Abstract: An HF housing coupler having a connector part connected to a housing is described, which has a connecting structure, via which a coaxial plug can be detachably connected to the connector part in a fixed manner. The invention is distinguished in that the connector part is implemented as a component differentiable from the housing, and provides at least one region which at least sectionally forms a formfitting connection with a housing wall which can be associated with the housing.

Abstract: A cover for a portable electronic device is disclosed. The cover can include at least one electrical component. For example, in one embodiment, an electrical component can be embedded in the cover. When the cover is placed on or mated with the portable electronic device, the electrical component embedded in the cover is able to interact with electrical circuitry of the portable electronic device. Advantageously, the cover can not only provide a protective and/or ornamental covering for the portable electronic device but can also augment the electrical capabilities of the portable electronic device.

Abstract: A method of fabricating a photovoltaic panel is disclosed which is formed by arranging a number of granular photovoltaic devices in an array and forming the array into the shape of a panel from a transparent resin and includes each photovoltaic device having a part protruding from the resin.

Abstract: This invention relates to a method for coating an elastomeric component with a coating that has a low coefficient of friction and the articles formed by the method. The method includes preparing an elastomeric coating; applying the coating to a substrate; contacting the coated substrate with an elastomeric compound; and heating the elastomeric compound and the coated substrate under pressure to bond the coating to the elastomeric compound and form a coated elastomeric component.

Abstract: A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Abstract: A housing, functioning as an antenna includes an antenna base including two protruding flanges. The housing is formed by injection molding a molten plastic material over and around the antenna base, whereby the antenna base is embedded in the housing, and the protruding flanges are exposed out of the housing. A method for fabricating the housing is also described.

Abstract: A method of fabricating an electronic entity includes the steps of: forming at least part of the entity by hardening a material (28) in a mold, and (26); personalizing the entity while in the mould (26). A corresponding device is also described.

Abstract: An improved compliant pin strip and process for making an electrical package having a printed circuit board encased in a housing and pin connectors mechanically and electrically connected to the printed circuit board and extending outwardly away from an outer surface of the housing is provided. This involves the use of a compliant pin strip having a dam bar that defines surfaces for a molding tool to close on and seal a mold cavity. The pin strip with dam bar enables a simplified, cost effective, and more robust manufacturing process.

Abstract: A potted electrical circuit is enclosed within a housing and has a first and second fiberglass layer that is laid upon a top surface of the potted electrical circuit. A lid of the housing seals the electrical circuit there within and an opening formed in a side wall allows circuitry wiring to extend there from out. The first fiberglass layer is a woven layer while the second fiberglass layer is a padding-like layer. Circuitry wiring pushes through the woven first fiberglass layer before extending out through the opening in the housing. The first fiberglass layer is tucked in and around the electrical circuit and adheres to the inside of the housing by attaching to the potting material while it hardens. In a preferred embodiment, the electrical circuit in combination with the insulation material is used within a transient voltage surge suppression device.

Abstract: Medical devices having electrically conductive pathways are disclosed. More particularly, the disclosure is directed to catheter shafts including an electrically conductive wire embedded in a polymeric tube. The disclosure is also directed to catheter shafts including an electrically conductive media coextruded in a polymeric tube. The disclosure is also directed to catheter shafts including electrically conductive pathways formed with electrically conductive ink, paste, adhesive and/or epoxy.

Abstract: A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity.

Abstract: A process for manufacturing an elastomeric sleeve of a joint for electrical cables. The sleeve has an electric field-control element, an electrical insulating element surrounding the electric field-control element, and at least a semiconductive element having two stress control screens. The process includes providing the electric field-control element and the two stress control screens on a supporting element; introducing the supporting element into a mold provided for molding the electrical insulating element; filling with the electrical insulating material the space radially external to the electric field-control element and the stress control screens, the step of filling being carried out during the step of introducing; curing the electrical insulating material to obtain the electrical insulating element of the elastomeric sleeve. An apparatus for carrying out the process for manufacturing is also disclosed.

Abstract: An overmoulded cable trap (302) for improved performance of an RF trap (102) is disclosed, wherein the RF trap (102) is placed on a section of an electrical cable (104) and fixed in position by overmoulding a thermoplastic material over both the RF trap (102) and the section of the electrical cable (104). The overmoulded cable trap (302) disclosed herein provides an RF trap (102) that has better shock protection, increased resistance to moisture, improved smoothness, is easier to handle and clean, is cheaper, can be created in very small packages where space is limited, can be easily sized to a range of diameters and lengths, is more reliable with respect to maximum rated voltage and less electromagnetic coupling to the environment, and generates less heat, than other designs of RF traps.

Abstract: A method of assembling and sealing a circuit board within a housing includes the steps of placing the circuit board within the housing, filling the space above the circuit board or around the circuit board with a potting material, and then exhausting that cavity of gases during a curing process of the potting material. Exhausting of the gases is performed and accommodated by a vent opening. An access opening is in communication with the vent opening and provides for the injection of sealant to block the vent opening.

Abstract: In one embodiment, a method for forming a leaded molded array package includes placing a lead frame assembly into a molding apparatus having lead cavities. The method further includes forming seals between conductive leads within the lead frame assembly and the lead cavities, and encapsulating the lead frame assembly to form a molded array assembly. The molded array assembly is then separated into individual leaded molded packages.

Abstract: An electrical connector including a plurality of electrical contacts; and a housing. The housing includes a pre-mold housing member which has been overmolded onto the electrical contacts; and an overmold housing member which has been overmolded onto the electrical contacts and the pre-mold housing member. The pre-mold housing member comprises an exterior sealing surface which is not covered by the overmold housing member. The exterior sealing surface of the pre-mold housing member loops around an exterior lateral side of the housing which is between front and rear ends of the housing.

Abstract: An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.

Abstract: The present invention relates to an insert-molded cover (10) for electronic devices. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed with the metallic body. The metallic body includes a joining area (13) on an edge of the metallic body, the plastic antenna lid includes at least two portions (12a, 12b) formed in the joining area correspondingly. The present invention also relates to a method for manufacturing an insert-molded cover for electronic devices.

Abstract: The present invention relates to an insert-molded cover (10) for a electronic device. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed on an edge of the metallic body. An outer surface (101) of a junction of the metallic body and the plastic antenna lid is smooth and painted by a coating (13). The present invention also relates a method for manufacturing an insert-molded cover for electronic devices.

Abstract: The present invention relates to an insert-molded cover (10) for a electronic device. The insert-molded cover includes a metallic body (11) and a plastic antenna lid (12) integrally formed on an edge of the metallic body. At least one latching structure (13, 14, 15, 16) is formed on a boundary of the metallic body and the plastic antenna lid. The present invention also relates a method for manufacturing an insert-molded cover for electronic devices.

Abstract: An over-molded electronic module (2) includes a frame (10), an electronic assembly (20), and a polymeric body (32). The frame (10) includes a sidewall (14) that defines an opening (12) to provide a position for the electronic assembly (20), and includes an upper face (16) and a lower face (18) opposite the upper face (16) to act as sealing surfaces during over-molding. The polymeric body (32) is formed of a polymeric composition encapsulating both sides of the electronic assembly (20) and a portion of the frame (10).

Abstract: An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.

Abstract: A reinforced assembly carrier is provided. A supporting frame made of molding compound is formed on the edge area of the upper surface and/or on the edge area of the lower surface of the assembly carrier thereby enhancing the mechanical strength of the assembly carrier.

Abstract: An actuator/coil assembly (136) is disclosed where two different bonding operations are used. First, a bobbin (164) is overmolded to a coil (172), and a first overmolded part (176) is overmolded to both the coil (172) and a fan tail (152) of the actuator (140). The overmolding operation defines one or more adhesive receptacles (168) in the bobbin (164) on a perimeter that interfaces with the coil (172), and further defines one or more adhesive receptacles (180) in the first overmolded part (176) on a perimeter that interfaces with the coil (172) and that interfaces with the fan tail (152) of the actuator (140). Adhesive (184) is disposed within these receptacles (168, 180) to increase the stiffness of the actuator/coil assembly (136).

Abstract: An electrosurgical electrode shroud including a hollow substantially cylindrical member having a first end portion and a second end portion; the first end portion defining an opening which is configured and dimensioned to receive an electrosurgical electrode assembly therein; the second end portion defining an opening which is configured and dimensioned to receive an electrode mounting portion of an electrosurgical instrument, wherein at least the second end portion is formed of a substantially translucent material. The electrosurgical electrode shroud may further include visual or tactile indicator on the second end portion for indicating a depth of penetration of the electrosurgical instrument within the second end portion when viewed by the surgeon through the translucent material.

Abstract: First, a horizontal nozzle is inserted between an upper mold section and a lower mold section in a horizontally extending state. Then, liquid resin is horizontally discharged from a discharge port of the horizontal nozzle. Thus, the liquid resin is supplied into a cavity. Thereafter the upper mold section and the lower mold section are closed. Consequently, an electronic component mounted on a substrate is dipped in the liquid resin stored in the cavity. Therefore, the electronic component is resin-sealed on the substrate by compression molding.

Abstract: A method is provided for the punching of a bridge break and thereafter sealing the bridge break during the injection molding process of the lead frame. The bridge breaking tool is placed over the bridge that is to be broken. The collar presses down on the circuit and the punch presses down on the bridge with enough force to form the bridge break. Once the bridge break is formed the punch is retracted from the cavity of the template and molten polymer is injected to flow around the ends of the bridge break. The bridge breaking tool's hold down collars and retracted punch form a molding area for molten polymer to flow over the bridge break and the exposed circuit area. The bridge breaking tool is retracted after the bridge break is encased in the cured molten polymer and the cured molten polymer forms a lead frame structure.

Abstract: A casing with a shielding function, a method for manufacturing the same and an electronic device using the same are disclosed. The electronic device has at least an electronic element and a casing. The casing includes a casing substrate and a film integrally formed with the casing substrate via an in-mold decoration process. The film includes a shielding layer for providing an electromagnetic shielding function for the electronic element and an adhesive layer for combining the casing substrate and the shielding layer.

Abstract: A method is provided to produce a hermetic encapsulation for an electronic component, which may be an optical and at least partially light-permeable component or a surface wave component, comprises attaching and electrically contacting a component based on a chip to a carrier comprising electrical connection surfaces, such that a front of the chip bearing component structures facing the carrier is arranged to clear it, covering a back of the chip with a film made of synthetic material, such that edges of the film overlap the chip; tightly bonding the film and carrier in an entire edge region around the chip; structuring the film such that the film is removed around the edge region in a continuous strip parallel to the edge region; and applying a hermetically sealing layer over the film, such that this layer hermetically terminates with the carrier in a contact region outside of the edge region.

Abstract: An optical reagent format with a precise capillary channel is made by molding a format on a carrier of a precise predetermined thickness. The carrier includes an insert at least a portion of which is molded in the format. Once the format is made, the insert is detached from the carrier and removed from the format leaving a precisely dimensioned capillary channel with an inlet and vent. A reagent may be applied in the capillary channel and the format used to measure the analyte in a fluid such as blood. An electrochemical sensor with a capillary channel is formed by placing a sacrificial insert and electrodes on a sensor base and applying plastic material. After the plastic material is cured, the sacrificial is removed leaving a capillary channel in the sensor. The inserts may be removed by a tool including a clamp for clamping and holding each insert stationary and a sliding block to which the sensor is secured.

Abstract: An electromagnetically shielded cable includes a shell having an end portion and a shield embedded in the end portion of the shell. A method of forming the electromagnetically shielded cable is also provided. The method includes the steps of inserting the end portion of the shield into a mold, and embedding the end portion of the shield in the shell. In one embodiment, the shell includes a connector extending from the shell and through an opening defined by the shield for embedding the shield in the shell. In another embodiment, the shield is embedded directly in the end portion of the shell.

Abstract: The present invention relates to the use of polyamide compositions comprising at least one semi-aromatic polyamide and at least one aliphatic semi-aromatic polyamide for making molded articles made of at least two moulded parts adhered to each other having improved adhesion.

Abstract: The invention relates to a method for encapsulating electrical and/or electronic components in a housing, the components being arranged on a printed circuit or a strip conductor in an assembly. Said assembly is positioned in the housing and is encapsulated with a curing, electrically insulating moulding compound. The method according to the invention is characterized by encapsulating preferably in a molding chamber at a pressure below atmospheric pressure and by removing the negative pressure after encapsulation and before curing.

Abstract: An electrically conductive composite material includes metallic nanostrands distributed throughout a matrix constructed of a polymer, ceramic, or elastomer. The nanostrands may have an average diameter under four microns and an average aspect ratio over ten-to-one. Larger fibers may also be included to enhance electrical conductivity or other properties. The nanostrands and/or fibers may be magnetically oriented to enhance electrical conductivity along one direction. A pressure sensor may be formed by utilizing an elastomer for the matrix. Electrical conductivity through the composite material varies in proportion to deflection of the elastomer. A composite material may be applied to a surface as an electrically conductive paint. Composite materials may be made by cutting a blank of the nanostrands to the desired shape, inserting the matrix, and curing the matrix. Alternatively, a suspension agent may first be used to dispose powdered nanostrands in the desired shape.

Abstract: Segments formed on a wiring substrate are arranged in a staggered array, and tie bars are provided between the segments.

Abstract: A patch and method for mounting an electronic monitoring device to the innerliner of a pneumatic tire is provided wherein the monitoring device is potted directly to an attachment patch. A frame is built on an attachment patch and the electronic monitoring device is disposed inside the frame. An encapsulation material is poured into the frame and cured to encapsulate the monitoring device directly against the patch. The patch may then be connected to the innerliner of a pneumatic tire.

Abstract: A ground coil device for a magnetic levitation railway that can be manufactured with a high productivity and exhibit less fluctuation in strength, reduced weight, and good recyclability, and a process for manufacturing the device. The ground coil device includes a coil conductor covered with a thermoplastic resin molding material containing 100 parts by mass of a thermoplastic resin, from 20 to 200 parts by mass of an inorganic filler, and from 0 to 25 parts by mass of an elastomer. A process for producing the ground coil device for magnetic levitation railway includes filling the thermoplastic resin molding material into a cavity of a metal mold into which the coil conductor is previously inserted, by an injection molding method, to obtain an integrally molded product.

Abstract: The invention provides a unitized membrane electrode assembly having a first gas diffusion backing having sealing edges; a polymer membrane; a second gas diffusion backing having sealing edges; a first electrocatalyst coating composition present at the interface of the first gas diffusion backing and the polymer membrane; a second electrocatalyst coating composition present at the interface of the second gas diffusion backing and the polymer membrane; and a thermoplastic polymer, fluid impermeable, seal, wherein the thermoplastic polymer is impregnated into the sealing edges of the first and second gas diffusion backings, and the seal envelops a peripheral region of both the first and second gas diffusion backings and the polymer membrane.

Abstract: The antenna module fabrication for a wireless electronic device includes setting up the antenna and the assembly base that is to connect the antenna to the designated circuit board. The antenna and the assembly base are two independent pieces, and the positioning parts are for positioning so that the antenna and assembly base are one body. The antenna module of the invention can achieve the advantages such as simple production, cost effectiveness, prevention of the antenna module from deforming and quality improvement.

Abstract: A printing device, a production unit and a production method of electronic parts suitable for production of precise electronic parts are provided. A squeegee is attached to a rotating machine, and is autorotated and self-driven, and moreover, a printing pressure is generated in the squeegee, and resin is strongly filled, thereby achieving a print having a precision-shape. Further, with a perforated plate as a boundary, upper and lower chambers are provided so as to control a pressure, thereby performing cutting and dispensing of the resin and achieving a print having a precision-shape. This method is applied to the packaging of electronic parts.

Abstract: An electrical connector including a plurality of electrical contacts; and a housing. The housing includes a pre-mold housing member which has been overmolded onto the electrical contacts; and an overmold housing member which has been overmolded onto the electrical contacts and the pre-mold housing member. The pre-mold housing member comprises an exterior sealing surface which is not covered by the overmold housing member. The exterior sealing surface of the pre-mold housing member loops around an exterior lateral side of the housing which is between front and rear ends of the housing.

Abstract: A method for assembling a microelectronic device is provided comprising the step of adhering a die to a substrate using a convex die attachment process. The convex die attachment process generally comprises a) providing a die having an underfill material thereon, b) picking up and inverting the die, c) heating the underfill until it liquefies at least slightly and forms a convex surface, and d) placing the die on a substrate.

Abstract: A molding composition suitable for encapsulating solid state devices includes an epoxy resin, a hardener, a poly(arylene ether) resin comprising less than 5 weight percent of particles greater than 100 micrometers, and about 70 to about 95 weight percent of a silica filler, based on the total weight of the composition. After curing, the composition exhibits improved increased copper adhesion and reduced shrinkage compared to conventional molding compositions.

Abstract: This invention involves encapsulating an RFID device in an encapsulating material by known encapsulating processes to form a domed, encapsulated RFID tag. The encapsulating material may be translucent or opaque, flexible or hard, and has minimal effect on transmission or reception of radio frequency (RF) signals. The invention further involves a stand-off bracket, composed of one or more materials that have minimal effect on transmission or reception of RF signals, for mounting an RFID device on or near materials that impede RF transmission and reception. The encapsulated RFID tag and stand-off bracket, separately, may have an adhesive or other attachment means on one of their surfaces so that they may be adhered or otherwise attached to another surface. In one application, an encapsulated RFID tag in the 860-928 MHz range is mounted on a stand-off bracket and may be used for tracking items to which it is attached.

Abstract: In a saturated polyester resin or a composition with the saturated polyester resin as the main component for molding, the melt viscosity at 200° C. is at least 5 dPa·s and not more than 1000 dPa·s, and the product a×b is at least 500 where a (N/cm2) is the tensile breaking strength and b (%) is the tensile breaking elongation of a film shape formed product. Preferably, the polyester resin has a glass transition temperature of not more than ?10° C., a melting point of at least 70° C. and not more than 200° C., and an ester group concentration of at least 1000 equivalents/106 g and not more than 8000 equivalents/106 g. A material superior in water resistance, electrical insulation, durability, working environment and productivity as a molding material for an electric electronic component having a sophisticated configuration is provided.

Abstract: An encapsulant is described for an optoelectronic device or optical component, which provides a coefficient of thermal expansion of less than 50 ppm/° C., with a variation of less than ±30%, and further provides an optical transmittance of at least 20% at a wavelength in the range of 400 to 900 nm, at an encapsulant thickness of about 1 mm. The encapsulant includes a filler consisting essentially of glass particles having diameters smaller than 500 ?m, being essentially free of titania and lead oxide, and having a refractive index in the range of 1.48 to 1.60, with a variance of less than about 0.001.

Abstract: A partially overmolded component having a precisely defined overmolding edge includes a component having a protruding elongate rib and the overmolding having a terminal edge abutting the protruding elongate rib. The rib defines surfaces that provide a greater area of contact between the component and an overmolding tool and a more tortuous flow path to bleed-through.

Abstract: A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations

Abstract: A method for making a reinforced composite separator plate is disclosed. According to the method, a reinforcement media (16) is molded into a composite material (22, 24) such as graphite embedded in a thermoplastic or thermosetting polymer resin matrix. The composite material is placed in a mold cavity (15, 17) such that the composite material flows through the reinforcement media. The separator plate is molded into a net step. The molding is performed via injection or compression moulding, or a combination of both.

Abstract: A method of manufacturing a terminal block for a telecommunication cable comprising the steps of providing a mold having a first half and a second half, each forming a respective body cavity configured to form a terminal block and configured to receive a substrate comprising a plurality of openings adapted to receive an insulated electrical contact. A plurality of projections extend from the first half into the cavity, wherein the plurality of projections are adapted to remove a portion of insulation from the electrical contact positioned within each of the openings. The substrate is positioned in the mold and the insulated electrical contact is inserted into each of the openings. The mold is closed such that the plurality of projections remove a portion of the insulation from the insulated electrical contact upon closing of the mold. A dielectric material is then injected into the mold containing the substrate and insulated electrical contact to form a terminal block.