the passageways of the heat sink for guiding the airflow to electronic components around the heat dissipation device. The guiding member engages the adjusting members and can move vertically relative to adjusting members, thereby adjusting a height of the guiding member along a height of the heat sink.

Abstract: The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In an embodiment, the vapor configuration is modified to include fins that define a cross-flow heat exchanger where the vapor from the vapor chamber serves as the fluid in the vertical cross-flow in the heat exchanger and natural or forced cooling air serves as the horizontal cross-flow for the heat exchanger.

Abstract: A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a plurality of fins, and a lower portion configured for allowing air to flow directly to an integrated circuit package thereunder.

Abstract: A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting member encloses the base therein and is secured to a periphery of the base. A plurality of clasps extends upwardly from the connecting member. The clip is clasped by the clasps of the connecting member to be attached thereto. The clip is pressed downwardly to engage with a plurality of hooks of a bracket around the electronic component of the printed circuit board to make the base intimately contact with the electronic component.

Abstract: The invention provides an integrated circuit packaging and method of making the same. The integrated circuit packaging includes a substrate, a semiconductor die, a heat-dissipating module, and a protection layer. The substrate has an inner circuit formed on a first surface, and an outer circuit formed on a second surface and electrically connected to the inner circuit. The semiconductor die is mounted on the first surface of the substrate such that the plurality of bond pads contact the inner circuit. The heat-dissipating module includes a heat-conducting device, and the heat-conducting device, via a flat end surface thereof, contacts and bonds with a back surface of the semiconductor die. The protection layer contacts a portion of the first surface of the substrate and a portion of the heat-conducting device, such that the semiconductor die is encapsulated therebetween.

Abstract: Method and apparatus for constructing and operating a high bandwidth package in an electronic device, such as a data storage device. In some embodiments, a high bandwidth package comprises a first known good die that has channel functions, a second known good die that has a controller function, and a third known good die that has a buffer function. Further in some embodiments, the high bandwidth package has pins that connect to each of the first, second, and third dies.

Abstract: A semiconductor module with two cooling surfaces and method. One embodiment includes a first carrier with a first cooling surface and a second carrier with a second cooling surface. The first cooling surface is arranged in a first plane, the second cooling surface is arranged in a second plane, at an angle different from 0° relative to the first plane.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: A light emitter with heat-dissipating module includes a light unit, a first heat-dissipating member, a second heat-dissipating member and a fastening member. The light unit includes a light-emitting element and a supporting plate having a pair of opposite surfaces. The first heat-dissipating member includes a first combining surface and a heat-dissipating portion. The first combining surface contacts with one of said two opposite surfaces of the supporting plate. The second heat-dissipating member includes a second combining surface and a heat-dissipating portion. The second combining surface contacts with the other of said two opposite surfaces of the supporting plate. The fastening member couples to the supporting plate, the first heat-dissipating member and the second heat-dissipating member to fix the combination of the supporting plate and the first and second heat-dissipating members.

Abstract: A heat dissipation device for dissipating heat from an electronic component (12) mounted on a printed circuit board (10) includes a retention module (30) resting on the printed circuit board, a heat sink (20) disposed on the retention module for contacting the electronic component, a clip (40) for securing the heat sink to the retention module, and a back plate unit mounted below the printed circuit board for engaging with the retention module and supporting the electronic component. The back plate unit includes a back plate (50), a gasket (62) engaging with the back plate, and a bracket (64) being sandwiched between the gasket and the back plate. The gasket has an annular top face contacting the printed circuit board, and a plurality of blocks (6202) contacting the back plate, whereby the gasket can provide a sufficient and uniform support to the electronic component.

Abstract: An electrical circuit assembly includes an electrical circuit substrate having a first side; a heat sink including a metal base plate having a first side and a second side, and a plurality of fins extending from the second side; and a thermally conductive and electrically insulating adhesive directly interconnecting at least a portion of the first side of the electrical circuit substrate with the first side of the base plate.

Abstract: A system and method are provided including a first thermal component adapted for thermal communication with an integrated circuit, and a second thermal component adapted for thermal communication with the first thermal component upon engagement therewith. Further provided is a coupler slidably coupled to the first thermal component and/or the second thermal component. In use, such coupler is capable of a first orientation for disengaging, the first thermal component and the second thermal component, and a second orientation for engaging the first thermal component and the second thermal component.

Abstract: A cooling system includes a moving rotor system which in turn includes: a disk on which a plurality of heat conducting structures are distributed, the heat conducting structures having a cross section optimized for maximum surface area to footprint area; the heat conducting structures having a shape to optimize the heat transfer coefficient between the structures moving through the ambient fluid; and a mechanism for generating a mass fluid flow over the conducting structures so that the heat conducting structures are persistently cooled.

Abstract: An electronic appliance includes a circuit board mounted with an electronic-circuit component. The circuit board is covered with a shield, and a metallic heat-dissipating member is arranged on the electronic-circuit component. The shield is grounded on the circuit board, and arranged such that at least one of the surfaces is in the vicinity of the heat-dissipating member. The heat-dissipating member is grounded on the circuit board by a ground member, and at the periphery of the ground member, magnetic members are arranged.

Abstract: A method of flatting evaporating section of a heat pipe embedded in a heat dissipation device includes the following steps: (a) providing at least a heat pipe and a base of the heat dissipation device to be thermally connected with the heat pipe, the base defining at least a groove for embedding the heat pipe therein; (b) positioning an evaporating section of the heat pipe on the groove of the base; (c) pressing the evaporating section of the heat pipe to embed the evaporating section into the groove of the base with a partial uneven surface of the evaporating section protruding out of the base; (d) flatting the protruded uneven surface of the evaporating section by polishing.

Abstract: A heat dissipation device includes a base, a first heat pipe, a first heat sink, a second heat pipe, a thermoelectric cooler and a second heat sink. The first heat pipe includes a first end and a second end. The first end of the first heat pipe is connected to the base. The second end of the first heat pipe is connected to a bottom of the first heat sink. The second heat pipe includes a first end and a second end. The first end of the second heat pipe is connected to the base. The second end of the second heat pipe is connected to a top end of the thermoelectric cooler. The second heat sink is mounted on a bottom of the thermoelectric cooler and located at a side of the first heat sink. The thermoelectric cooler spaces apart from the heat generating member. As such, the water generated by the thermoelectric cooler during a cooling process won't spread to the heat generating member and a short circuit of the heat generating member can be avoided.

Abstract: An electronic device can include a first semiconductor fin and a second semiconductor fin, each spaced-apart from the other. The electronic device can also include a bridge lying between and contacting each of the first semiconductor fin and the second semiconductor fin along only a portion of length of each of the first semiconductor fin and the second semiconductor fin, respectively. In another aspect, a process for forming an electronic device can include forming a first semiconductor fin and a second semiconductor fin from a semiconductor layer, each of the first semiconductor fin and the second semiconductor fin spaced-apart from the other. The process can also include forming a bridge that contacts the first semiconductor fin and second semiconductor fin. The process can further include forming a conductive member, including a gate electrode, lying between the first semiconductor fin and second semiconductor fin.

Abstract: In the semiconductor device, a control power MOSFET chip 2 is disposed on the input-side plate-like lead 5, and the drain terminal DT1 is formed on the rear surface of the chip 2, and the source terminal ST1 and gate terminal GT1 are formed on the principal surface of the chip 2, and the source terminal ST1 is connected to the plate-like lead for source 12. Furthermore, a synchronous power MOSFET chip 3 is disposed on the output-side plate-like lead 6, and the drain terminal DT2 is formed on the rear surface of the chip 3 and the output-side plate-like lead 6 is connected to the drain terminal DT2. Furthermore, source terminal ST2 and gate terminal GT2 are formed on the principal surface of the synchronous power MOSFET chip 3, and the source terminal ST2 is connected to the plate-like lead for source 13. The plate-like leads for source 12 and 13 are exposed, and therefore, it is possible to increase the heat dissipation capability of the MCM 1.