Abstract: A vertical cavity surface emitting laser and a method for fabricating thereof are disclosed. The laser includes: a reflective laser formed at a center portion of a contact layer, and an upper electrode that is separated from a reflective lens and that encloses the reflective lens. The method for fabricating the laser includes the steps of: sequentially growing a lower reflective mirror, an oscillation region, an upper reflective mirror, and a contact layer on a upper surface of a semiconductor substrate; forming a lower electrode on a lower surface of the semiconductor substrate; forming, on the contact layer, an annular mask with a mesa shaped opening at the center portion; growing, through the opening of the mask with a mesa structure, a reflective mirror with a center and peripheral portions of different thickness; and forming annular upper electrode surrounding the reflective mirror after removing the mask.

Abstract: A manufacturing method and a thus produced light-emitting structure for a white colored light-emitting device (LED) and the LED itself are disclosed. The white colored LED includes a resonant cavity structure, producing and mixing lights which may mix into a white colored light in the resonant cavity structure, so that the white colored LED may be more accurately controlled in its generated white colored light, which efficiently reduces deficiency, generates natural white colored light and aids in luminous efficiency promotion. In addition to the resonant cavity structure, the light-emitting structure also includes a contact layer, an n-type metal electrode and a p-type metal electrode.

Abstract: A light-emitting device is provided in which a plurality of thin films including a light-emitting layer are stacked. The light-emitting device includes a waveform structure having a directive scattering function in one interface between the thin films.

Abstract: The present invention provides a laser diode with a current blocking layer without a pn-junction. The laser diode includes a lower cladding layer, an active region and an upper cladding layer on the GaAs substrate in this order. The active region includes first and second regions. The upper cladding layer, which includes a ridge structure, locates on the first region, while, the current blocking region is on the second region of the active region so as to sandwich the ridge structure. The current blocking layer of the invention is made of one of un-doped GaInP and un-doped AlGaInP grown at a relatively low temperature and shows high resistance greater than 105 ?·cm.

Abstract: A method of manufacturing semiconductor laser device capable of reducing ?L, with manufacturing restrictions satisfied, is provided. In a distributed-feedback or distributed-reflective semiconductor laser device, immediately before burying regrowth of a diffraction grating, halogen-based gas is introduced to a reactor, and etching is performed on the diffraction grating so that each side wall has at least two or more crystal faces and a ratio of length of an upper side in a waveguide direction to a bottom side parallel to a (100) surface is 0 to 0.3. And, a reactive product formed on side surfaces of the diffraction grating and in trench portions between stripes of the diffraction grating at an increase of temperature for regrowth is removed. Therefore, the diffraction grating with reduced height and a sine wave shape is obtained, thereby ?L of the device is reduced. Thus, an oscillation threshold and optical output efficiency can be improved.

Abstract: A surface emitting semiconductor device comprises an active layer, a p-type III-V compound semiconductor layer, an n-type III-V compound semiconductor layer, and a burying layer. The active layer includes a primary surface, the primary surface having first and second areas. The p-type III-V compound semiconductor layer is provided on the first and second areas of the primary surface of the active layer. The n-type III-V compound semiconductor layer is provided on the second area of the primary surface of the active layer. The n-type III-V compound semiconductor is provided on the p-type III-V compound semiconductor layer. The n-type III-V compound semiconductor and the p-type III-V compound semiconductor layer form a tunnel junction. The n-type III-V compound semiconductor layer contains tellurium as an n-type dopant. The burying layer is made of III-V compound semiconductor. The n-type III-V compound semiconductor layer is covered with the burying layer.

Abstract: The present invention provides an optical device and a surface emitting type device which have high efficiency and a stable operation and are manufactured at high manufacturing yield. The optical device and the surface emitting type device are characterized in that they have a distributed Bragg reflector (DBR) including a plurality of semiconductor layers made of a nitride semiconductor with substantially same gaps therbetween. Further, the optical device and the surface emitting type device are characterized in that they have a distributed Bragg reflector (DBR) in which a plurality of semiconductor layers made of nitride semiconductor and a plurality of organic layers made of organic material are alternately laminated.

Abstract: A light emitting device includes a substrate, a doped substrate layer, a layer of first conductivity type overlying the doped substrate layer, a light emitting layer overlying the layer of first conductivity type, and a layer of second conductivity type overlying the light emitting layer. A conductive transparent layer, e.g., of indium tin oxide, and a reflective metal layer overlie the layer of second conductivity type and provide electrical contact with the layer of second conductivity type. A plurality of vias may be formed in the reflective metal and conductive transparent layer as well as the layer of second conductivity type, down to the doped substrate layer. A plurality of contacts are formed in the vias and are in electrical contact with the doped substrate layer. An insulating layer formed over the reflective metal layer insulates the plurality of contacts from the conductive transparent layer and reflective metal layer.

Abstract: An optical functional film comprises a multilayer film formed by stacking a plurality of films. The plurality of films are formed by a same material and refractive indices of adjacent films are different.

Abstract: A vertical GaN-based LED includes: an n-electrode; a light-emitting structure in which an n-type GaN layer, an active layer, and a p-type GaN layer are sequentially formed under the n-electrode; a p-electrode formed under the light-emitting structure; a passivation layer formed to cover the side and bottom surfaces of the light-emitting structure and expose a predetermined portion of the p-electrode, the passivation layer being formed of a distributed Bragg reflector (DBR); a plating seed layer formed under the passivation layer and the p-electrode; and a support layer formed under the plating seed layer.

Abstract: A solid state light emitting device having a plurality of semiconductor finger members with side walls perpendicular to a substrate. Multiple quantum wells are formed on the side walls, and are also perpendicular to the substrate. Each multiple quantum well is sandwiched between the side wall of a finger member and a second semiconductor member of a conductivity type opposite to that of the finger member. Ohmic contacts are applied to the finger members and second semiconductor member for receiving a voltage. The device is GaN based such that emitted light will be in the UV region.

Abstract: A device for emitting optical radiation is integrated on a substrate of semiconductor material. The device includes an active layer having a main area for generating radiation, and first and second electro-conductive layers having an electric signal that generates an electric field to which an exciting current is associated. In the device, a dielectric region is formed between the first and second layers to space peripheral portions of the first and second layers so that the electric field in the main area is higher than the electric field between the peripheral portions, thereby facilitating generation of the exciting current in the main area. A method of manufacturing is also disclosed.

Abstract: A green LED has a substrate, a GaN heavily n-doped bottom confining layer, an active region, an upper GaN confinement layer, and a semi-transparent ohmic contact layer. The active region has less than or equal to three highly compressively strained quantum wells. The widths of the quantum wells is less than 3 nm. The active region arrangement provides a short free carrier life-time and hence an increase in the modulation bandwidth of the LED.

Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module is connected to a heat dissipating plate configured to mount to an electrical junction box. Thus, heat from the LEDs is conducted to the heat dissipating plate and to the junction box. A sensor is configured to detect environmental parameters and a driver is configured to illuminate the LEDs in response to the environmental parameters, thereby selectively configuring the LEDs to function in a wide variety of useful applications.

Abstract: A metallic photonic box capable of intensifying light at a certain wavelength, includes: a metallic surrounding forming a resonance chamber; and an insulator layer, disposed in the resonance chamber, having a predetermined dimension defining a cut-off wavelength, which inhibits light of a wavelength greater than the cut-off wavelength from resonating, whereby when the metallic photonic box is heated to generate light radiation, the light radiation is intensified at a wavelength rage predetermined by the cut-off wavelength.

Abstract: A special type of Distributed Bragg Reflectors (DBRs) is provided. Semiconductor resonant cavity devices for emitting or absorbing light are also provided. A DBR is provided for reflecting radiation with a wavelength &lgr; includes at least one mirror pair. Each mirror pair comprises a bottom layer and a top layer, the top layer of one mirror pair comprising gallium phosphide (GaP) and having an optical thickness of substantially an odd multiple of &lgr;/4. A resonant cavity device for emitting or absorbing light with a wavelength &lgr; may comprise a first mirror and a second mirror with an active region located therebetween. The second mirror may comprise a stack of DBRs including at least one mirror pair, the mirror pair having at least a top layer and a bottom layer. The top layer is the layer most remote from the first mirror, and this layer is essentially composed of gallium phosphide (GaP) and has an optical thickness of substantially an odd multiple of &lgr;/4.