Abstract: A high holding voltage (HV) electrostatic discharge (ESD) protection circuit comprises a silicon controlled rectifier (SCR) device and compensation regions located within the length between the anode and cathode (LAC) of the SCR device which increase the holding voltage of the SCR device. The compensation regions may introduce negative feedback mechanisms into the SCR device which may influence the loop gain of the SCR and cause it to reach regenerative feedback at a higher holding voltage.

Abstract: Device structures and design structures that include a silicon controlled rectifier, as well as fabrication methods for such device structures. A well is formed in the device layer of a silicon-on-insulator substrate. A silicon controlled rectifier is formed that includes an anode in the well. A deep trench capacitor is formed that includes a plate coupled with the well. The plate of the deep trench capacitor extends from the device layer through a buried insulator layer of the silicon-on-insulator substrate and into a handle wafer of the silicon-on-insulator substrate.

Abstract: An ESD protection device including second P-type wells, first P+-type doped regions, first N+-type doped regions and a P-type substrate having a first P-type well, an N-type well and an N-type deep well is provided. The second P-type wells are disposed in the N-type deep well. The first P+-type doped regions and the first N+-type doped regions are respectively disposed in the first P-type well, the N-type well and the second P-type wells in alternation. The first P+-type doped region in the N-type well and the N-type deep well are electrically connected to the first connection terminal. The doped regions in the first P-type well and the P-type substrate are electrically connected to the second connection terminal. The second P-type wells and the first N+-type doped regions therein form a diode string connected in series between the first N+-type doped region of the N-type well and the second connection terminal.

Abstract: Bi-directional silicon controlled rectifier device structures and design structures, as well as fabrication methods for bi-directional silicon controlled rectifier device structures. A well of a first conductivity type is formed in a device region, which may be defined from a device layer of a semiconductor-on-insulator substrate. An anode of a first silicon controlled rectifier is formed in the first well. A cathode of a second silicon controlled rectifier is formed in the first well. The anode of the first silicon controlled rectifier has the first conductivity type. The cathode of the second silicon controlled rectifier has a second conductivity type opposite to the first conductivity type.

Abstract: In order to suppress an off leak current of an off transistor for ESD protection, in an NMOS for ESD protection whose isolation region has a shallow trench structure, a drain region is placed apart from the shallow trench isolation region so as not to be in direct contact with the shallow trench isolation region in a region where the drain region of the NMOS transistor for ESD protection is adjacent to at least a gate electrode of the NMOS transistor for ESD protection.

Abstract: An SCR includes a first doped region of a first type having a first doping concentration. A first well of the first type and a first well of a second type are disposed in upper areas of the first doped region of the first type such that the first well of the second type is laterally spaced from the first well of the first type by a non-zero distance. A second doped region of the first type has a second doping concentration that is greater than the first doping concentration and is disposed in the first well of the second type to form an anode of the SCR. A first doped region of the second type is disposed in the first well of the first type and forms a cathode of the SCR.

Abstract: Device structures and design structures that include a silicon controlled rectifier, as well as fabrication methods for such device structures. A well is formed in the device layer of a silicon-on-insulator substrate. A silicon controlled rectifier is formed that includes an anode in the well. A deep trench capacitor is formed that includes a plate coupled with the well. The plate of the deep trench capacitor extends from the device layer through a buried insulator layer of the silicon-on-insulator substrate and into a handle wafer of the silicon-on-insulator substrate.

Abstract: An electrostatic discharge protection device is provided. The electrostatic discharge protection device can include a semiconductor substrate having a first well and a second well, a silicon controller rectifier (SCR) device, and first and second impurity areas disposed on the first and second wells to form a PN junction. The SCR can have a PNPN structure or an NPNP structure, and the PN junction structure and the SCR device can be alternately disposed when the substrate is viewed from above.

Abstract: An overvoltage protection devices operable to provide protection against overvoltage events of positive and negative polarity, comprising: an N P N semiconductor structure defining: a first N-type region; a first P-type region; and a second N-type region; wherein one of the first or second N-type regions is connected to a terminal, conductor or node that is to be protected against an overvoltage event, and the other one of the first or second N-type regions is connected to a reference, and wherein a field plate is in electrical contact with the first P-type region, and the field plate overlaps with but is isolated from portions of the first and second N type regions.

Abstract: An overvoltage protection device in combination with a filter, the overvoltage protection device having a first node for connection to a node to be protected, a second node for connection to a discharge node; and a control node; and wherein the filter comprises at least one of: (a) a capacitor connected between the first node and the discharge node; (b) a capacitor connected between the control node and the discharge node; or (c) an inductor in series connection with the first node.

Abstract: A semiconductor device includes a first well region of a first conductivity type, a second well region of a second conductive type within the first well region. A first region of the first conductivity type and a second region of the second conductivity type are disposed within the second well region. A third region of the first conductivity type and a fourth region of the second conductivity type are disposed within the first well region, wherein the third region and the fourth region are separated by the second well region. The semiconductor device also includes a switch device coupled to the third region.

Abstract: Provided is an electrostatic discharge (ESD) protection diode that is formed on an input/output pad of an integrated circuit (IC), the ESD protection diode including: an N-type semiconductor that constitutes a first diode and is connected to a pad for a power supply voltage; a P-type semiconductor that constitutes the first diode and is connected to a signal line; an N-type semiconductor that constitutes a second diode and is connected to the signal line; a P-type semiconductor that constitutes the second diode and is connected to a pad for grounding; and a third diode that is formed by contacting the N-type semiconductor of the first diode and the P-type semiconductor of the second diode.

Abstract: The present invention discloses an isolated SCR ESD device, comprising: a substrate; a first well located in the substrate, which is floating and has a first conductivity type; a first high density doped region located in the first well and having a second conductivity type; a second well nearby the first well and having the second conductivity type; a second high density doped region located in the second well and having the second conductivity type; and a third high density doped region located in the second well and having the first conductivity type, wherein the first high density doped region is for electrical connection with a pad, and wherein the first well is not provided with a high density doped region having the first conductivity type for connection with the pad.

Abstract: Device structures and design structures for a silicon controlled rectifier, as well as methods for fabricating a silicon controlled rectifier. The device structure includes first and second layers of different materials disposed on a top surface of a device region containing first and second p-n junctions of the silicon controlled rectifier. The first layer is laterally positioned on the top surface in vertical alignment with the first p-n junction. The second layer is laterally positioned on the top surface of the device region in vertical alignment with the second p-n junction. The material comprising the second layer has a higher electrical resistivity than the material comprising the first layer.

Abstract: An ESD protection element may include: a fin structure including a first connection region having a first conductivity type, a second connection region having a second conductivity type, first and second body regions formed between the connection regions, the first body region having the second conductivity type and formed adjacent to the first connection region, the second body region having the first conductivity type and formed adjacent to the second connection region, the body regions having a lower dopant concentration than the connection regions, a diffusion region formed between the body regions and having substantially the same dopant concentration as at least one of the first and second connection regions; a gate region on or above the first body region or the second body region; a gate control device electrically coupled to the gate region and configured to control at least one electrical potential applied to the gate region.

Abstract: A latchup silicon controlled rectifier (SCR) includes a p+ region and an n+ region located in a p-well of the latchup SCR; and a p+ region and an n+ region located in a n-well of the latchup SCR, wherein the latchup SCR further comprises one of embedded silicon germanium (eSiGe) in the p+ region in the n-well of the latchup SCR and silicon carbide (SiC) in the n+ region in the p-well of the latchup SCR.

Abstract: A high holding voltage (HV) electrostatic discharge (ESD) protection circuit comprises a silicon controlled rectifier (SCR) device and compensation regions located within the length between the anode and cathode (LAC) of the SCR device which increase the holding voltage of the SCR device. The compensation regions may introduce negative feedback mechanisms into the SCR device which may influence the loop gain of the SCR and cause it to reach regenerative feedback at a higher holding voltage.

Abstract: A semiconductor structure and manufacturing method for the same, and an ESD circuit are provided. The semiconductor structure comprises a first doped region, a second doped region, a third doped region and a resistor. The first doped region has a first type conductivity. The second doped region has a second type conductivity opposite to the first type conductivity. The third doped region has the first type conductivity. The first doped region and the third doped region are separated by the second doped region. The resistor is coupled between the second doped region and the third doped region. An anode is coupled to the first doped region. A cathode is coupled to the third doped region.

Abstract: Methods and apparatus for increased holding voltage SCRs. A semiconductor device includes a semiconductor substrate of a first conductivity type; a first well of the first conductivity type; a second well of a second conductivity type adjacent to the first well, an intersection of the first well and the second well forming a p-n junction; a first diffused region of the first conductivity type formed at the first well and coupled to a ground terminal; a first diffused region of the second conductivity type formed at the first well; a second diffused region of the first conductivity type formed at the second well and coupled to a pad terminal; a second diffused region of the second conductivity type formed in the second well; and a Schottky junction formed adjacent to the first diffused region of the second conductivity type coupled to a ground terminal. Methods for forming devices are disclosed.

Abstract: An SCR includes a first doped region of a first type having a first doping concentration. A first well of the first type and a first well of a second type are disposed in upper areas of the first doped region of the first type such that the first well of the second type is laterally spaced from the first well of the first type by a non-zero distance. A second doped region of the first type has a second doping concentration that is greater than the first doping concentration and is disposed in the first well of the second type to form an anode of the SCR. A first doped region of the second type is disposed in the first well of the first type and forms a cathode of the SCR.

Abstract: A LSCR includes a substrate having a semiconductor surface which is p-doped. A first nwell and a second nwell spaced apart from one another are in the semiconductor surface by a lateral spacing distance. A first n+ diffusion region and a first p+ diffusion region are in the first nwell. A second n+ diffusion region is in the second nwell. A second p+ diffusion is between the first nwell and second nwell which provides a contact to the semiconductor surface. Dielectric isolation is between the first n+ diffusion region and first p+ diffusion region, along a periphery between the first nwell and the semiconductor surface, and along a periphery between the second nwell and the semiconductor surface. A resistor provides coupling between the second n+ diffusion region and second p+ diffusion.

Abstract: Device structures, design structures, and fabrication methods for a silicon controlled rectifier. A well of a first conductivity type is formed in a device region, which may be defined from a device layer of a semiconductor-on-insulator substrate. A doped region of a second conductivity type is formed in the well. A cathode of a silicon controlled rectifier and a cathode of a diode are formed in the device region. The silicon controlled rectifier comprises a first portion of the well and an anode comprised of a first portion of the doped region. The diode comprises a second portion of the well and an anode comprised of a second portion of the doped region.

Abstract: According to one embodiment, a semiconductor device that has a rectification element includes a semiconductor substrate, a first well region of a first conductivity type formed on the semiconductor substrate, a second well region of a second conductivity type formed on the semiconductor substrate, and a plurality of fins arranged over the first well region and the second well region at a first pitch in the same direction. In the semiconductor device, the rectification element includes a cathode region, an anode region, a well contact region, and a trigger region that are configured using fins. These regions are connected to each wiring portion to form a PNP-type bipolar transistor and an NPN-type bipolar transistor.

Abstract: Device structures, design structures, and fabrication methods for passive devices that may be used as electrostatic discharge protection devices in fin-type field-effect transistor integrated circuit technologies. A portion of a device layer of a semiconductor-on-insulator substrate is patterned to form a device region. A well of a first conductivity type is formed in the epitaxial layer and the device region. A doped region of a second conductivity type is formed in the well and defines a junction with a portion of the well. The epitaxial layer includes an exterior sidewall spaced from an exterior sidewall of the device region. Another portion of the device layer may be patterned to form fins for fin-type field-effect transistors.

Abstract: Device structures, design structures, and fabrication methods for passive devices that may be used as electrostatic discharge protection devices in fin-type field-effect transistor integrated circuit technologies. A device region is formed in a trench and is coupled with a handle wafer of a semiconductor-on-insulator substrate. The device region extends through a buried insulator layer of the semiconductor-on-insulator substrate toward a top surface of a device layer of the semiconductor-on-insulator substrate. The device region is comprised of lightly-doped semiconductor material. The device structure further includes a doped region formed in the device region and that defines a junction. A portion of the device region is laterally positioned between the doped region and the buried insulator layer of the semiconductor-on-insulator substrate. Another region of the device layer may be patterned to form fins for fin-type field-effect transistors.

Abstract: An electrostatic discharge (ESD) protection device includes a well region formed from semiconductor material with a first doping type and a floating base formed from semiconductor material with a second doping type. The floating base is disposed vertically above the well region. The ESD also includes a first terminal receiving region formed from semiconductor material with a third doping type. The first terminal receiving region is disposed vertically above the floating base. The ESD further includes a second terminal receiving region. The second terminal receiving region is laterally spaced apart from the first terminal receiving region by silicon trench isolation (STI) region. In some embodiments, the second terminal receiving region is formed from semiconductor material with the third doping type to form a bipolar junction transmitter (BJT) or with a fourth doping type to form a silicon controlled rectifier (SCR).

Abstract: The present invention provides an ESD protection device comprising a SCR structure that is a transverse PNPN structure formed by performing a P-type implantation and an N-type implantation in an N-well and a P-well on a silicon substrate, respectively, wherein a P-type doped region in the N-well is used as an anode, and N-type doped region in the P-well is used as a cathode, characterized in that, N-type dopants are implanted into the N-well to form one lead-out terminal of a resistor, P-type dopants are implanted into the P-well to form another lead-out terminal for the resistor, and the two leading-out terminals are connected by the resistor.

Abstract: A semiconductor device includes an SCR ESD device region disposed within a semiconductor body, and a plurality of first device regions of the first conductivity type disposed on a second device region of the second conductivity type, where the second conductivity type is opposite the first conductivity type. Also included is a plurality of third device regions having a sub-region of the first conductivity type and a sub-region of the second conductivity type disposed on the second device region. The first regions and second regions are distributed such that the third regions are not directly adjacent to each other. A fourth device region of the first conductivity type adjacent to the second device region and a fifth device region of the second conductivity type disposed within the fourth device region are also included.

Abstract: A silicon-controlled-rectifier (SCR) with adjustable holding voltage is disclosed, which comprises a heavily doped semiconductor layer and an epitaxial layer formed on the heavily doped semiconductor layer. A first N-well having a first P-heavily doped area is formed in the epitaxial layer. A second N-well or a first P-well is formed in the epitaxial layer. When the second N-well is formed in the epitaxial layer, a P-doped area is located between the first N-well and the second N-well. Besides, a first N-heavily doped area is formed in the second N-well or the first P-well. At least one deep isolation trench is formed in the epitaxial layer and located between the first P-heavily doped area and the first N-heavily doped area. A distance between the deep isolation trench and the heavily doped semiconductor layer is larger than zero.

Abstract: An ESD protection element for use in an electrical circuit having a fin structure or a fully depleted silicon-on-insulator structure. The fin structure or the fully depleted silicon-on-insulator structure contains a first connection region having a first conductivity type; a second connection region having a second conductivity type, which is opposite to the first conductivity type; and also a plurality of body regions which are formed alongside one another and which are formed between the first connection region and the second connection region. The body regions alternately have the first conductivity type and the second conductivity type. The ESD protection element has at least one gate region formed on or above at least one of the plurality of body regions, and also at least one gate control device which is electrically coupled to the at least one gate region.

Abstract: An ESD protection device including second P-type wells, first P+-type doped regions, first N+-type doped regions and a P-type substrate having a first P-type well, an N-type well and an N-type deep well is provided. The second P-type wells are disposed in the N-type deep well. The first P+-type doped regions and the first N+-type doped regions are respectively disposed in the first P-type well, the N-type well and the second P-type wells in alternation. The first P+-type doped region in the N-type well and the N-type deep well are electrically connected to the first connection terminal. The doped regions in the first P-type well and the P-type substrate are electrically connected to the second connection terminal. The second P-type wells and the first N+-type doped regions therein form a diode string connected in series between the first N+-type doped region of the N-type well and the second connection terminal.

Abstract: An overvoltage protection devices operable to provide protection against overvoltage events of positive and negative polarity, comprising: an N P N semiconductor structure defining: a first N-type region; a first P-type region; and a second N-type region; wherein one of the first or second N-type regions is connected to a terminal, conductor or node that is to be protected against an overvoltage event, and the other one of the first or second N-type regions is connected to a reference, and wherein a field plate is in electrical contact with the first P-type region, and the field plate overlaps with but is isolated from portions of the first and second N type regions.

Abstract: A magnetic shield is presented. The shield may be used to protect a microelectronic device from stray magnetic fields. The shield includes at least two layers. A first layer includes a magnetic material that may be used to block DC magnetic fields. A second layer includes a conductive material that may be used to block AC magnetic fields. Depending on the type of material that the first and second layers include, a third layer may be inserted in between the first and second layers. The third layer may include a non-conductive material that may be used to ensure that separate eddy current regions form in the first and second layers.

Abstract: Provided is a semiconductor device including a substrate, and a first wiring layer, a second wiring layer, and a switch via formed on the substrate. The first wiring layer has first wiring formed therein and the second wiring layer has second wiring formed therein. The switch via connects the first wiring and the second wiring. The switch via includes at least at its bottom a switch element including a resistance change layer. A resistance value of the resistance change layer changes according to a history of an electric field applied thereto.

Abstract: A method of forming an IC device including a latchup silicon controlled rectifier (SCR) includes forming a mask on a top surface of a substrate, wherein the mask covers a first portion of the substrate and exposes a second portion of the substrate that is located in one of an n-well and a p-well on the substrate; etching the exposed second portion of the substrate to form an etched area; forming a stress engineered junction of the latchup SCR by selective epitaxial deposition in the etched area; and removing the mask.

Abstract: A structure includes first and second silicon controlled rectifiers (SCRs) formed in a substrate. The first and the second SCRs each include at least one component commonly shared between the first and the second SCRs.

Abstract: A power semiconductor structure with a field effect rectifier having a drain region, a body region, a source region, a gate channel, and a current channel is provided. The body region is substantially located above the drain region. The source region is located in the body region. The gate channel is located in the body region and adjacent to a gate structure. The current channel is located in the body region and is extended from the source region downward to the drain region. The current channel is adjacent to a conductive structure coupled to the source region.

Abstract: According to one embodiment, a semiconductor device that has a rectification element includes a semiconductor substrate, a first well region of a first conductivity type formed on the semiconductor substrate, a second well region of a second conductivity type formed on the semiconductor substrate, and a plurality of fins arranged over the first well region and the second well region at a first pitch in the same direction. In the semiconductor device, the rectification element includes a cathode region, an anode region, a well contact region, and a trigger region that are configured using fins. These regions are connected to each wiring portion to form a PNP-type bipolar transistor and an NPN-type bipolar transistor.

Abstract: An electrostatic discharge (ESD) protection circuit structure includes a dual directional silicon controlled rectifier (SCR) formed in a substrate. The SCR includes first and second P-wells laterally interposed by an N-well. A deep N-well is disposed underneath the P-wells and the N-well. First and second N-type regions are disposed in the first and second P-wells, respectively, and are coupled to a pair of pads. First and second P-type regions are disposed in the first and second P-wells, respectively, are coupled to the pads, and are disposed closer to the N-well than the first and second N-type regions, respectively.

Abstract: An overvoltage protection device in combination with a filter, the overvoltage protection device having a first node for connection to a node to be protected, a second node for connection to a discharge node; and a control node; and wherein the filter comprises at least one of: (a) a capacitor connected between the first node and the discharge node; (b) a capacitor connected between the control node and the discharge node; or (c) an inductor in series connection with the first node.

Abstract: A semiconductor device includes a first well region of a first conductivity type, a second well region of a second conductive type within the first well region. A first region of the first conductivity type and a second region of the second conductivity type are disposed within the second well region. A third region of the first conductivity type and a fourth region of the second conductivity type are disposed within the first well region, wherein the third region and the fourth region are separated by the second well region. The semiconductor device also includes a switch device coupled to the third region.

Abstract: A vertical NPNP structure fabricated using a triple well CMOS process, as well as methods of making the vertical NPNP structure, methods of providing electrostatic discharge (ESD) protection, and design structures for a BiCMOS integrated circuit. The vertical NPNP structure may be used to provide on-chip protection to an input/output (I/O) pad from negative-voltage ESD events. A vertical PNPN structure may be also used to protect the same I/O pad from positive-voltage ESD events.

Abstract: A voltage protection device and method is provided to prevent accidental triggering of an silicon-controlled rectifier (SCR) unless the electrostatic discharge (ESD) is at a predefined threshold above the normal power supply operating voltage or below the ground supply operating voltage. The holding voltage upon the SCR is maintained above the threshold voltage to prevent accidental triggering. The present SCR avoids use of an additional field effect transistor (FET), and avoids relying upon the breakdown of the drain terminal of the FET, but instead programs the amount of holding voltage needed above the power supply voltage using mask-programmability, fuses, or other means for maintaining the holding voltage to a desired range above the power supply voltage. The programmed holding voltage is implemented using a barrier region between the PNP and the NPN of the PNPN junctions of the SCR.

Abstract: An ESD protection circuit including an SCR having at least one PNP transistor and at least one NPN transistor such that at least one of the PNP transistor and the NPN transistor having an additional second collector. The circuit further including at least one control circuit coupled to the at least one second collector to control holding voltage of the SCR.

Abstract: A silicon control rectifier and an electrostatic discharge protection device of an integrated circuit including the silicon control rectifier. The silicon control rectifier includes a silicon body formed in a silicon layer in direct physical contact with a buried oxide layer of a silicon-on-insulator substrate, a top surface of the silicon layer defining a horizontal plane; and an anode of the silicon control rectifier formed in a first region of the silicon body and a cathode of the silicon control rectifier formed in an opposite second region of the silicon body, wherein a path of current flow between the anode and the cathode is only in a single horizontal direction parallel to the horizontal plane.

Abstract: A semiconductor device includes an SCR ESD device region disposed within a semiconductor body, and a plurality of first device regions of the first conductivity type disposed on a second device region of the second conductivity type, where the second conductivity type is opposite the first conductivity type. Also included is a plurality of third device regions having a sub-region of the first conductivity type and a sub-region of the second conductivity type disposed on the second device region. The first regions and second regions are distributed such that the third regions are not directly adjacent to each other. A fourth device region of the first conductivity type adjacent to the second device region and a fifth device region of the second conductivity type disposed within the fourth device region are also included.

Abstract: The present invention discloses a bi-directional SCR ESD device, comprising: a substrate; a first well located in the substrate, which is floating and has a first conductivity type; a second well and a third well both located in the first well and both having a second conductivity type, the second well and the third well being separated from each other; a first high density doped region of the first conductivity type and a second high density doped region of the second conductivity type located in the second well; and a third high density doped region of the first conductivity type and a fourth high density doped region of the second conductivity type located in the third well.

Abstract: The present invention discloses an isolated SCR ESD device, comprising: a substrate; a first well located in the substrate, which is floating and has a first conductivity type; a first high density doped region located in the first well and having a second conductivity type; a second well nearby the first well and having the second conductivity type; a second high density doped region located in the second well and having the second conductivity type; and a third high density doped region located in the second well and having the first conductivity type, wherein the first high density doped region is for electrical connection with a pad, and wherein the first well is not provided with a high density doped region having the first conductivity type for connection with the pad.

Abstract: An embodiment semiconductor device has a first device region disposed on a second device region within an ESD device region disposed within a semiconductor body. Also included is a third device region disposed on the second device region, a fourth device region adjacent to the second device region, a fifth device region disposed within the fourth device region, and a sixth device region adjacent to the fourth device region. The first and fourth regions have a first semiconductor type, and the second, third, fifth and sixth regions have a second conductivity type opposite the first conductivity type. An interface between the fourth device region and the sixth device region forms a diode junction. The first, second, fourth and fifth device regions form a silicon controlled rectifier.

Abstract: This invention provides a lateral high-voltage semiconductor device, which is a three-terminal one with two types of carriers for conduction and consists of a highest voltage region and a lowest voltage region referring to the substrate and a surface voltage-sustaining region between the highest voltage region and the lowest voltage region. The highest voltage region and the lowest region have an outer control terminal and an inner control terminal respectively, where one terminal is for controlling the flow of majorities of one conductivity type and another for controlling the flow of majorities of the other conductivity type. The potential of the inner control terminal is regulated by the voltage applied to the outer control terminal.