Abstract: An aluminum-plastic composite structure includes an aluminum portion and a plastic portion. The aluminum portion defines a plurality of micro grooves by ultraviolet lithography. The plastic portion is integrally formed on the aluminum portion and substantially filling in the micro grooves. A width of each micro groove is in a range from 0.02 millimeters to 0.05 millimeters. A depth of each micro groove is in a range from 0.2 millimeters to 0.25 millimeters.

Abstract: A manufacturing equipment for manufacturing an LED light bar includes a reflow oven and a clamping device. The LED light bar includes a printed circuit board and a plurality of LEDs arranged on the printed circuit board. The reflow oven includes a hearth box and a transmitting belt extended through the hearth box. The hearth box includes a heating area and a cooling area in an interior thereof. The clamping device is mounted on the transmitting belt. The clamping device defines a receiving space for receiving the LED light bar therein. The clamping device is changed between a clamping state for maintaining the LEDs in positions and a releasing state whereby the LED light bar can be removed from the clamping device.

Abstract: An apparatus for assembling a miniaturized device includes a manipulator system including six manipulators operable to position and orient components of the miniaturized device with submicron precision and micron-level accuracy. The manipulator system includes a first plurality of motorized axes, a second plurality of manual axes, and force and torque and sensors. Each of the six manipulators includes at least one translation stage, at least one rotation stage, tooling attached to the at least one translation stage or the at least one rotation stage, and an attachment mechanism disposed at a distal end of the tooling and operable to attach at least a portion of the miniaturized device to the tooling. The apparatus also includes an optical coordinate-measuring machine (OCMM) including a machine-vision system, a laser-based distance-measuring probe, and a touch probe. The apparatus also includes an operator control system coupled to the manipulator system and the OCMM.

Abstract: A substrate processing apparatus is disclosed for bringing a substrate from a carrier, by a substrate transfer portion inside a transfer chamber, into a processing module to perform a process therein. The substrate processing apparatus includes a substrate storing chamber coupled to an exterior of the transfer chamber via a transfer opening to be in communications with the transfer chamber; a first storing shelf in the substrate storing chamber to store substrates for a first storing purpose; a second storing shelf in the substrate storing chamber to store substrates for a second storing purpose different from the first storing purpose; and a shifting mechanism that shifts the first and the second storing shelves to position a substrate storing area of one of the first and the second storing shelves so that substrate transferring is enabled between the substrate storing area and the substrate transfer portion via the transfer opening.

Abstract: A tool to hold objects by suction includes a glue free gasket structure on its handling surface. The gasket structure includes a gland formed below the handling surface having an approximate dovetail section with a narrow opening at the handling surface defining a suction area, and a gasket inserted in the gland. The gasket has a shoulder portion that conforms to the shoulder portion of the dovetail section of the gland, and a sealing lip protruding through the narrow opening at the handling surface. The gasket fits movably in the gland, and is self-aligning to compensate for variations in the space between the holding surface and the object being handled. This gasket structure is especially useful for devices to cool injection molded parts.

Abstract: The present disclosure provides a novel suspension device used in producing a composition, such as, but not limited to, a polyimide composition. The suspension device in its most general form comprises a support element and an attachment element. The attachment element is in communication at one of its ends with the support element and at the other with a workpiece, such as a poly(amic acid) or polyimide workpiece. The suspension device may further comprise additional elements. The suspension device maintains the workpiece in a suspended state during processing so as to reduce or eliminate processing-related defects.

Abstract: An apparatus includes a first jaw (108) coupled to a second jaw (110) to form an opening (114) when the first jaw (108) and the second jaw (110) are closed. An aligning structure couples to at least one of the first jaw (108) and the second jaw (110). A portion of the aligning structure may be disposed within the opening (114) and aligns a power line (128) to a sensor (418) disposed within the first jaw (108) and the second jaw (110).

Abstract: An electrode transporter is provided comprising a transporter frame, a plurality of transitional support elements, and a plurality of flipside support elements. The flipside support elements are configured to immobilize an electrode along a gravitational force vector normal to a major face of an electrode positioned in an electrode accommodating space defined by the transitional support elements and the flipside support elements. The transitional support elements are configured to transition back and forth from a secured state, where the electrode is further immobilized along an opposing force vector opposite the gravitational force vector, to an unsecured state where the electrode is relatively mobile along the opposing force vector. Additional embodiments relate to the use of a transporter tripod and an electrode removal puck and lifting fork to remove an electrode from the transporter frame.

Abstract: Embodiments of electrostatic chucks are provided herein. In some embodiments, an electrostatic chuck may include a body having a notched upper peripheral edge, defined by a first surface perpendicular to a body sidewall and a stepped second surface disposed between the first surface and a body upper surface, and a plurality of holes disposed through the body along the first surface; a plurality of fasteners disposed through the plurality of holes to couple the body to a base disposed beneath the body; a dielectric member disposed above the body upper surface to electrostatically retain a substrate; an insulator ring disposed about the body within the notched upper peripheral edge and having a stepped inner sidewall that mates with the stepped second surface to define a non-linear interface therebetween; and an edge ring disposed over the insulator ring, the non-linear interface limiting arcing between the edge ring and the fastener.

Abstract: A carrier having a plurality of support bars for safely transferring a substrate is provided. The carrier includes a frame having a through-hole formed at a center, the center through-hole including a first inner surface and a second inner surface that faces the first inner surface within in the through-hole; and a plurality of support bars joined to the first inner surface and the second inner surface.

Abstract: The present invention provides a robot system in which a robot and a positioner are combined with each other. In the robot system, footprint is reduced and a production line having a short tact time between steps is formed. The robot system includes a work object, robots that perform a work operation on the work object, and positioners that position the work object, wherein the robots are provided on frame members of the positioners.

Abstract: A boom mountable robotic arm for temporarily supporting an elongate conductor includes a rigid member such as a beam or beam assembly adapted for mounting onto the upper end of a boom for example using a boom adaptor, at least one electrically insulated support post mounted to the rigid member, where each post temporarily supports an elongate electrical conductor, and at least two rotation devices for selectively controllable rotation of the rigid member and the electrically insulated support posts about at least two corresponding axes of rotation.

Abstract: An automatic soldering machine includes a frame assembly, an electric iron and a movable module fixed on the frame assembly. The movable module is used for making the electric iron connected with the movable module randomly move to a specified position at a predetermined area. The movable module includes a first driving unit having a first leading element movable along a first axis, a second driving unit having a second leading element movable along a second axis perpendicular to the first axis, a third driving unit having a third leading element movable along a third axis perpendicular to the first and second axis and a rotating unit capable of rotating around an axis thereof. The third driving unit is connected with the first leading element. The second driving unit is connected with the third leading element. The rotating unit is connected with the second leading element.

Abstract: A rework soldering jig is used for heating a surface mounted slot. The rework soldering jig includes a body and an assembly frame. The assembly frame is detachably disposed on the body. The body and the assembly frame together wrap the surface mounted slot. Since the rework soldering jig has the detachable assembly frame, a size thereof can be adjusted according to different forms of slots.

Abstract: A support section (28) for supporting a wafer (1) is convexly formed in the center of a receiving section (26) of a support groove (25) of a boat 21. At the time of boat loading of the boat (21), in which wafers (1) respectively received by the supporting sections (28) are aligned, from a standby chamber (33) to a processing chamber (14), the pressure in the standby chamber (33) and processing chamber (14) is set to 200 pascals or more, and 3000 pascals or less. By supporting the wafer upwards from the receiving section with use of the support section, even if peeling of the film on the wafer occurs from a large frictional force between the supported surface of the wafer and the support section under a reduced pressure, the particles from the peeling are caught by the receiving section and therefore particles are prevented from adhering to the IC fabrication surface of the wafer directly below the receiving section.

Abstract: A wafer holder for holding a semiconductor wafer during a thermal wafer treatment process. The wafer holder includes at least three wafer supports. Each wafer support includes an upright shaft and a plurality of flexible fibers supported by the shaft in positions such that at least some of the fibers engage the semiconductor wafer when the wafer rests on the wafer supports.

Abstract: There is disclosed a wafer processing apparatus having optimized electrode patterns for its resistive heating element. The optimized electrode pattern is designed to compensate for the heat loss around contact areas, electrical connections, and through-holes, etc., by generating more heat near or around those areas, providing maximum temperature uniformity. In another embodiment of the optimized design of the invention, the resistance of heating element closely matches the impedance of the power supply for higher efficiency, especially when higher operating temperature or higher electrical power is required.

Abstract: A fastening device includes a base and a fastening member. The base defines a receiving space for receiving an electronic component. The fastening member includes a fastening portion and an elastic abutting portion. The fastening portion is fixed to the base. The elastic abutting portion extends from the fastening portion upwards and through the base and is configured for securing the electronic component in the receiving space.

Abstract: A flexible printed circuit (FPC) connector assembling fixture is provided for assembling an FPC connector. The assembling fixture includes a base that is set horizontally. A lower slidable carriage is slidably coupled to the base. Upper and lower molds are respectively and rotatably coupled to an upper slidable carriage and the lower slidable carriage. A terminal fitting mechanism and a cover mounting mechanism are respectively mounted to the upper and lower molds. Guide posts are mounted to the base. The upper mold is slidably coupled to the base with the guide posts. The lower mold forms an accommodation chamber. The cover mounting mechanism includes a push rod and first and second slide channels. The second slide channel is in communication with the accommodation chamber and the first slide channel. The push rod is received in and slidably coupled to the second slide channel.

Abstract: A chuck apparatus for holding a substrate is the disclosed. The chuck apparatus includes a first surface portion on which the substrate is to be held and a second surface portion adjacent to the first surface portion and extending at least partially around an edge of the first surface portion and which, in use, is arranged to deflect gas over the first surface portion and thus the substrate that is to be held on the first surface portion.

Abstract: A row bar holder to hold a plurality of row bars containing reader heads for scanning operations is disclosed. The row bar holder includes: a base fixture having a length defining a y-axis and a width defining an x-axis, a plurality of separator walls formed on a top surface of the base fixture spaced from one another to separate the plurality of row bars containing reader heads, a plurality of grooves defined between the adjacent separator walls to receive the row bars, respectively, and a draw bar mountable within the base fixture, the draw bar having a plurality of draw bar walls that approximately align with the plurality of separator walls of the base fixture along the y-axis.

Abstract: An assembly auxiliary jig facilitates assembly of an electronic device having a casing, a first fitting, a second fitting, and a wire. The assembly auxiliary jig includes: a base having therein a receiving space for positioning and receiving the casing and an accessing recess configured to communicate with the receiving space and facilitate access to the casing; a first platform disposed at the base and having a positioning groove in communication with the receiving space to thereby receive the first fitting; a first lid hinged to the first platform and configured to close the positioning groove; a second platform disposed at the base and defined with a positioning recess in communication with the receiving space to receive the second fitting; and a second lid hinged to the second platform and configured to close the positioning recess.

Abstract: Generally, a fixture for securing optoelectronic packages may be used to secure one or more optoelectronic packages for mounting one or more components and/or one or more wires to at least first and second mounting surfaces at different relative angles. The fixture is rotatable between at least first and second mounting positions with a top surface of the fixture being at respective first and second mounting angles relative to a horizontal plane. The fixture may be configured to secure the optoelectronic package(s) for positioning at different mounting angles to facilitate mounting the components and/or wires to the mounting surfaces at the different angles. The fixture may also be configured to be continuously adjustable over a range of angles between the first and second mounting angles.

Abstract: A substrate supporting apparatus includes first and second shafts spaced by a distance that corresponds to or exceeds a width of a substrate, and at least one wire to support the substrate. The wire has ends coupled to respective ones of the first and second shafts. The wire is raised and lowered to place a substrate onto a lower electrode in a substrate processing chamber and to remove the substrate when processing is completed.

Abstract: A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.

Abstract: Provided is a carrier module for use in a handler for handling a packaged chip for a test, the carrier module including a body provided, a base plate where the packaged chips are placed, provided to the body, and at least one latch which holds the packaged chips in position in the base plate.

Abstract: An article support system for supporting articles and collecting paint or stain that drips off of the articles includes a plurality of stanchions being positioned and upwardly extending from a support surface. Each of the stanchions includes a top wall, a bottom wall and a perimeter wall that extends between the top wall and the bottom wall. Each of a plurality of span assemblies is mounted to a pair of the stanchions and extends between the stanchions. The span assemblies support the articles above the support surface when the articles are placed on and extend between the span assemblies positioned adjacent each other.

Abstract: A structure of a vacuum chuck for absorbing a substrate and usable in the fabrication of a liquid crystal display device is provided. This structure includes an absorbing plate absorbing a surface of the substrate, and a plurality of vacuum lines in an oblique line shape on the absorbing plate.

Abstract: An apparatus (100) for supporting workpieces thereon includes a seat (10), a holding board (20), and a magnetic module connecting the seat to the holding board. The magnetic module (70) includes a first member (40) secured in the seat and a second member (50) secured in the holding board. The first member and the second member cooperate to provide a magnetic force thereby detachably fixing the holding board to the seat.

Abstract: This invention provides a swing type electrode chip replacement apparatus which enables an electrode chip to be attached/detached without damaging a shank even if the shank is bent. The swing type electrode chip replacement apparatus comprises a fixed plate 20 located in the vicinity of a spot welding machine and a movable plate 21 slidable in the back-forth direction on the fixed plate 20, its front end being swingable in the right-left direction. An attaching unit 1 for attaching an electrode chip 95 to the tip of a shank 90 of a spot welding machine or a magazine of the electrode chip 60 for removing the electrode chip 95 is loaded on this movable plate 21, which is slidable in the back-forth direction and swingable in the right-left direction when the shank 90 comes into contact with the attaching unit 1 or the magazine of electrode chips 60.

Abstract: A jig for holding and conveyance includes a plate having a weak-adherence adhesive pattern on a surface and a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate. The weak-adherence adhesive pattern is formed at a position corresponding to the non-conductive portion. Alternatively, the weak-adherence adhesive pattern subjected to surface roughening is formed on a surface of the weak-adhesive layer at a position corresponding to the conductive portion.

Abstract: A vision measuring machine includes a workbench, a support mounted to the workbench, a moving member movably mounted to the support, two fixing portions and a lens respectively fixed to the moving member, a group of pulleys fixed to the support, two mounting members each including at least one pulley fixed to the workbench, a rail fixed between the fixing members, a sliding member for fixing a backlight module, and a cord for driving the sliding member. One end of the cord is fixed to one of the fixing portions. The opposite end of the cord rounds all of the corresponding pulleys, the rail, and the sliding member, and last is fixed to the other fixing portion. When the moving member with the lens is driven, the backlight module is driven together with the lens by the cord.

Abstract: Quick changeover apparatus for wafer handlers capable of handling at least two sizes of wafer frames and methods of using such apparatus are disclosed.

Abstract: A connection device for an electric component 4 is constituted by two units 2 and 3, height position change means that changes the height position of one end 4a of the electric component 4 relative to the other end 4b is provided for a second unit 3, and the size and weight of a first unit 2 that connects the electric component 4 to a wiring board can be reduced. Therefore, the electric component 4 can be connected, under a low load, to a limited connection region of a wiring board.

Abstract: A device used to secure a section of cable while one or more fiber is broken out from the cable. The device includes spaced apart clamp assemblies that hold a cable during the splicing process to protect the fairly delicate fibers within the sheathing. The disclosure also relates to a method of splicing using a clamp assembly.

Abstract: A support section (28) for supporting a wafer (1) is convexly formed in the center of a receiving section (26) of a support groove (25) of a boat 21. At the time of boat loading of the boat (21), in which wafers (1) respectively received by the supporting sections (28) are aligned, from a standby chamber (33) to a processing chamber (14), the pressure in the standby chamber (33) and processing chamber (14) is set to 200 pascals or more, and 3000 pascals or less. By supporting the wafer upwards from the receiving section with use of the support section, even if peeling of the film on the wafer occurs from a large frictional force between the supported surface of the wafer and the support section under a reduced pressure, the particles from the peeling are caught by the receiving section and therefore particles are prevented from adhering to the IC fabrication surface of the wafer directly below the receiving section.

Abstract: An arrangement for clamping a flat plate to a flat surface includes juxtaposing the plate to the flat surface. An axially-movable wedging element defining a surface fitted with wedges is fixed against motion in other than a direction of elongation, and is forced to move in the direction of elongation. The wedges are forced against a first spring beam to impart forces thereto. The forces are coupled from the first spring beam to a second spring beam by intermediary supports. The second spring beam bears against a surface of the flat plate to force the plate against the flat surface.

Abstract: A method is described for manufacturing electronic assemblies (52). Electronic die (36) held in a plastic matrix (43) form a partially completed panel (35) of electronic assemblies (52). The panel (35) is adhesively mounted to a ceramic carrier (20) having multiple holes (22) there through. Conductive interconnects (38-1, 38-2, etc.) and other layers are applied to the panel, coupled to electrical contacts on the die (36) and external electrical contacts (39-1) for the panel (50). The panel (50) and the carrier (20) are separated and the panel singulated to release the finished electronic assemblies (52). Silicone is a preferred adhesive (27) and is dissolved using a non-polar solvent (70) that penetrates through the holes (22) in the carrier (20) to the adhesive (27). The adhesive (27) is preferentially applied using a transfer adhesive sandwich (24), that is, an adhesive layer (27) with removable plastic sheets (25, 26) on either side that can be peeled away from the adhesive (27).

Abstract: A panel platen for holding substrates such as PCBs has an automatic shimming mechanism to provide shims for panels of varying sizes and/or thicknesses. A platen includes a top surface, and a plurality of adjustable shims located below the top surface and around an edge of the platen, wherein the adjustable shims can be raised and lowered to a desired height to compensate for different sizes or thicknesses of substrates. A platen may include a top surface, a plurality of adjustable height pads located around an edge of the top surface, and a motorized control mechanism located below the top surface and configured to raise and lower the plurality of adjustable height pads. A method of automatically shimming different sized substrates on a platen includes providing a plurality of motorized shims under a top surface of the platen, and raising and lowering the motorized shims based on a size or thickness of a substrate.

Abstract: An improved vacuum box assembly for use in printed circuit board manufacturing where the printed circuit board is supported during manufacturing operations on the second side of the board. The vacuum box uses a unique and improved side plate that securely retains commercially available substrate support devices within the vacuum box. The side plate has a retention cavity configured to receive one or more substrate support devices therein. The side plate retains the substrate support device in a desired position. Open or unoccupied regions of the retention cavity may be sealed by use of specifically configured vacuum blocking plates.

Abstract: A clamping device for a flexible substrate is provided. The clamping device includes a carrier board. The carrier board has a fixed positioning assembly and a plurality of movable positioning assemblies. The fixed positioning assembly and the movable positioning assemblies are disposed in locations that almost correspond to a plurality of through holes on the flexible substrate. The fixed positioning assembly includes a hole body with a positioning hole and a dowel pin. Each movable positioning assembly includes a hole body with a positioning hole, a plurality of curved extending arms and a dowel pin. Each curved extending arm is connected to the hole body and the carrier board and the dowel pin is inserted into the positioning hole.

Abstract: A wire bonder (900) with a rigid pedestal (902) having resilient inserts (920). A package (904) placed on the pedestal (902) contains an electrical device (906). The bond pads on the electrical device (906) are electrically connected to bond pads on the package (904) by a series of bond wires (908) through use of a well know bonding process. A vacuum source holds the package (904) against the pedestal (902) deforming the resilient strips (920) located in the rigid member (902) of the pedestal and ensuring good contact between the ground pads of the package (904) and conductive resilient members (920). The resilient members (920) are conductive and electrically connect the package grounds to a system ground (922).

Abstract: A lithographic apparatus is disclosed that includes an article support constructed to support a first article, capable of imparting a radiation beam with a pattern in its cross-section to form a patterned radiation beam, in a beam path of the radiation beam or a second article to be placed in a beam path of the patterned radiation beam, the article support having a plurality of supporting protrusions on which the first article or the second article is disposed in use, wherein the plurality of supporting protrusions are constructed to define a support zone to provide a plane of support for the first article or the second article, so that when the first article or the second article is subjected to a thermal load the support zone allows at least a portion of the first article or the second article to expand or contract to reduce the build up of a mechanical stress in the first article or second article, respectively, while maintaining the first article or second article substantially fixed to the article suppor

Abstract: The present invention relates to a submount on which at least one optical component is mounted. The submount has a mounted portion that is mounted onto a substrate or base, and a protruding portion that protrudes out from the substrate or the base when the mounted portion is mounted to the substrate or base. The gripped portion is formed to enable gripping thereof. Wiring, to enable active alignment, is provided to the gripped portion, and active alignment can be carried out by powering up the optical component mounted on the submount.

Abstract: A wafer processing apparatus is fabricated by depositing a film electrode onto the surface of a base substrate, the structure is then overcoated with a protective coating film layer comprising at least one of a nitride, carbide, carbonitride or oxynitride of elements selected from a group consisting of B, Al, Si, Ga, refractory hard metals, transition metals, and combinations thereof. The film electrode has a coefficient of thermal expansion (CTE) that closely matches the CTE of the underlying base substrate layer as well as the CTE of the protective coating layer.

Abstract: A workpiece holding jig for holding a workpiece having a plurality of first dividing lines extending in a predetermined direction and a plurality of second dividing lines formed in a direction intersecting the plurality of first dividing lines on the workpiece holding table of a processing machine for cutting the workpiece along the plurality of first dividing lines and the plurality of second dividing lines, wherein the workpiece holding jig has a plurality of through-grooves corresponding to the plurality of first dividing lines and the plurality of second dividing lines formed on the workpiece, a plurality of suction-holes which are open at the top and formed at positions corresponding to a plurality of areas sectioned by the plurality of first dividing lines and the plurality of second dividing lines of the workpiece and suction-passages that are formed at positions where they do not intersect the plurality of through-grooves and connected to the plurality of suction-holes.

Abstract: Provided is a PCB assembly machine including a board handling system configured to transport a PCB through the PCB assembly machine, wherein the PCB assembly machine further includes a pick and place system configured to pick and place electrical components onto the PCB. The PCB assembly machine also includes a feeder system configured to supply the electrical components, wherein the board handling system mounts directly to the feeder system.

Abstract: An aligning apparatus includes a loading plate to load at least one alignment object; first and second alignment bars to align the at least one alignment object loaded on the loading plate, wherein the first and second alignment bars are bent by a force greater than a threshold value when contacting the alignment object; and at least one driving unit to drive the first and second alignment bars in close and open directions toward and away from each other.

Abstract: A clamping apparatus for clamping a plurality of Hi-Fix boards arranged in a row, includes at least one rotational clamping unit installed to clamp facing end sides of the two or more Hi-Fix boards together, and a plurality of clamping units installed to clamp end sides of the Hi-Fix boards other than the facing sides thereof. The rotational clamping unit includes a clamper installed to rotate about a fixed rotation point to clamp or release the claming of the facing end sides of the two or more Hi-Fix boards, and a driving unit for providing a rotational force to the clamper.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.