Abstract: In an embodiment a component includes a carrier, at least one optoelectronic part arranged on the carrier, the optoelectronic part configured to emit electromagnetic radiation, a frame arranged on the carrier and enclosing a part space, wherein the optoelectronic part is arranged in the part space, and wherein the frame comprises a reflector, and a lens arranged on the frame and at least partially covering an opening of the part space, wherein the reflector is configured to direct the electromagnetic radiation onto the lens, wherein the lens is configured to direct the electromagnetic radiation of the optoelectronic part, and wherein the lens comprises at least a partial pyramidal-shaped section on a first side face facing toward the optoelectronic part.

Abstract: A force sensor including a first surface and a second surface facing each other in a first direction; a first protrusion protruded from the first surface toward the second surface; a first electrode on the first protrusion; a first force sensing layer on the first electrode; a second protrusion protruded from the second surface toward the first surface; and a second electrode on the second protrusion; wherein the first protrusion and the second protrusion are not overlapped with each other or are partially overlapped with each other.

Abstract: To provide a backlight that reduces the number of LEDs used while facilitating the attempt to make the backlight smaller in thickness. On a mount substrate (11), LEDs (13) are mounted in a square lattice arrangement. Over a portion near the center of each unit of the square lattice, protrusions (15) of a diffusion plate (14) are disposed. Among light emitted from the LEDs (13), light traveling in lateral directions between the mount substrate (11) and the diffusion plate (14) is captured by the protrusions (15). The captured light is refracted and reflected by the interfaces of the protrusions (15), and diffused due to diffusing particles, with the result that the light is turned into upward illumination light.

Abstract: A light guide for a luminaire is provided. The light guide includes: an elongated base comprising a light emitting surface at a distal end, and opposing major faces; and a plurality of collimators arranged in an adjacent manner and projecting in a proximal direction from the base, wherein each collimator has a light receiving surface at a proximal end, wherein each collimator expands laterally outwardly in a distal direction. Substantially all light received at the light receiving surfaces internally reflects through the collimators and the base and emits from the light emitting surface.

Abstract: The subject inventive arrangement produces a light guide that may be of any curved shape that produces and obtains a lighting appearance of a uniform or homogenous lit appearance at the light exit face by using a single light source and a single light-reflective coupler. The present invention is premised on a light guide system that includes a light guide; a light source; and a coupler positioned at the light source that is configured to receive generated light. The coupler is adapted to produce a collimated light beam from the light source. A stepped reflective surface is formed along a light reflecting face of the light guide by a plurality of light reflective facets and a plurality of lateral surfaces, which are configured to receive and direct collimated light towards a light-emitting exit face.

Abstract: A light emitting device includes a light source, a light guide member, and a defining member. The light source is configured to emit light. The light guide member is configured to guide the light and having a light incident end surface on which the light is to be incident. The defining member is arranged between the light source and the light guide member to define a distance between the light source and the light incident end surface of the light guide member. The defining member includes a light passage member configured to allow the light to pass between the light source and the light incident end surface, and a light transmission member configured to transmit the light between the light passage member and the light incident end surface. The light source is spaced apart from the light transmission member.

Abstract: A decorative bulb with inner lens includes a mounting base; a light bulb covering mounted on the mounting base; an optical lens, comprising a mounting part and a lens part integrally formed with the mounting part, the lens part is a semi-ellipsoid structure, and the lens part is provided with a light refraction strengthening part on an outer surface of the lens part, the light refraction strengthening part extends from a top of the lens part along the outer surface of the lens part to a bottom of the lens part, and a cross section of the light refraction strengthening part is in a shape of annular wave; a light unit mounted in the cone-shaped cavity.

Abstract: A lens for distribution of light from a light emitter having an emitter axis. The lens comprising an inner surface and an output surface with faceted and smooth outer regions. At least one of the faceted outer regions is formed by a plurality of pairs of transverse outer regions extending in direction of a plane of bilateral symmetry of the lens. The inner surface defines an inner cavity about the emitter axis and has inner-surface stepwise discontinuities formed by a plurality of pairs of transverse inner regions with intersection regions therebetween. The lens may also have at least two secondary surface portions spaced apart and extending along two sides of the inner surface, the secondary surface portions being configured for total internal reflection (TIR) of light received from the inner surface.

Abstract: An optical device comprises: at least one first reflecting surface disposed so as to reflect first light that has a light distribution having an optical axis parallel to a first axis, to an arc-shaped first region surrounding the first axis; and a second reflecting surface and a third reflecting surface that are disposed such that the second reflecting surface and the third reflecting surface meet each other on the first axis, and such that the first reflecting surface is disposed between the second reflecting surface and the third reflecting surface.

Abstract: A luminaire module delivers light with a beam angle of ?. The luminaire module includes a light emitting module and a reflector positioned symmetrically about an axis. Light produced by the light emitting module exits the light emitting module from one or more spatially-extended light emitting portions. The light emitting portion(s) is (are) fully contained within a spatially extended notional design envelope which is used to guide the design of reflector and its corresponding reflective surface, such that when any light exiting the light emitting portions through the design envelope strikes the reflective surface of the reflector, the light does not return to the source and escapes from the luminaire module within a beam angle ?, with no more than a single reflection from a reflector.

Abstract: A projection display apparatus of the present disclosure includes a solid state light source that emits blue light in a first wavelength range; a wheel having a light-emitting body that emits emission light in a second wavelength range closer to the longer wavelengths than the first wavelength range is and adjacent to the first wavelength range, in response to irradiation with the blue light; a light uniformizing element that uniformizes the blue light and the emission light; a light modulation element that modulates light uniformized by the light uniformizing element; and a projection unit that projects the light modulated by the light modulation element. An end of the light-emitting body that the blue light enters has a dichroic coating that partly reflects the blue light and transmits emission light.

Abstract: Light guiding elements having a light guiding section extending between a light entrance surface for coupling in light and a light exit surface for coupling out light from the light guiding element through the light exit surface. The light exit surface extends along an exit surface longitudinal direction. The light guiding section has at least a first and a second lateral surface extending from the light entrance surface to the light exit surface such that light can be guided by total internal reflection from the light entrance surface to the light exit surface. The form of the light entrance surface differs from that of the light exit surface. The light guiding section has a roof section extending toward the light exit surface in which the first and the second lateral surfaces taper toward each other with respect to the exit surface longitudinal direction.

Abstract: A motion sickness countermeasure system for a user within a vehicle having a light array system configured to output visual stimuli presented in a field of view of the user; and a controller outputting a control signal to the light array system to activate the light array system in such a way as to mimic the visual input one would receive if one were to look outside the vehicle.

Abstract: A solid state light source device for generating a constant broad band light useful in multiple SLM projectors. The light source device includes a blue or UV/near UV excitation light and a moving plate carrying wavelength conversion materials to convert the excitation light into a broad band light. The wavelength conversion materials include red, green, yellow and/or blue phosphors, and may pass some of the blue excitation light. The broad band light outputted by the phosphor plate includes at least two primary color components and has a constant intensity and spectrum as a function of time. The solid state light source device further includes a second light source such as a blue light source, and a light combination device which combines the output light of the moving phosphor plate and the light from the second light source into one beam of constant, broad band light.

Abstract: To provide a projector which enables a stable projection for a long period of time, there is provided a projector comprising a light source unit, a display device, a projection-side optical system, a light guiding optical system and a projector control unit, wherein the light source unit comprises an excitation light source unit comprising an excitation light source and a microlens array and a rectangular green luminescent plate which receives light emitted from the excitation light source to emit light in a green wavelength band, and the microlens array is disposed between the excitation light source and the luminescent plate and has a plurality of micro convex lenses which each have a similar shape to the shape of the luminescent material layer are arranged into a matrix, so as to convert light from excitation light source into a plurality of pencils of light to shine them onto the luminescent plate.

Abstract: A projector in an illumination optical system includes a laser light source, a synchronization signal processor that converts synchronization signals that are synchronized with video signals input from outside the projector into video signals to be used inside the projector, an LD driver that controls a lighting state of the laser light source according to the synchronization signals output from the synchronization signal processor, an LED (Light Emitting Diode) light source, an LED driver that controls a lighting state of the LED light source according to the synchronization signals output from the synchronization signal processor, a rotational state detector that detects a rotational state of a phosphor wheel, and a phosphor wheel driver that, based on a detected result of the rotational state detector, controls the rotational state of the phosphor wheel.

Abstract: A projection-type image display apparatus includes a light source unit that emits light, an image generating unit that generates image light according to an input video signal, a light-guide optical system that guides the light from the light source unit to the image generating unit, and a projection optical system that projects the image light generated by the image generating unit. The light source unit includes a light source that produces light, phosphor that is excited by the light from the light source, and a dichroic mirror that directs the light from the light source to the phosphor. The dichroic mirror is arranged with an incident angle of the light from the light source being 50° or more and 60° or less.

Abstract: A light emitting device includes a first semiconductor layer, an active layer, and a second semiconductor layer, and first and second electrodes electrically connected to the first and second semiconductor layers, respectively. The second electrode includes a reflective pad portion, a transparent electrode layer, a reflective finger portion and an electrode pad portion. The reflective pad portion is disposed in a region of an upper surface of the second semiconductor layer. The transparent electrode layer is disposed on the second semiconductor layer and has an opening encompassing the reflective pad portion such that the transparent electrode layer is not in contact with the reflective pad portion. The reflective finger portion extends from the reflective pad portion and has at least a portion thereof disposed on the transparent electrode layer. The electrode pad portion covers the reflective pad portion to be in contact with the transparent electrode layer.

Abstract: Lighting devices including light-emitting diodes and associated devices, systems, and methods are disclosed herein. A lighting device configured in accordance with a particular embodiment includes a lighting-emitting diode and an optical component along a radiation path of the lighting-emitting diode. The optical component includes a color-converting material with walls defining a pattern, the walls extending generally entirely through a thickness of the color-converting material. A total surface area of the walls within a primary zone of the optical component is greater than a total surface area of color-converting features at a major side of the color-converting material. A method for making a lighting device in accordance with a particular embodiment includes combining an optical component and a light-emitting diode, and shaping a color-converting material of the optical component to have a thickness and a pattern of walls selected to control the color of light output from the lighting device.

Abstract: A method for fabricating a process substrate includes: providing a first substrate; providing a substrate and an auxiliary substrate; contacting the substrate and the auxiliary substrate with each other in a vacuum state, thereby forming micro spaces of a vacuum state between the substrate and the auxiliary substrate; and increasing a pressure at the outside of the contacted substrate and auxiliary substrate to attach the substrate and the auxiliary substrate to each other by a pressure difference between the micro spaces and the outside of the contacted substrate and auxiliary substrate.

Abstract: The present invention is directed to a display device assembly which comprises a display device and a luminance enhancement structure. The luminance enhancement structure is directly laminated onto an ITO layer with an adhesive. The assembly of the present invention provides improved performance of the luminance enhancement structure.

Abstract: A light emitting apparatus comprises an electrically insulating base member; a pair of electrically conductive pattern portions formed on an upper surface of the base member; at least one light emitting device that is electrically connected to the pair of electrically conductive pattern portions; and a resin portion that surrounds at least a side surface of the at least one light emitting device and partially covers the pair of electrically conductive pattern portions. Each of the pair of electrically conductive pattern portions extends toward a periphery of the base member from resin-covered parts of the electrically conductive pattern portions. At least the resin-covered parts of each of the electrically conductive pattern portions has at least one elongated through hole extending in a direction in which the electrically conductive pattern portions extend from the resin-covered parts, wherein the resin portion contacts the base member via the through holes.

Abstract: A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.

Abstract: The present invention relates to a polarized light emitting diode (LED) device and the method for manufacturing the same, in which the LED device comprises: a base, a light emitting diode (LED) chip, a polarizing waveguide and a packaging material. In an exemplary embodiment, the LED chip is disposed on the base and is configured with a first light-emitting surface for outputting light therefrom; and the waveguide, being comprised of a polarization layer, a reflection layer, a conversion layer and a light transmitting layer, is disposed at the optical path of the light emitted from the LED chip; and the packaging material is used for packaging the waveguide, the LED chip and the base into a package.

Abstract: A pixel structure including a substrate, a color filter layer, a conductive light-shielding layer, a buffer layer, a scan line, a data line, an active device, and a pixel electrode is provided. The substrate has a pixel region. The color filter layer is disposed corresponding to the pixel region. The conductive light-shielding layer is disposed corresponding to the periphery of the pixel region. The buffer layer covers the conductive light-shielding layer and color filter layer. The scan line and the data line are disposed on the buffer layer. The active device is disposed on the buffer layer and electrically connected to the scan line and data line. The pixel electrode is disposed on the buffer layer and electrically connected to the active device, wherein an overlapping area between the pixel electrode and the conductive light-shielding layer constitutes a storage capacitor. A method for manufacturing the pixel structure is also provided.

Abstract: A pixel structure including a substrate, a color filter layer, a conductive light-shielding layer, a buffer layer, a scan line, a data line, an active device, and a pixel electrode is provided. The substrate has a pixel region. The color filter layer is disposed corresponding to the pixel region. The conductive light-shielding layer is disposed corresponding to the periphery of the pixel region. The buffer layer covers the conductive light-shielding layer and color filter layer. The scan line and the data line are disposed on the buffer layer. The active device is disposed on the buffer layer and electrically connected to the scan line and data line. The pixel electrode is disposed on the buffer layer and electrically connected to the active device, wherein an overlapping area between the pixel electrode and the conductive light-shielding layer constitutes a storage capacitor. A method for manufacturing the pixel structure is also provided.

Abstract: This invention relates to a semiconductor light-emitting device including a semiconductor light-emitting chip and a transparent carrier. The semiconductor light-emitting chip includes an active layer and transparent substrate. The active layer emits light under a bias. At least a portion of the light emitted from the active layer enters into the transparent carrier through the transparent substrate. The semiconductor light-emitting chip is coupled to the transparent carrier through the transparent substrate. The area of the transparent carrier is larger than that of the active layer.

Abstract: A light-emitting diode (LED) cutting method includes the following steps: positioning and retaining an LED die or an LED epitaxial substrate on a die retainer; introducing a liquid medium for preventing reflection of sound wave between a cutting tool and the die; activating a power source to drive a magnetostrictive material or piezoelectric ceramic material mounted on a machine to serve as a kinetic source by inducing volume expansion/compression that generates an up-and-down piston-like movement; and operating the cutting tool having super hard micro-particles of diamond, CBN, or SiC electroformed on the cutting tool to perform breaking cutting on an LED workpiece.

Abstract: A light emitting device includes a plurality of LEDs that each emit light. A wavelength conversion member converts wavelengths of at least part of the light emitted from the LEDs to at least one other wavelength, and outputs light obtained by combining light having at least two wavelengths emitted from the wavelength conversion member. At least part of a light emitting surface of the wavelength conversion member has a surface state that differs from other parts of the light emitting surface.

Abstract: A light emitting device includes a substrate elongated in a lengthwise direction; a plurality of LED chips disposed on the substrate in an intermediate region in widthwise direction, and aligned along the lengthwise direction at a distance of 80 ?m or less; and interconnection wirings formed on regions outside the intermediate region in the widthwise direction; wherein each of the LED chips has a p-side electrode disposed on the substrate, a p-type semiconductor layer disposed on the p-side electrode, an active layer formed on the p-type semiconductor layer, and an n-type semiconductor layer formed on the active layer, and has a region in which the n-type semiconductor layer, the active layer, and the p-type semiconductor layer are patterned, and an n-side electrode formed selectively on a surface of the n-type semiconductor layer and connected to the p-side electrode of an adjacent LED chip through the interconnection wiring.

Abstract: An LED lighting device A1 includes a plurality of LED chips 32, an LED unit 2 in which the LED chips 32 are mounted, and a mount 1 holding the LED unit 2. This arrangement allows the appearance or structure of the LED lighting device to be adapted for various applications. For instance, the LED lighting device may be mounted on an indoor ceiling to illuminate the floor surface or an upper part of a wall surface.

Abstract: Lighting devices including light-emitting diodes and associated devices, systems, and methods are disclosed herein. A lighting device configured in accordance with a particular embodiment includes a lighting-emitting diode and an optical component along a radiation path of the lighting-emitting diode. The optical component includes a color-converting material with walls defining a pattern, the walls extending generally entirely through a thickness of the color-converting material. A total surface area of the walls within a primary zone of the optical component is greater than a total surface area of color-converting features at a major side of the color-converting material. A method for making a lighting device in accordance with a particular embodiment includes combining an optical component and a light-emitting diode, and shaping a color-converting material of the optical component to have a thickness and a pattern of walls selected to control the color of light output from the lighting device.

Abstract: The present invention provides a substrate for array process of panel display device, which includes a cell switch set and a PVSA mode pad set. Cell switch set includes a plurality of switch elements. PSVA mode pad set includes a data scan pad and a common electrode pad. Data scan pad is connected through some switch elements of cell switch set to a plurality of scan lines and data lines. Common electrode pad is connected through switch element to common electrode line in the area. The present invention further provides a panel display device and manufacturing method of liquid crystal display panel. In this manner, the present invention reduces the number of pads in PSVA mode pad set to simplify peripheral routes.

Abstract: The present invention provides a panel and panel manufacture method, including: completing thin film transistor array and common electrode on glass substrate, forming adjacent substrate pair, adjacent substrate pair including first substrate and second substrate connected by adjacent line, common electrodes on first substrate and second substrate symmetrically distributed with respect to adjacent line; coating a first seal on peripheral area of adjacent substrate pair, coating a second seal along adjacent sides of first substrate and second substrate, second seal and first seal being partially overlapping, at least one of first seal and second seal including conductive particles; boxing adjacent substrate pair and filter substrate pair so that conductive particles conducting common electrodes of adjacent substrate pair and filter substrate pair; cutting adjacent substrate pair and filter substrate pair along adjacent lines to form panel. The present invention also provides a liquid crystal display panel.

Abstract: A method for producing a semiconductor optical device includes a first etching step of etching a stacked semiconductor layer with a first mask to form a stripe-shaped optical waveguide, the stripe-shaped optical waveguide including first and second stripe-shaped optical waveguides formed on first and second regions of a substrate, respectively; a step of forming a second mask on the stacked semiconductor layer with the first mask left; and a second etching step of etching the stacked semiconductor layer on the first region with the first and second masks. The second mask has a pattern for forming a mesa structure and includes an opening including first and second opening edges remote from side surfaces of the first stripe-shaped optical waveguide. The mesa structure is formed of the first stripe-shaped optical waveguide in the second etching step. The second stripe-shaped optical waveguide formed in the first etching step has a ridge structure.

Abstract: A pixel structure including a substrate, a color filter layer, a conductive light-shielding layer, a buffer layer, a scan line, a data line, an active device, and a pixel electrode is provided. The substrate has a pixel region. The color filter layer is disposed corresponding to the pixel region. The conductive light-shielding layer is disposed corresponding to the periphery of the pixel region. The buffer layer covers the conductive light-shielding layer and color filter layer. The scan line and the data line are disposed on the buffer layer. The active device is disposed on the buffer layer and electrically connected to the scan line and data line. The pixel electrode is disposed on the buffer layer and electrically connected to the active device, wherein an overlapping area between the pixel electrode and the conductive light-shielding layer constitutes a storage capacitor. A method for manufacturing the pixel structure is also provided.

Abstract: An LED package includes a substrate, an LED chip, and an encapsulation. The substrate includes a first surface. The LED chip is mounted on the first surface of the substrate. The encapsulation covers the LED chip. The encapsulation includes a transparent main body and a number of carbon nanotubes distributed in the transparent main body; the carbon nanotubes are arranged substantially extending along a same direction whereby light generated by the LED chip is polarized prior to radiation out of the encapsulation.

Abstract: The present invention relates to a display device, which includes a substrate; a first conductive layer disposed on the substrate and including a first terminal; a first insulating layer disposed on the first conductive layer; a second conductive layer disposed on the first insulating layer and including a second terminal; a second insulating layer disposed on the second conductive layer; a profile relieving member disposed on the second insulating layer; and a contact assistant disposed on the profile relieving member, in which the profile relieving member covers a portion of an edge of at least one of the first terminal and the second terminal.

Abstract: An optical device is equipped with a light receiving region 16a and a peripheral circuit region 22 located around the light receiving region 16a on a major surface of an light receiving element 11a; electrodes for external connection 15 electrically connected to the peripheral circuit region 22 formed on a back surface opposite to the major surface of the light receiving element 11a; a transparent member 12 covering the light receiving region 16a adhered on the major surface of the light receiving element 11a with a light-transmitting adhesive 13; and a molding resin 14 for coating side surfaces of the transparent member 12 and the major surface of the light receiving element 11a excluding the region covered with the transparent member 12.

Abstract: A method of forming an active matrix, light emitting diode (LED) array includes removing, from a base substrate, a layer of inorganic LED material originally grown thereupon; and bonding the removed layer of inorganic LED material to an active matrix, thin film transistor (TFT) backplane array.

Abstract: An anisotropic conductive film is provided that does not have a light-reflecting layer on a light emitting diode element which causes costs to increase when a light emitting device that uses an LED element is flip-chip mounted, and that does not cause emission efficiency to deteriorate. Further, a light emitting device that uses such an anisotropic conductive film is provided. This anisotropic conductive film has a structure in which a light-reflecting insulating adhesive layer and an anisotropic conductive adhesive layer are laminated, wherein the light-reflecting insulating adhesive layer has a structure in which light-reflecting particles are dispersed in an insulating adhesive. The light emitting device has a structure in which a light emitting diode element is flip-chip-mounted on a substrate, with this anisotropic conductive film provided between a connection terminal on the substrate and a bump for connection of the light emitting diode element.

Abstract: A backlight module comprises a back plate, a first light source module, and an optical component. The optical component includes a side surface and a bottom surface perpendicularly connected to the side surface. The first light source module comprises a plurality of first LEDs disposed on the back plate and at the side surface of the optical component for emitting light at a first wavelength toward the side surface of the optical component. The light is directed in a specific direction by the optical component and then sent out from an emitting surface. The backlight module further comprises a second light source module. The second light source module comprises a plurality of second LEDs disposed near the bottom surface of the optical component for emitting light at a second wavelength toward the bottom surface of the optical component. Light produced after the light at the first wavelength mixes with the light at the second wavelength becomes white light after passing through the optical component.

Abstract: An array substrate includes a base substrate and a contact part. The contact part is disposed on the base substrate. The contact part includes a first metal pattern, a disconnection control pattern and a connecting pattern. The second metal pattern is disposed on a layer different from the first metal pattern, the disconnection control pattern overlaps a side surface of the second metal pattern and a connecting pattern is formed on the first and second metal patterns and the disconnection control pattern and connects the first metal pattern with the second metal pattern.

Abstract: Provided is an optical integrated device comprising a first waveguide that is formed on a substrate and includes a first optical path; an electrode formed on the first waveguide; a second waveguide that is formed on the substrate and includes a second optical path; and a transparent waveguide that is formed on the substrate between the first waveguide and the second waveguide, and includes a transparent core that serves as an optical path and is formed of a material having higher bandgap energy than the first optical path. The electrode is formed above the first waveguide and is not formed above the transparent waveguide, and elements including the first waveguide are optically active elements that operate according to current injected thereto.

Abstract: A light emitting element in use for an LED array comprises an electrode layer, a semiconductor light emitting layer consisting of a p-type semiconductor layer, an active layer and an n-type semiconductor layer, a first wiring layer formed along and in parallel to one side of the semiconductor light emitting layer, and a plurality of second wiring layers extending from the first wiring layer to the semiconductor light emitting layer and electrically connected to the n-type semiconductor layer on a surface of the semiconductor light emitting layer, wherein a plane shape of the semiconductor light emitting layer comprises two short sides including a portion inclined from a line perpendicular to a upper and a lower sides, and a vertical line from a vertex where the upper side and the short side meet crosses the lower side of the adjacent light emitting element.

Abstract: A light emitting diode (LED) package including a carrier, at least one LED chip, and a light guide element is provided. The LED chip is disposed on the carrier. The light guide element including a light transmissive body, a light integration part, a reflective film, and a support part is disposed on the carrier and above the LED chip. The light integration part connected to the light transmissive body and disposed between the light transmissive body and the LED chip has a light incident surface facing the LED chip and at least one side. The side connects the light transmissive body and the light incident surface. The reflective film is disposed on the side. The support part leaning on the carrier is connected to the light transmissive body and surrounds the light integration part. The light transmissive body, the light integration part, and the support part are integrally formed.

Abstract: Provided is a light emitting device having strong bonding strength between the light emitting element and the wavelength converting member is provided. In the light emitting device, a light emitting element and a wavelength converting member are bonded. Particularly, the light emitting element has, from the wavelength converting member side, a first region and a second region, the wavelength converting member has, from the light emitting element side, a third region and a fourth region. The first region has an irregular atomic arrangement compared with the second region, the third region has an irregular atomic arrangement compared with the fourth region, and the first region and the third region are directly bonded.

Abstract: A method for manufacturing a semiconductor optical device includes the steps of growing a stacked semiconductor layer on a substrate having a cleavage direction in a first direction; forming a first mask having a plurality of openings arranged in the first direction; forming a mark array by etching the stacked semiconductor layer using the first mask; forming a second mask having first and second openings extending in a second direction intersecting the first direction; forming first and second grooves, and a waveguide mesa by etching the stacked semiconductor layer using the second mask; and producing a laser diode bar by cleaving a substrate product including the waveguide mesa. First and second residual marks are formed on the upper surface of the waveguide mesa. First and second transfer marks are formed on the bottoms of the first and the second grooves, respectively.

Abstract: According to one embodiment, a display device includes a main substrate, and a light control layer. The main substrate includes a main base having a main surface, a wavelength selective transmission layer provided on the main surface, and a circuit layer provided on the wavelength selective transmission layer. The light control layer is stacked with the main substrate and has variable optical characteristics. The wavelength selective transmission layer includes lower and upper reflecting layers, and first and second spacer layers. The upper reflecting layer is provided on the lower reflecting layer. The first spacer layer is provided between the lower and upper reflecting layers. The second spacer layer is provided between the lower and upper reflecting layers, and has a different thickness from the first spacer layer. The circuit layer includes first and second pixel electrodes, and first and second switching elements.

Abstract: A radiation-emitting component (10) having a layer stack (1) which is based on a semiconductor material and which has an active layer sequence (4) for generating electromagnetic radiation, and a filter element (2) which is arranged after the active layer sequence (4) in the irradiation direction (A) and by means of which a first radiation component is transmitted, and a second radiation component is reflected into the layer stack (1), wherein the second radiation component is subjected to a deflection process or an absorption and emission process, and the deflected or emitted radiation impinges on the filter element (2).