Abstract: A compound heat sink for the removal of thermal energy useful for, inter alia, electronic devices or other components. The compound heat sink includes a die cast base element; an extruded dissipation element having a thermal conductivity of at least about 150 W/m-K; and a thermal connection material positioned between and in thermal contact with each of the base element and the dissipation element, wherein the thermal connection material having an in-plane thermal conductivity greater than the thermal conductivity of the dissipation element.

Abstract: A heat exchanger comprises at least one first fluid passage contiguous with at least one second fluid passage. The first fluid passage is separated from the second fluid passage by a common boundary, the boundary having a first surface and a second surface. The first surface is described by a plurality of curvilinear surfaces joined at the ends thereof into a sinuous curvilinear surface and the second surface is described by a plurality of curvilinear surfaces joined at the ends thereof into a sinuous curvilinear surface. The curvilinear surfaces of the first and the second curvilinear surfaces are defined by a portion of an inverse square curve.

Abstract: A heat dissipation device includes a heat sink (10) for contacting a heat-generating component and a fan (20) mounted to the heat sink. The fan includes a frame (22) and a motor (24) received in the frame. The fan has an intake. The frame has a top level and a bottom level. An airflow is generated by the fan and flows through the heat sink. An anti-backflow plate (30) is mounted between the top level and the bottom level of the fan. The anti-backflow plate extends outwardly and beyond an extremity of the heat sink to prevent the airflow flowing through the heat sink from entering the intake of the fan.

Abstract: A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

Abstract: An electronic apparatus includes a case, a fan, a plurality of electronic parts, and a heat sink mounted for each electronic part. The heat sink includes a fluid unit, and a shutter plate controlling the quantity of air flowing in the heat sink through an action of the fluid unit actuated by heat of the electronic part. The fluid unit includes a container with liquid. The container is heated from the electronic part. When generated heat of the electronic part is large, the fluid inside the container expands, allowing the shutter plate to operate in an opening direction increasing the quantity of air flowing in the heat sink, and in a case when a generated heat quantity of the electronic part is small, the fluid inside the container shrinks, allowing the shutter plate to operate in a closing direction reducing the quantity of air flowing in the heat sink.

Abstract: A heat dissipating device includes a heat sink, and an adjusting member. The heat sink includes a base, and a plurality of fins formed on a top surface of the base. The adjusting member includes a mounting portion mounted to a side surface facing an airflow-generating source of the base, a first air-blocking portion connected to an upper portion of the mounting part, and a second air-blocking portion connected to a lower portion of the mounting part. Positions of the first air-blocking portion and the second air-blocking portion relative to the base are adjustable for adjusting distribution of an airflow on top and bottom sides of the base when the airflow flows through the heat dissipating device.

Abstract: An exemplary light source module includes a printed circuit board (PCB), a heat-dissipating assembly, and a number of light emitting elements. The PCB includes a first surface, an opposite second surface, and a number of through holes. The heat-dissipating assembly is located adjacent to the second surface and includes a base, a number of heat-conducting elements, and a number of heat dissipation fins. The base includes a third surface defining a number of cavities therein and an opposite fourth surface. The heat dissipation fins extend from the fourth surface. Each of the heat-conducting elements is inlaid in a corresponding cavity. Each of the light emitting elements is placed in a corresponding through hole and thermally contacts a corresponding heat-conducting element. Each light emitting element electrically connects with the PCB and defines a respective light emitting surface located outside the corresponding through hole.

Abstract: A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each having power semiconductor elements to be cooled mounted thereon; a plurality of radiation fins projecting from the bottom surface side of the base plate; and a peripheral wall projecting from the bottom surface side of the base plate so as to surround the radiation fins, the projecting length of the radiation fins is less than or equal to that of the peripheral wall, and the peripheral wall has end surfaces present in the same plane.

Abstract: An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.

Abstract: An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.

Abstract: A diamond micro-channel structure disposed on a die, as well as methods of forming the same, are disclosed. One or more walls of each channel may comprise diamond (or other diamond-like material). The micro-channel structure may form part of a fluid cooling system for the die. Other embodiments are described and claimed.

Abstract: A power semiconductor module with its thermal resistance and overall size reduced. Insulating substrates with electrode metal layers disposed thereon are joined to both the surfaces of a power semiconductor chip by using, for example, soldering. Metal layers are disposed also on the reverse surfaces of the insulating substrates and the metal layers are joined to the heat spreaders by using brazing. Heat radiating fins are provided on the heat radiating surface of at least one of the heat spreaders. The heat radiating side of each of the heat spreaders is covered by a casing to form a refrigerant chamber through which refrigerant flows to remove heat transmitted from the semiconductor chip to the heat spreader.

Abstract: A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract: A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in thermal expansion rate is fixed with solder 8 to the face of the wiring board 1 for mounting semiconductor devices 2; a rubber O-ring 15 is placed between the upper face of the frame 5 and the under face of the circumference of an air-cooled: heat sink 7; the plastic member 6 making possible relative sliding is placed between the upper face of the circumference of the heat sink 7 and the upper frame 10; the upper face of a plastic member 6 is restrained with the inside middle stage of an upper frame 10; and the lower part of the upper frame 10 and the frame 5 are fastened together with bolts 9.

Abstract: The present invention is to provide a cooling element for eliminating electromagnetic noise, which is formed by bending a plate into a symmetric structure symmetrically comprising a contact part being in connect with an electronic component to absorb heat and noise radiated therefrom; an extension part having one end connected with said contact part to absorb heat and noise from said contact part; and a dissipation part connected with the other end of said extension part to absorb heat and noise from said extension part; wherein the noises absorbed by the cooling element are transmitted along the paths among the contact part, extension part and the dissipation part, and are mutually offset with each other in accordance with the symmetric structure thereof.

Abstract: A semiconductor device includes: a substrate; a semiconductor element mounted on the substrate; a sealing structure for sealing the semiconductor element, the sealing structure being mounted on the substrate; and an adhesive for bonding the sealing structure and the substrate, wherein the sealing structure has a groove for storing the adhesive.

Abstract: A heat dissipation device (40) is used for dissipating heat generated by a plurality of LEDs (15) mounted on a circuit board (12). The heat dissipation device comprises two heat sinks (30) mounted on the circuit board via a heat spreader (20). Each of the two heat sinks comprises a plurality of fins (300) stacked together. A plurality of short walls (350) are formed at two opposite lateral sides of the two heat sinks. A plurality of openings (330) are defined below the short walls and opened laterally. A plurality of vertical cavities (360) are defined by the two heat sinks and communicate with the openings (330), respectively. The cavities in the two heat sinks are alternately arranged.

Abstract: An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the memory chips and the cooling plates to remove heat via air paths defined in the inside of each side board.

Abstract: Disclosed is a heat dissipation structure, which includes a housing that houses a circuit board having active components, a heat sink formed integral with one side of the housing for supporting the circuit board and having radiation fins on the outside, a plurality of heat pads provided at the inside wall of the heat sink corresponding to the active components, and heat conducting bonding layers bonded between the heat pads and the active components for quick dissipation of heat from the active components into the outside open air through the heat pads and the heat sink.

Abstract: A heatsink apparatus for dissipating heat generated by electronic parts is provided. The heatsink apparatus includes a fan and a heatsink fin. One end of the heatsink fin is adhered to an electronic component, the other end forms a curl portion, and a curl inner surface receives an air flow generated by the fan, so as to quickly dissipate the heat energy of the electronic component.

Abstract: A spreader plate for an electronic component cooling assembly has a flat lower surface and a substantially arcuate upper surface of larger surface area than the lower surface which is generally convex and arcuate in cross section, and which decreases in thickness, as measured between the lower and upper surfaces, moving from the central area out to the periphery. This allows the heat flux lines to be more evenly spaced and regular in length, as compared to a typical plate with flat upper and lower surfaces of equal surface area.

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract: Some aspects include a heat sink base, an upper metal cladded to an upper surface of the heat sink base, the upper metal defining at least one groove, and a heat sink fin disposed in the groove and secured to the upper metal. Some aspects may also include a lower metal cladded to a lower surface of the heat sink base, and a pedestal secured to the lower cladding.

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract: A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each having power semiconductor elements to be cooled mounted thereon; a plurality of radiation fins projecting from the bottom surface side of the base plate; and a peripheral wall projecting from the bottom surface side of the base plate so as to surround the radiation fins, the projecting length of the radiation fins is less than or equal to that of the peripheral wall, and the peripheral wall has end surfaces present in the same plane.

Abstract: A heat dissipation device includes a heat-absorbing member having two arched concave walls formed at opposite sides thereof, and a plurality of fins extending outwardly and slantwise from each of the two arched concave walls of the heat-absorbing member toward a middle between a front and a rear of the heat dissipation device.

Abstract: An integrated circuit chip is provided, the integrated circuit chip having: a base portion, the base portion having a peripheral wall forming an elevated perimeter depending away from a surface of the base potion; a plurality of extensions extending away from the surface, a periphery of each of the plurality of extensions being spaced away from the peripheral wall, the plurality of extensions further comprising a first group of extensions and a second group of extensions, each of the first group of extensions having a greater peripheral area than a peripheral area of each of the second group of extensions and the first group of extensions being aligned with a portion of an integrated circuit disposed on another surface of the base, the portion of the integrated circuit generating a higher heat flux than other portions of the integrated circuit, and a plate secured to the elevated perimeter, the plate the plate covering the plurality of extensions and further comprising an inlet opening and an outlet opening.

Abstract: A heat sink fin with joining structure is provided, the heat sink fin is joined with and spaced from other heat sink fins mutually, so as to from a heat sink. The heat sink fin includes a plate and at least one inserting piece. The plate has at least one inserted slot formed in the plate near an edge thereof. The inserting piece extends from the edge of the plate corresponding to the inserted slot and has a buckled hole and a deformable buckling portion. The position of the inserted slot is corresponding to that of the inserting piece of another heat sink fin, and the inserted slot is provided for the inserting piece of the neighboring heat sink fin to be inserted into, and then the buckling portion of the heat sink fin is deformed and buckled into the buckled hole of the neighboring heat sink fin.

Abstract: A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

Abstract: A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

Abstract: A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

Abstract: A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.

Abstract: A chip package including a carrier, at least one chip, a heat spreader, and a thermal interface material (TIM) is provided. The chip is disposed on the carrier and is electrically connected to the carrier. The heat spreader is disposed on the carrier, wherein the heat spreader and the carrier together form a closed space. The chip is located in the closed space. The closed space is filled with the TIM. In addition, a method of manufacturing the chip package is also provided.

Abstract: A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

Abstract: Provided is a heatsink comprising: a plurality of sheet-shaped heat-dissipating plates stacked on one another, each heat dissipating plate including a heat-absorbing region that has a lower end contacting a heat source to absorb heat from the heat source and a heat-dissipating region that extends from both sides of the heat-absorbing region to absorb heat from the heat-absorbing region and outwardly dissipate the heat, wherein the heat-absorbing regions are tightly joined to one another by applying an external pressure to form a central portion and the heat-dissipating regions are radially spread out about the central portion, wherein each of the heat-dissipating regions includes a long heat-dissipating region and a short heat-dissipating region, which are asymmetric with respect to the central portion. Accordingly, the heatsink can efficiently dissipate heat generated from the heat source mounted on an edge of a narrow circuit board by efficiently utilizing a space over the circuit board.

Abstract: A system for tracking the location of electronic devices and prohibiting unauthorized operation thereof includes a control unit, configured for wireless communication with an electronic device, the electronic device having a basic input/output system (BIOS) associated therewith. The control unit is configured to remotely disable the electronic device in the event the electronic device is detected to be beyond a programmed radius for a programmed duration, in accordance with a specifically defined level of security, wherein the extent to which the electronic device is disabled by the control unit is dependent upon the specifically defined level of security.

Abstract: An electrical apparatus that is cooled via natural convection includes an electrical component, a vertical heat dissipation surface in thermal communication with the electrical component, and a diverter extending from the heat dissipation surface. The diverter disrupts vertical airflow over the heat dissipation surface.

Abstract: A heat dissipating device made of highly efficient heat dissipating composite material consists of an aluminum heat dissipating member, and a copper heat conducting member; the aluminum heat dissipating member has many fins on one side; both the aluminum heat dissipating member and the copper heat conducting member are joined together with an alloyed interface being formed between them; each of the aluminum heat dissipating member and the copper heat conducting member has several protrusions and fitting gaps thereon, and the protrusions are fitted in corresponding fitting gap for increasing area of the alloyed interface as well as making the aluminum heat dissipating member and the copper heat conducting member grip each other.

Abstract: A cooling device incorporating a boiling chamber includes a heat sink (10), a fan (30) and a fan duct (50) covering the heat sink and the fan therein. The heat sink includes a chamber (14) receiving liquid (26) therein and a mounting plate (16) located at a bottom surface (200) of the chamber. The fan duct is mounted to two opposite edges of the mounting plate. The fan is mounted in a front part while the heat sink is mounted in a rear part of the fan duct. A top wall (220) of the chamber has a plurality of fins (18) extending upwardly therefrom. The liquid has a level higher than that of a bottom surface of the top wall so that a constant contact between the liquid and the top wall is ensured.

Abstract: A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of a heatpipe or a vapor chamber, and a plurality of parallel fins are soldered to the heatsink base frame. A solder release layer is applied to an outer surface of the heatsink base frame. The solder release layer has a lower melting temperature range than each solder used for securing the selected one of the heatpipe or the vapor chamber, and the plurality of parallel fins to the heatsink base frame. After the solder release layer is applied, the heatpipe or the vapor chamber is filled with a selected heat transfer media.

Abstract: An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.

Abstract: A plurality of memory lies within the airflow created by the cooling fans and includes modules arranged in a plurality of pairs of memory modules aligned in substantially the same direction as airflow. Each pair has a first memory module and a second memory module, the first and second memory modules each have a length, and the first memory module and the second module are disposed such that the length of the first memory module is in a substantially parallel relationship with respect to the length of the second memory module. A portion of the length of the first memory module is disposed between another pair of memory modules.

Abstract: The elevated heat dissipating device of the present invention comprises a thermal substrate connecting onto a heat source and at least one heat conductive pipe connecting to the thermal substrate. The heat conductive pipe further comprises a connecting part connected to a top portion of the thermal substrate, and a bending part which is bended and extended upward away from the thermal substrate. A plurality of sets of heat fins connecting to end portions of the bending part of the heat conductive pipe are supported and elevated by the heat conductive pipe so that an air space is formed between the thermal substrate and the sets of heat fins. A fan locating on a top part of the heat fins, wherein a plurality of air passages are formed in between those heat fins so that cool air ventilates from the fan through the air passages of the heat fins to the thermal substrate.

Abstract: A fan sink that includes a dual impeller push-pull axial fan and a heat sink to cool a hot electronic device is presented. The axial fan has a hub motor, a first impeller that is radially proximate to the hub motor, and a second impeller that is radially distal to the hub motor, wherein the first impeller pushes air in a first direction and the second impeller pulls air in a second direction. The heat sink is oriented between the axial fan and the hot electronic device such that the hot electronic device, the heat sink, and the axial fan are axially oriented, wherein cool air is forced onto the heat sink by one impeller in the axial fan, and wherein heated air from the heat sink is removed by an other impeller in the axial fan.

Abstract: A heat sink includes a heat-conductive base comprising a top surface; and a plurality of combined fins extending up from the top surface of the heat-conductive base, every two adjacent fins being spaced from each other with a passage formed therebetween, and the passage having an air inlet at one side of the heat sink, and an air outlet at an opposite side of the heat sink, wherein a top surface of each of the fins slopes down from the middle portion to the air inlet in a streamlined fashion, and from the middle portion toward the air outlet there is steeply sloping portion leading to a gently sloping portion terminating at a steeply sloping end surface of each of the fins. Resistance of the airflow is minimized, and speed of the heat dissipation is enhanced. Therefore, this aerodynamic design allows better airflow through the heat sink.

Abstract: A heat-dissipating device for a memory and a method for manufacturing the same are disclosed herein. A primary feature is to provide an integrally manufactured heat sink. The heat sink is made of a metal plate with a certain thickness. A plurality of protrusions is provided on one side of the heat sink. Part of the other side of the heat sink is a flat surface. The flat surfaces of the two heat sinks are in contact with both sides of the memory. A clamping member holds these two heat sinks at both sides of the memory.

Abstract: A net-shape molded heat sink is provided which includes a thermally conductive main body and a number of thermally conductive fins integrally connected to and emanating from the main body. The heat sink is formed by overmolding a carbon-carbon matrix core plate with a thermally conductive polymer composition that is filled with thermally conductive filler material. The molded heat sink is freely connecting through the part which makes it more efficient and has an optimal thermal configuration.

Abstract: A modularized redundant heat sink for dissipating heat generated from chips includes an independent rectangular fin whose sides are provided with at least more than two elastic pins, and which is provided with a bottom surface for conducting temperature; a circuit board on which are welded with at least more than two chips having upper surfaces. A bottom surface of the fin is attached to the upper surfaces of at least more than two chips through a heat conducting glue, so as to provide a temperature conducting and heat dissipating to at least more than two chips by one fin.

Abstract: A heat dissipating device for use with a heat-producing element in an electronic product includes a flat-plate heat collector and a plurality of parallelly arranged fins, both of which are made of a copper material to provide excellent heat conductivity. The fins are fixedly connected to one surface of the heat collector using a bonding agent, which is a molten state alloy containing copper, silver, and tin, and also provides excellent heat conductivity after becoming set. Heat produced by the heat-producing element during operation thereof is collected by the heat collector and transferred to the fins, and then carried away by air through heat exchange between the fins and the ambient air. The heat dissipating device employs the natural law of air convection to dissipate heat without consuming power or using other power-driven device.