Abstract: A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

Abstract: A temperature controllable vacuum chuck includes a mounting bracket, a porous plate, a heating element, and a temperature sensor. The porous plate is mounted to the mounting bracket and is configured for securing a substrate to the vacuum chuck when air is suctioned out of the vacuum chuck. The heating element is attached to the bottom of the porous plate and uniformly heats the porous plate, thereby heating any substrate mounted on the vacuum chuck and enabling control over the cure rate of fluid materials deposited on the substrate. The temperature sensor measures the temperature of the porous plate so that it can be adjusted when desired with a user controllable temperature control component.

Abstract: A holding unit holds a substrate to enable a surface of the substrate to be processed. The unit has a vacuum suction member that comes into contact with a peripheral portion of the surface of the substrate and sucks the substrate. A processing apparatus holds the wafer stably and allows an edge, a bevel portion and/or a back surface of the wafer to be processed.

Abstract: A compact pinlifter assembly is fitted in a substantially enclosed cavity within a wafer chuck such that an overall outside shape of the wafer chuck remains highly unaffected. The pinlifter assembly includes wedge guides providing a movement path in a wedge angle relative to the wafer holding face. A pin actuator is driven along the wedge guides transforming its movement along the wedge guides into a vertical movement of the lifting pins perpendicularly sliding between the cavity and the wafer holding face. The combination of wedge guides and pin actuator takes advantage of the relatively large lateral dimensions of the wafer chuck to move the pin actuator between end positions that are in a distance multiple of the pin lifters movement. Due to the wedge angle, the actuators comparatively large scale movement is transformed in a highly precise, smooth and balanced movement of the pin lifters.

Abstract: A ceramic sintered body comprising from 90 to 99.8% by volume of cordierite and from 0.2 to 10% by volume of mullite based on 100% by weight of a total sum of the contents of the cordierite and the mullite, and having a density of 2.48 g/cm3 or more.

Abstract: Susceptor designs are provided for controlling damage to wafers, particularly during cold wafer drops-off on a hot susceptor. The designs include axisymmetric grid designs, such that thermal gradients are symmetrical in the circumferential (?) direction and the same traversing any particular radial line. The grids are preferably arcuate and each have the same surface area. In one embodiment an outer zone is asymmetrically designed to induce predictable wafer curling in a saddle shape.

Abstract: A vacuum chuck for holding a semiconductor wafer during high pressure, preferably supercritical, processing comprising: a wafer holding region for holding the wafer; a vacuum region for applying vacuum to a surface of the wafer, the vacuum region within the wafer holding region; and a material, preferably sintered material, applied within the vacuum region, the material configurable to provide a uniform surface between the surface of the wafer and the wafer holding region, wherein the material is configured to allow vacuum to flow therethrough. The vacuum region preferably comprises at least one vacuum groove. Alternatively, the vacuum region includes at least two vacuum grooves that are concentrically configured on the wafer holding region. The vacuum groove alternatively comprises a tapered configuration. Alternatively, a coating material is applied between the wafer surface and the substantially smooth holding region surface, whereby the coating provides a seal between the wafer and the holding region.

Abstract: A device or chuck for fixing thin and/or flexible substrates allows a uniform and all-over sucking-up of the substrates without any disadvantageous warping or bending. The chuck has notches and holes communicating with a plurality of microgrooves arranged on the bearing surface. If a vacuum device sucks off air through the bores and the notches, a vacuum extends in the microgrooves so that a substrate located on the bearing surface is sucked up.

Abstract: A modular lift-pin assembly includes a lift-pin having a distal end, a connector, and an actuator pin. The connector includes an actuator end having a plurality of catch fingers disposed around the actuator end. Each of the plurality of catch fingers includes a lip extending radially inwards. A lift-pin end is coupled to the distal end of the lift-pin, and the actuator pin is coupled to the actuator end of the connector.

Abstract: An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.

Abstract: Disclosed is a wafer chuck, which has protrusions for supporting a substrate, for attracting and holding the substrate by negative pressure while the substrate is being supported by the protrusions. The wafer chuck includes pin-shaped protrusions dispersed on a suction side of the chuck, and circular peripheral wall portions disposed in the vicinity of the rim of the supported substrate and in the vicinity of the outer peripheral portion of a lifting hole, respectively. The suction side of the wafer chuck is provided with a first area in which the pin-shaped protrusions are arrayed in a grid-line manner, and a second area in which the pin-shaped protrusions are arrayed in circumferential form. The second area is provided in the vicinity of the peripheral wall portion and peripheral wall portion, and the first area is provided elsewhere.

Abstract: A machinable datum for use in a vacuum fixture is disclosed.

Abstract: The invention provides a chuck for holding a workpiece, such as a chip-array semiconductor Chip Scale Packages (CSP) substrate, having a plurality of components such as CSPs to be singulated, and chaff areas of the components. The chuck comprises means to hold the chaff areas when the components are being singulated, that may include a first pressure means to hold the components and a second pressure means to hold the chaff areas.

Abstract: By preventing warping of chips when detaching individual chips from a dicing sheet, improvement in quality without cracks and in productivity is realized. A collet (115) used in a step of detaching chips (110) discretely divided as bonded to a dicing sheet (109) from the dicing sheet has a flat attraction surface made of a porous material of a size equal to or larger than the chip size. Alternatively, the collet may have a chip attraction groove containing poles, balls or hemispheres, for example, to prevent warping of chips. In the step of detaching each chip from the dicing sheet, a means for reducing the bonding force of the dicing sheet, such as heating device or cooling device, may be provided. Thus, warping or cracking can be prevented in a process of thinned semiconductor substrate. Additionally, since the means for reducing the bonding force of the dicing sheet is provided in a semiconductor manufacturing equipment, breakage or cracking of chips can be prevented more reliably.

Abstract: In a first aspect, a rotary vacuum-chuck is provided that may hold a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate. The chuck has one or more openings in fluid communication with the hollow rotary shaft. A venturi is formed near an end of the hollow rotary shaft to apply vacuum to the hollow rotary shaft and the openings in the chuck surface. No seal is required between the end of the hollow rotary shaft and a surrounding stationary block.

Abstract: A rotary vacuum-chuck mounts a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate, the surface having one or more openings in fluid communication with the hollow rotary shaft. A vacuum generator evacuates the hollow rotary shaft and the one or more openings so as to vacuum chuck a substrate to the chuck surface. A labyrinthine gap is defined between a first member that rotates with the hollow rotary shaft and a second member that is stationary. A fluid in the labyrinthine gap provides a gas-tight seal between the first and second members.

Abstract: In a first aspect, a rotary vacuum-chuck is provided that may hold a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate. The chuck has one or more openings in fluid communication with the hollow rotary shaft. A venturi is formed near an end of the hollow rotary shaft to apply vacuum to the hollow rotary shaft and the openings in the chuck surface. No seal is required between the end of the hollow rotary shaft and a surrounding stationary block.

Abstract: A vacuum chuck with a conductive circuit embedded.onto it's surface wherein the chuck provides a reliable conductive path for electrical testing as well as reliable and uniform mechanical support over the entire area of a flexible panel to be tested. In one possible form, the chuck comprises an air permeable fine grain porous alumina ceramic module having a surface coated with conductive material wherein the coating is thin enough that it does not prevent air from passing through the conductive material or the ceramic module. The conductive material may also be etched or otherwise formed into a conductive pattern to facilitate testing of a panel.

Abstract: A rotary vacuum-chuck mounts a substrate such as a silicon wafer for rotation. The vacuum-chuck includes a hollow rotary shaft and a chuck mounted on the hollow rotary shaft and having a surface adapted to support a substrate, the surface having one or more openings in fluid communication with the hollow rotary shaft. A vacuum generator evacuates the hollow rotary shaft and the one or more openings so as to vacuum chuck a substrate to the chuck surface. A labyrinthine gap is defined between a first member that rotates with the hollow rotary shaft and a second member that is stationary. A fluid in the labyrinthine gap provides a gas-tight seal between the first and second members.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. A heater and a heat sink can be included in the bottom assembly to allow for temperature cycle testing of the wafer. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects. Mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated.

Abstract: A method for eliminating wafer breakage during a wafer transfer process in a grinding apparatus by a wafer transfer pad and an apparatus for conducting such method are disclosed. In the method, a surface of the vacuum pad, or the wafer transfer pad, that is formed of sintered ceramic is first cleaned by contacting a rotating brush and a spray of cleaning solvent. The invention further discloses an apparatus for eliminating wafer breakage during the wafer transfer process by a vacuum pad by incorporating a pressure regulating valve situated in the vacuum conduit such that a vacuum pressure applied can be regulated at a rate not higher than 30 psi/sec. to the surface of the wafer transfer pad.

Abstract: A wafer chuck is provided, having a wafer chucking surface, and a plunger consisting either of a body that extends at least partially along the outer perimeter of the wafer chucking surface, or a plurality of pins positioned outside the wafer chucking surface. The plunger may be normally biased to extend past the wafer chucking surface and/or may be adapted not to rotate with the wafer chucking surface. The plunger bias may be achieved via one or more vacuum bellows.

Abstract: A method for eliminating wafer breakage during a wafer transfer process in a grinding apparatus by a wafer transfer pad and an apparatus for conducting such method are disclosed. In the method, a surface of the vacuum pad, or the wafer transfer pad, that is formed of sintered ceramic is first cleaned by contacting a rotating brush and a spray of cleaning solvent. The invention further discloses an apparatus for eliminating wafer breakage during the wafer transfer process by a vacuum pad by incorporating a pressure regulating valve situated in the vacuum conduit such that a vacuum pressure applied can be regulated at a rate not higher than 30 psi/sec. to the surface of the wafer transfer pad.

Abstract: A system for measuring the thickness of a wafer while it is being thinned this disclosed. The system and method provide integrating an optical reflectometer into a common wafer thinning apparatus. Using reflected optical signals from the top and bottom of the wafer, the thickness of the wafer is determined with time based calculations in real-time while thinning is occurring. Once the desired thickness has been reached, the thinning operation is halted. By performing the measurement in-situ, this system and a method prevent scrapping of wafers which are overthinned and the reloading of wafers which are too thick. Since an optical reflectometer is used, the measurement is contactless, and thus prevents possible damage to wafers during measurement.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A chuck is provided for holding a semiconductor wafer using a suction force. The chuck includes a chuck plate and may further include a manifold plate, and a seal plate to form a laminated chuck configuration. The chuck plate is disposed about a first axis and includes a first contact region disposed on a first side. The chuck plate further includes a first groove within the first contact region extending generally spirally outwardly from a first location proximate to the first axis to a second location within the first contact region. The chuck plate further includes a first plurality of vacuum holes extending from the first groove into the first side of the chuck plate. A method is provided for a probing a test pad on a semiconductor die disposed on a semiconductor wafer and removing an oxide layer disposed on the test pad. A probe needle contacts the test pad and is overdriven less than or equal to 1 micron into the test pad.

Abstract: A thermophoretic vacuum wand that is particularly suited for transporting articles in a cleanroom environment so that potential particle contaminants in the air do not become adhered to the surface of the article is described. The wand includes a housing having a platen with a front surface with suction port(s) through the platen; a vacuum source for applying a negative pressure to the suction port(s); and heating device for the object. Heating the article when it is held by the vacuum wand affords thermophoretic protection that effectively prevents particles in the air from depositing onto the article.

Abstract: A method and apparatus for manufacturing high-frequency oscillator elements from a workpiece material includes a tool holder formed of magnetic material providing a magnetic field at a tip thereof and a spherical whetstone made of a magnetic material. A grinding mount is made of a magnetic material installed on a main rotating shaft proximate the tool holder through which flux of the magnetic field is channeled. The spherical whetstone held at the tip of the tool holder by magnetic attraction. The workpiece material is mounted on the grinding mount and the tool holder is rotated around an axis coincident with a center of the spherical whetstone while bringing the spherical whetstone into engagement with the workpiece material to lap the workpiece material.

Abstract: The present invention therefore provides in one aspect a lathe including: a headstock comprising a lathe spindle; a tailstock; and a lathe bed wherein the lathe bed is mounted to be rotatable in a horizontal plane about a vertical axis. In a second aspect of the invention there is provided a lathe including: a headstock comprising a lathe spindle passing through a hollow column and within the hollow column means adapted to safely connect a vacuum to the interior of the lathe spindle; a tailstock; and a lathe bed wherein the lathe bed is mounted to be rotatable in a horizontal plane about a vertical axis.

Abstract: A vacuum collet includes a filament disposed in the collet for assisting in removal of components from the collet. The filament is movable in a vertical direction within the collet to gently dislodge components lodged on a bottom face of the collet. The filament may be actuated by a solenoid or pneumatic or hydraulic actuator.

Abstract: A device for establishing a seal between a pair of articles, has a first resilient member arranged to be positioned between the articles, so that the first resilient member and the articles collectively form a first chamber. A vacuum supply is provided for supplying a vacuum to the first chamber. A pressure supply is also provided for applying a pressure to the first resilient member to force the first resilient member against both of the articles.

Abstract: A thermophoretic vacuum wand that is particularly suited for transporting articles in a cleanroom environment so that potential particle contaminants in the air do not become adhered to the surface of the article is described. The wand includes a housing having a platen with a front surface with suction port(s) through the platen; a vacuum source for applying a negative pressure to the suction port(s); and heating device for the object. Heating the article when it is held by the vacuum wand affords thermophoretic protection that effectively prevents particles in the air from depositing onto the article.

Abstract: The conforming, tungsten carbide collet utilized for odd shaped integrated circuit structures is replaced by a plurality of individual collects of the type utilized for integrated circuits. These are typically made of polymide, which is substantially softer than tungsten carbide. In a preferred embodiment, the elongated collect usually used with respect to laser bars is replaced by two individual collects of the type described, which contact the laser bars only near their ends.

Abstract: A substrate (10) having a central region (32) and a peripheral region (34) is processed using a chuck (40) that contacts peripheral regions (34) of the substrate but not the central region. A fabrication step is performed while the substrate (10) is on the chuck (40, 60, 70). The chuck can be used in the formation of a lithographic mask or a semiconductor device.

Abstract: A system for positioning an article at a predetermined angular orientation with respect to a vacuum collet comprising a vacuum collet having an article pickup surface; and an alignment ledge overhanging the pickup surface, wherein the alignment ledge is at a predetermined angular orientation with respect to the vacuum collet.

Abstract: The present invention involves both an apparatus and a method for handling and holding panels and other substrates for photolithographic exposures. In one of its aspects, the present invention comprises bi-modal vacuum cup-bellows devices which automatically retract behind (below) the surface of a chuck, and to remain so retracted at all times except when it is desired to draw a panel toward the chuck. The retraction eliminates interference with movements of the panel during snubbing. In another of its aspects, the present invention comprises registration (locator) pin mechanisms that incorporate bearings. The bearings both turn and move axially, and operate to prevent the panel edges from hanging thereon. In another of its aspects, the present invention comprises a hand-off vacuum cup-bellows device that clamps onto each panel as it comes from a robotic loader. Such device incorporates a lubricious cover that prevents rolling of the cup edges and that facilitates sliding of each panel during snubbing.

Abstract: A rotational support assembly for holding and rotating an article. The assembly includes a support member for holding the article and a drive mechanism for rotating the support member. A drive shaft couples the drive mechanism directly to the support member. The assembly also includes a vacuum system including at least one passageway formed in the support member and the drive shaft. The passageway extends between an inlet in the shaft for coupling the passageway to a vacuum source and an outlet opening connected to the surface of the support member for holding the article against the support member by a vacuum.

Abstract: Disclosed is method and apparatus for distributing a chemical over the surface of a substrate. The method includes depositing the chemical on a portion of the surface of a substrate near the center of the substrate. The method further includes controlling the temperature of the surface of a substrate so that the viscosity of the chemical is calibrated to cause the chemical to be deposited on the surface of the substrate in a substantially uniform manner.

Abstract: A long service life abutment member for use in an electronic component placement apparatus, such as a suction bit and an abutment body of a clamping finger. A diamond film or sintered diamond body is formed on top of the suction surface of the body of the suction bit for placing an electronic component at an intended place on a printed circuit board and on top of abutment bodies of clamping fingers for clamping the electronic component therebetween.

Abstract: A substrate holding apparatus in which first and second vacuum clamping devices each have a holding surface for holding a portion of a substrate, a first driving device for rotating the first vacuum clamping device relative to the second vacuum clamping device, and a second driving device for reciprocally moving the first vacuum clamping device between a position in which it protrudes by a predetermined amount from the holding surface of the second vacuum clamping device and a position in which it does not protrude from that holding surface. Also disclosed is a substrate holding device in which a vacuum clamping device creates a vacuum clamp force on the holding surface thereof, a cylindrical delivering member surrounds at least a portion of the holding surface and is reciprocally movable between a position in which it protrudes by a predetermined amount from the holding surface and a position in which it does not protrude from the holding surface, and a driving device for moving the delivering member.

Abstract: A flange holding apparatus composed of: (a) a head for engaging a flange; (b) a collar surrounding the head, wherein the collar extends along a portion of the length of the head, wherein the head and the collar define a gap therebetween and the head can move between a centered position and an eccentric position relative to the collar; and (c) a resilient member disposed in the gap, wherein movement of the head from the centered position to the eccentric position compresses a portion of the resilient member, whereby the compressed portion of the resilient member urges the head to return to the centered position.

Abstract: An apparatus for engaging a workpiece against a polishing surface in a first embodiment includes a lower plate member, the lower plate member includes a hub on a top surface. An upper plate member includes a seat disposed on a bottom surface. The hub fits within the seat to form an air bearing between the lower and upper plate members. A structure supplies air to the air bearing and a flexure spring is disposed between the upper and lower plate members. The lower plate member includes vacuum holes in its bottom surface which are connected to a vacuum source which creates a vacuum pressure for holding the workpiece against the lower plate. A retainer ring including a flange is positioned about the outer edge surface of the lower plate member for holding the workpiece in place on the bottom surface of the lower plate member.

Abstract: The present invention relates to chucks and methods for positioning multiple objects, optionally for transport onto a recipient substrate. Instead of using conventional clamps that employ mechanical force, the present invention is directed to the use of a non-mechanical force such as negative pressure in a vacuum chuck, or static electricity in an electrostatic chuck as the force applied to the objects held by the chuck. Further, the chuck has a layer for holding the objects which are optionally subsequently transferred to a recipient substrate, the layer having a configuration substantially corresponding to the configuration of the recipient substrate. In certain aspects, the present invention is directed to a chuck for positioning objects with an average width or diameter less than or equal to one millimeter, and a thickness preferably less than about 3 millimeters, such as beads used in the chemical industry.

Abstract: An apparatus for placing electrically-conductive balls on electrodes of workpieces so as to form projected electrodes includes a ball-placing head which picks up the conductive balls from a reservoir. Suction holes for respectively suction-holding the conductive balls are formed in a lower surface of a box member of the ball-placing head. Recesses are formed respectively in portions of this lower surface where the suction holes are not formed. The box member of the ball-placing head is caused to rest on an upper surface of layers of conductive balls stored in a container of the reservoir. In this condition gas is blown or injected into the container so as to fluidize the conductive balls. At this time the gas flows upward into the recesses in the lower surface of the box member, thereby sufficiently fluidizing the whole of the upper layer of conductive balls, so that all of the suction holes can effectively and securely pick up and hold the conductive balls.

Abstract: Disclosed herein is a clamping device comprising a workpiece-engaging portion including a workpiece-engaging surface; sealing means for sealing the workpiece-engaging portion with the workpiece; the sealing means including a first resilient member arranged to seal between the workpiece-engaging surface and the workpiece, wherein the sealing means, the workpiece-engaging portion and the workpiece collectively form a first chamber; vacuum supply means for supplying a vacuum to the first chamber to draw together the workpiece and the workpiece-engaging portion; and pressure supply means for applying a pressure to the first resilient member to force the first resilient member against the workpiece-engaging portion and the workpiece. Also disclosed is a method for clamping a workpiece to a processing machine as well as a workpiece processing machine incorporating the clamping device.

Abstract: A substrate holding apparatus is provided with a plate-shaped substrated holding unit including a first surface having plural protruding portions coming into contact with a plate-shaped substrate. The apparatus is a substantially flat second surface and adapted to support the substrate on the substrate holding unit by suction and comprises a temperature regulating unit which is composed of a material of a high thermal conductivity and positioned as to contact the second surface, a heat discharging the heat from the substrate holding unit, and a heat discharge control unit for controlling the heat discharging property of the heat discharging unit.

Abstract: In an apparatus for adhering a polarizer to an LCD (Liquid Crystal Display) panel, a set plate for holding the panel thereon by suction is formed with a plurality of channels on the surface thereof. A discharge bar adjoins the set plate and blows air under pressure into the channels. When the panel is laid on or separated from the set plate, the air dissipates static electricity. This reduces electrostatic charge deposited on the panel and thereby reduces the electrostatic breakdown of the panel.

Abstract: Disclosed are an object holding process and and an apparatus therefor in which a process strain of the object can be accurately compensated for. When the exposure operation is started, the bottom surface of the object is held by a holding unit. If the object has a strain, the process strain is calculated. Here, if the process strain is larger than a tolerance, the temperature of the object is set to an object setting temperature in a position other than an exposure position in order to contract or expand the object by a predetermined amount for a magnification correction. The bottom surface of the object is then held by the holding unit again, and the exposure of the object is performed in the exposure position.

Abstract: A centrifuge is provided with a mounting arrangement that secures a centrifuge bowl to a turntable in response to centrifugal force generated when the turntable is rotated. The centrifuge includes first and second retainers, one of which is connected to the turntable, while the other is connected to the centrifuge bowl. The second retainer engages the first retainer when the first and second retainers are in an interlocking position to secure the centrifuge bowl to the turntable. A movable arm is provided on the turntable and coupled to the second retainer, the movable arm has a ballast that forces the movable arm and second retainer in a first direction in response to centrifugal force generated by rotating the turntable so that the second retainer is forced into the interlocking position with the first retainer. In one embodiment, a vacuum applied to an opening in the turntable assists in mounting a centrifuge bowl to the turntable.

Abstract: A nozzle for a vacuum mounting head of a component placement machine. The nozzle includes a positioning block defining a plurality of spaced apart pads on top of the block with each of the pads having a pad hole in the top of the pad. The positioning block also defines an opening in the bottom of the block for mounting the nozzle on the vacuum mounting head. The positioning block further defines an interior air passage connecting each of the pad holes with the opening in the bottom of the block for the application of a vacuum force by the nozzle.