Abstract: A work station for splicing together a pair of fiber optic cables includes a portable splicing table including a recessed portion for supporting a splice enclosure. The recessed portion extends across the width of the splicing table and allows for a pair of fiber optic cables to enter the table in the recessed portion. A pair of cable grips are included in the recessed area for holding the cables in place during the splicing operation. A plurality of fiber clips may be disposed on the table surface and used to match up the pairs of fibers to be spliced together from the cables.

Abstract: A jig for mounting fine metal balls to a semiconductor chip substrate or a circuit board is disclosed. A tray storing the metal balls is accommodated in a frame and constantly biased upward by springs. Head stops are provided on the frame such that when a suction head mates with the tray for sucking the metal balls, the tray stops at a position slightly sunken into the frame. A clearance is formed between the tray and the frame in the horizontal direction in order to absorb errors in dimensional accuracy when the tray and head are positioned by positioning pins.

Abstract: A universal fixture for a pre-assembly of computer components includes a base and a support plate adjustably mounted on the base for movement to various inclined positions. At least one support arm interconnects the base and the support plate for securing the support plate in an inclined position. A fixture is rotatably mounted on the support plate and includes various positioning stops and an adjustable slide for properly positioning various computer components for attaching chassis mounting devices to the components. The adjustment of the support plate and rotation of the fixture provide ergonomic advantages to the assembler performing the pre-assembly operations.

Abstract: An adjustable tooling pin assembly for precisely positioning printed circuit boards having different diameter and spacing of tooling alignment holes with different series of boards. Two support bodies are positioned along a base at the approximate location of spaced tooling holes. One support body carries an upwardly extending tooling pin with a diameter smaller than the tooling hole. The other support body carries two upwardly extending, adjacent, thin tooling pins, one of which is fixed to the support body and the other fastened to a block slidable in a channel in the support body, to move the movable pin relative to the fixed pin. The board holes are placed over the pins, the support bodies are secured to the base with the outermost tooling pins engaging the outer hole edges. The movable pin is moved away from the adjacent fixed pin by rotating a threaded rod extending though the support block to move the movable pin into contact with the tool hole edge opposite the fixed pin edge.

Abstract: A fixture supports and secures a printed circuit board ("PCB") during processing thereof. The fixture includes a frame for supporting the PCB and an attachable and entirely detachable bar or plate for securing the PCB in the fixture. A first opening is defined by the frame and is of sufficient dimensions to expose a first surface of the PCB. The plate defines a second opening, the second opening being of sufficient dimensions to expose a second surface of the PCB for processing. Spring-loaded latch assemblies connect the bar or plate to the frame at its ends or corners, respectively. The latch assemblies are simultaneously actuated by application of a slight pressure on the plate or bar. Simultaneous actuation of the latch assemblies ensures uniform application of pressure on the PCB, to avoid creation of a moment in the board. The latch assemblies do not require an operator's individual, repeated manipulation, but are actuated with a single application of slight pressure to the plate or bar.

Abstract: A clamping ring design that eliminates the Wafer sticking problem. In the first embodiment of the present invention the wafer clamp ring is redesigned to sharply reduce the wafer to wafer-ring contact area. In the second embodiment of the present invention a clamp ring guide is added to prolong the lifetime of the clamp ring.

Abstract: A jig for loosening electric wires of a wire harness passed through a grommet is disclosed. The jig includes a fixing-side clamping portion for clamping the one end of a wire harness, a guide rail extending in a longitudinal direction of the wire harness, a bearing slidably engaged with the guide rail; a lock portion for locking said bearing to the guide rail, a circular rotating member, supported by said bearing, for rotating the wire harness in a circumferential direction of the wire harness; and a movable-side clamping portion, integrally attached to the rotating member, for clamping the other end of the wire harness. The rotating member may have a spiral cam groove, and the bearing may have an engagement protrusion to be engaged with the cam groove so that when the one clamping portion is inverted, the rotating member can move in its longitudinal direction. The one clamping portion may include a rachet mechanism.

Abstract: A circuit board carrier and method of using the same. The circuit board carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the circuit board carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.

Abstract: The fixture has a pair of plates for supporting a pack of printed circuit boards having two locating pins projecting from one face of the pack and which are housed inside a gap between the two plates. The plate is fitted with a fixed bar, while the other plate is fitted with a movable bar associated with a conduit made of elastomeric material, extending parallel to the movable bar, and which is deformed by means of compressed air to move the movable bar towards the fixed bar to clamp the pin. The first plate also carries a locating member having a V-shaped seat, which cooperates with the movable bar to locate and clamp the other pin and so align the pack on the fixture.

Abstract: Registration system and method provide for alignment of films with circuit panels. The exact position of tooling holes in the panel are found using tapered pins. After the exact position of the tooling holes are found tapered registration pins are inserted into the tooling holes. The top of the registration pin is narrower than the tooling hole so that the pin will easily slide into the tooling hole. The middle part of the registration pin is substantially the same size as the tooling hole, thereby ensuring a snug fit between the tooling hole and the registration pin. Where a tooling hole is comprised of overlapping holes, the registration pin contacts several of these holes. A loading apparatus provides pneumatic pressure beneath the registration pin to push the registration pin into the tooling hole. After the registration pins are placed in the tooling holes of the panel, a film is placed on the panel such that the registration pins are inserted into the holes of the film.

Abstract: A multiple force tool for applying pressure to circuit components during a manufacturing operation. A plurality of compressed air pressure cylinders are supported on a plurality of horizontal arms over a circuit board. A pressure foot of each compressed air pressure cylinder is extendable when an air controller foot switch is depressed. Positioning of each of the cylinders is afforded along two axes, so that the cylinders may be positioned over components which are to be pressed against the circuit board. Heat sinks may be pressed against components located on the circuit board to bond the heat sinks to the components.

Abstract: With the present invention, a circuit card assembly having a nonvertically approaching device may be manufactured with reflow soldering. The circuit card assembly includes a circuit card and a nonvertically approaching device such as an edge connector, which is soldered to the circuit card with reflowed solder. The device is soldered to the circuit card by initially heating the circuit card, along with included reflow solder, prior to mating the device to the circuit card. Once the solder has melted and while it is in a liquidus state, the device is mated with the circuit card. In this manner, the nonvertically approaching leads of the device slide into the solder as they are positioned onto their circuit card soldering surfaces. Once cooled, the solder solidifies to conductively mount the device to the circuit card.A mating pallet is provided for soldering a device having nonvertically approaching leads to a circuit card.

Abstract: An optical assembly workstation includes a principal work surface and a movable work surface arranged above the principal work surface, with the elevated work surface being movable back and forth in at least one axial direction relative to the principal work surface. A frame assembly provides both support and a mechanism for moving the elevated work surface relative to the principal work surface. The movable work surface is either configured to receive an optical work piece, or is itself the optical work piece. The arrangement of a movable work surface over the principal work surface provides flexibility in optical test and optical assembly equipment placement, frees the principal work surface area of clutter, and reduces the probability of inadvertent damage to the optical fibers and optical assemblies being manufactured or tested at the optical assembly workstation.

Abstract: A device is provided for holding a printed circuit panel having two substantially parallel margins. The device has a frame and employs two grasping jaws to hold the first and second margins of the panel, respectively. An actuator coupled to one of the grasping jaws provides a force that tends to move away one grasping jaw with respect to the other grasping jaw and thereby provides a tension to keep the printed circuit panel plane. Since the printed circuit panel is grapsed by and traction is exerted on the two parallel margins, the panel is held with highly accurate planeness regardless of its dimensions and of its thickness. In This manner, the device for holding a printed circuit panel may accommodate panels with a wide variety of sizes.

Abstract: The present invention is a universal fixture for holding printed circuit boards with different sizes and shapes during, stencil printing and other manufacturing processes related to printed circuit boards. In one embodiment, a universal fixture for holding a printed circuit board has a platform with a work surface, a first support member attached to the platform to hold a portion of a printed circuit board, and a second moveable support member attached to the first support member to support another portion of the printed circuit board. The platform is preferably adapted to be attached to a workstation of a processing machine, such as a stenciling machine for printing solder or adhesive onto the printed circuit board. The first support member preferably has an elongated sidewall, a first endwall extending transversely from the sidewall, and a second endwall spaced apart from the first endwall along the sidewall and extending transversely from the sidewall.

Abstract: A universal fixture has an alignment surface which temporarily holds a heat sink for installation of a plurality of electrical devices on its working surfaces. The fixture rotates about an axis to place an alignment surface in a first or second mounting position corresponding to a generally vertical orientation of the alignment surface. This corresponds to a horizontal position of the opposite first and second sides of the heat sink temporarily mounted thereon. Double rows of openings in the rotatable alignment member are universal in the sense they are configured to accept connection pins of the common packages to be clamped against the opposite sides of the heat sink. This permits one fixture to accommodate a variety of devices and arrangements. A unique standoff device supports smaller packages above the alignment surface to permit clamping across larger and smaller electrical devices without the necessity of attempting to manipulate and hold the devices by hand during the clamping operation.

Abstract: A support fixture to support a PC card, having components on side 1. A backing plate supports a casting, the casting having a nest. The surface of the nest is characterized in that it is a slightly larger mirror image of the side 1 of the PC card. The backing plate has apertures and the casting is received in the apertures to lock the casting to the backing plate. Vacuum holes are formed in the backing plate, to draw a vacuum to hold the PC card in a planar position.

Abstract: A vapor control apparatus including an endless rim, a stagnation plate and a cover having an exhaust port. The endless rim has a first edge engaging the cover, a second edge opposite the first edge, an interior region and an exterior region defined by the rim and the cover, and a flow passage from the interior region to the exterior region adjacent the cover. The exhaust port is in fluid communication with the interior region and the second edge is seatable on a wafer support. A stagnation plate is disposed in the interior region, defining a stagnant region intermediate the stagnation plate and the surface, and defining at least one flow path in fluid communication with the stagnant region and the interior region.

Abstract: A fixture for making laminated integrated circuit devices from layers of integrated circuits comprises a base having support structure for at least two side body portions. The side body portions are adapted to be held in position by the support structure and project outwardly from the base in an orientation for substantially enclosing a plurality of the integrated circuit layers in a desired alignment for subsequent lamination to one another. The support structure enables the side body portions to be spaced from one another and have only one degree of freedom of movement toward and away from one another, enough to accommodate some dimensional differences between the plurality of integrated circuit layers. A retainer holds the side body portions in a fixed relative position providing the desired alignment for the subsequent lamination. The retainer biases the side body portions toward one another.

Abstract: A method of manufacturing a semiconductor device includes providing an apparatus (210, 510) having tabs (212, 214, 412, 414) for holding and separating semiconductor substrates wherein a first tab (212, 412) is different from a second tab (214, 414), using the first tab (212, 412) to support a semiconductor substrate (224) wherein the second tab (214, 414) does not support the semiconductor substrate (224), and exposing the semiconductor substrate (224) to a chemical to move the semiconductor substrate (224) towards the second tab (214, 414) without removing the semiconductor substrate (224) from the apparatus (210, 510).

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. A heater and a heat sink can be included in the bottom assembly to allow for temperature cycle testing of the wafer. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects. Mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated.

Abstract: A wire bond clamp for holding lead frame fingers of a plurality of lead frames against a heater block so that electrical connections may be made between the lead frames and IC components. The wire bond clamp includes a baseplate having a plurality of openings. Each of the openings are provided for receiving a clamping insert, which insert has a central aperture therethrough and jaws surrounding the central aperture on a bottom surface of the insert. The central apertures on each clamping insert are sized and positioned so that during a wire bond process, the wire bond clamp may be lowered over a plurality of lead frames and IC components, and tips of the lead frame fingers and the IC components will be located within the central apertures. The jaws of each clamping insert are provided to engage each of the lead frame fingers, and to hold each of the fingers against the heater block.

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method includes the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provides for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract: A vertical circuit board soldering apparatus for soldering printed circuit boards by immersing them in a molten solder bath. Air knives are employed to remove excess solder from boards leaving the bath. A displacement mechanism vertically dips the circuit boards. The mechanism comprises a parallelepiped frame that comprises two spaced apart parallel rails securing a sliding chassis therebetween. The chassis comprises three parallel spaced apart members. An upper member transversely extends between the rails while captivating a portion of each rail adjacent its ends. A parallel lower member depends from the upper member with an adjustable intermediate member therebetween. The intermediate member also transversely extends between the rails while captivating another portion of the rails. The intermediate member is coupled to the upper member by a screw jack that moves the intermediate member upwardly or downwardly to vary the distance therebetween to accommodate various board sizes.

Abstract: An apparatus for leveling (136) a circuit board (105) against a rail (128, 130) of a part placement machine (102) comprises a plate (200) and at least one spring (404, 506, 507, 508). The circuit board (105) can have any one of a plurality of different predetermined thicknesses. The plate (200) is positioned beneath the rail (128, 130) and has first and second sides (204, 300). The first side (204) is dimensioned to support the circuit board (105). The plate (200) is moveable to a first predetermined distance from the rail (128, 130). The first predetermined distance is no smaller than a smallest one of the plurality of different predetermined thicknesses of the circuit board (105). The at least one spring (404, 506, 507, 508) is carried on the second side (300) of the plate (200) to bias the plate towards the rail (128, 130). The at least one spring (404, 506, 507, 508) is compressible to accommodate the circuit board (105) between the plate (200) and the rail (128, 130).

Abstract: The present invention provides a hot shear fixture for effectively and efficiently separating components of a device package for low yield analysis. More specifically, the hot shear fixture provides a cavity for receiving the desired device package and a shearing plate. Depending on the thermal properties of the package materials, the fixture, device package and shear plate are heated for a predetermined time before the shear plate is advanced to separate the desired components of the inserted device package.

Abstract: A semiconductor wafer testing apparatus has a work table on which a carrier containing semiconductor wafers to be checked is placed. The work table is equipped for combined wafer alignment and wafer code recognition while the wafers remain in their carrier in one position on the work table. The alignment is accomplished with a wafer flat zone aligner which has a pair of roller pins each coming in contact with circumferences of the wafers being stacked in the carrier through an open lower part of the carrier and an opening in the table. The wafer code recognition is accomplished with an optical character recognizer that moves up and down and forward and backward with respect to the carrier, and interposes between the wafers in the carrier so as to read out codes which are on each wafer. This combined automated work station helps prevent contamination of the wafers by an operator or by unnecessary handling of the wafers, and also reduces cycle time for the entire inspection process.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: An LED jig for securing a plurality of individual light emitting diodes to a circuit board module. The LED jig comprises a disk shaped structure having a plurality of openings in which the light emitting diodes are positioned. Flanges on each end of the openings serve to secure the light emitting diodes therein. The LED jig also comprises structures which protect the light emitting diodes from possible damage, structures which serve to secure the LED jig to the circuit board module, structures which serve as guides for properly mounting the LED jig to the circuit board, and structures which serve to offset the LED jig from the circuit board module.

Abstract: A mechanism for holding a substrate on a substrate stage of a substrate treatment apparatus according to the present invention comprises an exhaust mechanism section connected to the substrate treatment apparatus having the substrate stage therein and used to discharge a gas from the substrate treatment apparatus by suction, and a holding mechanism section having one end portion formed with a plurality of intake holes opening in the upper surface of the substrate stage on which the substrate is placed and the other end portion connected to the exhaust mechanism section, whereby the sucking force of the exhaust mechanism section is caused to act on the intake holes so that the substrate is held on the substrate stage by suction.

Abstract: A telephone cable splicing tool including a splicing tray, a rod having two ends, with one end engaged with the splicing tray, and vise grip pliers engaged with the other end of the rod.

Abstract: A surface mount electrical connector incorporating features to facilitate alignment of contact tails to contact pads on a printed circuit board. The contact tails are held together with a tie bar. Tabs on the tie bar are shaped to engage features on a blade of an alignment tool. The blade can be inserted into the small available on the printed circuit board, but can be easily manipulated for precise alignment of the contact tails.

Abstract: A cable sold device 10 comprises a top portion 14 and a base portion 12 which are connected with each other via a hinge 15 and define a space 18 for accommodating at least one cable C. The movement of the at least one cable C in the space 18 is restricted while the top portion 14 and the base portion 12 are closed with respect to each other. Further, an apparatus 500 for introducing the cables C into a grommet 6 comprises the cable hold device 510, a grommet hold device 510 for holding the grommet 6 substantially in line with the cables C, and an actuation mechanism 520 for causing a relative movement of the grommet hold device 510 with respect to the cable hold device 10.

Abstract: An assembly device for a wiring harness comprises a fork (11) having legs (12,13) and a closure (17). One of the legs (12) is rigid, and the other leg (13) and the closure (17) are relatively flexible to permit wires to enter the fork with ease and to permit the completed harness to be extracted with ease. A second embodiment has two rigid legs (12a,12b).

Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.

Abstract: This invention relates to a circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.

Abstract: A foil screen is held in registration with a printed circuit board during the application of solder paste on the printed circuit board, within a frame assembly with a prescribed tension by providing a rigid frame for juxtaposition with the foil screen, engaging the foil screen with at least one coupler, engaging the one coupler with a tensioner for resiliently biasing the one coupler to exert a tensioning force of prescribed magnitude upon the foil screen to tension the foil screen with the prescribed tension, and selectively applying an actuating force to the one coupler, the actuating force being opposite to the tensioning force, and selectively releasing the actuating force from the one coupler, such that upon actuation of the actuator to apply the actuating force, the tensioning force is overcome for release of the foil screen from the one coupler, and upon actuation of the actuator to release the actuating force, the one tensioner resiliently biases the one coupler to exert the tensioning force of prescr

Abstract: There is here disclosed a printed board positioning method in which various types of printed boards different in rigidity are positioned horizontally with a good operation efficiency. Relative to a printed board laid on a first guide portion and a second guide portion, a movable clamp is advanced. The printed board is clamped from opposite sides by the movable clamp and a fixed clamp. Subsequently, after a first vertically movable clamp is lowered to press one end of the printed board onto the second guide portion, the movable clamp is retreated to release the opposite side clamping condition. Thereby, the deflection of the printed board is eliminated and the printed board is placed in a horizontal attitude. Subsequently, a second vertically movable clamp is lowered to press the other end of the printed board onto the first guide portion.

Abstract: An improved panel positioning device which can be easily and accurately regulated by linearly regulating a heightwise displacement of the panel. A panel is mounted to an upper portion of a holder, and the holder is pivotally mounted to a holder support plate, a first regulating plate provided with first and second side plates on both sides is located below the holder support plate. First through fifth regulating knobs regulates a pivot angle, a lengthwise position, a widthwise position, a pivot angle about a lengthwise axis, and a heightwise position of the holder respectively. A third regulating plate for regulating the heightwise position of the holder is mounted to a side frame so as to be lengthwisely moved and is engaged with the fifth regulating knob at one side thereof.

Abstract: A PCB support for supporting PCBs during surface mounting processing and other PCB assembly processes. In one embodiment, a PCB stand has a support structure attachable to an elevator table of a PCB processing machine and a platform connected to the support structure. The support structure may be a superstructure that can project away from the elevator table, and the platform may be a beam or other member that can support a significant portion of the surface area on the backside of the PCB. The superstructure and platform operate together to position the height of the platform with respect to the elevator table at an elevation at which the platform supports and interior region of the PCB assembly when the elevator table is in a processing position.

Abstract: A wafer restraining device clips onto a semiconductor wafer cassette. The wafer restraining device is provided with at least one opening to allow bubbles forming during acid baths on excess resist-covered semiconductor wafers to escape. Portions of the wafer restraining device only contact the periphery of the sensitive, disc-shaped semiconductor wafers.

Abstract: A method of precisely positioning a quantity of conductive spacers (e.g., spherically shaped solder balls) on respective conductive pads (e.g., copper pads) of an underlying substrate (e.g., an FR4 printed circuit board or flexible circuit member) wherein the spacers are forcibly retained within a suitable holder and, when engaged with the respective pads, reflowed to effect a plurality of positive electrical connections between the spacers and pads. Such forcible retention allows for partial extension of the spacers from the invention's carrier, which is also disclosed.

Abstract: A retaining tool for grasping ends of a broken wire in a wire bundle and maintaining them in fixed relationship, including a thin generally U-shaped body with legs having alligator clips at each end thereof. Spurs are formed along each leg, each spur depending generally perpendicularly from a leg. An optional handle may be formed on the body to extend therefrom. The body may be coated with an electrical insulator or portions thereof may be enclosed by a non-conductive sleeve.

Abstract: A universal fixture for holding printed circuit board assemblies during stencil printing and other PCB assembly processes. In one embodiment, a universal printed circuit board holder has a plurality of supports adapted to be moveably connected to a platform of a printed circuit board processing machine. Each support has a connection end for engaging the platform, a support end to support a first side of a printed circuit board populated with components, and an attachment element at the support end to releasably hold the PCB to the support. The connection ends of the supports are moveably attachable to the platform at a plurality of different positions to selectively locate the attachment elements in alignment with support points on the first side of the printed circuit board. Accordingly, the universal printed circuit board holder preferably supports the populated first side of the printed circuit board in a manner that allows the second side to be manipulated by the printed circuit board processing machine.

Abstract: A novel system for kinematically positioning planar surfaces such as printed circuit board components and elements of material, where one element has precisely formed and positioned (e.g., punched) slots that fit loosely over three corresponding posts, such that when a bias force, such as gravity from a tilted plane or a combing action, or expanding bladder on the posts, is applied, the surfaces are referenced to one side of the slots to in effect form a planar kinematic coupling so the relative planar position and orientation is defined with great accuracy and repeatability; such also allowing an entire factory system to be built where each piece of precision manufacturing equipment can use this planar kinematic coupling to achieve great accuracy in the manufacture of printed circuit boards or the like to allow for the use of ever smaller electronics components.

Abstract: A one-piece guide tool for use in guiding a harnessing device underneath a plurality of wires disposed on a harness board. The guide tool comprises an elongated body having a top surface on which the plurality of wires can be seated, a pair of sides and an elongated slot. The elongated slot extends down from the top surface and includes an entry end and an exit end. The elongated slot has a depth sufficient to enable a harnessing device to be guided into the elongated slot from the entry end, underneath the plurality of wires seated on the top surface and then out through the exit end without slipping out of the slot. Each of the sides of the elongated body includes a tab for mounting the guide tool onto the harness board.

Abstract: A circuit board carrier and method of using the same. The carrier allows circuit boards to be processed on lead frame-based semiconductor processing equipment. The circuit board carrier contains a structure to secure a circuit board thereto and the carrier is sized and shaped, and provided with standardized indexing holes, to allow processing of circuit boards on processing equipment configured for lead frame-based processing.

Abstract: A support table supports a module board during a screen printing thereof. The support table has a body in which rectangular grooves are formed in both upper and lower surfaces thereof, a plurality of slots formed in a middle portion thereof and open to the grooves, and a plurality of jigs which are inserted into the slots and fixed relative to the body. The jigs can compensate for any difference between the heights of semiconductor devices which are mounted on the board, and support the board, with the board or the semiconductor devices resting directly on the jigs as the manufacture process at that time requires.

Abstract: A seating tool 10 for installing connectors on a circuit board comprises a base plate 12, an alignment plate 40 and fasteners 60 to fasten them together at respective fastening locations. The alignment plate 40 has at least two connector alignment surfaces 42, 44 at different locations thereon and a set of at least two fastening locations 46, 48 associated with a respective alignment surface for securing the alignment plate 40 to the base plate 12 in at least two orientations relative to the base plate 12 to accommodate board-mounting of differing connectors having different dimensions of the posts from the front faces of the connectors.

Abstract: An apparatus for supporting a substrate such as a printed circuit board (PCB) having various electronic components installed on one side with that side down so that other components can be installed on the opposite side. An assembly of three perforated plates has deformable, typically rubber-like, pins projecting through the perforations. Springs below the assembly bias the pins to a position extending above the plate. When a PCB is laid on the pins with mounted electronic components downward, the components with pres the pins down distances corresponding to component thickness. The pins provide uniform support while working on the opposite side. The center perforated plate of the three is moved to the side, clamping the pins in position, so that the PCB can be removed and replaced with another identical PCB. Different devices for causing the plate clamping action and devices for indexing PCB position and for maintaining the PCB flat and level are also provided.