Abstract: A method for fabricating an electronic assembly comprises attaching an insulative film to a frame and positioning at least one electronic component having a face with connections pads face down on the insulative film. The insulative film is positioned on a porous sheet supported by a vacuum fixture. The porous sheet and vacuum fixture are adapted so as to be capable of creating vacuum conditions for holding the insulative film with a substantially flat surface on the porous sheet. A vacuum is created within the vacuum chamber for flatly holding the insulative film on the porous sheet. A substrate is applied to the insulative film and the at least one electronic component. In one embodiment the substrate is applied by securing the insulative film in position with a mold form having at least one opening around the electronic component and adding substrate molding material at least partially around the component through the opening.

Abstract: An imaging mount and apparatus that reduces or eliminates stress induced in an imaging mask mounted thereto. The mount comprises a support block and a trio of mounting pads connected thereto. At least two of the mounting pads are connected to the support block so that their respective positions are adjustable within a predetermined plane which is preferably substantially parallel to a surface of a substrate to be imaged. Each of the mounting pads including means for securing the imaging mask generally parallel to the predetermined plane. The positions the adjustable mounting pads adjust within the predetermined plane responsive to securing of the lithography mask thereto so that the imaging mask is essentially undeflected due to the securing thereof. The absence of deformation (and, as a result, stress) in the imaging mask due to its being secured to the mount reduces the degree of distortion of radiation passing through the mask and to the imprinted surface.

Abstract: It is an object of the present invention to obtain a vacuum chucking which can vacuum suck a wafer even if dusts attach thereon. The main body of vacuum chuck (101) has a plurality of block grooves (125) on the surface on which the wafer (1) is sucked and fixed, in which vacuum evacuation paths (105) each for vacuum evacuating each block groove (125) are provided for each block groove (125). When the wafer(1) is sucked and fixed under low pressure, even if the degree of vacuum in one of the block grooves (125) decreases due to attachment of dusts on part of the suction surface, or the like, the wafer (1) can surely be sucked and held.

Abstract: A vacuum collet (10) for picking up a semiconductor die (11). A plate (12) has a vacuum tube (15) and a downwardly extending skirt (19). Skirt (19) contacts the perimeter of die (11). The vacuum is distributed to the perimeter of the semiconductor die (10) by a baffle (16) interposed between the plate (12) and the die (11) and within the skirt (19).

Abstract: A pick and place machine (30) having morphing vacuum tip (10) comprises a chamber (24) having a sealed first port (25), a filter (22) on a second port (27), and a vacuum (12) on a third port (23), a needle (28) pierced through the sealed first port and through the filter on the second port, wherein a vacuum (14) is placed on the portion of the needle piercing through the sealed first port. Finally, the morphing vacuum tip additionally comprises a non-porous bag (18) having a plurality of fine particles (16) within the bag and an external portion of the bag surrounding a periphery of a portion of the needle pierced through the filter on the second port, the non-porous bag having an open portion being exposed to an external side of the filter on the second port of the chamber, wherein the vacuum on the third port sucks air out of the non-porous bag and the filter prevents the plurality of fine particles from entering the chamber.

Abstract: A spinning plate for substrates has on the surface of its spinning disk a continuous seal that is pressed from below against the edge of the substrate. The substrate can thus be retained by suction on the spinning disk. In order to center the substrate, a pressing element is moved under suction against the edge of the substrate and presses the same against centering stops of supporting blocks.

Abstract: An apparatus for separating a wafer from a support plate, to which the wafer is bonded with a thermally softened adhesive, includes an upper plate having opposite upper and lower surfaces and a plurality of holes having apertures at the lower surface through which air is evacuated to hold the support plate to the lower surface; a lower plate having opposite upper and lower surfaces and a plurality of holes having apertures at the upper surface through which air is evacuated to hold the wafer to the upper surface; a heater for softening the thermally softened adhesive embedded in at least one of the upper and lower plates; a robot arm for moving the upper plate in vertical and horizontal directions; and a shaft for rotatably connecting the upper plate to the robot arm. In operation, after the adhesive connecting the wafer and the support plate is softened by the heater, the robot arm moves the upper plate upward while rotating or turning the upper plate, whereby the support plate is separated from the wafer.

Abstract: A vacuum chuck for a lathe, including a vacuum connector assembly to be mounted within a spindle bore of a lathe. A tapered portion of an outer end of a vacuum tube centrally locates the outer end of the vacuum tube in a spindle bore. A resilient sleeve is radially expanded over a tapered inner end of the vacuum tube, within the spindle bore, centralizing the vacuum tube radially within the spindle bore, fastening the vacuum tube securely within the spindle bore, and sealing off the space between the vacuum tube and the inner surface of the spindle bore.

Abstract: An improved semiconductor wafer carrier provides gimballing motion of the wafer to dynamically align the wafer to a polishing platen. This gimballing motion is achieved by providing a conical receptacle which has a spring friction fit with a spherical button. A torque plate with spring fingers provides the spring friction fit between the conical receptacle on the rotating shaft and the spherical button on the drive plate of the wafer carrier.

Abstract: A vacuum chuck (10) holds a semiconductor wafer (56) securely in place during manufacturing processes. An external chuck (12) has a hollow center portion receiving a spindle support (14) and shaft (16). A positive pressure is applied through the shaft to a nozzle assembly (26) that rests on the spindle support. The nozzle assembly is further housed within a cavity in an internal chuck (28) that rests within a cup in the external chuck. The nozzle assembly use a venturi jet (44) to convert the positive pressure to a vacuum. A plurality of vacuum ports (34 and 36) from the cavity of the internal chuck transfer the vacuum to an upper surface (40) of the internal chuck to hold the semiconductor wafer in place. A plurality of exhaust ports (30 and 32) from the cavity of the internal chuck exhaust gases radially across the upper surface (13) of the external chuck toward its perimeter to prevent undesired chemicals from reaching the underside of the semiconductor wafer.

Abstract: A glass substrate is supported on a pedestal in a rotatable cup having an upper opening. The pedestal, which is substantially similar in shape to the glass substrate, has a ridge extending along an outer peripheral edge of an upper surface thereof, for engaging an outer peripheral edge of a lower surface of the glass substrate. After a resist solution to be coated on the glass substrate is applied to an upper surface thereof, the upper opening of the rotatable cup is closed by a cover, and then the rotatable cup is rotated to spread the applied resist solution uniformly over the upper surface under centrifugal forces. In one embodiment, the apparatus comprises an inner rotatable cup and an outer rotatable cup, each with its own separate cover. In another embodiment, a pedestal is mounted on the bottom of the inner cup having a vacuum chuck movable therein.

Abstract: A wafer holding device of the vacuum attraction type includes a structural member having a protrusion for supporting a wafer and elastic members made of a material having an elasticity modulus smaller than that of the wafer and that of the structural member. The elastic members are distributed on a wafer attraction plane of the structural member.

Abstract: Apparatus for coating the surface of an object with a coating material are disclosed. The apparatus comprise a vacuum chuck assembly suitable for holding the object to be coated in a downward, i.e., inverted position, and a coating material applicator movably positioned beneath the vacuum chuck assembly to traverse the surface of the object in a generally parallel direction to the surface. The vacuum chuck assembly provides a means for temperature control as well as a means for establishing a vacuum for holding the object in the inverted position.

Abstract: The invention provides a method and apparatus for picking a separated semiconductor die 128 from a wafer and placing it on a die attach pad 144 for bonding thereto. In a preferred embodiment, the apparatus comprises a die collet having a body 124 with a proximal end 123 and a distal end 125; at least one pair of spaced-apart walls 136 extending distally from the distal end of the body and having opposing faces 181 defining an aperture 126, the faces of the walls being sloped such that a distal portion of the aperture is wider than the die and a proximal portion of the aperture is narrower than the die; a recess 152 on the faces of the walls extending substantially the length of the die, the recess having a distally-facing surface 154 for contacting at least a portion of the top side 138 of the die; and means for holding the die in the aperture, usually including a vacuum port 128.

Abstract: A laminar flow vacuum chuck (10) has a plurality of vacuum ports (20, 52) disposed near the center of the chuck. A plurality of interconnected grooves (22, 24, 26, 26, 30, 32, 34, 36, 38, 40, 42, 44, 46, 50, 62, 64) extend from the vacuum ports (20, 52) to the perimeter 14. By reason of the shape of the interconnected grooves and the location of the vacuum ports, the downward force on a wafer supported by the chuck increases as the wafer size increases.

Abstract: This invention relates to a method and apparatus for retaining disk-like structures, such as magnetic memory substrate plates, or disks, during machining, cutting, or grinding operations. A fluid is applied to one surface of the disk to retain the other surface of the disk against a chuck at a force which is sufficient to maintain the disk against the chuck during the operations.

Abstract: A method and apparatus for substantially automatically joining front and back parts of buttons employs a turntable with retaining means that are rotated through a series of stations at which the parts are placed in the retaining means in a desired orientation, joined, and checked for defects. A human operator places button front parts at a first station, and the remaining stations carry out the assembly and quality control steps automatically. Placement at the first station determines the alignment and orientation of the two buttons.

Abstract: A chuck for holding semiconductor wafers during testing of circuits formed thereon has a flat mounting surface with dual electrically isolated Kelvin contacts on the surface and passages communicating between the surface and a vacuum manifold for securing the wafers on the chuck with air pressure.

Abstract: A machine for automatically joining front and back parts of buttons employs a turntable with nests that are rotated through a series of stations at which the parts are placed in the nests in a desired orientation, joined, and checked for defects. Orientation of the parts is achieved by video imaging of a first part as it is randomly placed in a nest, and computer-controlled placement of the second part based on the ascertained position of the first part.

Abstract: A method of supporting a wafer comprising the steps of: dividing a pressure space formed between the table plate and the wafer into a first pressure space and a second pressure space by means of a pressure setting wall, setting a supporting pressure of a compressed air supplied to the first pressure space, by a throttle function of a throttle passage formed between a pressure regulating wall and the wafer, and determining a further supporting pressure of the compressed air supplied from the first pressure space to the second pressure space through the throttle passage, by a throttle function of a throttle opening for connecting the second pressure space with the atmosphere. A wafer supporting apparatus for carrying out the method and a wafer mounter having the apparatus.

Abstract: A heater block for bonders used in a semiconductor assembly line uses a vacuum suction force to securely hold the heater plate on the heater block via vacuum passages and vacuum adhesion holes connected to a vacuum pump so that an attachment and removal of the heater plate is accomplished easily and in a short span of time by merely turning on and off the vacuum suction adhesion force.

Abstract: An apparatus (60) which handles fragile semiconductor wafers (21) adhesively mounted to a submount (22) using a high temperature wax is provided. The apparatus (60) includes a vacuum chuck (24) for holding a first surface of the wafer (21) and a solvent chamber (11, 11') for applying solvent to the back surface of the submount (22). The apparatus (60) includes an enclosure (29) for providing an inert gas environment around the solvent chamber (11, 11'), the wafer (21), and the vacuum chuck (24). The apparatus (60) further includes a means for remounting (30) the wafer (21) to a submount (22) using a low temperature wax after the high temperature wax is dissolved. The wafer (21) is then released from the vacuum chuck (24) and the first surface of the wafer (21) is mounted to an adhesive tape (34). Following the mounting, the low temperature wax is dissolved or melted to demount the wafer (21 ) from the submount (22), leaving the wafer (21) securely mounted on the adhesive tape (34) for sawing.

Abstract: Apparatus for engaging and holding a non-oriented hot glass container of predetermined square cross sectional contour and closed end that includes a chuck having an open end for receiving the container and an internal valve plate for abutment with the end of the container received in the chuck. The chuck is coupled to a cam-operated arm for lowering the chuck over a container. A transition plate has a square opening contoured to be closely received over the square cross section of the container, and is mounted for free rotation adjacent to the open end of the chuck. Guide fingers project from the plate away from the open end of the chuck so as to engage the container end as the chuck is lowered over the container, and to rotate the plate relative to the chuck so that the plate opening is aligned with the square cross section of the container end. A vacuum is applied to the valve plate within the chuck for holding the container end against the valve plate.

Abstract: Apparatus (11) is robotically operated to pick up an optical element such as a ball lens (12) or an optical fiber, place it in a groove or depression (13) of a substrate (14), and apply pressure to it so that it is bonded to the substrate. The tool comprises a retracting element holder (17) surrounding a bonding tool (16). A vacuum channel (18) communicates with the element holder so that, by the application of a vacuum, it can pick up an optical element. The tool then moves the element to place it, for example, in a depression (13) of a substrate, whereupon the vacuum is released, thereby to allow the element to nest between opposing sidewalls of the depression. The retracting holder element is simultaneously retracted vertically upwardly so as to expose a bonding surface of the bonding tool. After the element has nested in the groove, the bonding tool contacts the element and forces it against opposite sidewalls to effect a thermo-compression bond of the optical element with the sidewalls.

Abstract: A vacuum-attraction holding device includes a holding base having an attracting surface, for holding a substrate thereon; a suction passageway formed in the base, for supplying a vacuum to the holding base to attract the substrate to the attracting surface; and a pressure sensor provided in the base and being communicated with the suction passageway.

Abstract: This invention relates to a self aligning, vacuum end effector which is capable of picking up objects which have a pick up surface which is not planar with the pick up surface of the end effector. The end effector is comprised of two parts: a nozzle base which fixedly attaches to an automatic assembly device, such as robotic arm; and a nozzle tip, which is the part of the end effector which actually comes in contact with the object to be picked up. The nozzle base and nozzle tip are secured together by a retention spring. The nozzle tip has a generally, semi-spherically shaped ball portion which is partly inserted into a bore within the nozzle base and rests against a quad ring which is secured within the bore. Consequently, when the nozzle tip makes contact with an object which is to be picked up and moved, the semi-spherical ball portion of the nozzle tip slides against the quad ring and the nozzle tip pivotally moves and aligns itself with the plane of the surface of the object to be picked up.

Abstract: Disclosed herein is an equipment for sticking a vinyl tape on the backside surface of a wafer prior to the dicing of the wafer. Suction ports for sucking and supporting the peripheral part of the wafer surface is provided in the outer block of a stage for supporting the wafer, a recessed part is formed at the central part of the support stage so as to avoid the contact of the central part of the wafer to the support stage, and concentric ring-shaped projection parts are formed on the bottom surface of the recessed part. The height of the top face of the ring-shaped projection parts is set to be slightly lower than the outer block of the support stage which is the wafer contact part, with minute gaps being kept from the fixed wafer. It is possible to prevent the generation of flexure due to a turning roller at the time of sticking of the tape by introducing high pressure air to the recessed part of the wafer support part and the minute gaps.

Abstract: A flexible product, more particularly an information-carrying disc, is removed from a carrier plate, more particularly a mold, by creating a partial vacuum at the side of the product facing away from the carrier plate. While the product is being displaced in a direction facing away from the carrier plate under the influence of the partial vacuum, the product is guided in such a way that it is displaced over the greatest distance at two opposite ends and the displacement of the parts of the product situated between these ends decreases gradually towards the center of the product.

Abstract: A pneumatic mandrel for use in machining and fusing plastic pistons and cylinders has a forward end wall with a port therethrough in pneumatic communication with a vacuum pump via a pneumatic tube extending longitudinally through the mandrel. A cylinder may be snugly mounted on the mandrel and may also be fixed against rearward axial movement by a stop member means the rearward end of the mandrel. The cylinder overhangs the forward end wall of the mandrel by substantially the length of the piston so that the end walls of the piston and cylinder will be aligned when the piston head is drawn by vacuum into firm abutment with the forward end wall of the mandrel. Preferably, a sink about the forward end wall port forms a peripheral landing about the end wall to assure firmness in the abutment. Relief ports are also provided through the mandrel for release of the vacuum to facilitate removal of the cylinder and piston from the mandrel.

Abstract: A vacuum chuck apparatus includes a vacuum chuck mounted on one end of a hollow shaft whose other end is connected through a rotary seal to a vacuum source. The seal includes a first member having a cap portion cemented to the shaft end and an axially bored frustoconical projection on its end wall and a second member having a frustoconical socket complementing the projection which partially nests in the socket. The second member has a radial pin loosely engaging a longitudinal slot in a stationary bracket to restrict its rotation and permit its axial movement. A spring loaded pressure plate bears on the outer end face of the seal second member.

Abstract: A ball screw supported Z stage for use in a wafer prober is disclosed. The present invention provides the capability of precisely positioning and rigidly supporting a work surface in a low profile package.

Abstract: A method and apparatus for testing integrated circuit devices includes a cooling chuck which is extensible within a bore in a cooling chuck body to a position in thermal contact with the integrated circuit device. The temperature of the cooling chuck is regulated by a fluid cooling system, which can be set to operate at a selected capacity to maintain the integrated circuit device at a desired temperature during testing.

Abstract: An apparatus for lifting a pellet which is on a wafer sheet including a pin holder having a plurality of peripheral pin insertion holes formed in an X pattern. The pin holder also has V-shaped cut-out areas in the left and right sides surrounded by the X pattern, and the pin holder is driven up and down by a vertical drive. The pellet-lifting apparatus further includes peripheral lifting pins inserted into the peripheral pin insertion holes, and V-shaped bridges fastened to the pin holder so that the peripheral lifting pins are held between inner surfaces of the cut-out areas in the pin holder. With such a structure, peripheral lifting pins are set in the peripheral pin insertion holes of the pin holder so that the pins meet different sizes of pellets and lift them in a stable manner.

Abstract: The vacuum chuck, which is an accessory device for holding a workpiece in machining and inspection, has a suction head made of a porous sintered particles of a thermoplastic resin, e.g., a fluorocarbon resin, preferably, bonded to the chuck base. The suction head is free from the problem of unreliableness of holding of workpieces without the danger of damaging the workpiece. The outer peripheral surfaces of the sucking head are provided with an air-impermeable layer to increase the efficiency of suction by preventing leakage of vacuum. The water-and-oil-resistance of the suction head can be improved by blending the powder of the thermoplastic resin with a powder of a thermosetting resin, e.g., epoxy resin.

Abstract: A method and apparatus for mounting a die, particularly a rigid cutting die, on a die cylinder includes having a bubble along a seal on the die to bridge any gaps between the die and the die cylinder when the die is initially positioned on the die cylinder. This bubble seal enables a vacuum to be applied between the initially positioned die and the die cylinder to pull the die down against and into conformity with the surface of the die cylinder, at the same time flattening the bubble seal. A key at a trailing edge of the die locates in an axial keyway in the die cylinder to circumferentially position the die; a bolt is then inserted at a leading edge of the die to establish axial location. During operation the die is held in position by the vacuum. Beam sensors and light reflectors may be incorporated to sense when a wrong die is present and shut down the apparatus.

Abstract: A plate-like article holding device particularly suitably usable in an exposure apparatus for printing a pattern of a reticle or mask on a semiconductor wafer, as a wafer holding device for holding the wafer at a pattern printing station, is disclosed. In an embodiment, the holding device includes a wafer chuck having a wafer attracting surface and a plurality of throughbores formed in relation to the attracting surface. Also, the device includes a plurality of support pillars provided in relation to the throughbores, respectively, and having end faces effective to support a wafer by attraction. There is provided a driving mechanism for moving the wafer chuck in a direction substantially perpendicular to the wafer attracting surface of the chuck so as to allow that the supporting end faces of the support pillars project outwardly beyond the wafer attracting surface of the wafer chuck or, alternatively, they are accommodated within the wafer chuck.

Abstract: In a mandrel system for receiving a cup-like product having a side wall with a ribbed interior surface, the exterior portion of the mandrel wall is adapted to firmly engage the interior surface of the product side wall in the regions between the ribs and to enhance interior backing of the product side wall in the regions between the ribs. In one embodiment, the exterior portion of the mandrel wall includes a compressible material. In another embodiment, the exterior surface of the mandrel wall includes channels for receiving the ribs on the interior surface of the product side wall. The mandrel wall is apertured to enable air to flow through the mandrel wall to draw the product into firm engagement with the mandrel when a vacuum is created inside the mandrel.

Abstract: A cup shaped holder for transporting and installing a key cap on a key switch in a keyboard. The holder has an open end and resilient side walls for closely receiving the upper portion of a key cap. The closed end of the holder is at an angle to the direction of movement of the holder and is adapted to engage the upper surface of the key cap to more nearly align the cap with the key switch when the cap is pressed on the switch by the holder.

Abstract: A device for disengaging a suction mechanism from a lens. A housing is provided that has an upper supporting rim for a lens. The device also has a gripping member that is adapted to grasp the base of the suction mechanism in a forceps-like manner. The gripping member is accommodated in the housing in such a way as to be axially movable therein. When the gripping member moves out of a starting position and away from the supporting rim, the lens is drawn against the latter and can be diengaged from the suction mechanism.

Abstract: A collet holder which provides heated gas directly to and around the collet head, and prevents oxygen entrainment. The collet holder is characterized by three concentric sections. The first section receives the cartridge heater and holds the collet, providing it with a vacuum. The second section surrounds the forward portion of the first section and creates the gas turbulent flow heat exchanger. The collet extends through a discharge orifice by which the heated gas is applied to the collet head. Finally, a third shield section encases the collet holder and minimizes heat loss.

Abstract: A vacuum chuck for securely holding integrated circuit hybrid package substrates in fixed relationship to an X/Y table that is subjected to severe repeated lateral acceleration and decceleration forces to prevent appreciable lateral displacement of the package substrate relative to the X/Y table. A plurality of shallow, closed loop grooves are disposed in the chuck. A resilient O ring is disposed in each groove and normally extends a small but precise amount above the surface of the base. A vacuum path opens into each region circumscribed by an O ring. When a package substrate is positioned on an O ring and the vacuum then is applied, the O ring is compressed, causing the sides of the O ring to tightly engage the walls of the groove, preventing the O ring from "rolling" in the groove as a result of lateral acceleration and decceleration forces on the package.

Abstract: Bonding of lead wires between electrical contact points of an integrated circuit and the conductive elements of a flexible tape-like structure on which the integrated circuit is seated is accomplished by means of a vacuum chuck having distributed recesses through which a partial vacuum is applied to the flexible structure. Support elements are provided with the vacuum recesses to ensure that the flexible tape-like structure presents a planar orientation to a bonding tool. The tape-like structure is maintained in a substantially rigid position during the bonding process enabling precision bonding of lead wires.

Abstract: In a superprecision lathe of the present invention, a main spindle having mounted at one end thereof a vacuum chuck rotatably supported in an air bearing fixed on a headstock. There is formed within the main spindle a first vacuum passage connected to the vacuum chuck and opened at the outer surface of the main spindle, and a second vacuum passage formed in the headstock and of which an open end to be connected to a vacuum pump and is opened at the inner surface of the air bearing. The first vacuum passage is connected to the second vacuum passage through an interconnection region defined by two annular grooves formed at the opposite positions of the outer surface of the main spindle and the inner surface of the air bearing; therefore, it is not necessary to use a specific sealing member, any external vibration is not transmitted to the main spindle, and the object can be worked effectively with a high speed rotation of the main spindle.

Abstract: A wafer chuck for releasably holding a wafer, includes a base member having an upper surface for carrying and holding thereon the wafer, a lift mechanism operative on the wafer when it rests on the base member to move the wafer relative to the base member in a direction away from the base member, the lift mechanism having an operative member extending substantially in a direction to a radially inward position from a radially outward position of the base member, the operative member having an end portion movable, relative to the base member, between a first position at which it is retracted from the upper surface of the base member and a second position at which it is protrudent from the upper surface of the base member so as to engage with the wafer to move the same relative to the base member, and driving means for moving, relative to the base member, the end portion of the operative member between the first and second positions.

Abstract: A chuck for holding a workpiece (e.g., a semiconductor wafer) in a vacuum comprises a curved reference surface. By clamping the edges of the workpiece and maintaining its backside against the curved surface (or against pins mounted on the surface), the frontside of the workpiece can be thereby established in a precise equidistant relationship with respect to the reference surface. Such a chuck is advantageous for holding wafers to be lithographically patterned in a high-resolution way by electron-beam, ion-beam and X-ray-beam techniques.

Abstract: A balancing chuck is disclosed for semiconductor wafers having a flat region which typically causes wafer imbalance on spinning equipment. The wafer's flat region is determined by a proximity sensor mounted on a centering arm overlying the wafer. The chuck is constructed to include an annular race containing a spherical counterweight. As the chuck is rotated to determine the wafer's flat region, a magnet prevents movement of the spherical counterweight within the race and allows for its subsequent alignment with the mass imbalance. A plurality of circumferential pockets are provided within the race to retain the position of the counterweight which functions as a counterbalance maintained in proper angular alignment during spinning of the chuck.

Abstract: Before being coated with the magnetizable material, the substrate plates are machined on a precision turning lathe in such a way that the annular surface provided for the storage area is convexly arched on both sides of the plate. For this purpose, the substrate plate, during machining, is held on the chuck in a concave arch of the annular surface and machined flat with a purely radial free movement of the cutting tool, or held on a flat chuck and turned down under a feed movement of the tool, which feed movement corresponds to the required convex arching of the annular surface. In the first machining method, the elastically deformed substrate plate, after removal from the chuck, loses tension and forms a convexly arched annular surface.

Abstract: A device for holding delicate workpieces, particularly optical lenses, includes a membrane having a clamping surface. To receive a workpiece, the membrane is pressurized and bulges in such a manner that the clamping surface is enlarged and becomes funnel-shaped. In order to clamp the workpiece, the pressure in the membrane is decreased so that the membrane assumes a shape in which the clamping surface is constricted and holds the workpiece with a force which is evenly distributed over its entire periphery, through which deformation and destruction of workpieces is safely avoided.

Abstract: A method for centering a semiconductor wafer on a vacuum chuck having a centered shaft. A shaft centering tool which is contained in pre-existing openings in a housing surrounding the shaft is used to define the desired location of the shaft. A second device having the same circumference as the wafer, is employed on the chuck in order that teflon guides can be set into position around the chuck. Once the guides are set, wafers introduced into the guides will be centered on the chuck.

Abstract: The present invention relates to manufacturing and adjusting the orientation of a motor vehicle headlamp and to a motor vehicle headlamp for performing the method. In a headlamp (7) of the type comprising a transparent front glass (15) fixed to the bodywork (28, 29) of the vehicle and an optical assembly (35, 36) having an optical axis (38) passing through the glass (15), graduated adjustment means (90) are provided for adjusting the orientation of the optical assembly (35, 36) relative to the glass (15) in order to enable the orientation of the optical axis (38) to be adjusted using said means (90) relative to an error as measured between the orientation of the glass (15) as mounted and a predetermined orientation thereof. This makes it possible to use mechanical means for measuring such an error and to adjust the orientation of the optical axis as a result of such measurement providing the headlamp is of the above-described type.