Abstract: A polymeric light emitting substance having a polystyrene reduced number-average molecular weight of from 103 to 108 wherein this light emitting substance has in the main chain or side chain a metal complex structure showing light emission from the triplet excited state, and the substance can form a light emitting layer by industrially simple application methods such as a spin coat method, inkjet method, printing method and the like.

Abstract: A method for manufacturing a light-emitting device includes a step of forming an etching resistant protection layer on a substrate provided with an organic planarizing layer, a step of forming a plurality of electrodes on the etching resistant protection layer, a step of forming an organic compound layer on the substrate provided with the plurality of electrodes, a step of forming a resist layer on the organic compound layer formed on parts of electrodes among the plurality of electrodes using a photolithographic method, and a step of removing the organic compound layer in a region not covered with the resist layer by dry etching, wherein an entire surface of the organic planarizing layer on the substrate on which steps up to the step of forming the plurality of electrodes have been performed is covered with at least one of the etching resistant protection layer and the electrode.

Abstract: A metal contact of a solar cell is formed by electroplating copper using an electroplating seed that is formed on a dielectric layer. The electroplating seed includes an aluminum layer that connects to a diffusion region of the solar cell through a contact hole in the dielectric layer. A nickel layer is formed on the aluminum layer, with the nickel layer-aluminum layer stack forming the electroplating seed. The copper is electroplated in a copper plating bath that has methanesulfonic acid instead of sulfuric acid as the supporting electrolyte.

Abstract: The invention relates to a top-emissive organic light-emitting diode (OLED) (10) arranged to emit light having different emission colors, comprising a multi-layered structure provided with a first electrode, a second electrode and a functional layer enabling light emission disposed between the first electrode and the second electrode, wherein thickness (H1, H2) of the functional layer is modulated by allowing at least a portion of the functional layer to interact with a thickness modulator (5a, 5b, 5c), wherein the functional layer comprises a hole injection layer or the electron injection layer.

Abstract: To provide a light emitting device in which generation of cross talk between adjacent light emitting elements is suppressed, even when the light emitting device uses a light emitting element having high current efficiency. Also, to provide a light emitting device having high display quality even when the light emitting device uses a light emitting element having high current efficiency. The light emitting device has a pixel portion including a plurality of light emitting elements, wherein each of the plurality of light emitting elements includes a plurality of light emitting bodies provided between a first electrode and a second electrode and a conductive layer formed between the plurality of light emitting bodies, wherein the conductive layer is provided for each light emitting element, and wherein an edge portion of the conductive layer is covered with the plurality of light emitting bodies.

Abstract: An organic light emitting display apparatus and method of manufacturing the same to improve an image quality of the organic light emitting display apparatus. The organic light emitting display apparatus includes: a first electrode formed on a substrate; an intermediate layer disposed on the first electrode, the intermediate layer having an organic emission layer; and a second electrode formed on the intermediate layer, wherein the first electrode includes an etching unit facing the intermediate layer.

Abstract: A composite article with at least one high integrity protective coating, the high integrity protective coating having at least one planarizing layer and at least one organic-inorganic composition barrier coating layer. A method for depositing a high integrity protective coating.

Abstract: To provide a light emitting device in which generation of cross talk between adjacent light emitting elements is suppressed, even when the light emitting device uses a light emitting element having high current efficiency. Also, to provide a light emitting device having high display quality even when the light emitting device uses a light emitting element having high current efficiency. The light emitting device has a pixel portion including a plurality of light emitting elements, wherein each of the plurality of light emitting elements includes a plurality of light emitting bodies provided between a first electrode and a second electrode and a conductive layer formed between the plurality of light emitting bodies, wherein the conductive layer is provided for each light emitting element, and wherein an edge portion of the conductive layer is covered with the plurality of light emitting bodies.

Abstract: There is provided a thin film transistor having improved reliability. A gate electrode includes a first gate electrode having a taper portion and a second gate electrode with a width narrower than the first gate electrode. A semiconductor layer is doped with phosphorus of a low concentration through the first gate electrode. In the semiconductor layer, two kinds of n?-type impurity regions are formed between a channel formation region and n+-type impurity regions. Some of the n?-type impurity regions overlap with a gate electrode, and the other n?-type impurity regions do not overlap with the gate electrode. Since the two kinds of n?-type impurity regions are formed, an off current can be reduced, and deterioration of characteristics can be suppressed.

Abstract: An OLED display includes a substrate, a first electrode on the substrate, an organic emission layer on the first electrode, a second electrode on the organic emission layer, an insulating layer substantially covering the second electrode and having an opening that exposes a center portion of the second electrode, and a power supply electrically coupled with the second electrode through the opening of the insulating layer and configured to supply power to the second electrode.

Abstract: The invention relates to an electronic device, particularly photoreceptor or electrophotographic device, comprising an organic function material, which comprises an electron transport component and a hole trap component, to an organic material, which is a mixture or a copolymer comprising an electron transport component and a hole trap component, its use as charge transport material in a photoreceptor or electrophotographic device, especially of the positive charging type, and to electronic devices comprising such a material.

Abstract: An organic light-emitting display device and a method of manufacturing the same. The organic light-emitting display device includes a first film formed of an inorganic material, a second film that is formed of an organic material and formed on the first film, and includes a first surface and a second surface facing each other and lateral surfaces at boundaries of the first surface and the second surface, with the first surface contacting the first film, a third film that is formed of an inorganic material and covers the second surface and lateral surfaces of the second film, with a first sealing region contacting the first film being formed at a boundary between the second film and the third film, an organic light-emitting unit that is disposed on the third film to overlap with the second film, and a fourth film that covers the organic light-emitting unit, with a second sealing region contacting the third film being formed at a boundary of the fourth film.

Abstract: A method of manufacturing an organic EL element having a corrugated structure, the organic EL element comprising a transparent supporting substrate, a transparent electrode, an organic layer, and a metal electrode, the method comprises the steps of: laminating on the transparent supporting substrate a curable-resin layer having concavity and convexity formed thereon in a periodic arrangement in a way that a curable resin is applied onto the transparent supporting substrate, the curable resin is then cured with a master block being pressed thereto, and thereafter the master block is detached; and obtaining an organic EL element by laminating on the curable-resin layer the transparent electrode, the organic layer, and the metal electrode individually so that a shape of the concavity and convexity formed on a surface of the curable-resin layer can be maintained.

Abstract: An organic light emitting diode display is disclosed. The organic light emitting diode display includes a plurality of subpixels that emit light of at least three colors, the plurality of subpixels each including a first electrode, an organic light emitting layer, and a second electrode. Each of the organic light emitting layers of at least two of the plurality of subpixels includes at least two electron transport layers. The organic light emitting layer of at least one of the plurality of subpixels includes at least one electron transport layer.

Abstract: A buffer layer manufacturing method, including the steps of forming a fine particle layer of ZnS, Zn(S, O), and/or Zn(S, O, OH), mixing an aqueous solution (I) which includes a component (Z), an aqueous solution (II) which includes a component (S), and an aqueous solution (III) which includes a component (C) to obtain a mixed solution and mixing an aqueous solution (IV) which includes a component (N) in the mixed solution to prepare a reaction solution in which the concentration of the component (C) is 0.001 to 0.25M, concentration of the component (N) is 0.41 to 1.0M, and the pH before the start of reaction is 9.0 to 12.0, and, using the reaction solution, forming a Zn compound layer of Zn(S, O) and/or Zn(S, O, OH) on the fine particle layer by a liquid phase method with a reaction temperature of 70 to 95° C.

Abstract: According to an embodiment of the present invention, an organic electroluminescent display device includes transistors formed on a substrate, an insulating layer on the transistors, a lower electrode formed on the insulating layer and coupled to a source or a drain of each of the transistors, a bank layer having openings to expose a part of the lower electrode, a bus electrode formed on the bank layer, an organic light-emitting layer formed to cover the lower electrode, the bank layer, and the bus electrode and patterned to expose at least a part of the bus electrode, and an upper electrode formed on the organic light-emitting layer and configured to come into contact with the exposed bus electrode.

Abstract: An organic light emitting device is disclosed. The organic light emitting device includes a substrate, a display positioned on the substrate, and a dummy pattern positioned at an edge of the display. The display includes a plurality of subpixels each including a first electrode, an emissive unit including at least an organic emissive layer, and a second electrode. The dummy pattern includes a dummy layer including the same formation material as that of at least one of a plurality of layers for forming the emissive unit.

Abstract: A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. That is, the method includes in-situ monitoring of the physical, electrical, and optical properties of the thin films.

Abstract: A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. That is, the method includes in-situ monitoring of the physical, electrical, and optical properties of the thin films.

Abstract: To prevent a point defect and a line defect in forming a light-emitting device, thereby improving the yield. A light-emitting element and a driver circuit of the light-emitting element, which are provided over different substrates, are electrically connected. That is, a light-emitting element and a driver circuit of the light-emitting element are formed over different substrates first, and then electrically connected. By providing a light-emitting element and a driver circuit of the light-emitting element over different substrates, the step of forming the light-emitting element and the step of forming the driver circuit of the light-emitting element can be performed separately. Therefore, degrees of freedom of each step can be increased, and the process can be flexibly changed. Further, steps (irregularities) on the surface for forming the light-emitting element can be reduced than in the conventional technique.

Abstract: An organic light-emitting element has an anode, a cathode, and a layer including an organic compound between the anode and the cathode. The layer including the organic compound has at least one tetracyano compound represented by at least one of Formula (1) or (2) below. In Formula (1), R1 to R4 are each a hydrogen atom, a halogen atom, a substituted or unsubstituted alkyl group, a substituted or unsubstituted alkoxy group, a substituted or unsubstituted aralkyl group, a substituted or unsubstituted aromatic group, a nitro group, or a cyano group. In Formula (2), n represents an integer of 1 to 2, Mn+ is a metal ion or an onium cation, and R1 to R4 are as defined in formula (1).

Abstract: A buffer layer manufacturing method, including: a preparation step for preparing a reaction solution which includes a component (Z) of at least one kind of zinc source, a component (S) of at least one kind of sulfur source, a component (C) of at least one kind of citrate compound, a component (N) of at least one kind selected from the group consisting of ammonia and ammonium salt, and water, in which the concentration of the component (C) is 0.001 to 0.25M, the concentration of the component (N) is 0.001 to 0.40M, and the pH of the reaction solution before the start of reaction is 9.0 to 12.0; and a film forming step for forming a Zn compound layer consisting primarily of Zn(S, O) and/or Zn(S, O, OH) by a liquid phase method with a reaction temperature of 70 to 95° C.

Abstract: Provided are a hyperbranched polymer represented by Formula 1 below, an organic light-emitting diode including an organic layer including the hyperbranched polymer, and a method of manufacturing the organic light-emitting diode: For a detailed description about Formula 1, the Detailed Description of the Invention may be referred to. The hyperbranched polymer is excellent in view of hole injection capability and/or electron blocking capability and adhesion with an electrode, and thus, the organic light-emitting diode including the organic layer including the hyperbranched polymer can have good electrical properties.

Abstract: To provide a light emitting device in which generation of cross talk between adjacent light emitting elements is suppressed, even when the light emitting device uses a light emitting element having high current efficiency. Also, to provide a light emitting device having high display quality even when the light emitting device uses a light emitting element having high current efficiency. The light emitting device has a pixel portion including a plurality of light emitting elements, wherein each of the plurality of light emitting elements includes a plurality of light emitting bodies provided between a first electrode and a second electrode and a conductive layer formed between the plurality of light emitting bodies, wherein the conductive layer is provided for each light emitting element, and wherein an edge portion of the conductive layer is covered with the plurality of light emitting bodies.

Abstract: A method for manufacturing the active plate of a flat matrix display screen, in which each cell comprises an electrode plate connected by a transistor to a first conductive line, comprising the steps of providing an outgrowth coated with an insulator of each first conductive line at the level of each cell; etching or making porous an end portion of each outgrowth; laterally growing, for example, by a VLS method, a PIP or NIN semiconductor structure in each end portion which has been etched or made porous; and establishing a contact at the free end of the semiconductor structure and forming a gate at the level of the median portion of the semiconductor structure.

Abstract: A method of manufacturing an organic electroluminescent display device may comprise forming transistors on a substrate, forming a lower electrode over an insulating layer, forming an insulating layer on the transistors, the lower electrode being coupled to a source or a drain of each of the transistors, forming a bank layer on the lower electrode, the bank layer having openings to expose part of the lower electrode, forming a bus electrode on the bank layer, forming an organic light-emitting layer to cover the lower electrode, the bank layer, and the bus electrode, patterning the organic light-emitting layer using a laser, thereby exposing the bus electrode placed on the bank layer, and forming an upper electrode on the organic light-emitting layer so that the upper electrode comes into contact with the exposed bus electrode.

Abstract: An organic light-light conversion device excellent in device characteristics, comprising a light sensing unit having a layer including a photo-conductive organic semiconductor developing a photo-current multiplication phenomenon by light irradiation, and a light emitting unit having a layer including an electroluminescent organic semiconductor emitting light by current injection, characterized in that at least one of the photo-conductive organic semiconductor and an electroluminescent organic semiconductor is polymer semiconductor. An imaging intensifier consisting of a plurality of arranged above organic light-light conversion devices. An optical sensor provided with a means of measuring and outputting voltages applied to the above organic light-light conversion device and to the opposite ends of a layer including the electroluminescent organic semiconductor.

Abstract: A method for manufacturing an organic light emitting device is disclosed. In one embodiment, the method includes an organic light emitting diode comprising a first electrode, a light emission layer, and a second electrode on a substrate; forming a first protection film by loading the substrate on which the organic light emitting diode has been formed to an inkjet device in a first direction; and forming a second protection film by loading the substrate on which the first protection film has been formed in a second direction, the first and the second direction being formed differently from each other.

Abstract: A method for large scale manufacture of photovoltaic devices includes loading a substrate into a load lock station and transferring the substrate in a controlled ambient to a first process station. The method includes using a first physical deposition process in the first process station to cause formation of a first conductor layer overlying the surface region of the substrate. The method includes transferring the substrate to a second process station, and using a second physical deposition process in the second process station to cause formation of a second layer overlying the surface region of the substrate. The method further includes repeating the transferring and processing until all thin film materials of the photovoltaic devices are formed. In an embodiment, the invention also provides a method for large scale manufacture of photovoltaic devices including feed forward control. That is, the method includes in-situ monitoring of the physical, electrical, and optical properties of the thin films.

Abstract: A specially designed mask controls the arrangement of conductive materials that form a source and drain of a transistor. Designing the mask can be costly and time-consuming, which means that the testing of a circuit involving a transistor can also be costly, time consuming and a barrier towards efficient circuit development and testing. Accordingly, the present invention provides a pre-fabricated, general-purpose pattern comprising an array of conductive islands. The pattern is used as a source and a drain terminal for the formation of a thin-film transistor and as a conductive source for the formation of other electrical components upon the array.

Abstract: A voltage-operated layered arrangement comprising a substrate (1), a layered structure (2, 3, 4, 5) that is applied to the substrate and that comprises at least one electrically conductive functional layer (3) arranged between a first electrode (2) and a second electrode (4), and a field-degrading layer (5) that is less electrically conductive than the functional layer (3) and that is applied to the second electrode (4) arranged on the side of the layered structure remote from the substrate in such a way that it covers the second electrode (4) at least in the region of an edge (4a) and connects the second electrode (4) to the first electrode (2) electrically.

Abstract: An organic light emitting device includes a transistor having gate, source, and drain electrodes, and first electrode connected to one of the source or drain electrodes. The device also includes an emitting layer positioned on the first electrode and a second electrode positioned on the emitting layer. Each of the source and drain electrodes includes first, second, and third layers having different tapered angles. The first electrode may include a metallic layer and a conductive layer, with a tapered angle of the metallic layer being different from a tapered angle of the conductive layer.

Abstract: An organic light-emitting device, including a substrate, an organic light-emitting element on the substrate, a sealing member on the organic light-emitting element, a ¼ wavelength layer on one surface of the substrate, the organic light-emitting element, or the sealing member, and a linear polarization layer on one surface of the substrate, the organic light-emitting element, the sealing member, or the ¼ wavelength layer, the linear polarization layer being closer to an image display surface than the ¼ wavelength layer.

Abstract: A printed wiring board is configured to be connected to an organic substrate in a state where a semiconductor chip is mounted thereon. A plurality of first layers are formed of a material having the same coefficient of thermal expansion as the semiconductor chip. A plurality of second layers are formed of a material having the same coefficient of thermal expansion as the organic substrate. The first layers have different thicknesses from each other and the second layers have different thicknesses from each other. The first layers and the second layers form a lamination by being laminated alternately one on another. The thicknesses of the first layers decrease from a side where the semiconductor chip is mounted toward a side where the organic substrate is connected. The thicknesses of the second layers decrease from the side where the organic substrate is connected toward the side where the semiconductor chip is mounted.

Abstract: The present invention provides an organic EL display panel manufacturing method which is capable of forming a desired organic film or the like with high accuracy without imparting damages to a substrate and an organic film and an organic EL display panel which is manufactured by the method. An opening portion which corresponds to a panel pattern region of a display panel is formed in a vapor deposition mask. The opening portion has a bottom surface in the inside of a recessed surface which is retracted from a surface on which the vapor deposition mask is brought into contact with the substrate. The opening portion of the vapor deposition mask is spaced apart from the substrate with a predetermined gap space and evaporated particles from an evaporating source are vapor-deposited to the substrate through the opening portion.

Abstract: An organic light emitting display including an ultraviolet protecting layer and a method of manufacturing the same include a lower substrate; an ultraviolet hardening adhesive formed on the lower substrate; a driving unit and a light emitting unit deposited on the lower substrate and surrounded by the ultraviolet hardening adhesive; an encapsulation layer covering the driving unit and light emitting unit and preventing moisture and oxygen penetration from an outside; an upper substrate arranged on the encapsulation layer facing the lower substrate and fixed by the ultraviolet hardening adhesive; and an ultraviolet ray blocking film formed in a region to block the driving unit and the light emitting unit from being irradiated by UV rays radiated to harden the ultraviolet hardening adhesive. The ultraviolet ray blocking film is disposed in the encapsulation layer or on the upper substrate to protect the driving unit and light emitting unit from ultraviolet rays.

Abstract: An organic light emitting display includes a substrate, an OLED including an anode electrode, a cathode electrode and an organic thin film formed between the anode electrode and the cathode electrode, a reflective layer on the OLED, the reflective layer comprising a laminated first material and second material, the first material and the second material having different refractive indices, and an encapsulation layer on the reflective layer, the encapsulation layer comprising at least one of organic thin film and inorganic thin film.

Abstract: An organic transistor is formed with a low material cost and low manufacturing cost while still providing high performance and a low contact resistance with an organic semiconductor of the transistor. The organic transistor has electrodes whose bodies are formed mainly of an inexpensive first metal and whose surfaces are formed of a second metal that is expensive but provides high performance properties. To obtain stability of this structure with a low cost, a property of the second metal is used in which the second metal is easily segregated on the surface of the first metal in an alloy of the first metal and the second metal.

Abstract: An OFET includes a ferroelectric gate dielectric permitting electrical reprogramming, such as to implement an electrically re-programmable array logic (PAL) or a field-programmable gate array (FPGA). Methods of constructing such an OFET, PAL, or FPGA, can including roll printing. An OFET on a piezoelectric substrate provides local amplification in an active matrix. Methods of constructing such an OFET on a piezoelectric substrate can including rolling printing. Techniques permit direct measurement of trap distribution, such as across the channel length of an OFET device. Techniques permit direct measurement of the size and location of an electrically active grain structure in OFET devices. Techniques permit confirmation of the mechanism of operation of a number of OFET techniques, including use of silanes or thiols, or OFET operation or aging. Techniques provide an internal circuit probe, such as for a ferroelectric gate dielectric OFET or a piezoelectric substrate OFET, for example.

Abstract: An organic thin-film transistor, including a layer exposing a benzene ring, having a surface separation of from 2.8 to 3.0 ?; and an organic semiconductive layer located overlying the layer exposing a benzene ring.

Abstract: A phosphor has a general formula of (M1-m-nCemEun)3Al2O5X2, wherein M is at least one selected from the group consisting of Ca, Sr and Ba; and X is at least one selected from the group consisting of Cl and Br, while 0<m<1 and 0<n<1.

Abstract: An off-current is reduced in an organic transistor, with which an organic transistor array is formed. A display apparatus is constructed using the organic transistor array. The organic transistor includes a substrate, a gate electrode, a separating electrode, a gate insulating film, a source electrode, a drain electrode, and an organic semiconductor layer. The organic transistor has a region in which the separating electrode and the organic semiconductor layer are laminated. A power supply is connected to the separating electrode.

Abstract: A method of forming a multijunction solar cell including an upper subcell, a middle subcell, and a lower subcell, including providing first substrate for the epitaxial growth of semiconductor material; forming a first solar subcell on the substrate having a first band gap; forming a second solar subcell over the first solar subcell having a second band gap smaller than the first band gap; forming a grading interlayer over the second subcell, the grading interlayer having a third band gap greater than the second band gap; and forming a third solar subcell over the grading interlayer having a fourth band gap smaller than the second band gap such that the third subcell is lattice mis-matched with respect to the second subcell, wherein at least one of the bases of a solar subcell has an exponentially doped profile.

Abstract: A display apparatus and method of forming the same comprise an insulating substrate; a thin film transistor formed on the insulating substrate; a first electrode electrically connected to the thin film transistor and having a first maximum roughness; a buffer layer formed on the first electrode and having a second maximum roughness lower than the first maximum roughness; an organic emission layer formed on the buffer layer; and a second electrode formed on the organic emission layer. Accordingly, it is an aspect of the present invention to provide a display apparatus and method of manufacturing the same which reduce the number of defects due to roughness of a pixel electrode.

Abstract: An organic light emitting device includes a transistor having gate, source, and drain electrodes, and first electrode connected to one of the source or drain electrodes. The device also includes an emitting layer positioned on the first electrode and a second electrode positioned on the emitting layer. Each of the source and drain electrodes includes first, second, and third layers having different tapered angles. The first electrode may include a metallic layer and a conductive layer, with a tapered angle of the metallic layer being different from a tapered angle of the conductive layer.

Abstract: A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene.

Abstract: Organic electronic devices that include dummy electrodes are described, along with methods for using such devices.

Abstract: An organic device package includes a flexible substrate having a topside and a bottom side. Further, the organic device package includes an organic electronic device having a first side and a second side disposed on the topside of the flexible substrate. In addition, the organic device package includes a first barrier layer disposed on the bottom side of the flexible substrate.

Abstract: The present invention intends to provide a light-emitting transistor (LEFET), a light-emitting device with a switching function, which can produce an adequately strong emission of light with higher emission efficiency. The drain electrode 25 is made of aluminum and the source electrode 24 is made of gold. When a voltage is applied between the source electrode 24 and the drain electrode 25, the source electrodes 24 and the drain electrodes 25 inject positive holes and electrons into the light-emitter layer 26, respectively. The positive holes and the electrons recombine, whereby the light-emitter layer 26 generates light. The on/off state of the emission can be controlled by switching the gate voltage on and off. In contrast to conventional LEFETs in which the drain electrode is also made of gold, the present invention uses aluminum, whose work function is lower than that of gold, whereby a larger number of electrons is injected into the light-emitter layer 26 at a lower voltage.

Abstract: An organic light-emitting display (OLED) includes a first substrate, a first organic light-emitting pixel area, a first driver, a second substrate, a system circuitry, and a conductive member. The second substrate is opposite to the first substrate. The first organic light-emitting pixel area is defined on the first substrate and is sealed between the first substrate and the second substrate. The first driver disposed on the first substrate is used for driving the first organic light-emitting pixel area to generate images. The system circuitry disposed on the second substrate is for electrically connected to the first driver. The first substrate and the second substrate are electrically connected with each other through the conductive member.